CN215773561U

CN215773561U - Microphone packaging structure, microphone device and electronic equipment

Info

Publication number: CN215773561U
Application number: CN202121905967.6U
Authority: CN
Inventors: 刘波
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2022-02-08
Anticipated expiration: 2031-08-13

Abstract

The utility model relates to a microphone packaging structure, a microphone device and an electronic device; the microphone packaging structure includes: a substrate and a housing; the substrate is provided with a surface, the surface comprises a raised part positioned in the middle area, a ring platform positioned in the edge area and lower than the raised part, and a transition surface, and the transition surface is connected with the raised part and the ring platform; the shell has the roof and centers on the roof extends the lateral wall that sets up, the roof with the base plate sets up relatively, be provided with the stair structure on the internal surface of lateral wall, the stair structure include the step face and with the step side that the step face is connected, step face butt is in the uplift is on the surface, the step side centers on the outside of transition face, just the step side with ring platform welded connection. The utility model has the technical effects that the substrate can be protected in the process of forming the microphone packaging structure, and the failure probability of the microphone is reduced.

Description

Microphone packaging structure, microphone device and electronic equipment

Technical Field

The present invention relates to the field of electroacoustic technology, and more particularly, to a microphone package structure, a microphone device, and an electronic apparatus.

Background

Micro-Electro-Mechanical systems (MEMS) is a miniaturized Mechanical and electromechanical component manufactured by Micro-fabrication technology, and in use, it is usually packaged with an Integrated Circuit (ASIC) chip in a microphone package structure by a corresponding technology to form a MEMS microphone device. The MEMS microphone chip may sense an acoustic signal through vibration of the diaphragm, thereby converting the acoustic signal into an electrical signal. At present, the MEMS microphone device can be assembled into different types of electronic devices such as mobile phones, tablet computers, notebook computers, VR devices, and smart wearable devices, and the application thereof is very wide.

When the substrate and the shell are welded by soldering paste, the melted soldering paste can climb along the side wall of the shell at the welding position of the substrate and the shell, and then the substrate is damaged. When the substrate is damaged by external influence, electronic elements such as an MEMS microphone chip carried on the substrate are also affected, which increases the failure probability of the MEMS microphone device and reduces the operation stability thereof.

Therefore, it is very necessary to provide a new technical solution for a microphone package structure to solve the problems in the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a microphone packaging structure, a microphone device and a new technical scheme of electronic equipment.

According to a first aspect of the present invention, a microphone package structure is provided. The microphone packaging structure includes:

the substrate is provided with a surface, the surface comprises a raised part positioned in a middle area, a ring platform positioned in an edge area and lower than the raised part, and a transition surface, and the transition surface is connected with the raised part and the ring platform;

the shell, the shell has the roof and centers on the roof extends the lateral wall that sets up, the roof with the base plate sets up relatively, be provided with the stair structure on the internal surface of lateral wall, the stair structure include the step face and with the step side that the step face is connected, step face butt is in the uplift is on the surface, the step side centers on the outside of transition face, just the step side with ring platform welded connection.

Optionally, the lower ends of the side surfaces of the steps are turned outwards to form connecting parts, and the connecting parts are fixed on the ring tables through soldering paste in a welding mode.

Optionally, the surface of the ridge is a planar structure.

Optionally, the ring platform is of a planar structure, the transition surface is of a straight-wall structure, and the transition surface and the longitudinal section of the ring platform are in an L shape.

Optionally, the step surface is of a planar structure, and the step side surface is of a plane, inclined or arc structure.

According to a second aspect of the present invention, a microphone arrangement is provided. The microphone device comprises the microphone packaging structure, a MEMS microphone chip and an ASIC chip;

the substrate and the shell are enclosed to form an accommodating cavity, and the MEMS microphone chip and the ASIC chip are arranged in the accommodating cavity.

Optionally, the MEMS microphone chip includes a substrate having a back cavity and a diaphragm disposed on the substrate;

and one end of the substrate, which is far away from the vibrating diaphragm, is fixedly arranged on the base plate and is electrically connected with the circuit layer in the base plate.

Optionally, the substrate is provided with at least one sound hole, and the sound hole is communicated with the back cavity of the MEMS microphone chip.

Optionally, the ASIC chip is fixedly disposed on the substrate and electrically connected to the circuit layer in the substrate, and a protective adhesive is coated outside the ASIC chip.

According to a third aspect of the present invention, an electronic device is provided. The electronic equipment comprises the microphone device.

The microphone packaging structure provided by the embodiment of the utility model is characterized in that the matching structure of the welding position of the substrate and the shell is improved, and the welding position of the shell and the substrate is designed to be step-shaped, so that the welded solder paste can stay at the outer edge of the substrate, and the solder paste can be prevented from climbing onto the surface of the substrate along the side wall of the shell while the shell and the substrate are electrically connected, thereby reducing the risks of tin climbing and splashing and improving the reliability of the product. The microphone packaging structure is beneficial to reducing the failure probability of the MEMS microphone device and improving the working stability of the MEMS microphone device.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description, serve to explain the principles of the utility model.

Fig. 1 is a schematic structural diagram of a conventional microphone device.

Fig. 2 is a second schematic structural diagram of a conventional microphone device.

Fig. 3 is a schematic structural diagram of a microphone package structure according to an embodiment of the present invention.

Fig. 4 is a schematic structural view of the housing of fig. 3.

Description of reference numerals:

1-substrate, 11-bump, 12-ring table, 13-transition surface, 2-shell, 21-top wall, 22-side wall, 23-step surface, 24-step side surface, 241-connecting part, 3-MEMS microphone chip, 31-substrate, 32-vibrating diaphragm, 4-ASIC chip, 5-sound hole, 6-protective adhesive and 7-tin paste.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses.

Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

The microphone packaging structure provided by the embodiment of the utility model can be used for manufacturing an MEMS microphone device. The MEMS microphone device can be applied to various electronic products such as mobile phones, notebook computers, tablet computers, VR equipment and intelligent wearable equipment.

As shown in fig. 3 and 4, a microphone package structure according to an embodiment of the present invention includes a substrate 1 and a housing 2; the substrate 1 has a surface, and the surface includes a raised part 11 located in the central region, a ring platform 12 located in the edge region and lower than the raised part 11, and a transition surface 13, the transition surface 13 connects the raised part 11 and the ring platform 12; the shell 2 has a top wall 21 and centers on the lateral wall 22 that top wall 21 extends the setting, top wall 21 with base plate 1 sets up relatively, be provided with the stair structure on the internal surface of lateral wall 22, the stair structure include step face 23 and with step side 24 that step face 23 is connected, step face 23 butt is in on the surface of uplift 11, step side 23 centers on the outside of transition face 13, just step side 24 with loop platform 12 welded connection.

The microphone packaging structure provided by the embodiment of the utility model is an improved matching structure at the welding position of the substrate 1 and the shell 2. Wherein, will the shell 2 with the position of base plate 1 welded designs respectively for the step form to can make welded tin cream 7 stop in the outward flange position department of base plate 1, like this, will the shell 2 with when base plate 1 accomplishes electrical connection, can also separate tin cream 7 edge the climbing takes place for the lateral wall of shell 2, has reduced and has climbed tin and the risk of spattering the tin, has improved the reliability of product. When the microphone packaging structure is applied to manufacturing the MEMS microphone device, the failure probability of the MEMS microphone device is reduced, and the working stability of the MEMS microphone device is improved.

As shown in fig. 1 and 2, in the conventional MEMS microphone package structure, the lower end of the sidewall of the housing 2 and the edge of the substrate 1 are connected by soldering with solder paste. The prior art is easy to cause two failure modes: (1) in the packaging process, the solder paste 7 is easy to climb along the side wall of the housing 2 in a molten state due to the large amount of solder paste and the like at the corner position of the housing 2, and after the solder paste is in contact with the MEMS microphone chip 3 carried on the substrate 1, the MEMS microphone chip 3 may leak electricity, and the product may fail. (2) In the reflow melting state of the solder paste, gas generated by internal soldering flux, water vapor and the like is not removed in time, so that the soldering flux, the solder paste and the like splash onto the MEMS microphone chip 3 to cause the microphone device to lose efficacy.

The scheme provided by the embodiment of the utility model can well overcome the above-mentioned failure problem. As shown in fig. 3 and 4, the recessed ring 12 is disposed at an edge of the substrate 1, the ring 12 is used for being soldered to the sidewall of the housing 2, and the step structure disposed on the sidewall 22 of the housing 2 is matched with the ring 12 and the transition surface 13 on the substrate 1, so that the solder paste 7 can be stopped and stopped at an outer edge region of the substrate 1, thereby effectively preventing the solder paste 7 from climbing along the sidewall of the housing 2, reducing risks of tin climbing and splashing, and improving reliability of the product.

