CN215771133U - Package and lead frame - Google Patents
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- CN215771133U CN215771133U CN202122035934.7U CN202122035934U CN215771133U CN 215771133 U CN215771133 U CN 215771133U CN 202122035934 U CN202122035934 U CN 202122035934U CN 215771133 U CN215771133 U CN 215771133U
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Abstract
The utility model discloses a package body and a lead frame. The lead frame includes: the lead frame comprises a plurality of lead frame units, wherein a welding area and a non-welding area outside the welding area are divided on the upper surface of each lead frame unit, a rough surface is arranged on the non-welding area, and the welding area is not provided with the rough surface; the lead frame unit comprises a base island and a plurality of pins arranged around the base island, and the welding areas are arranged on the base island and/or the pins; at least one routing welding part is arranged in the welding area, and the routing welding part is electrically connected with the chip through a bonding wire. The utility model provides a packaging body and a lead frame, which can improve the grabbing strength of a plastic packaging material and the surface of the frame on one hand, improve the welding effect on the other hand, avoid the problems of wire bonding, wire flying, infirm welding and the like caused by rough surface, and avoid the problems of cavities, insufficient welding and the like generated in flip-chip welding.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a packaging body and a lead frame.
Background
In order to improve the gripping strength between the plastic package material and the surface of the frame and to enable the plastic package material to be firmly combined with the surface of the frame, the surface of the lead frame needs to be roughened before plastic package.
In the prior art, the surface of the lead frame is generally roughened by micro-etching or oxidation. Specifically, the copper surface of the lead frame is generally treated with a chemical agent to form a rough surface. However, the rough surface manufactured by the roughening process is the copper surface of the whole frame, that is, the roughening process is usually used for roughening the whole surface of the lead frame. And the coarsened surface is coarsened by chemical agents, and the coarsened depth is shallow and is not completely controllable.
Furthermore, the lead frame of the routing product has gold and silver plating layers, so the roughened surface can be covered by the plating layers, and the influence of the whole roughened lead frame on the plastic package of the routing product is small. Flux spreads over gold and silver plating, so flip-chip products typically use bare copper frames as lead frames. However, the roughened copper surface is not favorable for wetting the solder balls by the soldering flux, and the roughened copper surface is not well combined with the melted solder, so that cavities are easily generated, so that the whole roughened lead frame can improve the grabbing strength of the plastic package material and the frame surface of the flip product, but is not friendly to the solder, and therefore, the whole roughened lead frame has great influence on the welding effect of the flip product.
Therefore, it is desirable to provide a package and a lead frame to overcome the above-mentioned drawbacks.
It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention and for the understanding of those skilled in the art. These solutions are not considered to be known to the person skilled in the art merely because they are set forth in the background section of the utility model.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a package and a lead frame, which can improve the bonding strength between a molding compound and the surface of the lead frame, improve the soldering effect, and avoid the problems of wire bonding, wire flying, poor soldering, etc. caused by rough surface, and avoid the problems of void, insufficient soldering, etc. caused by flip chip bonding.
To achieve the above object, the present invention provides a lead frame comprising: the lead frame comprises a plurality of lead frame units, wherein a welding area and a non-welding area outside the welding area are divided on the upper surface of each lead frame unit, a rough surface is arranged on the non-welding area, and the welding area is not provided with the rough surface.
As a preferred embodiment, the lead frame unit includes a base island and a plurality of leads disposed around the base island, and the land is disposed on the base island and/or the leads.
In a preferred embodiment, at least one wire bonding portion is disposed in the bonding region, and the wire bonding portion is electrically connected to the chip through a bonding wire.
As a preferred embodiment, the lead frame unit includes a plurality of leads, each of which is provided with the land and the non-land, and on which the non-land and the land are arranged close to and away from the cutting line of the lead frame, respectively.
In a preferred embodiment, at least one pad is provided in the bonding area, on which pad a chip is flip-chip bonded.
As a preferred embodiment, the method further comprises: the frame, the frame encloses to be established a plurality ofly the outside of lead frame unit, every the lead frame unit still includes a plurality of splice bars, and is a plurality of the splice bar is with a plurality of the pin is corresponding, every the splice bar is used for with the frame with correspond the pin links to each other.
In a preferred embodiment, the rough surface is formed by an ablation trench formed by high-speed pulsing of a laser.
In a preferred embodiment, the laser high-speed pulse is emitted by a laser with a power of 290-300 watts, and the wavelength of the laser high-speed pulse is 530-535 nm.
In a preferred embodiment, the ablation trench has a depth of 0.035mm to 0.05 mm.
A package, comprising: the lead frame as described above; and plastically packaging the plastic packaging body of the lead frame, wherein the plastic packaging body and the rough surface form a locking structure.
The utility model has the technical effect that the lead frame is provided with the lead frame unit, the lead frame unit is provided with the welding area and the non-welding area, the non-welding area is provided with the rough surface, and the welding area does not have the rough surface. During packaging, the non-welding area is jointed with the plastic packaging material, so that the grabbing strength of the plastic packaging material and the surface of the frame is improved through the rough surface, and the plastic packaging material is combined with the surface of the frame more firmly. And because the welding area does not have the rough surface, the copper surface of the welding area is well combined with the melted soldering tin, the problems of cavities, insufficient soldering and the like generated during flip-chip welding can be avoided, and the soldering flux is favorable for wetting the solder balls, so that the welding effect is good. Furthermore, the problems of wire bonding and flying, infirm welding and the like caused by rough surface of the welding area can be avoided. That is, in the lead frame according to the embodiment of the present invention, the surface of the lead frame unit is divided into the welding area and the non-welding area, and only the non-welding area is roughened, so that the surface of the lead frame unit is partially roughened, rather than the entire surface is roughened in the prior art. So can improve the plastic envelope material on the one hand and the surperficial intensity of grabbing of frame, on the other hand improves the welding effect, avoids producing the cavity. Therefore, the utility model provides a package body and a lead frame, which can improve the grabbing strength of a plastic package material and the surface of the frame on one hand, improve the welding effect on the other hand, avoid the problems of wire bonding, wire flying, infirm welding and the like caused by rough surface, and avoid the problems of cavities, insufficient welding and the like generated in flip-chip welding.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a top view of a lead frame according to an embodiment of the utility model.
Fig. 2 is a top view of a lead frame unit according to a first embodiment of the present invention.
Fig. 3 is a top view of a lead frame unit according to a second embodiment of the present invention.
Fig. 4 is a state diagram of a lead frame body according to an embodiment of the utility model.
Fig. 5 is a diagram illustrating an ablated state of a lead frame body according to an embodiment of the utility model.
Fig. 6 is a schematic structural diagram of an ablation trench according to an embodiment of the present invention.
Description of reference numerals:
11. a lead frame unit; 13. an outer frame; 15. connecting ribs; 16. a pin; 17. a pad; 18. a non-welding area; 19. a welding zone; 21. a base island; 25. a bonding wire; 26. a chip; 27. rough surface; 28. the slot is ablated.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the utility model. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Specifically, as shown in fig. 1, one embodiment of the present invention provides a lead frame. The lead frame includes: the lead frame unit comprises a plurality of lead frame units 11, wherein a welding area 19 and a non-welding area 18 positioned outside the welding area 19 are divided on the upper surface of each lead frame unit 11, a rough surface 27 is arranged on the non-welding area 18, and the rough surface 27 is not arranged on the welding area 19.
The technical scheme shows that: the lead frame of the embodiment of the present invention is provided with a lead frame unit 11. The lead frame unit 11 is provided with a land 19 and a non-land 18, the non-land 18 is provided with a rough surface 27, and the land 19 does not have the rough surface 27. During packaging, the non-soldering region 18 is bonded to the molding compound, so that the rough surface 27 improves the holding strength of the molding compound to the frame surface, and the molding compound is bonded to the frame surface more firmly. And because the welding area 19 does not have the rough surface 27, the copper surface of the welding area 19 is well combined with melted soldering tin, the problems of cavities, insufficient soldering and the like generated in the process of flip-chip welding can be avoided, and the soldering flux is favorable for wetting the soldering tin, so that the welding effect is good. Furthermore, the bonding pad 19 can avoid the problems of wire flying and poor bonding due to rough surface. That is, in the lead frame according to the embodiment of the present invention, the surface of the lead frame unit 11 is divided into the bonding region 19 and the non-bonding region 18, and only the non-bonding region 18 is roughened, so that the surface of the lead frame unit 11 is partially roughened, rather than being roughened in the prior art. So can improve the plastic envelope material on the one hand and the surperficial intensity of grabbing of frame, on the other hand improves the welding effect, avoids producing the cavity.
Further, the lead frame of the embodiment of the present invention includes a plurality of lead frame units 11. The plurality may be 2, 3, 4, etc., and this application does not specify. For example, as shown in fig. 1, the present application provides a lead frame. The lead frame comprises two lead frame units 11 defined by cutting lines W. Each lead frame unit 11 may be used to construct a package (semiconductor device) after dicing. Hereinafter, a structure of one lead frame unit 11 will be described as an example.
