CN215731645U

CN215731645U - Suction cup air knife

Info

Publication number: CN215731645U
Application number: CN202122092429.6U
Authority: CN
Inventors: 安迪
Original assignee: Wuxi Jiangsong Science And Technology Co ltd
Current assignee: Wuxi Jiangsong Technology Co ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-02-01
Anticipated expiration: 2031-08-31

Abstract

The utility model relates to the technical field of silicon wafer clamping mechanisms, in particular to a sucker air knife. The air suction type electric knife comprises a knife body, wherein the knife body comprises an installation part and a suction disc part, an air suction connection port is arranged on the installation part, a suction disc communicated with the air suction connection port is arranged on the suction disc part, air blowing connection ports are symmetrically arranged on the installation part and positioned on two sides of the air suction connection port, and air blowing ports communicated with the air blowing connection ports are arranged on the side surface of the installation part. The silicon wafer separation device is reasonable and simple in structure and convenient and fast to operate, the plurality of cutter bodies are sequentially arranged on the silicon wafer clamping jaws, the air suction source and the air blowing source are respectively connected with the air suction connecting port and the air blowing connecting port, the air suction source can provide suction force, so that the suction disc can suck silicon wafers, meanwhile, air in the air blowing source is blown out through the air blowing port to blow the sticky silicon wafers, the sticky silicon wafers are separated, the suction disc only sucks one silicon wafer at a time, and then, the silicon wafers are independently treated.

Description

Suction cup air knife

Technical Field

The utility model relates to the technical field of silicon wafer clamping mechanisms, in particular to a sucker air knife.

Background

The silicon chip is a main material for producing photovoltaic products, is also an important material for manufacturing integrated circuits, can be made into various semiconductor devices by means of photoetching, ion implantation and the like, and is widely applied to the fields of aerospace, industry, agriculture, national defense and the like. The silicon chip generally uses the sucking disc to snatch the transportation, and the sucking disc is when absorbing the silicon chip, and two liang of silicon chips can be glued together for a bit, and then is unfavorable for the processing to every silicon chip.

The above problems are problems that the art needs to solve.

Disclosure of Invention

The utility model aims to provide a sucker air knife, so that silicon wafers can be prevented from being stuck together, and each silicon wafer can be conveniently and independently processed.

In order to solve the technical problem, the utility model provides the following scheme: the utility model provides a sucking disc air knife, includes the cutter body, the cutter body includes installation department and sucking disc portion, be provided with the connector that induced drafts on the installation department, be provided with on the sucking disc portion with the sucking disc of connector intercommunication that induced drafts, lie in on the installation department the connector bilateral symmetry that induced drafts is provided with the connector of blowing, be provided with on the side of installation department with the mouth of blowing of connector intercommunication of blowing.

As a further improvement of the utility model, the side surface is an inclined surface, and the included angle between the side surface and the sucker part is 145-155 degrees.

As a further improvement of the utility model, the included angle between the side surface and the sucker part is 150 degrees.

As a further improvement of the utility model, the sucker comprises an annular groove, and a suction port communicated with the blowing connecting port is arranged in the annular groove.

As a further improvement of the utility model, the number of the suckers is 3-4.

As a further improvement of the utility model, the bottom of the sucking disc part is provided with a chamfer.

The utility model has the beneficial effects that:

the silicon wafer separation device is reasonable and simple in structure and convenient and fast to operate, the plurality of cutter bodies are sequentially arranged on the silicon wafer clamping jaws, the air suction source and the air blowing source are respectively connected with the air suction connecting port and the air blowing connecting port, the air suction source can provide suction force, so that the suction disc can suck silicon wafers, meanwhile, air in the air blowing source is blown out through the air blowing port to blow the sticky silicon wafers, the sticky silicon wafers are separated, the suction disc only sucks one silicon wafer at a time, and then, the silicon wafers are independently treated.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of section A of FIG. 1;

fig. 3 is an enlarged schematic view of a portion B in fig. 2.

Reference numerals: 1. a cutter body; 101. an installation part; 102. a chuck section; 103. a side surface; 2. an air suction connector; 3. a suction cup; 301. an annular groove; 302. a suction port; 4. a blowing connector; 5. an air blowing port; 6. and (6) chamfering.

Detailed Description

The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.

Referring to fig. 1, the present invention is an embodiment of the present invention, including a cutter body 1, the cutter body 1 includes a mounting portion 101 and a suction disc portion 102, the mounting portion 101 is provided with an air suction connection port 2, the suction disc portion 102 is provided with a suction disc 3 communicated with the air suction connection port 2, the mounting portion 101 is symmetrically provided with air blowing connection ports 4 at two sides of the air suction connection port 2, and a side surface 103 of the mounting portion 101 is provided with an air blowing port 5 communicated with the air blowing connection ports 4. Install a plurality of cutter bodies 1 on the silicon chip clamping jaw in proper order, will inhale the air supply and blow the source and be connected with connector 2 and the connector 4 of blowing that induced drafts respectively, the source of breathing in can provide suction for sucking disc 3 can absorb the silicon chip, blow out through mouth 5 of blowing simultaneously the gas in the air supply, blow to gluing glutinous silicon chip, and then make the separation of gluing glutinous silicon chip, make sucking disc 3 only absorb a silicon chip at every turn, and then be convenient for carry out solitary processing to every silicon chip.

In this embodiment, in order to enable the wind energy blown out from the air blowing port 5 to separate the sticky silicon wafer, the side surface 103 is set to be an inclined surface, the included angle between the side surface 103 and the suction cup portion 102 is 145 ° to 155 °, the air blowing port 5 can blow the silicon wafer obliquely, and the included angle is set to be 145 ° to 155 °, so that the air blowing effect can be improved.

In the present embodiment, in order to further improve the effect of the wind blown from the air outlet 5 on the separation of the silicon wafer, the angle between the side surface 103 and the suction cup portion 102 is set to 150 °, and the effect of the separation of the silicon wafer can be further improved.

In this embodiment, the suction cup 3 includes an annular groove 301, and a suction port 302 communicating with the blowing connection port 4 is provided in the annular groove 301. The induced draft in the suction port 302 flows in the annular groove 301, which can increase the contact area with the silicon wafer and improve the suction stability.

In this embodiment, in order to improve the stability of the suction cups 3 to the silicon wafer suction, the number of the suction cups 3 is set to 3 to 4, and the stability of the silicon wafer suction can be improved by the suction of the plurality of suction cups 3 to the silicon wafer.

In this embodiment, the bottom of the chuck part 102 is provided with the chamfer 6, so that the chuck part 102 can be smoothly inserted into a silicon wafer, and the stability of production and transportation is improved.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the utility model is all within the protection scope of the utility model. The protection scope of the utility model is subject to the claims.

Claims

1. The utility model provides a sucking disc air knife, its characterized in that, includes cutter body (1), cutter body (1) includes installation department (101) and sucking disc portion (102), be provided with air suction connector (2) on installation department (101), be provided with on sucking disc portion (102) with sucking disc (3) of air suction connector (2) intercommunication, lie in on installation department (101) air suction connector (2) bilateral symmetry is provided with connector (4) of blowing, be provided with on side (103) of installation department (101) with blow mouth (5) of blowing connector (4) intercommunication.

2. A suction cup air knife according to claim 1, characterised in that the side surface (103) is a bevelled surface, the side surface (103) making an angle of 145-155 ° with the suction cup portion (102).

3. A suction cup air knife according to claim 2, characterised in that the angle between the side surface (103) and the suction cup portion (102) is 150 °.

4. A suction cup air knife according to claim 1, characterised in that the suction cup (3) comprises an annular groove (301), and a suction opening (302) communicating with the blowing connection opening (4) is provided in the annular groove (301).

5. A suction cup air knife according to claim 1, characterised in that the number of suction cups (3) is 3-4.

6. A suction cup air knife according to claim 1, characterised in that the bottom of the suction cup portion (102) is provided with a chamfer (6).