CN215769571U

CN215769571U - Cabin host

Info

Publication number: CN215769571U
Application number: CN202120698766.7U
Authority: CN
Inventors: 饶威
Original assignee: Shanghai Pateo Electronic Equipment Manufacturing Co Ltd
Current assignee: Pateo Connect and Technology Shanghai Corp
Priority date: 2021-04-06
Filing date: 2021-04-06
Publication date: 2022-02-08
Anticipated expiration: 2031-04-06

Abstract

The utility model relates to the field of vehicle-mounted hosts, in particular to a cabin host. The cabin host comprises a circuit board, a plurality of functional modules, a plurality of connectors and a fan; the plurality of functional modules are arranged at different positions of the circuit board, and the distances among the plurality of functional modules are all larger than a first set value; a plurality of connectors are arranged at edge positions of the circuit board; the fan is arranged on the top surface of the cabin host, the air inlet of the fan is arranged on the top surface of the cabin host, and the air outlet is arranged above the circuit board and at a position corresponding to the connectors. The embodiment effectively improves the reliability and the heat dissipation efficiency of the cabin host.

Description

Cabin host

Technical Field

The utility model relates to the field of vehicle-mounted hosts, in particular to a cabin host.

Background

One of the main development directions of on-board hosts is the cabin host. The cabin host integrates the functions of human-vehicle interaction, multi-screen linkage, vehicle-mounted internet and the like, and is the most advanced intelligent system.

In order to meet the requirements of higher reliability and more functions of the cabin host, functional modules are integrated into the hardware of the cabin host at present. This multi-module integration approach presents a significant challenge to the heat dissipation of the host, which determines the final performance and reliability of the host.

SUMMERY OF THE UTILITY MODEL

In order to achieve the purpose, the utility model adopts the following technical scheme:

in a first aspect, the present invention provides a cabin host machine, comprising: a circuit board, a plurality of functional modules, a plurality of connectors and a fan;

the plurality of functional modules are arranged at different positions of the circuit board, and the distances among the plurality of functional modules are all larger than a first set value;

the plurality of connectors are arranged at edge positions of the circuit board;

the fan is arranged on the top surface of the cabin host, the air inlet of the fan is arranged on the top surface of the cabin host, and the air outlet is arranged above the circuit board and at a position corresponding to the connectors.

Optionally, the plurality of functional modules include a system-level SOC chip, an artificial intelligence AI chip, a built-in power amplifier, and a communication module.

Optionally, a distance between the internal power amplifier and the main power connector is smaller than a second set value.

Optionally, the method further includes: the middle frame with the fins covers the circuit board;

the fan is fixed in the central area of center, and the wind channel is located the upper region of center.

Optionally, the lower surface of the middle frame is in direct contact with the plurality of functional modules; the middle frame is made of aluminum alloy.

Optionally, the fan is a centrifugal fan.

Optionally, the method further includes: a built-in antenna;

the built-in antenna is arranged on two sides of the circuit board;

the built-in antenna occupies a side portion area and a top portion area of the main body.

Optionally, the sum of the width of the top surface occupied by the built-in antenna and the width of the top surface occupied by the fan is adapted to the width of the top surface of the host.

Optionally, the plurality of connectors are disposed on at least one other side of the circuit board different from the internal antenna.

Optionally, the AI chips of the plurality of functional modules are disposed at a position close to the internal antenna on one side, the SOC chips of the plurality of functional modules are disposed at a position close to the internal antenna on the other side, and the communication modules of the plurality of functional modules are disposed at a position close to the plurality of connectors.

In the embodiment, the overall layout of the cabin host adopts a scheme of a single circuit board, so that the connection among the circuit boards is reduced, and the reliability is improved; moreover, the size of the single-board integrated host is small, and the single-board integrated host is convenient to arrange on a vehicle machine. The functional modules are dispersedly arranged on the circuit board at certain intervals, so that the distribution of a power supply area on the circuit board is facilitated, heat sources are uniformly distributed on the circuit board, and the heat dissipation efficiency is improved. The fan in this embodiment is by the top surface air inlet of host computer, and the top air-out in the border position of circuit board for the wind channel is from last to down, from centre to both ends, is convenient for blow away each functional module's heat production.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1a is a plan view of the internal structure of a cabin host provided in an embodiment of the present invention;

fig. 1b is a three-dimensional effect diagram of the internal structure of the cabin host provided by the embodiment of the utility model.

FIG. 1c is a schematic view of an inlet and an outlet of a fan according to an embodiment of the present invention;

FIG. 2 is a three-dimensional effect diagram of the external structure of the cabin host provided by the embodiment of the utility model;

FIG. 3 is a plan view of a longitudinal cross-sectional structure of a cabin host provided in an embodiment of the utility model;

fig. 4 is a plan view of a longitudinal cross-sectional structure of the middle frame and the internal antenna according to the embodiment of the present invention;

icon: 10-a circuit board; 20-a functional module; 210-SOC chip; 220-AI chip; 230-built-in power amplifier; 240-a communication module; 30-a connector; 310 — a main power connector; 40-a fan; 410-an air inlet; 420-air outlet; 50-a built-in antenna; 60-middle frame; 610-fin.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Fig. 1a is a plan view of an internal structure of a cabin host provided in an embodiment of the present invention, fig. 1b is a three-dimensional effect diagram of the internal structure of the cabin host provided in the embodiment of the present invention, and fig. 1c is a schematic diagram of an air inlet and an air outlet of a fan provided in the embodiment of the present invention, as shown in fig. 1a, fig. 1b, and fig. 1c, the cabin host includes: a circuit board 10, a plurality of functional modules 20, a plurality of connectors 30, and a fan 40.

The plurality of functional modules 20 are disposed at different positions of the circuit board 10, and distances between the plurality of functional modules 20 are greater than a first set value.

The specific functional module 20 is determined by the function that the cabin host needs to provide. Optionally, as shown in fig. 1a and 1b, the functional module 20 includes a System-on-a-Chip (SOC) Chip 210, an Artificial Intelligence (AI) Chip 220, a built-in power amplifier 230, and a communication module 240. The communication module 240 may be a 5G (fifth generation mobile communication network) module. The first setting value may be determined comprehensively according to the size of the circuit board 10 and the size and number of the received functional modules 20, so as to ensure that a plurality of functional modules 20 are all disposed on the circuit board 10 and spaced apart by a certain distance. Illustratively, the first set value may be 5 centimeters.

Optionally, the distance between the internal power amplifier 230 and the main power connector 310 is smaller than the second set value. The second setting value may be determined by combining the size of the circuit board 10 and the distance between the internal power amplifier 230 and the other functional module 20, so as to ensure that the internal power amplifier 230 is far away from the other functional module 20 and close to the main power connector 310, which facilitates the direct connection of the internal power amplifier 230 with the main power connector 310. Illustratively, the second set value may be 2 centimeters.

A plurality of connectors 30 are provided at edge positions of the circuit board 10. As shown in fig. 1a and 1b, the circuit board 10 includes 4 sides. The plurality of connectors 30 are arranged in 1 row and are disposed on the right side of the circuit board 10 to facilitate connection with other components. Furthermore, the connector 30 generates less heat and is distributed at edge positions rather than at the middle position of the circuit board 10, leaving a middle position for efficient heat dissipation to the functional module 20 that generates more heat.

It should be noted that the plurality of connectors 30 may be divided into 2 groups, and disposed on the left and right sides of the circuit board 10.

The cabin main unit is a three-dimensional structure, the circuit board 10 is arranged on the bottom surface of the cabin main unit, and the fan 40 is arranged on the top surface of the cabin main unit as shown in fig. 1 c. The air inlet 410 of the fan 40 is arranged on the top surface of the cabin main unit, and specifically, the air inlet 410 of the fan 40 is two opposite half-moon-shaped openings, so that air is convenient to gather. The air outlet 420 is disposed above the circuit board 10 and at a position corresponding to the plurality of connectors 30. That is, the outlet 420 is provided at an edge position above the circuit board 10. Fig. 1c shows a left outlet vent 420 and a right outlet vent 420.

In this embodiment, the overall layout of the cabin host adopts a scheme of a single circuit board 10, which reduces the connection between circuit boards and improves the reliability; moreover, the size of the single-board integrated host is small, and the single-board integrated host is convenient to arrange on a vehicle machine. The plurality of functional modules 20 are dispersedly arranged on the circuit board 10 at a certain distance, which is beneficial to the distribution of the power supply area on the circuit board 10 and the uniform distribution of the heat source on the circuit board 10, and improves the heat dissipation efficiency. The fan 40 in this embodiment is powered by the top surface of the main unit to supply air and to discharge air above the edge of the circuit board 10, so that the air duct is from top to bottom and from the middle to the two ends, thereby facilitating the heat generation of each functional module 20 to be blown away.

Fig. 2 is a three-dimensional effect diagram of the external structure of the cabin host provided by the embodiment of the utility model. As shown in fig. 2, the cabin host further includes a middle frame 60 with fins 610, which covers the circuit board 10; the fan 40 is fixed to a central region of the middle frame 60.

Fig. 3 is a plan view of a longitudinal sectional structure of the cabin host provided in the embodiment of the present invention. Referring to fig. 3, the lower surface of the middle frame 60 is in direct contact with the plurality of functional modules 20, the middle frame 60 is made of an aluminum alloy, and a die-casting process is performed, so that heat generated by the plurality of functional modules 20 is directly transferred to the upper surface of the middle frame 60, and the air duct is located in an upper region of the middle frame 60, that is, in a middle region of the adjacent fins 610. The arrows in fig. 3 show the lane and wind direction. The air flow generated by the fan 40 transfers heat to the outside of the main unit, thereby shortening the heat transfer path and reducing thermal resistance.

Optionally, the fan 40 is a centrifugal fan. The centrifugal fan has good ventilation effect, the impeller of the centrifugal fan is designed to be backward inclined, no friction exists during operation, the noise is very low, dust is not easy to adhere to the impeller, and the centrifugal fan is very convenient to maintain.

Fig. 4 is a plan view of a longitudinal cross-sectional structure of the middle frame and the internal antenna according to the embodiment of the present invention. As shown in fig. 1a to 4, the cabin host further comprises an internal antenna 50. The built-in antennas 50 are disposed at both sides of the circuit board 10, occupying the side partial area and the top partial area of the main body. The two-sided and double-sided arrangement makes the space allocated by the host computer for the built-in antenna 50 larger, increases the heat exchange area, and reduces the influence on the antenna efficiency.

Preferably, as shown in fig. 1c, the sum of the width of the top surface occupied by the built-in antenna 50 and the width of the top surface occupied by the fan 40 is adapted to the width of the top surface of the main unit, so that the width of the main unit of the cabin is fully allocated to the built-in antenna 50 and the fan 40, and the rest of the upper surfaces are allocated to the fins 610, thereby increasing the heat dissipation area and reducing the influence on the antenna efficiency.

In this embodiment, in the cabin host, the host integrates a heat dissipation scheme of the fan 40 and a scheme of the built-in antenna 50. Besides the large power consumption SOC chip 210 and the internal power amplifier 230, the circuit board 10 is integrated with an individual AI chip 220, a communication module 240, and the like. The stable operation of each module directly influences the realization of the main functions of the cabin host.

As shown in fig. 1a to 4, a plurality of connectors 30 are provided on the circuit board 10 on at least one side surface different from the internal antenna 50. Specifically, the internal antenna 50 is disposed on the upper and lower sides of the circuit board 10, and the plurality of connection devices are disposed on the left, right, or left and right sides of the circuit board 10.

As shown in fig. 1a, the AI chip 220 is disposed at a position close to the one-side built-in antenna 50, specifically, at a position close to the upper-side built-in antenna 50. The SOC chip 210 is disposed at a position close to the other-side internal antenna 50, specifically, at a position close to the lower-side internal antenna 50. The communication module 240 is disposed at a position close to the plurality of connectors 30, specifically, a position close to the right-side connector 30.

By integrating the above embodiments, the problems of integrating the large-power-consumption SOC chip 210, the AI chip 220, the built-in power amplifier 230 and the communication module 240 of the cabin host are solved, the high efficiency and reliability of the operation of the electronic devices in the host are ensured, the silence is considered, and the driving experience is improved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention.

Claims

1. A cabin host machine, comprising: a circuit board, a plurality of functional modules, a plurality of connectors and a fan;

2. The host of claim 1, wherein the plurality of functional modules comprise a system-on-a-chip (SOC) chip, an Artificial Intelligence (AI) chip, a built-in power amplifier, and a communication module.

3. The host computer of claim 2, wherein the distance between the internal power amplifier and the main power connector is less than a second predetermined value.

4. The host of claim 1, further comprising: the middle frame with the fins covers the circuit board;

5. The host computer of claim 4, wherein a lower surface of the middle frame is in direct contact with the plurality of functional modules;

the middle frame is made of aluminum alloy.

6. The host machine of claim 1, wherein the fan is a centrifugal fan.

7. The host of claim 1, further comprising: a built-in antenna;

the built-in antenna is arranged on two sides of the circuit board;

8. The host of claim 7,

the sum of the width of the top surface occupied by the built-in antenna and the width of the top surface occupied by the fan is matched with the width of the top surface of the host.

9. The host of claim 7,

the plurality of connectors are provided on the circuit board at least one other side surface different from the internal antenna.

10. The host computer according to claim 9, wherein the AI chips of the plurality of functional modules are disposed at a position near the internal antenna on one side, the SOC chips of the plurality of functional modules are disposed at a position near the internal antenna on the other side, and the communication modules of the plurality of functional modules are disposed at a position near the plurality of connectors.