Further, the upper surface of each lead frame unit 11 is divided into a land 19 and a non-land 18 located outside the land 19. That is, the upper surface of each lead frame unit 11 is divided into a bonding area 19 and a non-bonding area 18. Further, the non-welded region 18 is provided with a rough surface 27. The rough surface 27 improves the bonding strength between the molding compound and the non-land area 18, so that the molding compound is bonded to the non-land area 18 more firmly. Further, the land 19 does not have the rough surface 27 thereon. That is, the surface of the welding area 19 is not roughened, so that the un-roughened copper surface is well combined with the melted soldering tin, the problems of cavities, insufficient soldering and the like generated in the flip-chip welding can be avoided, and the soldering flux is favorable for wetting the solder balls, so that the welding effect is good. Furthermore, the bonding pad 19 can avoid the problems of wire flying and poor bonding due to rough surface.
Further, the rough surface 27 is formed by an ablation groove 28. In particular, the ablation slots 28 may be reticulated. Of course, the ablation grooves 28 are not limited to a mesh shape, and may have other suitable shapes, for example, the ablation grooves 28 may have a stripe shape, a pattern shape, a cross shape, or the like.
Further, the ablation trench 28 is formed by laser high-speed pulsing. Specifically, the laser high-speed pulse is emitted by a laser with power of 290-300 watts, and the wavelength of the laser high-speed pulse is 530-535 nm. Therefore, the surface of the lead frame unit 11 is selectively roughened by laser, so that the roughening operation is more convenient and flexible. And the laser is used for carrying out the area selective coarsening on the lead frame, so that the cost can be reduced. Specifically, in order to satisfy the encapsulation needs of the flip-chip product among the prior art for the lead frame can improve the plastic envelope material on the one hand and the intensity of grabbing on frame surface, and on the other hand can improve the welding effect, avoids producing the cavity, generally selects to carry out the selectivity coarsing to the lead frame. More specifically, the areas which do not need to be roughened are covered by a chemical mask, and the areas which need to be roughened are roughened by chemical liquid. Such roughening process requires multiple dry film, exposure, and development processes, which increases the cost of the lead frame and is not favorable for the comprehensive competitiveness of the product. The operation of carrying out the selective coarsening of the region on the surface of the lead frame unit 11 through the laser is simple, and the operation processes of adding a plurality of dry films, exposing, developing and the like are avoided, so that the cost is lower. Furthermore, the coarsening of the lead frame does not need to use chemical liquid medicine, so that the secondary pollution to the lead frame is avoided. Moreover, the coarsening depth is controllable through the energy control of the laser, so that the coarsening depth is deeper than the conventional coarsening depth, and the plastic packaging material is easier to lock.
Further, in the overall roughening process of the prior art, the depth of the surface roughening cannot be precisely controlled, and thus a large roughness depth cannot be achieved, and the roughness depth can be precisely controlled by the laser roughening process, specifically, as shown in fig. 6, the depth of the ablation groove 28 is 0.035mm to 0.05 mm. So that the plastic package material can be better locked.
Further, fig. 2 is a schematic structural diagram of a lead frame according to the first embodiment of the present application. Fig. 3 is a schematic structural diagram of a lead frame according to a second embodiment of the present application. The first and second embodiments are described below in conjunction with fig. 2 and 3, respectively.
As shown in fig. 2, in one lead frame unit 11 of the first embodiment, the lead frame unit 11 includes a plurality of leads 16. The plurality may be 2, 3, 4, etc., and this application does not specify. As shown in fig. 2, for example, the lead frame unit 11 includes 6 leads 16. Further, each pin 16 is provided with a bonding area 19 and a non-bonding area 18. At least one pad 17 is provided in the land 19. The at least one may be 1 or more. The pad 17 is used for flip-chip bonding of the chip 26, so that the lead frame unit 11 is used for flip-chip packaging. Specifically, the chip 26 may be flip-chip bonded on the pad 17 by a solder ball. Of course, the chip 26 is not limited to being flip-chip bonded to the pad 17 by a solder ball, but may be flip-chip bonded to the pad 17 by a gold ball, a tin stud, or the like. No provision is made for this application. As such, as shown in fig. 2, in one lead frame unit 11 of the first embodiment, each lead 16 is divided into a land 19 and a non-land 18. That is, the surface of each lead 16 includes a region having a roughened surface 27 and a region not having a roughened surface 27. On one hand, the plastic package body is combined with the rough surface 27, so that the plastic package body and the rough surface 27 form a locking structure; on the other hand, the pad 17 is provided on the non-rough surface 27, so that the soldering effect is improved and the generation of voids is avoided.
Further, on the lead 16, a non-soldering land 18 and a soldering land 19 are arranged close to and away from the cutting line of the lead frame, respectively. For example, as shown in fig. 2, the 6 pins 16 are arranged in a first row and a second row in the up-down direction. The first row is located above the second row. The first row includes 3 pins 16. The second row includes 3 pins 16. On the three pins 16 of the first row, the non-lands 18 are all located above the lands 19. Thus, on the three leads 16 in the first row, the non-lands 18 are all close to the cutting line on the upper portion of the lead frame. Further, on the three pins 16 of the second row, the non-lands 18 are all located below the lands 19. As such, on the three leads 16 of the second row, the non-lands 18 are all close to the cut line in the lower portion of the lead frame. Furthermore, the bonding pads 19 on the three leads 16 in the first row are respectively adjacent to and opposite to the bonding pads 19 on the three leads 16 in the second row, so that the 6 bonding pads 19 on the 6 leads 16 can be concentrated on the lead frame unit 11, thereby facilitating the flip chip bonding of the chip 26.
Further, as shown in fig. 3, in one lead frame unit 11 of the second embodiment, the lead frame unit 11 includes a base island 21 and a plurality of leads 16 disposed around the base island 21. As will be appreciated by those skilled in the art, the base island 21 is used to mount a chip 26. Further, the land 19 is disposed on the base island 21 and/or the pin 16. That is, the land 19 may be disposed on the base island 21. Or lands 19 are provided on the leads 16. Or lands 19 are provided on both the base island 21 and the leads 16. For example, as shown in fig. 3, the land 19 is provided on the lead 16. Further, at least one wire bonding portion is disposed in the bonding pad 19. The wire bond is electrically connected to a chip 26 by a bond wire 25. When the lands 19 are thus disposed on the base island 21, the chip 26 is electrically connected to the wire bonds on the base island 21 via the bonding wires 25. When bonding pads 19 are disposed on leads 16, chip 26 is electrically connected to the wire bonds on leads 16 via bond wires 25. When the bonding pads 19 are disposed on the base island 21 and the leads 16, the chip 26 is electrically connected to the wire bonds on the base island 21 and the leads 16 by bonding wires 25.
Further, the lead frame of the embodiment of the present application further includes an outer frame 13. The outer frame 13 surrounds the plurality of lead frame units 11. As shown in fig. 1, for example, two lead frame units 11 are located within a housing 13. Further, each lead frame unit 11 also includes a plurality of connecting ribs 15. The plurality of connection ribs 15 correspond to the plurality of pins 16. The correspondence may be that the number of connecting ribs 15 is equal to the number of pins 16. As shown in fig. 1, for example, each lead frame unit 11 includes 6 leads 16 and 6 connecting ribs 15. Each connecting rib 15 is used to connect the outer frame 13 to a corresponding pin 16. The pins 16 can thus be connected to the outer frame 13 via the connecting ribs 15.
Further, the embodiment of the application also provides a packaging body. The package includes: the lead frame as described above; and plastically packaging the plastic packaging body of the lead frame, wherein the plastic packaging body and the rough surface 27 form a locking structure. This packaging body can improve the plastic envelope material on the one hand and the frame surface grab the joint strength, and on the other hand can improve the welding effect, avoids producing cavity, rosin joint scheduling problem when avoiding flip-chip bonding because the surperficial coarse lead to routing flying wire, welding insecure scheduling problem.
Further, the embodiment of the application also provides a roughening method of the lead frame. The coarsening method comprises the following steps: a portion of the upper surface of each of the lead frame units 11 is ablated by a laser to form an ablation groove 28, thereby dividing the upper surface of the lead frame unit 11 into a land 19 not including the ablation groove 28 and a non-land 18 including the ablation groove 28.
Further, in the prior art, the area which does not need to be roughened is generally covered by a chemical mask, and the area which needs to be roughened is roughened by chemical liquid. Such roughening process requires multiple dry film, exposure, and development processes, which increases the cost of the lead frame and is not favorable for the comprehensive competitiveness of the product.
In the roughening method of the lead frame according to the embodiment of the utility model, the surface of the lead frame unit 11 is selectively roughened by the laser, so that the operation processes of multiple dry films, exposure, development and the like can be avoided, the roughening operation is more convenient and flexible, and the cost is reduced. Furthermore, the coarsening of the lead frame does not need to use chemical liquid medicine, so that the secondary pollution to the lead frame is avoided. Moreover, the coarsening depth is controllable through the energy control of the laser, so that the coarsening depth is deeper than the conventional coarsening depth, and the plastic packaging material is easier to lock.
