CN215769559U

CN215769559U - Singlechip module

Info

Publication number: CN215769559U
Application number: CN202122376031.5U
Authority: CN
Inventors: 尹小琴; 尹欣; 谭琴
Original assignee: Shenzhen Nanhe Technology Co ltd
Current assignee: Shenzhen Nanhe Technology Co ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-02-08
Anticipated expiration: 2031-09-29

Abstract

The utility model discloses a single chip microcomputer assembly which comprises a main body, wherein a single chip microcomputer is arranged in the main body, two fixing pieces are fixedly connected to two sides of the top and two sides of the bottom of the single chip microcomputer, springs are fixedly connected between one side of each fixing piece and the inner wall of the main body, four limiting rods are fixedly connected between the inner wall of the top and the inner wall of the bottom of the main body, two fixing blocks are slidably connected to the outer portions of the four limiting rods, one side of each fixing block is fixedly connected with one side of each fixing piece, soaking plates are fixedly connected to the top and the bottom of the single chip microcomputer, and heat conducting plates are arranged on one sides of the two soaking plates. According to the utility model, by arranging the limiting rod, the fixing block, the fixing piece, the single chip microcomputer, the guide plate, the pins, the conducting wire, the connecting sheet and the heat dissipation strip, when the device is used, the stability of the single chip microcomputer is ensured through sealing and shock absorption, and meanwhile, the heat dissipation is ensured, so that the device is simple to operate, good in operation effect, reasonable in structure, stable and practical.

Description

Singlechip module

Technical Field

The utility model relates to the technical field of single-chip microcomputers, in particular to a single-chip microcomputer assembly.

Background

The single chip computer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU with data processing capacity, a random access memory RAM, a read only memory ROM, various I/O ports, an interrupt system, a timer/counter and the like (possibly comprising a display driving circuit, a pulse width modulation circuit, an analog multiplexer, an A/D converter and other circuits) on a silicon chip by adopting a super-large scale integrated circuit technology, and is widely applied to the field of industrial control. The singlechip is extremely accurate, and the during operation should avoid external environment to produce the influence to it, in order to guarantee that the singlechip can better operation, we propose a singlechip subassembly.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a single chip microcomputer assembly.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a single chip microcomputer component, includes the main part, the inside of main part is equipped with the singlechip, two stationary blades of the top both sides of singlechip and the equal fixedly connected with in bottom both sides, eight equal fixedly connected with spring between one side of stationary blade and the inner wall of main part, four gag lever posts of fixedly connected with between the top inner wall of main part and the bottom inner wall, four the equal sliding connection in outside of gag lever post has two fixed blocks, eight one side of fixed block respectively with one side fixed connection of eight stationary blades, the top of singlechip and the equal fixedly connected with soaking board in bottom, two one side of soaking board all is equipped with the heat-conducting plate, two soaking boards and two all be equipped with heat conduction silicone grease between the baffle, one side of two soaking boards all is equipped with heat dissipation mechanism, and the inside of main part is equipped with coupling mechanism.

Further, heat dissipation mechanism includes two heating panels, rectangular groove has all been seted up, two to the top and the bottom of main part a plurality of heat conduction rubber of the equal fixedly connected with in one side of heat-conducting plate, it is a plurality of heat conduction rubber's one end runs through the inside to two rectangular groove of main part respectively, two the heating panel is respectively in the inner wall fixed connection of two rectangular groove of main part, a plurality of heat conduction rubber respectively with one side fixed connection of two heating panels.

Furthermore, the connecting mechanism comprises four connecting sheets, a plurality of conductors are electrically connected to the outer side of the single chip microcomputer, one ends of the four groups of conductors are electrically connected to one sides of the four connecting sheets respectively, and a plurality of wires are electrically connected to one sides of the four connecting sheets.

Furthermore, four rectangular through holes are formed in the outer side of the main body, guide plates and four guide plates are arranged inside the four rectangular through holes of the main body, one side of each guide plate is electrically connected with a pin, and one side of each lead is electrically connected with one side of each guide plate.

Further, the top both sides and the equal fixedly connected with two stabilizer blades of bottom both sides of main part, eight the equal fixedly connected with installation piece of one end of stabilizer blade.

Furthermore, a plurality of radiating strips are arranged on one side of each of the two radiating plates.