According to the scheme provided by the embodiment of the utility model, the substrate can be protected when the shell 2 and the substrate 1 are welded and fixed, so that the probability of failure of the MEMS microphone device is reduced.

In the embodiment of the present invention, the substrate 1 may be a circuit board known in the art, such as a PCB, and the like, which is not limited in the present invention. The circuit design of the microphone device can be realized by adopting the circuit board on the substrate 1.

In the embodiment of the present invention, the structure of the housing 2 is designed to: includes a top wall 21 opposed to the substrate 1, and a side wall 22 extending from a peripheral edge of the top wall 21 toward the substrate 1. I.e. a semi-enclosed structure of the housing 2 is enclosed by the side walls 22 and the top wall 21. The substrate 1 is fixedly arranged at the opening end of the shell 2, and the substrate and the shell jointly enclose to form a microphone packaging structure with a closed space.

The housing 2 may be made of a metal material, for example, to ensure that the formed microphone packaging structure has an electromagnetic shielding effect. As shown in fig. 3, the working performance of the MEMS microphone chip 3 and the ASIC chip 4 inside the microphone device can be protected from external influences, and the whole microphone device can work normally.

Of course, the housing 2 may be made of other materials known in the art, and the present invention is not limited thereto.

In an alternative example of the utility model, as shown in fig. 3 and 4, the lower end of the step side 24 is turned inside out to form a connection 241 (i.e. a corner of the housing 2), and the connection 241 may be fixed to the ring stand 12 by soldering with solder paste. This makes it possible to connect the housing 2 and the base plate 1 together.

In an alternative example of the present invention, the surface of the ridge portion 11 has a planar structure. The design ensures that the step surface 23 can be stably abutted against the step surface, the formed matching relation is simple, and the assembly is also convenient.

On the surface of the base plate 1, the elevations 11 are higher than the ring platform 12, which are connected by the transition surface 13. Since the side wall of the housing 2 is soldered to the lower ring stand 12, it helps to eliminate the phenomenon that the solder paste 7 climbs along the side wall of the housing 2.

In an alternative example of the present invention, the annular platform 12 has a planar structure, the transition surface 13 has a straight-wall structure, and the longitudinal sections of the transition surface 13 and the annular platform 12 are L-shaped. The structure is easy to manufacture, is convenient to match with the step structure arranged on the inner surface of the side wall of the shell 2, and separates solder paste at the edge position of the substrate 1 without spreading to the surface of the substrate 1.

In an alternative example of the present invention, the step surface 23 is a planar structure, and the step side surface 24 is a planar, inclined or arc surface structure. The step surface 23 can be stably lapped on the bulge portion 11. The step side surface 24 is arranged around the outer side of the transition surface 13.

On the other hand, the embodiment of the utility model also provides a microphone device.

As shown in fig. 3, the microphone device includes the microphone package structure as described above, and a MEMS microphone chip 3 and an ASIC chip 4; the substrate 1 and the shell 2 enclose to form an accommodating cavity, and the MEMS microphone chip 3 and the ASIC chip 4 are arranged in the accommodating cavity. The MEMS microphone chip 3 and the ASIC chip 4 may be protected by the housing 2 and the substrate 1.

Wherein, the MEMS microphone chip 3 includes a substrate 31 having a back cavity and a diaphragm 32 disposed on the substrate 31; one end of the substrate 31, which is far away from the diaphragm 32, is fixedly arranged on the substrate 1 and is electrically connected with the circuit layer in the substrate 1.

At least one sound hole 5 is formed in the substrate 1, and the sound hole 5 is communicated with a back cavity of the MEMS microphone chip 3.

External air flow and sound waves can reach the inside of the MEMS microphone chip 3 through the sound hole 5 and contact the diaphragm 32, so that the MEMS microphone chip 3 collects sound wave information. The MEMS microphone chip 3 is a transducer that converts a sound signal into an electrical signal. The MEMS microphone chip 3 can be fabricated using, for example, a MEMS (micro electro mechanical system) process.

The acoustic hole 5 may have a through-hole structure or another structure penetrating the substrate 1. The sound hole 5 can be a circular hole, a square hole, a rectangular hole, an elliptical hole, a triangular hole, a rhombic hole, a parallelogram hole or the like. The technical effect of the utility model can be realized by various forms of sound holes, the processing and the manufacturing are more facilitated, and the practicability and the reliability are higher.

The substrate 31 of the MEMS microphone chip 3 may be fixedly connected to the substrate 1 by using an adhesive, for example. The connecting mode is simple, the stability is good, and the cost is lower.

In addition to the MEMS microphone chip 3 described above, an ASIC chip 4 is included in the microphone device. The ASIC chip 4 is connected to the MEMS microphone chip 3, so that the electrical signal output by the MEMS microphone chip 3 can be transmitted to the ASIC chip 4, processed and output by the ASIC chip 4.

The MEMS microphone chip 3 and the ASIC chip 4 may be electrically connected through a metal wire (bonding wire) to achieve conduction therebetween. Of course, the MEMS microphone chip 3 and the ASIC chip 4 can be connected by a circuit layout in the substrate 1 in a flip-chip manner.

The ASIC chip 4 is fixedly disposed on the substrate 1 (for example, may be fixedly connected to the substrate 1 by an adhesive) and electrically connected to a circuit layer in the substrate 1, and a protective adhesive 6 is coated outside the ASIC chip 4. The protective adhesive 6 can protect the ASIC chip 4 from water, dust and the like, so that the service life of the ASIC chip is prolonged.

In another aspect, the present invention also provides an electronic device, which includes the microphone apparatus as described above.

The electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, an intelligent wearable device, and the like, which is not limited in this respect.

Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for the purpose of illustration and is not intended to limit the scope of the utility model. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the utility model. The scope of the utility model is defined by the appended claims.

Claims

1. A microphone package structure, comprising:

the substrate (1), the substrate (1) has a surface, and the surface includes the uplift (11) located in the central region, locate at the marginal zone and lower than the loop platform (12) of the uplift (11) and transition surface (13), the transition surface (13) connects the uplift (11) with the loop platform (12);

shell (2), shell (2) have roof (21) and center on roof (21) extend lateral wall (22) that sets up, roof (21) with base plate (1) sets up relatively, be provided with stair structure on the internal surface of lateral wall (22), stair structure include step face (23) and with step side (24) that step face (23) are connected, step face (23) butt is in on the surface of uplift portion (11), step side (24) are around the outside of transition face (13), just step side (24) with loop platform (12) welded connection.

2. The microphone package structure according to claim 1, wherein the lower end of the step side (24) is turned outward to form a connection portion (241), and the connection portion (241) is fixed to the land (12) by soldering with solder paste.

3. Microphone packaging structure according to claim 1, characterized by the fact that the surface of the bump (11) is planar.

4. The microphone packaging structure according to claim 1, wherein the ring platform (12) is a planar structure, the transition surface (13) is a straight-wall structure, and the transition surface (13) and the longitudinal section of the ring platform (12) are L-shaped.

5. The microphone package structure according to claim 1, wherein the step surface (23) is a planar structure, and the step side surface (24) is a planar, inclined or arc surface structure.

6. Microphone arrangement, characterized by comprising a microphone package structure according to any of claims 1-5, and a MEMS microphone chip (3) and an ASIC chip (4);

the substrate (1) and the shell (2) are enclosed to form an accommodating cavity, and the MEMS microphone chip (3) and the ASIC chip (4) are arranged in the accommodating cavity.

7. Microphone arrangement according to claim 6, characterized by the fact that the MEMS microphone chip (3) comprises a substrate (31) with a back cavity and a diaphragm (32) arranged on the substrate (31);

one end, far away from the vibrating diaphragm (32), of the substrate (31) is fixedly arranged on the substrate (1) and is electrically connected with the circuit layer in the substrate (1).

8. The microphone device as claimed in claim 7, wherein the substrate (1) is provided with at least one sound hole (5), and the sound hole (5) is communicated with the back cavity of the MEMS microphone chip (3).

9. Microphone arrangement according to claim 6, characterized by the fact that the ASIC chip (4) is fixedly arranged on the substrate (1) and electrically connected to the wiring layer inside the substrate (1), the ASIC chip (4) being coated with a protective glue (6).

10. An electronic device, characterized in that it comprises a microphone arrangement according to any of claims 6-9.