CN215768881U - Conductive test bench for semiconductor chip - Google Patents
Conductive test bench for semiconductor chip Download PDFInfo
- Publication number
- CN215768881U CN215768881U CN202121853294.4U CN202121853294U CN215768881U CN 215768881 U CN215768881 U CN 215768881U CN 202121853294 U CN202121853294 U CN 202121853294U CN 215768881 U CN215768881 U CN 215768881U
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- Prior art keywords
- semiconductor chip
- bedplate
- seat
- temperature
- light
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000012360 testing method Methods 0.000 title claims abstract description 31
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims description 23
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 206010034960 Photophobia Diseases 0.000 description 3
- 208000013469 light sensitivity Diseases 0.000 description 3
- 206010057040 Temperature intolerance Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model is suitable for the related technical field of semiconductors, and provides a semiconductor chip conductive test bench, which comprises a bedplate and a support frame arranged at the bottom of the bedplate, and further comprises: the stabilizing assembly is arranged on the bedplate and used for fixing the semiconductor chip to be tested; the light-resistant temperature control assembly covers the top of the stabilizing assembly and is used for providing a constant-temperature and light-resistant testing environment for the semiconductor chip to be tested.
Description
Technical Field
The utility model belongs to the technical field of semiconductor correlation, and particularly relates to a semiconductor chip conduction test bench.
Background
A semiconductor is a substance having an electrical conductivity between an insulator and a conductor, and the electrical conductivity is easily controlled, and the semiconductor can be used as a material of an information processing device, and is very important from the viewpoint of technological or economic development.
Common semiconductor materials include silicon, germanium, gallium arsenide and the like, a semiconductor chip refers to a semiconductor device which is etched and wired on the semiconductor chip and can realize a certain function, and in the production process of the semiconductor chip, the performance of the semiconductor chip needs to be detected, including conducting detection and the like on the semiconductor chip.
Most test benches now have difficulty in controlling environmental conditions due to heat and light sensitivity of semiconductor chips, which affects not only the convenience of operation but also the test results.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model aims to provide a semiconductor chip conductive test bench, and the problem that the test result is influenced because the semiconductor chip has heat sensitivity and light sensitivity and the environmental condition is difficult to control when most test benches detect the semiconductor chip is solved.
The embodiment of the utility model is realized in such a way that the semiconductor chip conductive test bench comprises a bedplate and a support frame arranged at the bottom of the bedplate, and further comprises:
the stabilizing assembly is arranged on the bedplate and used for fixing the semiconductor chip to be tested;
and the light-shading temperature control assembly is covered on the top of the stabilizing assembly and is used for providing a constant-temperature and light-shading test environment for the semiconductor chip to be tested.
Preferably, the stabilizing assembly comprises:
the chip packaging structure comprises a fixed seat, a plurality of accommodating cavities and a plurality of pin connecting pieces, wherein the fixed seat is provided with the accommodating cavities, each accommodating cavity is internally provided with a bottom flexible pad, and each accommodating cavity is provided with a pin connecting piece connected with a pin of a chip;
the pressing seat is arranged opposite to the fixed seat, one end of the pressing seat is hinged with the mounting seat fixed on the bedplate, and a top flexible part for pressing the chip in a propping manner is arranged on the pressing seat; and
the telescopic piece is hinged on the bedplate, and the extending end of the telescopic piece is hinged with the pressing seat.
Preferably, the mounting seat and the telescopic piece are arranged on the same side of the pressing seat, and the mounting seat and the telescopic piece are sequentially arranged along the direction far away from the pressing seat.
Preferably, a bottom flexible pad is uniformly distributed at the bottom of the inner side of each accommodating cavity.
Preferably, the light-shielding and temperature-controlling assembly comprises:
the light shield is detachably fixed on the bedplate, and a constant-temperature shading chamber is formed between the light shield and the bedplate;
and the temperature control fan is arranged on the shading cover, and the air outlet end of the temperature control fan is communicated with the interior of the constant-temperature shading chamber.
Preferably, the bottom of the light shield is integrally provided with a magnetic part, the platen is provided with an embedding groove for accommodating the magnetic part, and a magnetic part for attracting the magnetic part is arranged in the embedding groove.
Preferably, the bottom of the support frame is provided with an insulating non-slip mat.