Specifically, as shown in fig. 4, a lead frame body with a corresponding shape is first manufactured according to actual needs. The lead frame body includes a plurality of lead frame unit 11 bodies. As shown in fig. 5, a part of the upper surface of the body of each lead frame unit 11 is then ablated by a laser to form an ablation groove 28, so that the upper surface of the lead frame unit 11 is divided into a welding area 19 not containing the ablation groove 28 and a non-welding area 18 containing the ablation groove 28. Further, the power of the laser is 290 to 300 watts, and the laser is used for emitting continuous 530nm to 535nm laser high-speed pulses.
In one embodiment, after forming the bonding pads 19 not including the ablation trench 28 and the non-bonding pads 18 including the ablation trench 28 on the lead frame unit 11, the chip 26 is flip-chip bonded to the bonding pads 17 of the bonding pads 19.
In another embodiment, after forming the bonding pad 19 not containing the ablation groove 28 and the non-bonding area 18 containing the ablation groove 28 on the lead frame unit 11, the chip 26 is bonded to the wire bonding portion of the bonding pad 19 through the bonding wire 25.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above detailed description is provided for the package and the lead frame provided by the embodiment of the present invention, and the principle and the implementation of the present invention are explained by applying a specific example, and the description of the above embodiment is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A lead frame, comprising: the lead frame comprises a plurality of lead frame units, wherein a welding area and a non-welding area outside the welding area are divided on the upper surface of each lead frame unit, a rough surface is arranged on the non-welding area, and the welding area is not provided with the rough surface.
2. The lead frame according to claim 1, characterized in that the lead frame unit comprises a base island and a plurality of pins arranged around the base island, the lands being arranged on the base island and/or the pins.
3. The lead frame of claim 2, wherein at least one wire bond is disposed within the bonding area, the wire bond being electrically connected to the chip by a bonding wire.
4. The lead frame according to claim 1, wherein the lead frame unit includes a plurality of leads, each of the leads being provided with the land and the non-land thereon, and the non-land and the land are arranged close to and away from a cutting line of the lead frame, respectively, on the leads.
5. Leadframe according to claim 4, characterized in that at least one bonding pad is provided in the bonding area, on which pad a chip is flip-chip bonded.
6. The lead frame according to any one of claims 2 to 5, further comprising: the frame, the frame encloses to be established a plurality ofly the outside of lead frame unit, every the lead frame unit still includes a plurality of splice bars, and is a plurality of the splice bar is with a plurality of the pin is corresponding, every the splice bar is used for with the frame with correspond the pin links to each other.
7. Leadframe according to any of claims 1 to 6, characterized in that the rough surface is formed by an ablated groove formed by high-speed pulsing of a laser.
8. The lead frame according to claim 7, characterized in that the laser high speed pulse is emitted by a laser having a power of 290-300 w, the laser high speed pulse having a wavelength of 530-535 nm.
9. The lead frame of claim 7, wherein the ablation slots have a depth of 0.035mm to 0.05 mm.
10. A package, comprising:
a lead frame according to any one of claims 1 to 9;
and plastically packaging the plastic packaging body of the lead frame, wherein the plastic packaging body and the rough surface form a locking structure.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122035934.7U CN215771133U (en) | 2021-08-26 | 2021-08-26 | Package and lead frame |
| PCT/CN2022/102749 WO2023024700A1 (en) | 2021-08-26 | 2022-06-30 | Package, and lead frame and roughening method therefor |
| TW111129943A TW202310213A (en) | 2021-08-26 | 2022-08-09 | Package, lead frame and method for roughening lead frame |
| US18/202,272 US20230298978A1 (en) | 2021-08-26 | 2023-05-25 | Package, Lead Frame and Roughening Method Thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122035934.7U CN215771133U (en) | 2021-08-26 | 2021-08-26 | Package and lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215771133U true CN215771133U (en) | 2022-02-08 |
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ID=80079334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122035934.7U Active CN215771133U (en) | 2021-08-26 | 2021-08-26 | Package and lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215771133U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023024700A1 (en) * | 2021-08-26 | 2023-03-02 | 上海凯虹科技电子有限公司 | Package, and lead frame and roughening method therefor |
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2021
- 2021-08-26 CN CN202122035934.7U patent/CN215771133U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023024700A1 (en) * | 2021-08-26 | 2023-03-02 | 上海凯虹科技电子有限公司 | Package, and lead frame and roughening method therefor |
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