The utility model has the beneficial effects that:

1. by arranging the limiting rod, the fixing block, the fixing plate, the single chip microcomputer and the springs, when the device is used, the single chip microcomputer is installed in the main body, then the fixing plates on the plurality of springs are respectively fixed outside the single chip microcomputer, the single chip microcomputer is fixed in the main body, when the single chip microcomputer is impacted externally, the single chip microcomputer extrudes the plurality of springs through the fixing plates, the springs absorb external impact force, the fixing blocks on one side of the fixing plates slide with the limiting rod to limit, the stability of the single chip microcomputer is ensured, then the heat generated by the single chip microcomputer is transmitted to the heat conducting plate through the heat conducting silicone grease through the heat conducting plate, the heat conducting plate guides the heat to the heat radiating plate through the plurality of heat conducting rubbers, and finally the heat is dissipated;

2. by arranging the guide plate, the pins, the conducting wires and the connecting sheets, when the device is used, the singlechip is connected with the pins on one side of the guide plate through the conducting wires on the connecting sheets on one side of the conductors, so that the connection stability of the singlechip is improved;

3. through setting up the heat dissipation strip, when using this device, the heat radiating area of a plurality of heat dissipation strip greatly increased heating panels further guarantees the radiating effect of device, has increased the practicality of device.

Through setting up gag lever post, fixed block, stationary blade, singlechip, spring, baffle, pin, wire, connection piece, heat dissipation strip, when using this device, this device guarantees the stability of singlechip through sealed and moving away to avoid possible earthquakes to guarantee the heat dissipation simultaneously, easy operation, the operation is effectual, rational in infrastructure, stable practical.

Drawings

Fig. 1 is a schematic side sectional view of a single chip microcomputer assembly provided in embodiment 1;

fig. 2 is a schematic top view cross-sectional structure diagram of a single chip microcomputer assembly provided in embodiment 1;

fig. 3 is a schematic structural diagram of a heat dissipation strip of the mcu assembly according to embodiment 2.

In the figure: the heat dissipation device comprises a main body 1, a guide plate 2, pins 3, a lead 4, a connecting sheet 5, a limiting rod 6, a fixing block 7, a fixing sheet 8, a single chip microcomputer 9, a heat conduction plate 10, heat conduction silicone grease 11, a heat equalizing sheet 12, an installation sheet 13, supporting legs 14, springs 15, conductors 16, heat conduction rubber 17, a heat dissipation plate 18 and a heat dissipation strip 19.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-2, a single chip microcomputer assembly, including main part 1, main part 1's inside is equipped with singlechip 9, two stationary blades 8 of the equal fixedly connected with in top both sides and bottom both sides of singlechip 9, equal fixedly connected with spring 15 between one side of eight stationary blades 8 and the inner wall of main part 1, four gag lever posts 6 of fixedly connected with between the top inner wall of main part 1 and the bottom inner wall, the equal sliding connection in outside of four gag lever posts 6 has two fixed blocks 7, one side of eight fixed blocks 7 respectively with one side fixed connection of eight stationary blades 8, the equal fixedly connected with soaking board 12 in top and bottom of singlechip 9, one side of two soaking boards 12 all is equipped with heat-conducting plate 10, all be equipped with heat conduction silicone grease 11 between two soaking boards 12 and two baffle 10, one side of two soaking boards 12 all is equipped with heat dissipation mechanism, the inside of main part 1 is equipped with coupling mechanism.

Wherein, the heat dissipation mechanism comprises two heat dissipation plates 18, rectangular grooves are respectively arranged at the top and the bottom of the main body 1, a plurality of heat conduction rubbers 17 are fixedly connected at one side of the two heat conduction plates 10, one ends of the plurality of heat conduction rubbers 17 respectively penetrate into the two rectangular grooves of the main body 1, the two heat dissipation plates 18 are respectively fixedly connected with the inner walls of the two rectangular grooves of the main body 1, the plurality of heat conduction rubbers 17 are respectively fixedly connected with one sides of the two heat dissipation plates 18, the singlechip 9 is arranged in the main body 1 and then respectively fixed outside the singlechip 9 through fixing pieces 8 on the plurality of springs 15, so that the singlechip 9 is fixed inside the main body 9, when the singlechip 9 is impacted externally, the singlechip 9 extrudes the plurality of springs 15 through the fixing pieces 8, the springs 15 absorb the external impact force and limit the singlechip 9 and the limiting rod 6 to limit the position through the fixing pieces 7 at one side of the fixing pieces 8, the stability of the single chip microcomputer 9 is guaranteed, then the soaking piece 12 transmits heat generated by the single chip microcomputer 9 to the heat conducting plate 10 through the heat conducting silicone grease 11, the heat conducting plate 10 guides the heat to the heat radiating plate 18 through the heat conducting rubbers 17, and finally the heat is dissipated, the stability of the single chip microcomputer is guaranteed through sealing and shock absorption, and meanwhile, the heat radiation is guaranteed, the operation is simple, and the operation effect is good;

wherein, coupling mechanism includes four connection pieces 5, and the outside electric connection of singlechip 9 has a plurality of conductors 16, and the one end of four group's conductors 16 respectively with one side electric connection of four connection pieces 5, the equal electric connection of one side of four connection pieces 5 has a plurality of wires 4.

