CN215746930U

CN215746930U - Circuit board soldering tin removing device

Info

Publication number: CN215746930U
Application number: CN202121624653.9U
Authority: CN
Inventors: 卢超; 杨冬伟; 陈正; 郭键柄; 丁志广; 张亚东
Original assignee: Lanzhou Engineering and Research Institute of Nonferrous Metallurgy Co Ltd
Current assignee: Lanzhou Engineering and Research Institute of Nonferrous Metallurgy Co Ltd
Priority date: 2021-07-16
Filing date: 2021-07-16
Publication date: 2022-02-08
Anticipated expiration: 2031-07-16

Abstract

The utility model belongs to the technical field of hazardous waste recycling equipment, and particularly discloses a circuit board soldering tin removing device which comprises a cleaning unit, a heating unit and a control unit, wherein the cleaning unit comprises a cleaning tank for containing a heating medium, a heating structure and an ultrasonic structure; the separation unit comprises a centrifugal groove, a first driving structure and a second driving structure, the centrifugal groove is located in the cleaning groove, and a plurality of separation holes are formed in the bottom wall and/or the side wall of the centrifugal groove. According to the scheme, the soldering tin on the waste circuit board is heated in the high-temperature oil, so that the oxidation of tin is effectively avoided, the tin obtained by recovery is simple substance tin, and the tin can be directly recycled without redundant processing in the following process, so that the obtaining efficiency of the tin is improved; the whole falling process of soldering tin is carried out in high-temperature oil, harmful smoke is avoided, the treatment process is clean and environment-friendly, and no secondary pollution is caused.

Description

Circuit board soldering tin removing device

Technical Field

The utility model belongs to the technical field of hazardous waste recycling equipment, and particularly relates to a circuit board soldering tin removing device.

Background

With the development of information technology, a large number of electronic and electrical equipment is brought, printed circuit boards as important components of electronic components are rapidly increased and greatly updated, a large amount of soldering tin is contained in waste printed circuit boards, the waste printed circuit boards have high recycling value, and meanwhile, the removal of the soldering tin before the waste printed circuit boards are treated can create good recycling conditions for the recycling of copper, gold, silver and the like in the circuit boards, so that the metal recycling cost is reduced.

It has been found that solder accounts for about 4% of the circuit board. At present, the removal of soldering tin on a circuit board mainly comprises a wet method and a mechanical separation method. The wet method for removing the soldering tin on the circuit board has the defects of complex technological process, high consumption of chemical reagents and the like, and generates a large amount of waste water and waste gas in treatment engineering, thereby causing adverse effects on the environment. The mechanical separation method mainly comprises the steps of heating soldering tin to melting, then adopting mechanical external force to separate and recover the soldering tin, and dividing the soldering tin into infrared heating, hot air heating, metal conduction heating and the like according to a heating mode.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a circuit board soldering tin removing device, which avoids harmful smoke generated by direct contact of a circuit board body and air under a high-temperature condition, is clean and environment-friendly in the treatment process, has no secondary pollution, and removes residual tin in a centrifugal mode to be clean and thorough.

In order to achieve the purpose, the technical scheme of the utility model is as follows:

a circuit board solder removing device includes:

the cleaning unit comprises a cleaning tank for containing a heating medium, a heating structure for heating the heating medium and an ultrasonic structure;

the separation unit comprises a centrifugal groove, a first driving structure for driving the centrifugal groove to lift and a second driving structure for driving the centrifugal groove to rotate, the centrifugal groove is located in the cleaning groove, and a plurality of separation holes are formed in the bottom wall and/or the side wall of the centrifugal groove.

Based on the scheme, the using principle of the device is that the centrifugal groove is moved to the upper part of the cleaning groove in advance through the first driving structure, and then the circuit board to be processed is placed in the centrifugal groove. Then introducing a heating medium into the cleaning tank, wherein the heating medium is usually heating oil, the liquid level of the oil is controlled to be positioned below the centrifugal tank, then the temperature of the oil is raised through a heating structure, and the oil temperature is controlled to be 195-205 ℃.

After the preparation work is finished, the centrifugal tank is moved to the lower part of the cleaning tank through the first driving structure, the cleaning tank is completely immersed in the high-temperature oil, the soldering tin on the circuit board is melted by the heat of the high-temperature oil, and then the circuit board is cleaned through the ultrasonic structure, so that the melted soldering tin is separated from the circuit board.

Then shift out the centrifuge bowl from high temperature oil through first drive structure, because all seted up a plurality of separation holes on centrifuge bowl diapire and/or the lateral wall, so high temperature oil and soldering tin in the centrifuge bowl can flow out to the washing tank in from the separation hole, and soldering tin subsides to the washing tank bottom portion at last. Then, the centrifugal groove is driven to rotate by the second driving structure, the circuit board inside the centrifugal groove is driven to rotate by the centrifugal groove, high-temperature oil and molten soldering tin on the circuit board and the electronic element fall off under the action of centrifugal force and flow into the cleaning groove through the separation hole, and the soldering tin on the circuit board is thoroughly removed. And finally, taking the circuit board out of the separation tank, and taking out the soldering tin from the bottom of the cleaning tank.

Preferably, a plurality of partition plates are arranged in the centrifugal groove at intervals, and each partition plate is provided with a plurality of separation holes. The baffle is used for interval and fixed circuit board, can make the stable placing of posture of circuit board with erectting in the centrifugal tank, avoids the circuit board to rock when rotating along with the centrifugal tank and collides with and damage, also does benefit to the flow of melting soldering tin and high temperature oil and makes it break away from the circuit board more easily, promotes the effect of getting rid of soldering tin.

Preferably, the second driving structure comprises a centrifugal motor, an output shaft of the centrifugal motor is fixedly connected with a rotating shaft, the lower end of the rotating shaft is fixedly connected with the centrifugal groove, the first driving structure comprises a telescopic structure, and an output end of the telescopic structure is fixedly connected with the centrifugal motor body. The lifting of the centrifugal groove is driven by the telescopic structure, the structure is simple, and the operation is convenient.

Preferably, the ultrasonic structure comprises an ultrasonic generator and a transducer, the transducer is connected with the cleaning tank, the ultrasonic generator is connected with the transducer, the ultrasonic cavitation effect is used for cleaning and removing the soldering tin, and the effect is good.

Preferably, the upper and lower parts of the cleaning tank are respectively a separation part and a cleaning part, the heating structure is arranged at the cleaning part, and the side walls of the separation part and the cleaning part are both provided with heat preservation layers. The cleaning part sets up heating structure and intensifies for hot oil, is convenient for tentatively detach the soldering tin on the circuit board, and the washing tank wholly sets up the heat preservation and insulates against heat for the inside heat preservation that keeps warm of washing tank, reduces thermal loss in the washing tank, reduces the energy consumption.

Preferably, the centrifugal motor is a speed-adjustable motor.

Preferably, a temperature thermocouple is arranged at the bottom of the cleaning tank.

Preferably, the heating structure comprises a heating element arranged in the cleaning part, and the heating element is a resistance wire.

Preferably, the side walls of the separating part and the cleaning part are smoothly connected through a round chamfer or an oblique chamfer.

The beneficial effect of this scheme:

(1) according to the scheme, the soldering tin on the waste circuit board is heated in the high-temperature oil, so that the oxidation of tin is effectively avoided in the tin removing process, the recovered tin is simple substance tin, redundant processing is not required in the subsequent process, the tin can be directly recycled, and the obtaining efficiency of the tin is improved; meanwhile, the whole falling process of soldering tin is carried out in high-temperature oil, harmful smoke generated by direct contact of the high-temperature condition of the circuit board body and air is avoided, the processing process is clean and environment-friendly, and no secondary pollution is caused.

(2) The desorption of this scheme soldering tin and electronic components utilizes the cavitation of ultrasonic wave to wash the desorption, compares with mechanical shock, and is more swift effective, and has avoided electronic components's damage.

(3) This scheme circuit board and the high temperature oil on the electronic components compare the clear water through rotatory mode centrifugal separation and soak the washing, and no waste water produces, and remaining high temperature oil and soldering tin can directly flow to the cleaning bath bottom in addition, realize the thorough recovery of the continuous utilization of high temperature oil and soldering tin.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present invention;

FIG. 2 is a schematic diagram of the centrifugal tank lowered to the bottom of the washing tank in the embodiment.

Reference numerals in the drawings of the specification include: the device comprises a cleaning tank 10, a cleaning part 11, a separating part 12, a centrifugal tank 20, a partition plate 30, a rotating shaft 40, an electric push rod 41, a centrifugal motor 42, a resistance wire 50, a temperature thermocouple 51, an ultrasonic generator 60 and a transducer 61.

Detailed Description

Various embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Here, it is to be noted that, in the drawings, the same reference numerals are given to constituent parts having substantially the same or similar structures and functions, and repeated description thereof will be omitted. The term "sequentially comprising A, B, C, etc" merely indicates the order of the included elements A, B, C, etc. and does not exclude the possibility of including other elements between a and B and/or between B and C. The description of "first" and its variants is merely for distinguishing the components and does not limit the scope of the utility model, and "first" may be written as "second" and the like without departing from the scope of the utility model.

The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships.

Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to fig. 1 and 2.

Referring to fig. 1 and 2, the present embodiment provides a circuit board solder removing apparatus, including a cleaning unit and a detaching unit, wherein the cleaning unit includes a cleaning tank 10 for containing a heating medium, a heating structure for heating the heating medium, and an ultrasonic structure; the separation unit comprises a centrifugal groove 20, a first driving structure for driving the centrifugal groove 20 to ascend and descend and a second driving structure for driving the centrifugal groove 20 to rotate, the centrifugal groove 20 is located in the cleaning groove 10, and a plurality of separation holes are formed in the bottom wall and/or the side wall of the centrifugal groove 20.

Wherein, washing tank 10 and centrifuge bowl 20 are the square cell body that the stainless steel casing constitutes, and in the horizontal direction, the length and width of centrifuge bowl 20 all is less than the length and width of washing tank 10, and the length and width of the long and width of washing tank 10 upper portion is greater than the diagonal length of centrifuge bowl 20, and in the direction of height, the height of washing tank 10 is greater than the twice of centrifuge bowl 20 height, makes centrifuge bowl 20 freely go up and down and rotate in washing tank 10.

The separation holes are arranged on the bottom wall and the side wall of the centrifugal groove 20 at certain intervals, and the aperture of each separation hole is smaller than 5 mm, so that electronic elements falling off from the circuit board are prevented from passing through.

Based on the scheme, the using principle of the device is that the centrifugal groove 20 is moved to the upper part of the cleaning groove 10 in advance through the first driving structure, and then the circuit board to be processed is placed in the centrifugal groove 20. Then a heating medium is led into the cleaning tank 10, the heating medium is usually heating oil, the liquid level of the oil is controlled to be positioned below the centrifugal tank 20, and then the temperature of the oil is raised through a heating structure, and the temperature of the oil is controlled to be 195-205 ℃. The order of the above two steps may be replaced.

After the preparation, the centrifugal tank 20 is moved to the lower part of the cleaning tank 10 by the first driving structure, the cleaning tank 10 is completely immersed in the high-temperature oil, the soldering tin on the circuit board is melted by the heat of the high-temperature oil, and then the circuit board is cleaned by the ultrasonic structure, so that the melted soldering tin is separated from the circuit board.

Then shift out centrifuge bowl 20 from high temperature oil through first drive structure, because all seted up a plurality of separation holes on centrifuge bowl 20 diapire and/or the lateral wall, so high temperature oil and soldering tin in centrifuge bowl 20 can flow out to the purge trough 10 in from the separation hole, and the soldering tin subsides to the purge trough 10 bottom at last. After the centrifugal groove 20 moves to the position above the high-temperature oil, the centrifugal groove 20 is driven to rotate by the second driving structure, the centrifugal groove 20 rotates to drive the circuit board inside to rotate, the high-temperature oil and the molten soldering tin on the circuit board and the electronic element fall off under the action of centrifugal force and flow into the cleaning groove 10 through the separation hole, and the soldering tin on the circuit board is thoroughly removed. And finally, taking the circuit board and the electronic element out of the separation tank, separating the circuit board and the electronic element, and taking the soldering tin out of the bottom of the cleaning tank 10.

In some embodiments, a plurality of partition plates 30 are spaced in the centrifugal groove 20, each partition plate 30 is also provided with a plurality of separation holes, and the distance between two adjacent partition plates 30 is slightly larger than the thickness of the circuit board, so that the circuit board can be clamped between two partition plates 30 and does not have a large range of motion in the interlayer of two partition plates 30. Baffle 30 is used for interval and fixed circuit board, can make the circuit board with the stable placing of the gesture of erectting in centrifuge bowl 20, avoids the circuit board to rock when centrifuge bowl 20 rotates and collide with and damage, also more does benefit to the flow of melting soldering tin and high temperature oil and makes it break away from the circuit board more easily, promotes the effect of getting rid of soldering tin, and the separation hole on the baffle 30 is convenient for high temperature oil and soldering tin to pass through.

In some embodiments, the first driving structure includes a telescopic structure, the telescopic structure may be an electric push rod 41, an air cylinder or a hydraulic cylinder, etc., in this embodiment, the telescopic structure is the electric push rod 41, a machine body of the telescopic structure is fixedly mounted on a frame or a wall body above through screws, the second driving structure includes a centrifugal motor 42 and a rotating shaft 40, the machine body of the centrifugal motor 42 is fixedly connected with an output end of the telescopic structure through screws, an upper end of the rotating shaft 40 is fixedly connected to an output shaft of the centrifugal motor 42 through a coupling, and a lower end of the rotating shaft 40 is fixedly connected with a middle portion of the centrifugal groove 20 through screws. The centrifugal groove 20 is driven to lift by the telescopic structure, the structure is simple, the operation is convenient, and the centrifugal motor 42 is a speed regulating motor, so that the rotating speed can be conveniently regulated according to the actual use condition.

In some embodiments, the ultrasonic structure comprises an ultrasonic generator 60 and a transducer 61, the transducer 61 is connected with the cleaning tank 10, the ultrasonic generator 60 is connected with the transducer 61, and the cleaning effect is good by using the cavitation effect of ultrasonic waves to clean and remove the soldering tin.

In some embodiments, the upper and lower parts of the cleaning tank 10 are a separating part 12 and a cleaning part 11, respectively, the heating structure is disposed at the cleaning part 11, and the side walls of the separating part 12 and the cleaning part 11 are both provided with insulating layers, and the insulating layers are glass wool embedded in a stainless steel shell. Wherein, the height that highly all is greater than centrifuge bowl 20 of cleaning part 11 and separation part 12, cleaning part 11 sets up heating structure and for hot oil intensification, is convenient for tentatively detach the soldering tin on the circuit board, and cleaning tank 10 is whole to set up the heat preservation and to keep warm for cleaning tank 10 is inside thermal-insulated, reduces thermal loss in cleaning tank 10, reduces the energy consumption.

In some embodiments, a thermo-couple 51 is disposed at the bottom of the cleaning tank 10 to monitor the temperature of the high temperature oil.

In some embodiments, the heating structure comprises a heating element disposed within the washing section 11, the heating element being a resistance wire 50, in particular, a gap between glass wool and a stainless steel housing, the resistance wire 50 being disposed within the gap. In the present embodiment, the resistance wire 50 is used for heating, but the present invention is not limited to this heating method, and may also include an induction heating method.

In some embodiments, the separating portion 12 and the inner wall of the cleaning portion 11 are smoothly connected by a round chamfer or an oblique chamfer, so that the high-temperature oil on the side wall of the separating portion 12 can smoothly flow into the cleaning portion 11.

The method can realize the complete removal of the soldering tin of the waste circuit board, the separation rate of components reaches more than 98 percent, and the removal efficiency is high. The method and the device of the utility model are adopted to remove the soldering tin on the waste printed circuit board, no waste water, waste residue and waste gas are generated, and the treatment process is environment-friendly and efficient.

The foregoing detailed description of the preferred embodiments of the utility model has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.

Claims

1. A circuit board soldering tin remove device which characterized in that includes:

the cleaning unit comprises a cleaning tank (10) for containing a heating medium, a heating structure for heating the heating medium and an ultrasonic structure;

the separation unit comprises a centrifugal groove (20), a first driving structure for driving the centrifugal groove (20) to lift and a second driving structure for driving the centrifugal groove (20) to rotate, wherein the centrifugal groove (20) is positioned in the cleaning groove (10), and a plurality of separation holes are formed in the bottom wall and/or the side wall of the centrifugal groove (20).

2. The solder removing apparatus for circuit board according to claim 1, wherein: a plurality of partition plates (30) are arranged in the centrifugal groove (20) at intervals, and each partition plate (30) is provided with a plurality of separation holes.

3. A device for removing solder from a circuit board according to claim 1 or 2, wherein: the second driving structure comprises a centrifugal motor (42), a rotating shaft (40) is fixedly connected to an output shaft of the centrifugal motor (42), the lower end of the rotating shaft (40) is fixedly connected with the centrifugal groove (20), the first driving structure comprises a telescopic structure, and the output end of the telescopic structure is fixedly connected with the centrifugal motor (42) body.

4. A device for removing solder from a circuit board according to claim 1 or 2, wherein: the ultrasonic structure comprises an ultrasonic generator (60) and a transducer (61), wherein the transducer (61) is connected with the cleaning tank (10), and the ultrasonic generator (60) is connected with the transducer (61).

5. The solder removing apparatus for circuit board according to claim 1, wherein: the upper part and the lower part of the cleaning tank (10) are respectively a separating part (12) and a cleaning part (11), the heating structure is arranged at the cleaning part (11), and the side walls of the separating part (12) and the cleaning part (11) are respectively provided with a heat insulating layer.

6. The solder removing apparatus for circuit board according to claim 5, wherein: the bottom of the cleaning tank (10) is provided with a temperature thermocouple (51).

7. The solder removing apparatus for circuit board according to claim 5, wherein: the heating structure comprises a heating element arranged in the cleaning part (11), and the heating element is a resistance wire (50).

8. The solder removing apparatus for circuit board according to claim 3, wherein: the centrifugal motor (42) is a speed-regulating motor.

9. A device for removing solder from circuit board as claimed in claim 5, 6 or 7, wherein: the separating part (12) and the inner wall of the cleaning part (11) are smoothly connected through a round chamfer or an inclined chamfer.