CN215771197U - Forming device for processing light-emitting diode - Google Patents
Forming device for processing light-emitting diode Download PDFInfo
- Publication number
- CN215771197U CN215771197U CN202122200443.3U CN202122200443U CN215771197U CN 215771197 U CN215771197 U CN 215771197U CN 202122200443 U CN202122200443 U CN 202122200443U CN 215771197 U CN215771197 U CN 215771197U
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- China
- Prior art keywords
- plate
- forming device
- emitting diode
- oven
- frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001746 injection moulding Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 21
- 238000001035 drying Methods 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000007599 discharging Methods 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 5
- 230000007306 turnover Effects 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims 2
- 229920003023 plastic Polymers 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007711 solidification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
Images
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a forming device for processing a light-emitting diode in the technical field of the light-emitting diode, which comprises an oven, wherein a lead screw transmission assembly is arranged on one side outside the oven, a moving block is arranged on the lead screw transmission assembly, a rotating motor is arranged in the moving block, a rotating frame is arranged on the output end of the rotating motor, a discharging plate and a spot gluing plate are symmetrically arranged on one side of the rotating frame, an injection molding plate is arranged at the top in the oven, support frames are arranged at four corners of the bottom of the injection molding plate, and a hydraulic lifting frame is arranged at the bottom of each support frame; according to the utility model, by designing the integrated diode processing and forming device consisting of the material placing plate, the glue dispensing plate and the injection molding plate drying oven, the process of diode packaging and forming can be rapidly completed, the operation of continuously replacing equipment in the traditional processing process is omitted, the time is greatly saved, and the production efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of light emitting diodes, in particular to a forming device for processing a light emitting diode.
Background
The light emitting diode is a common light emitting device, releases energy through the recombination of electrons and holes to emit light, has wide application in the field of illumination, can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like.
When the light-emitting diode is cured and molded, the existing equipment is in an independent and separated structure in the processes of feeding, dispensing and drying, so that the equipment needs to be continuously replaced, time is wasted, and the production efficiency is reduced. Therefore, one skilled in the art provides a forming apparatus for processing light emitting diodes to solve the above problems in the background art.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a forming device for processing light emitting diodes, so as to solve the problems of the prior art.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a forming device is used in LED processing, includes the oven, oven outside one side is provided with screw drive assembly, the last movable block that is provided with of screw drive assembly, be provided with the rotating electrical machines in the movable block, be provided with the swivel mount on the rotating electrical machines output, swivel mount bilateral symmetry is provided with blowing board and some offset plate, the top is provided with the injection molding board in the oven, injection molding board bottom four corners department is provided with the support frame, the support frame bottom is provided with the hydraulic pressure crane.
As a still further scheme of the utility model: the lead screw transmission assembly comprises a lead screw, a sliding rod and a driving motor, the moving block is connected with the lead screw and the sliding rod in a sliding mode, the rotating motor is embedded in the moving block, and the rotating frame is connected with the output end of the rotating motor through a key.
As a still further scheme of the utility model: the dispensing plate and the material discharging plate are fixedly installed with the rotating frame through screws, a material sucking hole is formed in the material discharging plate, and the bottom of the material sucking hole is connected with a negative pressure pump through a pipeline.
As a still further scheme of the utility model: the bottom of the glue dispensing plate is spliced with a glue dispensing nozzle, the top of the glue dispensing nozzle is communicated with a glue source box through a pipeline, a pressure pump is arranged in the glue source box, and the hydraulic lifting frame and the bottom of the drying oven are fixedly installed through screws.
As a still further scheme of the utility model: the support frame with the welding of injection molding board bottom, hydraulic lifting frame top with the welding of support frame bottom, the shaping has the shaping chamber on the injection molding board, the bottom sliding connection has a die carrier in the shaping chamber, die carrier bottom middle part is fixed with demolding electric putter.
As a still further scheme of the utility model: and a turnover sealing door plate is mounted on the inner wall of the oven through a hinge, and a heating and drying assembly which is fixedly penetrated through the inner wall of the oven is arranged right below the turnover sealing door plate.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, by designing the integrated diode processing and forming device consisting of the material placing plate, the glue dispensing plate and the injection molding plate drying oven, the process of diode packaging and forming can be rapidly completed, the operation of continuously replacing equipment in the traditional processing process is omitted, the time is greatly saved, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front cross-sectional view of an oven and injection molded plate of the present invention;
FIG. 3 is a schematic view showing the connection relationship between the feeding plate, the dispensing plate, the rotating frame and the screw transmission assembly according to the present invention;
FIG. 4 is a bottom view of the injection molded plate of the present invention.
In the figure: 1-baking oven; 2-injection molding a plate; 3-forming a cavity; 4-discharging the plate; 5-material suction hole; 6-glue dispensing plate; 7-a lead screw drive assembly; 8-a hydraulic lifting frame; 9-heating and drying the components; 10-turning the sealing door plate; 11-top mould frame; 12-demoulding electric push rod; 13-dispensing nozzles; 14-a negative pressure pump; 15-glue source box; 16-a moving block; 17-a rotating electrical machine; 18-a rotating frame; 19-support frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, in the embodiment of the utility model, a forming device for processing a light emitting diode includes an oven 1, a lead screw transmission assembly 7 is arranged on one side of the outside of the oven 1, a moving block 16 is arranged on the lead screw transmission assembly 7, a rotating motor 17 is arranged in the moving block 16, a rotating frame 18 is arranged on the output end of the rotating motor 17, a material discharging plate 4 and a point rubber plate 6 are symmetrically arranged on one side of the rotating frame 18, an injection molding plate 2 is arranged at the top in the oven 1, supporting frames 19 are arranged at four corners of the bottom of the injection molding plate 2, and a hydraulic lifting frame 8 is arranged at the bottom of the supporting frame 19.
The lead screw transmission assembly 7 comprises a lead screw, a slide rod and a driving motor, a movable block 16 is in sliding connection with the lead screw and the slide rod, a rotating motor 17 is embedded in the movable block 16, a rotating frame 18 is in key connection with the output end of the rotating motor 17, the lead screw transmission assembly 7 is used for moving the dispensing equipment and the blanking equipment, and the rotating frame 18 and the rotating motor 17 are used for exchanging the positions of the dispensing equipment and the blanking equipment; the dispensing plate 6 and the discharging plate 4 are fixedly installed with the rotating frame 18 through screws, material suction holes 5 are formed in the discharging plate 4, the bottoms of the material suction holes 5 are connected with a negative pressure pump 14 through pipelines, negative pressure is generated in the material suction holes 5 when the negative pressure pump 14 sucks, the diode support can be sucked tightly and suspended, and then the diode support is placed in the injection molding hole; a glue dispensing nozzle 13 is inserted into the bottom of the glue dispensing plate 6, the top of the glue dispensing nozzle 13 is communicated with a glue source box 15 through a pipeline, a pressure pump is arranged in the glue source box 15, a hydraulic lifting frame 8 and the bottom of the drying oven 1 are fixedly installed through screws, epoxy resin is arranged in the glue source box 15 and is provided with an anti-solidification assembly, and the hydraulic lifting frame 8 is identical to a common lifting folding frame in structure and principle; the support frame 19 is welded with the bottom of the injection molding plate 2, the top of the hydraulic lifting frame 8 is welded with the bottom of the support frame 19, the molding cavity 3 is formed on the injection molding plate 2, the bottom in the molding cavity 3 is connected with a top mold frame 11 in a sliding mode, a mold stripping electric push rod 12 is fixed in the middle of the bottom end of the top mold frame 11, and the mold stripping electric push rod 12 takes the bottom structure of the oven 1 as a support after the injection molding plate 2 is contracted into the oven 1; the hinge is installed in oven 1 inner wall and is overturned sealed door plant 10, is provided with under the sealed door plant 10 of upset and runs through fixed heating drying assembly 9 with oven 1 inner wall, and the sealed door plant 10 of upset is the same with the structure of common automatic folding door, realizes opening and shutting of door plant through the push rod mechanism of both sides.
The working principle of the utility model is as follows: when the device is used specifically, an external power supply and an external control device are connected, a feeding device puts a light-emitting diode support formed by pressure welding into a material suction hole 5 of a material placing plate 4, the negative pressure generated by a negative pressure pump 14 tightly sucks the material, a glue source box 15 in a glue dispensing plate 6 is aligned with a forming cavity 3 of a bottom injection molding plate 2 through a glue dispensing nozzle 13, epoxy resin is injected, a rotating motor 17 drives a rotating frame 18 to rotate, the glue dispensing plate 6 and the material placing plate 4 are switched, the diode support is pressed into the epoxy resin, the negative pressure pump 14 stops, the material is released, a screw rod transmission assembly 7 lifts the material placing plate 4, a hydraulic lifting frame 8 drives the injection molding plate 2 to move downwards into an oven 1 through a supporting frame 19, a turnover sealing door plate 10 folds and places the door plate downwards through electric push rods arranged at two sides, the door plates at the two sides are clamped and sealed, the injection molding plate 2 is sealed at the bottom of the oven 1, and a heating and drying assembly 9 passes through external control equipment, adjust the temperature and the time of stoving solidification, after the epoxy resin solidification, the work of demolding electric putter 12, regard as the support with 1 substructure of oven, the bottom output promotes a die carrier 11 and releases the work piece in the die cavity 3 to 2 tops of injection molding board, then hydraulic pressure crane 8 rises injection molding board 2 to 1 tops of oven, the unloading subassembly, sweep the shaping diode at top to collection device in can, the integral type processing design of this device, can accomplish diode encapsulation fashioned technology fast, the operation of traditional processing technology change equipment in succession has been saved, time has been practiced thrift greatly, the efficiency of production has been improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. The utility model provides a forming device is used in LED processing, includes oven (1), its characterized in that: the improved drying oven is characterized in that a lead screw transmission assembly (7) is arranged on one side of the outer portion of the drying oven (1), a moving block (16) is arranged on the lead screw transmission assembly (7), a rotating motor (17) is arranged in the moving block (16), a rotating frame (18) is arranged at the output end of the rotating motor (17), a material discharging plate (4) and a spot rubber plate (6) are symmetrically arranged on one side of the rotating frame (18), an injection molding plate (2) is arranged at the top of the drying oven (1), support frames (19) are arranged at four corners of the bottom of the injection molding plate (2), and a hydraulic lifting frame (8) is arranged at the bottom of each support frame (19).
2. The forming device for processing the light-emitting diode as claimed in claim 1, wherein: the screw rod transmission assembly (7) comprises a screw rod, a sliding rod and a driving motor, the moving block (16) is connected with the screw rod and the sliding rod in a sliding mode, the rotating motor (17) is embedded in the moving block (16), and the rotating frame (18) is connected with the output end of the rotating motor (17) through a key.
3. The forming device for processing the light-emitting diode as claimed in claim 2, wherein: the dispensing plate (6) and the material discharging plate (4) are fixedly installed with the rotating frame (18) through screws, a material suction hole (5) is formed in the material discharging plate (4), and the bottom of the material suction hole (5) is connected with a negative pressure pump (14) through a pipeline.
4. The forming device for processing the light-emitting diode as claimed in claim 3, wherein: the bottom of the dispensing plate (6) is spliced with a dispensing nozzle (13), the top of the dispensing nozzle (13) is communicated with a glue source box (15) through a pipeline, a pressure pump is arranged in the glue source box (15), and the hydraulic lifting frame (8) and the bottom of the drying oven (1) are fixedly installed through screws.
5. The forming device for processing the light-emitting diode as claimed in claim 4, wherein: support frame (19) with mould plastics board (2) bottom welding, hydraulic pressure crane (8) top with support frame (19) bottom welding, the shaping has one-tenth die cavity (3) on the board of moulding plastics (2), bottom sliding connection has top die carrier (11) in one-tenth die cavity (3), top die carrier (11) bottom middle part is fixed with demolding electric putter (12).
6. The forming device for processing the light-emitting diode as claimed in claim 5, wherein: the drying oven is characterized in that a turnover sealing door panel (10) is mounted in the inner wall of the drying oven (1) through a hinge, and a heating and drying assembly (9) which is fixedly penetrated through the inner wall of the drying oven (1) is arranged right below the turnover sealing door panel (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122200443.3U CN215771197U (en) | 2021-09-13 | 2021-09-13 | Forming device for processing light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122200443.3U CN215771197U (en) | 2021-09-13 | 2021-09-13 | Forming device for processing light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215771197U true CN215771197U (en) | 2022-02-08 |
Family
ID=80086636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122200443.3U Expired - Fee Related CN215771197U (en) | 2021-09-13 | 2021-09-13 | Forming device for processing light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215771197U (en) |
-
2021
- 2021-09-13 CN CN202122200443.3U patent/CN215771197U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220208 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |