CN215746972U - Uniform heat conduction reflow soldering support plate - Google Patents
Uniform heat conduction reflow soldering support plate Download PDFInfo
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- CN215746972U CN215746972U CN202122334091.0U CN202122334091U CN215746972U CN 215746972 U CN215746972 U CN 215746972U CN 202122334091 U CN202122334091 U CN 202122334091U CN 215746972 U CN215746972 U CN 215746972U
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Abstract
The utility model provides a uniform heat conduction reflow soldering support plate which comprises a main body assembly and a heat conduction assembly, wherein the main body assembly comprises an arc-shaped plate body, a circular rod body and an inclined plate body; a heat conducting component is arranged in the main body component; the heat conduction assembly comprises a welding carrier plate body, a small circular blind hole, a large circular blind hole, a copper plate body and an alkali-free glass fiber plate body; the lower surface of the welding support plate body is uniformly provided with small circular blind holes, and the lower surface of the welding support plate body is uniformly provided with large circular blind holes. According to the utility model, according to the air convection path of heat conduction, the small circular blind holes and the large circular blind holes with different sizes and different depths are arranged on the back surface of the welding carrier plate body, so that the influence degree of heat absorption (heat absorption) of the carrier plate body on a product is reduced, wherein the arrangement of the alkali-free glass fiber plate body is used for improving the temperature uniformity, improving the product curing effect and greatly improving the quality of reflow welding of the product.
Description
Technical Field
The utility model relates to the technical field of welding carrier plates, in particular to a uniform heat conduction reflow welding carrier plate.
Background
The reflow soldering furnace process is characterized in that soft soldering of mechanical and electrical connection between a soldering end or a pin of a surface-mounted component and a printed board pad is realized by re-melting paste soft solder pre-distributed on the printed board pad, and when the reflow soldering furnace is used, a carrier plate for placing a product to enter the reflow soldering furnace for heating and curing is required to be used for transferring;
when the existing welding support plate works, the internal temperature of the reflow soldering furnace is transmitted to the welding support plate, and the welding support plate is unevenly heated due to the fact that the welding support plate is unevenly heated, so that the curing effect is influenced, the product can be damaged when the local high temperature is heated, the working efficiency is reduced, and therefore the uniform heat conduction reflow soldering support plate is provided.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a reflow soldering carrier board with uniform heat conduction to solve or alleviate the technical problems in the prior art, and at least provide a useful choice.
The technical scheme of the embodiment of the utility model is realized as follows: a uniform heat conduction reflow soldering support plate comprises a main body assembly and a heat conduction assembly, wherein the main body assembly comprises an arc-shaped plate body, a circular rod body and an inclined plate body;
a heat conducting component is arranged in the main body component;
the heat conduction assembly comprises a welding carrier plate body, a small circular blind hole, a large circular blind hole, a copper plate body and an alkali-free glass fiber plate body;
the lower surface of the welding support plate body is uniformly provided with small circular blind holes, the lower surface of the welding support plate body is uniformly provided with large circular blind holes, and the inner side wall of the welding support plate body is embedded with a copper plate body.
In some embodiments, the arc plate body is evenly installed on the upper surface of the welding support plate body, and through the arrangement of the arc plate body, the safety of a product can be protected through compression resistance, and the product can be limited.
In some embodiments, two square through grooves are symmetrically formed in the outer side wall of the welding carrier plate body, the upper surface of the welding carrier plate body is provided with positioning holes, and through the arrangement of the square through grooves, air circulation is facilitated, and damage to a product due to overhigh temperature is prevented.
In some embodiments, the placing groove is uniformly formed in the upper surface of the welding carrier plate body, and the placing groove is convenient for an operator to place a product into the placing groove.
In some embodiments, the two fixing through grooves are symmetrically formed in the outgoing wall of the welding carrier plate body, and the welding carrier plate body is convenient to limit through the arrangement of the fixing through grooves.
In some embodiments, circular through holes are uniformly formed in the bottom wall of the inner side of the square through groove, and heat dissipation of the welding carrier plate body is improved through the arrangement of the circular through holes.
In some embodiments, the inclined plate body is uniformly installed on the inner side wall of the square through groove, the inclined square through hole is uniformly formed in the inner side wall of the square through groove, air is blocked through the inclined plate body and is discharged through the inclined square through hole, and heat diversion can be effectively carried out.
In some embodiments, the alkali-free glass fiber plate body penetrates through the inner side wall of the square through groove, and the alkali-free glass fiber plate body has high temperature resistance, high elasticity and other properties through the arrangement of the alkali-free glass fiber plate body, so that the toughness of the welding carrier plate body is improved, and high-temperature fracture is caused.
Due to the adoption of the technical scheme, the embodiment of the utility model has the following advantages:
according to the utility model, according to the air convection path of heat conduction, the small circular blind holes and the large circular blind holes with different sizes and different depths are arranged on the back surface of the welding carrier plate body, so that the influence degree of heat absorption (heat absorption) of the carrier plate body on a product is reduced, wherein the arrangement of the alkali-free glass fiber plate body is used for improving the temperature uniformity, improving the product curing effect and greatly improving the quality of reflow welding of the product.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments or technical descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a perspective structural view of the present invention;
FIG. 2 is a perspective bottom view of the present invention;
FIG. 3 is a perspective cross-sectional structural view of the present invention;
FIG. 4 is an enlarged structural view of the area A of FIG. 3 according to the present invention;
FIG. 5 is an internal structural view of the present invention in a perspective side view;
FIG. 6 is an enlarged structural view of the area B in FIG. 5 according to the present invention.
Reference numerals: 1. a body assembly; 101. an arc-shaped plate body; 102. a circular rod body; 103. inclining the plate body; 2. a heat conducting component; 201. welding a carrier plate body; 202. a small circular blind hole; 203. a large circular blind hole; 204. a copper plate body; 205. an alkali-free glass fiber board body; 4. a placement groove; 5. positioning holes; 6. fixing the through groove; 7. a square through groove; 8. a circular through hole; 9. the square through hole is inclined.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 6, an embodiment of the present invention provides a uniform heat conduction reflow soldering carrier plate, which includes a main body assembly 1 and a heat conduction assembly 2, wherein the main body assembly 1 includes an arc-shaped plate body 101, a circular rod body 102, and an inclined plate body 103;
a heat conducting component 2 is arranged in the main body component 1;
the heat conducting component 2 comprises a welding carrier plate body 201, a small circular blind hole 202, a large circular blind hole 203, a copper plate body 204 and an alkali-free glass fiber plate body 205;
the lower surface of the welding carrier plate body 201 is uniformly provided with small circular blind holes 202, the lower surface of the welding carrier plate body 201 is uniformly provided with large circular blind holes 203, and the inner side wall of the welding carrier plate body 201 is embedded with a copper plate body 204.
In one embodiment, the arc-shaped plate body 101 is uniformly installed on the upper surface of the welding carrier plate body 201, and the arc-shaped plate body 101 can resist pressure to protect the safety of a product and limit the product.
In one embodiment, two square through grooves 7 are symmetrically formed on the outer side wall of the welding carrier body 201, and the positioning hole 5 is formed on the upper surface of the welding carrier body 201, so that air circulation is facilitated and the product is prevented from being damaged due to overhigh temperature through the arrangement of the square through grooves 7, wherein the position of the welding carrier body 201 is further enhanced by the arrangement of the positioning hole 5.
In one embodiment, the placing groove 4 is uniformly formed in the upper surface of the welding carrier plate body 201, and the placing groove 4 is convenient for an operator to place a product into the placing groove 4, so that the placing groove 4 improves the fixation of the product.
In one embodiment, two fixing through grooves 6 are symmetrically formed in the outgoing wall of the welding carrier body 201, and the welding carrier body 201 is convenient to limit through the arrangement of the fixing through grooves 6.
In one embodiment, the inner bottom wall of the square through groove 7 is uniformly provided with circular through holes 8, and through the arrangement of the circular through holes 8, the heat dissipation of the welding carrier plate body 201 is improved, the constant temperature of the welding carrier plate body 201 is maintained, and the product is prevented from being damaged by high temperature.
In one embodiment, the inclined plate body 103 is uniformly installed on the inner side wall of the square through groove 7, the inclined square through hole 9 is uniformly formed in the inner side wall of the square through groove 7, air is blocked through the inclined plate body 103 and discharged through the inclined square through hole 9, heat diversion can be effectively carried out, and the phenomenon that the product is damaged due to overhigh temperature is avoided.
In one embodiment, the alkali-free glass fiber plate body 205 penetrates through the inner side wall of the square through groove 7, and the alkali-free glass fiber plate body 205 has high temperature resistance, high elasticity and the like through the arrangement of the alkali-free glass fiber plate body 205, so that the toughness of the welding carrier plate body 201 is improved, and high temperature fracture is caused.
The utility model is in operation: the product is placed in the placing groove 4, wherein the arc-shaped plate body 101 can resist pressure to protect the product and limit the product, the positioning hole 5 is placed on the fixing position, the through groove 6 is fixed, the welding carrier plate body 201 is further positioned, the welding carrier plate body 201 is transported into a reflow furnace, then the small circular blind holes 202 and the large circular blind holes 203 with different sizes and different depths are arranged on the back surface of the welding carrier plate body 201 according to the heat conduction air convection path, the influence degree of the heat absorption and heat absorption of the carrier plate body on the product is reduced, the arrangement of the copper plate body 204 is used for improving the uniformity of temperature and improving the curing effect of the product, then the arrangement of the alkali-free glass fiber plate body 205 is used for improving the toughness of the welding carrier plate body 201 and causing high-temperature fracture, and the arrangement of the square through groove 7 facilitates air circulation, prevent the high temperature, then the air blocks through slope plate body 103 and discharges through slope square through hole 9, can effectively carry out the heat water conservancy diversion, avoids appearing the high temperature, damages the condition of product.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present invention, and these should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. The utility model provides a uniform heat conduction reflow soldering support plate, includes main part subassembly (1) and heat-conducting component (2), its characterized in that: the main body component (1) comprises an arc-shaped plate body (101), a circular rod body (102) and an inclined plate body (103);
a heat conduction assembly (2) is arranged in the main body assembly (1);
the heat conduction assembly (2) comprises a welding carrier plate body (201), a small circular blind hole (202), a large circular blind hole (203), a copper plate body (204) and an alkali-free glass fiber plate body (205);
small circular blind holes (202) are uniformly formed in the lower surface of the welding carrier plate body (201), large circular blind holes (203) are uniformly formed in the lower surface of the welding carrier plate body (201), and a copper plate body (204) is embedded in the inner side wall of the welding carrier plate body (201).
2. The uniformly thermally conductive reflow solder carrier of claim 1, wherein: the upper surface of welding support plate body (201) evenly installs arc plate body (101).
3. The uniformly thermally conductive reflow solder carrier of claim 1, wherein: two square through grooves (7) are symmetrically formed in the outer side wall of the welding carrier plate body (201), and positioning holes (5) are formed in the upper surface of the welding carrier plate body (201).
4. The uniformly thermally conductive reflow solder carrier of claim 1, wherein: the upper surface of the welding carrier plate body (201) is uniformly provided with placing grooves (4).
5. The uniformly thermally conductive reflow solder carrier of claim 1, wherein: two fixed through grooves (6) are symmetrically formed in the outgoing wall of the welding carrier plate body (201).
6. The uniformly thermally conductive reflow solder carrier of claim 3, wherein: circular through holes (8) are uniformly formed in the bottom wall of the inner side of the square through groove (7).
7. The uniformly thermally conductive reflow solder carrier of claim 3, wherein: the square through groove is characterized in that an inclined plate body (103) is uniformly installed on the inner side wall of the square through groove (7), and an inclined square through hole (9) is uniformly formed in the inner side wall of the square through groove (7).
8. The uniformly thermally conductive reflow solder carrier of claim 3, wherein: and an alkali-free glass fiber plate body (205) penetrates through the inner side wall of the square through groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122334091.0U CN215746972U (en) | 2021-09-26 | 2021-09-26 | Uniform heat conduction reflow soldering support plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122334091.0U CN215746972U (en) | 2021-09-26 | 2021-09-26 | Uniform heat conduction reflow soldering support plate |
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| Publication Number | Publication Date |
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| CN215746972U true CN215746972U (en) | 2022-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122334091.0U Active CN215746972U (en) | 2021-09-26 | 2021-09-26 | Uniform heat conduction reflow soldering support plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114309855A (en) * | 2022-03-08 | 2022-04-12 | 深圳市捷豹自动化设备有限公司 | Vacuum welding system |
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2021
- 2021-09-26 CN CN202122334091.0U patent/CN215746972U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114309855A (en) * | 2022-03-08 | 2022-04-12 | 深圳市捷豹自动化设备有限公司 | Vacuum welding system |
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