CN215787303U

CN215787303U - Chip hot dismantling machine

Info

Publication number: CN215787303U
Application number: CN202121974600.XU
Authority: CN
Inventors: 刘正平; 林闽
Original assignee: Xiamen Jingxin Technology Co ltd
Current assignee: Xiamen Jingxin Technology Co ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-02-11
Anticipated expiration: 2031-08-23

Abstract

The utility model discloses a chip thermal dismantling machine which comprises a base, a carrying part and a heating part, wherein the carrying part is movably arranged on the base, and the heating part is perpendicular to the carrying part; the heating member includes an XZ moving mechanism; the XZ moving mechanism is movably arranged on the heater and used for heating a welding spot of the chip; and the output end of the heater is provided with a sealing nozzle external member used for grabbing the chip after the welding leg is melted. The utility model has reasonable design, simple structure, low failure rate, good use safety and good operation stability; the device has the advantages of convenient speed regulation, controllable heating temperature, no need of using other chemicals, convenient and fast operation, greatly improved working efficiency and wide market prospect.

Description

Chip hot dismantling machine

Technical Field

The utility model relates to the technical field of chip disassembling equipment, in particular to a chip hot disassembling machine.

Background

In the installation process of the chip, if the chip is found to be bad or wrong, the chip needs to be removed in time, the chip is mainly removed through heating, however, the existing heating removal is mainly performed manually through heating equipment such as an electric iron, and the following technical problems still exist in the disassembly:

1) the PCB can not be disassembled conveniently, and the PCB can be discolored and other patches can fall off, which brings trouble to work;

2) therefore, the requirement on operators is high, the labor intensity is high, workers are easy to fatigue, accidents can happen in severe cases, and great loss is caused to production and life of people.

In view of the above, it is very necessary to design a fully automatic chip thermal detacher, which solves the above technical problems.

Disclosure of Invention

The utility model provides a chip hot dismantling machine which adopts a mode of combining a hot air gun and a sealing nozzle inner sleeve, realizes heating, simultaneously absorbs a chip, simultaneously heats the chip uniformly and stably, simultaneously constructs a control three-axis space coordinate moving mechanism by matching an XZ moving mechanism with a carrying part, improves the accuracy, has good heating effect, high dismantling efficiency and intelligent and automatic levels, reduces the labor capacity of workers, has a simple structure, is convenient to use, and is easy to maintain and repair, thereby solving the technical problems in the prior art.

In order to solve the technical problems, the utility model provides the following technical scheme:

a chip thermal disassembling machine comprises a base, a carrying part movably arranged on the base and a heating part vertically arranged with the carrying part; the heating member includes an XZ moving mechanism; the XZ moving mechanism is movably provided with a heater for heating the chip welding foot; and the output end of the heater is provided with a sealing nozzle external member for grabbing and melting the chip after the welding leg while guiding the airflow.

The sealing nozzle external member comprises a sealing nozzle outer sleeve and a sealing nozzle inner sleeve which is coaxially arranged with the sealing nozzle outer sleeve; the sealing mouth inner sleeve is connected with the sealing mouth outer sleeve through the fasteners in the array.

An air hole joint is arranged between the inner nozzle sealing sleeve and the outer nozzle sealing sleeve, and a columnar blind hole is formed in the inner side of the inner nozzle sealing sleeve; the air hole joint is communicated with the column blind hole.

Wherein, the peripheral side of the inner sleeve of the sealing nozzle is arranged in a reverse right angle.

The sealing nozzle outer sleeve is provided with a square object through hole, and one end of the sealing nozzle outer sleeve is provided with a square object protruding portion.

Wherein, the heater is a hot air gun.

The carrying part comprises a carrying bracket arranged on the inner side of the base and a belt transmission device fixedly arranged on the carrying bracket; and the carrying jig is arranged at the top of the carrying bracket and is fixedly connected with the belt transmission device.

Wherein, a protective cover is arranged between the carrying jig and the carrying bracket.

Wherein, the carrying jig is provided with column through holes in an array; the bottom of the carrying jig is fixedly connected with a sliding table; the sliding table is in a concave shape.

The chip hot dismantling machine further comprises a controller, wherein the controller is arranged on the inner side of the base and is in control connection with the carrying part and the heating part.

Compared with the prior art, the utility model has the following advantages:

1) according to the utility model, by adopting a mode of combining the hot air gun and the sealing nozzle inner sleeve, the heating is realized, the chip is sucked and the uniform and stable heating is realized at the same time, meanwhile, the control triaxial space coordinate moving mechanism is constructed by matching the XZ moving mechanism with the carrying part, the accuracy is improved, the heating effect is good, the dismounting efficiency is high, the intelligent and automatic levels are high, the labor amount of workers is reduced, the structure is simple, the use is convenient, and the maintenance is easy;

2) the utility model has reasonable design, simple structure, low failure rate, good use safety and good operation stability; the device has the advantages of convenient speed regulation, controllable heating temperature, no need of using other chemicals, convenient and fast operation, greatly improved working efficiency and wide market prospect.

Drawings

FIG. 1 is an exploded view of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a sealing assembly according to an embodiment of the utility model.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Exemplary embodiments according to the present application will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art, in the drawings, it is possible to enlarge the thicknesses of layers and regions for clarity, and the same devices are denoted by the same reference numerals, and thus the description thereof will be omitted.

The utility model is further described with reference to the following figures and specific embodiments.

As shown in fig. 1 to 2: the embodiment provides a chip hot-disassembling machine, which comprises a base 1, a carrying part 2 movably arranged on the base 1 and a heating part 3 arranged perpendicular to the carrying part 2; the heating member 3 includes an XZ moving mechanism 31; the XZ moving mechanism 31 is movably provided with a heater 32 for heating the chip welding feet; the output end of the heater 32 is provided with a sealing nozzle suite 33 for capturing and melting the chip after the welding leg while guiding the airflow. Specifically, the three-axis coordinate robot capable of enabling the heater 32 to move in a three-axis space is built by matching the carrying part 2 with the XZ moving mechanism 31, so that the three-axis coordinate robot is suitable for disassembling chips on different types of circuit boards, and is high in practicability; simultaneously through the triaxial coordinate robot that delivery part 2 cooperation XZ moving mechanism 31 was built can put the chip with the accurate transport of heater block 3 and disassemble the position, improved the accuracy, the efficient of dismouting, intelligent and automatic level are high, have reduced workman's the amount of labour, simple structure, convenient to use, easy to maintain maintenance. The carrier member 2, the heater 32, and the sealing nozzle kit 33 will be described in detail below.

On the basis of the above embodiment, the sealing sleeve assembly 33 includes an outer sealing sleeve 331 and an inner sealing sleeve 332 coaxially disposed with the outer sealing sleeve 331; the inner seal cover 332 is connected with the outer seal cover 331 through an array of fasteners. A zigzag airflow hole is formed between the inner sealing nozzle sleeve 332 and the outer sealing nozzle sleeve 331 for allowing the hot airflow generated by the heater 32 to pass through and heating and melting the spot welding pins around the chip at the same time, so that the chip can be conveniently detached from the circuit board by the subsequent inner sealing nozzle sleeve 332.

On the basis of the above embodiment, an air hole joint 333 is arranged between the inner nozzle sealing sleeve 332 and the outer nozzle sealing sleeve 331, and a columnar blind hole is arranged on the inner side of the inner nozzle sealing sleeve 332; the air vent fitting 333 communicates with the column blind hole. Specifically, the air hole joint 333 is connected with an external device for exhausting air from the blind hole of the columnar object, so that negative pressure is formed on the inner side of the blind hole to firmly suck the chip, and the chip is conveniently moved and quickly detached.

On the basis of the above embodiment, the inner sleeve 332 of the sealing nozzle is arranged with a reverse right angle on the peripheral side, so as to provide support for the fastening piece when being fixed, and effectively reduce the occupied space.

On the basis of the above embodiment, the nozzle sealing outer sleeve 331 is provided with a square through hole, and one end of the nozzle sealing outer sleeve 331 is provided with a square protruding part.

On the basis of the above embodiment, the heater 32 is a heat gun.

On the basis of the above embodiment, the carrier member 2 includes a carrier bracket 21 disposed inside the base 1, and a belt transmission device 22 fixedly disposed on the carrier bracket 21; and the carrying jig 23 is arranged at the top of the carrying support 21, and the carrying jig 23 is fixedly connected with the belt transmission device 22.

On the basis of the above embodiment, a shield 24 is disposed between the carrying fixture 23 and the carrying bracket 21 for placing.

On the basis of the above embodiment, the carrying fixture 23 is provided with column through holes in an array; the bottom of the carrying jig 23 is fixedly connected with a sliding table; the sliding table is in a concave shape; and a swinging plate is arranged on one side of the carrying jig 23 and used for neatly placing the detached chips to prevent the chip collision angle from being scrapped.

On the basis of the above embodiment, the chip hot-disassembling machine further comprises a controller, wherein the controller is arranged on the inner side of the base 1, and the controller is in control connection with the carrying part 2 and the heating part 3.

The working principle of the utility model is as follows: the circuit board of the chip to be disassembled is fixed on the carrying part 2 and is transported to the position under the heating part 3 through the carrying part 2, at the moment, the heater 32 is transported to the chip position by the action of the XZ moving mechanism 31, the heater 32 starts to act to heat the welding feet at the periphery of the chip to melt the chip, the sealing nozzle inner sleeve 332 is vacuumized through the air hole joint 332 in the heating process, the chip is firmly adsorbed by the sealing nozzle inner sleeve 332, the XZ moving mechanism 31 acts in the direction after the chip is melted to strip the chip from the circuit board, the automation degree of the whole process is high, the barrier rate is low, the use safety and the operation stability are good, the speed regulation is convenient, the heating temperature is controllable, other chemicals are not needed, the operation is convenient and fast, the working efficiency is greatly improved, and the market prospect is wide.

Finally, it should be noted that the above-mentioned embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the modifications and equivalents of the specific embodiments of the present invention can be made by those skilled in the art after reading the present specification, but these modifications and variations do not depart from the scope of the claims of the present application.

Claims

1. A chip hot dismantling machine is characterized in that: the device comprises a base (1), a carrying part (2) movably arranged on the base (1) and a heating part (3) which is perpendicular to the carrying part (2); the heating means (3) comprises an XZ moving mechanism (31); the XZ moving mechanism (31) is movably provided with a heater (32) for heating the chip welding foot; and a sealing nozzle external member (33) is arranged at the output end of the heater (32) and used for grabbing and melting the chip after the welding leg while guiding the airflow.

2. The die thermal stripper as defined in claim 1, wherein the sealing sleeve assembly (33) comprises an outer sealing sleeve (331) and an inner sealing sleeve (332) coaxially arranged with the outer sealing sleeve (331); the inner sealing mouth sleeve (332) is connected with the outer sealing mouth sleeve (331) through an array of fasteners.

3. The chip thermal dismantling machine according to claim 2, wherein an air hole joint (333) is provided between said inner nozzle sealing sleeve (332) and said outer nozzle sealing sleeve (331), and a column blind hole is provided inside said inner nozzle sealing sleeve (332); and the air hole joint (333) is communicated with the column blind hole.

4. The chip thermal dismantling machine according to claim 3, wherein said inner sealing-nozzle sleeve (332) is chamfered on its peripheral side.

5. The chip thermal dismantling machine according to claim 3, wherein said seal housing (331) is provided with a square through hole, and one end of said seal housing (331) is provided with a square projection.

6. The die thermal detacher of claim 1, wherein the heater (32) is a heat gun.

7. The chip thermal breaker according to claim 1, characterized in that said carrier member (2) comprises a carrier support (21) arranged inside said base (1), a belt drive (22) fixedly arranged on said carrier support (21); and the carrying jig (23) is arranged at the top of the carrying support (21), and the carrying jig (23) is fixedly connected with the belt transmission device (22).

8. The machine for thermal de-bonding of chips according to claim 7, characterized in that a shield (24) is provided between the carrier jig (23) and the carrier support (21).

9. The thermal chip breaker according to claim 8, wherein the carrier fixture (23) is provided with column through holes in an array; the bottom of the carrying jig (23) is fixedly connected with a sliding table; the sliding table is in a concave shape.

10. The thermal chip breaker according to claim 1, further comprising a controller disposed inside the base (1), wherein the controller is in control connection with the carrier member (2) and the heating member (3).