The outer side of the main body 1 is provided with four rectangular through holes, the main body 1 is provided with guide plates 2 inside the four rectangular through holes, one sides of the four guide plates 2 are electrically connected with pins 3, one sides of four groups of wires 4 are respectively electrically connected with one sides of the four guide plates 2, and the single chip microcomputer 9 is connected with the pins 3 on one sides of the guide plates 2 through the wires 4 on the connecting sheet 5 on one side of the conductor 16, so that the connection stability of the single chip microcomputer is improved;

wherein, two stabilizer blades 14 of the equal fixedly connected with in top both sides and the bottom both sides of main part 1, the equal fixedly connected with installation piece 13 of one end of eight stabilizer blades 14.

The working principle is as follows: when the device is used, the singlechip 9 is arranged in the main body 1, then the singlechip 9 is respectively fixed outside the singlechip 9 through the fixing pieces 8 on the plurality of springs 15, so that the singlechip 9 is fixed inside the main body 9, when the singlechip 9 is impacted externally, the singlechip 9 extrudes the plurality of springs 15 through the fixing pieces 8, the springs 15 absorb the external impact force, the fixing pieces 7 on one side of the fixing pieces 8 slide with the limiting rods 6 to limit, so that the stability of the singlechip 9 is ensured, then the soaking pieces 12 transmit the heat generated by the singlechip 9 to the heat conducting plate 10 through the heat conducting silicone grease 11, the heat conducting plate 10 guides the heat to the heat radiating plate 18 through the plurality of heat conducting rubbers 17, and finally the heat is dissipated;

the singlechip 9 is connected with the pin 3 at one side of the guide plate 2 through the lead 4 on the connecting sheet 5 at one side of the conductor 16, so that the connection stability of the singlechip is improved.

Example 2

Referring to fig. 3, compared with embodiment 1, in the present embodiment, in order to increase the practicability of the device, one side of two heat dissipation plates 18 is provided with a plurality of heat dissipation strips 19, and the heat dissipation area of the heat dissipation plates 18 is greatly increased by the plurality of heat dissipation strips 19, so that the heat dissipation effect of the device is further ensured, and the practicability of the device is increased.

When the device is used, the heat dissipation area of the heat dissipation plate 18 is greatly increased by the plurality of heat dissipation strips 19, the heat dissipation effect of the device is further ensured, and the practicability of the device is increased.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A single chip microcomputer assembly comprises a main body (1) and is characterized in that a single chip microcomputer (9) is arranged inside the main body (1), two fixing pieces (8) are arranged on two sides of the top and two sides of the bottom of the single chip microcomputer (9), springs (15) are arranged between one side of each fixing piece (8) and the inner wall of the main body (1), four limiting rods (6) are arranged between the inner wall of the top and the inner wall of the bottom of the main body (1), two fixing blocks (7) are arranged outside the four limiting rods (6), one side of each fixing block (7) is fixedly connected with one side of each fixing piece (8), soaking plates (12) are arranged on the top and the bottom of the single chip microcomputer (9), heat conducting plates (10) are arranged on one side of each soaking plate (12), and heat conducting silicone grease (11) is arranged between each soaking plate (12) and the two heat conducting plates (10), one side of each of the two soaking plates (12) is provided with a heat dissipation mechanism, and a connecting mechanism is arranged inside the main body (1).

2. The single chip microcomputer assembly according to claim 1, wherein the heat dissipation mechanism comprises two heat dissipation plates (18), rectangular grooves are formed in the top and the bottom of the main body (1), a plurality of heat conduction rubbers (17) are arranged on one side of each of the two heat conduction plates (10), one ends of the plurality of heat conduction rubbers (17) penetrate through the two rectangular grooves of the main body (1) respectively, the two heat dissipation plates (18) are fixedly connected with the inner walls of the two rectangular grooves of the main body (1) respectively, and the plurality of heat conduction rubbers (17) are fixedly connected with one sides of the two heat dissipation plates (18) respectively.

3. The single chip microcomputer assembly according to claim 2, wherein the connecting mechanism comprises four connecting pieces (5), a plurality of conductors (16) are arranged on the outer side of the single chip microcomputer (9), one ends of the four groups of conductors (16) are respectively electrically connected with one sides of the four connecting pieces (5), and a plurality of wires (4) are arranged on one sides of the four connecting pieces (5).

4. The single chip microcomputer assembly according to claim 3, wherein four rectangular through holes are formed in the outer side of the main body (1), guide plates (2) are arranged inside the four rectangular through holes of the main body (1), pins (3) are arranged on one sides of the four guide plates (2), and one sides of the four groups of wires (4) are electrically connected with one sides of the four guide plates (2) respectively.

5. The single chip microcomputer assembly according to claim 4, wherein two support legs (14) are arranged on two sides of the top and two sides of the bottom of the main body (1), and a mounting piece (13) is arranged at one end of each of the eight support legs (14).

6. The single chip microcomputer assembly according to claim 5, wherein a plurality of heat dissipation strips (19) are arranged on one side of each of the two heat dissipation plates (18).