According to the semiconductor chip conductive test board provided by the embodiment of the utility model, the semiconductor chip to be tested is conveniently fixed through the arrangement of the stabilizing component, and the light-shading temperature control component is matched, so that the semiconductor chip to be tested can be used for providing test environments with proper temperature, light shading, light sensation and the like, and the test accuracy and convenience are ensured.
Drawings
Fig. 1 is a front view structural diagram of a conductive testing platform of a semiconductor chip according to an embodiment of the present invention;
FIG. 2 is a top view of the holder and pin connector according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a light shield according to an embodiment of the present invention.
In the drawings: 1. a platen; 101. a support frame; 2. a fixed seat; 3. an accommodating chamber; 301. a stitch connector; 4. a bottom flexible pad; 5. pressing a base; 6. a top flexible portion; 7. mounting; 8. a telescoping member; 9. a light shield; 10. a magnetic part; 11. caulking grooves; 12. a magnetic member; 13. a temperature control fan; 14. a temperature sensor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
As shown in fig. 1, a structure diagram of a semiconductor chip conduction test station provided for an embodiment of the present invention includes a platen 1 and a support frame 101 disposed at a bottom of the platen 1, and further includes:
the stabilizing assembly is arranged on the bedplate 1 and used for fixing the semiconductor chip to be tested;
and the light-shading temperature control assembly is covered on the top of the stabilizing assembly and is used for providing a constant-temperature and light-shading test environment for the semiconductor chip to be tested.
In one embodiment of the utility model, the semiconductor chip to be tested is conveniently fixed by the arrangement of the stabilizing assembly, and the light-shielding temperature control assembly is matched, so that a test environment with proper temperature, light shielding and light sensing can be provided for the semiconductor chip to be tested, and the test accuracy and convenience are ensured.
As shown in fig. 1 to 3, as a preferred embodiment of the present invention, the stabilizing member includes:
the chip packaging structure comprises a fixed seat 2, wherein a plurality of accommodating cavities 3 are formed in the fixed seat 2, a bottom flexible pad 4 is arranged in each accommodating cavity 3, and a pin connecting piece 301 connected with pins of a chip is arranged on each accommodating cavity 3;
the pressing seat 5 is arranged opposite to the fixed seat 2, one end of the pressing seat 5 is hinged with a mounting seat 7 fixed on the bedplate 1, and a top flexible part 6 for abutting and pressing the chip is mounted on the pressing seat 5; and
and the telescopic piece 8 is hinged on the bedplate 1, and the extending end of the telescopic piece is hinged with the pressing seat 5.
This embodiment facilitates fixing and unfixing of the chip by the extension and contraction of the extensible member 8 when applied in practice.
As shown in fig. 1, as another preferred embodiment of the present invention, the mounting seat 7 and the telescopic member 8 are disposed on the same side of the pressing seat 5, and the mounting seat 7 and the telescopic member 8 are sequentially arranged in a direction away from the pressing seat 5.
This embodiment when using in practice lays in proper order along the direction of keeping away from pressure seat 5 through mount pad 7 and extensible member 8 for extensible member 8 is pressing seat 5 to cooperating the use to the fixing base 2 and fixing the chip, and is more laborsaving.
As shown in fig. 1, as another preferred embodiment of the present invention, a bottom flexible cushion 4 is disposed at the bottom inside each of the accommodating chambers 3.
When the present embodiment is applied in practice, the semiconductor chip can be fixed and protected at the same time by the arrangement of the bottom flexible pad 4.
As shown in fig. 1 to 3, as another preferred embodiment of the present invention, the light-shielding and temperature-controlling assembly includes:
the light shield 9 is detachably fixed on the bedplate 1, and a constant-temperature shading chamber is formed between the light shield 9 and the bedplate 1;
and the temperature control fan 13 is arranged on the light shield 9, and the air outlet end of the temperature control fan is communicated with the interior of the constant temperature light shield chamber.
In one aspect of the present invention, the constant temperature shading chamber is further provided with a temperature sensor 14 electrically connected to the control panel, so as to conveniently adjust the temperature in the constant temperature shading chamber.
When the embodiment is applied in practice, a constant-temperature shading chamber is formed between the light shield 9 and the bedplate 1 through the arrangement of the light shield 9 and the temperature control fan 13, so that the influence of temperature and illumination on the conductivity of the chip can be reduced to the greatest extent.
As shown in fig. 1 to 3, as another preferred embodiment of the present invention, a magnetic part 10 is integrally disposed at the bottom of the light shield 9, an embedding groove 11 for accommodating the magnetic part 10 is disposed on the platen 1, and a magnetic member 12 for attracting the magnetic part 10 is disposed in the embedding groove 11.
This embodiment is when using in the reality, and the setting through caulking groove 11 and magnetism piece 12 is convenient for can dismantle fixed lens hood 9 for form the room that shades with constant temperature between lens hood 9 and the platen 1, reduce the influence that temperature and illumination brought to the chip conductivity in the at utmost.
As shown in fig. 1 to 3, as another preferred embodiment of the present invention, an insulating anti-slip pad is disposed at the bottom of the supporting frame 101.
When the embodiment is applied in practice, the testing can be facilitated and the external interference can be prevented to the maximum extent through the arrangement of the insulating anti-slip pad.
The embodiment of the utility model provides a semiconductor chip conductive test bench, which is convenient for fixing a semiconductor chip to be tested through the arrangement of a stabilizing component, can be used for providing a test environment with proper temperature, light resistance and light sensitivity for the semiconductor chip to be tested by matching with a light-proof temperature control component, and ensures the test accuracy and convenience.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor chip electrically conducts testboard, includes the platen and sets up the support frame at the platen bottom, its characterized in that still includes:
the stabilizing assembly is arranged on the bedplate and used for fixing the semiconductor chip to be tested;
and the light-shading temperature control assembly is covered on the top of the stabilizing assembly and is used for providing a constant-temperature and light-shading test environment for the semiconductor chip to be tested.
2. The semiconductor chip conduction test stand of claim 1, wherein said securing assembly comprises:
the chip packaging structure comprises a fixed seat, a plurality of accommodating cavities and a plurality of pin connecting pieces, wherein the fixed seat is provided with the accommodating cavities, each accommodating cavity is internally provided with a bottom flexible pad, and each accommodating cavity is provided with a pin connecting piece connected with a pin of a chip;
the pressing seat is arranged opposite to the fixed seat, one end of the pressing seat is hinged with the mounting seat fixed on the bedplate, and a top flexible part for pressing the chip in a propping manner is arranged on the pressing seat; and
the telescopic piece is hinged on the bedplate, and the extending end of the telescopic piece is hinged with the pressing seat.
3. The conductive test bench of claim 2, wherein the mounting seat and the telescopic member are disposed on the same side of the pressing seat, and the mounting seat and the telescopic member are sequentially arranged along a direction away from the pressing seat.
4. The semiconductor chip conduction testing table according to claim 2, wherein a bottom flexible pad is disposed at a bottom of an inner side of each accommodating chamber.
5. The semiconductor chip conduction test bench of claim 1, wherein the light-shielding and temperature-controlling assembly comprises:
the light shield is detachably fixed on the bedplate, and a constant-temperature shading chamber is formed between the light shield and the bedplate;
and the temperature control fan is arranged on the shading cover, and the air outlet end of the temperature control fan is communicated with the interior of the constant-temperature shading chamber.
6. The conductive testing table of claim 5, wherein the bottom of the light shield is integrally provided with a magnetic attraction portion, the platen is provided with a slot for accommodating the magnetic attraction portion, and a magnetic attraction member for attracting the magnetic attraction portion is disposed in the slot.
7. The conductive test bench of any one of claims 1 to 4, wherein an insulating anti-slip pad is disposed at the bottom of the supporting frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121853294.4U CN215768881U (en) | 2021-08-10 | 2021-08-10 | Conductive test bench for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121853294.4U CN215768881U (en) | 2021-08-10 | 2021-08-10 | Conductive test bench for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215768881U true CN215768881U (en) | 2022-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121853294.4U Active CN215768881U (en) | 2021-08-10 | 2021-08-10 | Conductive test bench for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215768881U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116577643A (en) * | 2023-07-11 | 2023-08-11 | 苏州晶睿半导体科技有限公司 | Automatic testing system and method for semiconductor chip |
-
2021
- 2021-08-10 CN CN202121853294.4U patent/CN215768881U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116577643A (en) * | 2023-07-11 | 2023-08-11 | 苏州晶睿半导体科技有限公司 | Automatic testing system and method for semiconductor chip |
| CN116577643B (en) * | 2023-07-11 | 2023-12-22 | 苏州晶睿半导体科技有限公司 | Automatic testing system and method for semiconductor chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A semiconductor chip conductivity testing platform Granted publication date: 20220208 Pledgee: Xuzhou Rural Commercial Bank Co.,Ltd. Pledgor: XUZHOU HANTONG ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980033123 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |