CN215729547U - High-efficient heat dissipation hard disk mounting structure and hard disk installation device - Google Patents

Abstract

The utility model discloses a high-efficiency heat dissipation hard disk mounting structure and a hard disk mounting device, wherein the high-efficiency heat dissipation hard disk mounting structure comprises a device body; the device body is provided with a circuit board used for accommodating the circuit board electrically connected with the hard disk and a cavity used for accommodating one end of the hard disk; a first opening for inserting the hard disk into the cavity is formed in the side face of the device body; the side surface of the device body is also provided with a first through hole which corresponds to the general data interface of the circuit board and communicates the cavity with the outside. When the universal data interface is used, the circuit board electrically connected with the universal data interface can be installed in the cavity. When the hard disk is used, the hard disk is inserted into the cavity through the first opening and is electrically connected with the circuit board, the circuit board connected with the hard disk is connected with the electronic equipment through the universal data line, and data transmission between the hard disk and the electronic equipment is achieved. The hard disk exposed to the environment can realize quick heat dissipation through heat exchange with the environment, and the hard disk is convenient to insert into or take out of the cavity.

Description

High-efficient heat dissipation hard disk mounting structure and hard disk installation device

Technical Field

The utility model relates to a hard disk installation device, in particular to a high-efficiency heat dissipation hard disk installation structure and a hard disk installation device.

Background

The hard disk is mainly used for storing large-capacity data, but because the hard disk interfaces are generally five types, namely IDE, SATA, SCSI, SAS and optical channels, the hard disk interfaces cannot be connected with the electronic equipment through a general data line for data transmission. In order to improve the universality of the hard disk, a hard disk mounting device with a universal data interface is available on the market, and after the hard disk is mounted on the hard disk mounting device matched with the hard disk mounting device, the hard disk can be connected with general electronic equipment by using a universal data cable.

However, the hard disk has large data transmission and long time consumption, so that the heat generated by the hard disk after long-time work is high, but the hard disk is installed in the hard disk installation device, so that the heat dissipation capacity of the hard disk is reduced by the hard disk installation device, the heat dissipation rate of the hard disk is reduced, the data transmission rate is reduced, and the data in the hard disk is lost in serious cases.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that a hard disk mounting device reduces the heat dissipation capability of a hard disk mounted therein, according to an aspect of the present invention, there is provided a high-efficiency heat-dissipating hard disk mounting structure.

The high-efficiency heat dissipation hard disk mounting structure comprises a device body; the device body is provided with a circuit board used for accommodating the circuit board electrically connected with the hard disk and a cavity used for accommodating one end of the hard disk; a first opening for inserting the hard disk into the cavity is formed in the side face of the device body; the side surface of the device body is also provided with a first through hole which corresponds to the general data interface of the circuit board and communicates the cavity with the outside.

When the universal data interface is used, the circuit board electrically connected with the universal data interface can be installed in the cavity. When the hard disk is required to be used, the hard disk is inserted into the cavity through the first opening and is electrically connected with the circuit board, so that the circuit board connected with the hard disk can be connected with the electronic equipment through the universal data line, and data transmission between the hard disk and the electronic equipment is realized. Because only one end of the hard disk is inserted into the cavity, and the other end of the hard disk is exposed in the environment, when the hard disk is used for heating for a long time, the heat emitted by the hard disk can be quickly dissipated by exchanging heat with the environment; moreover, one end of the hard disk is exposed to the environment, so that the hard disk can be conveniently inserted into or taken out of the cavity.

In some embodiments, the device body includes a housing provided with a first sink and a second opening communicating the first sink with the outside, the first opening being provided on the housing and being configured to enable the first sink to communicate with the outside so that the circuit board can be placed in the first sink through the first opening or the second opening; and the cover plate is detachably covered on the second opening of the shell, and the cover plate and the shell enclose a cavity.

Therefore, when the cover plate is detached from the shell, the circuit board can be installed in the first sinking groove of the shell, so that the circuit board can be conveniently installed and detached. When the circuit board is mounted, the cover plate can be detachably covered on the second opening of the shell to protect the circuit board from external influence.

In some embodiments, the first opening is provided on one side surface of the housing, the second opening is provided on an adjacent side surface of the housing to the side surface on which the first opening is provided, and the first opening and the second opening communicate with each other. The housing may be manufactured, for example, by injection molding, molding or machining, to facilitate the manufacture of the housing.

In some embodiments, an end portion of the cover plate extends toward a side facing away from the housing to a position close to an end portion of the hard disk accommodated in the cavity, and the cover plate is provided to be able to contact the hard disk inserted into the cavity and electrically connected to the circuit board. From this, when using this high-efficient heat dissipation hard disk mounting structure, can place the apron on the mesa, the apron is located this high-efficient heat dissipation hard disk mounting structure's bottom promptly to, the apron can give the hard disk that holds in the cavity and support.

In some embodiments, the cover plate is provided with a first mounting structure for detachable connection with the hard disk. Because the hard disk can be dismantled with the apron and be connected, can guarantee that the hard disk is installed more steadily on this high-efficient heat dissipation hard disk mounting structure.

In some embodiments, a surface of at least one of the cover plate and the case corresponding to the hard disk accommodated in the cavity is provided with a heat dissipation structure, and the cover plate and the case provided with the heat dissipation structure are made of a heat conductive material. Therefore, the heat dissipation performance of the high-efficiency heat dissipation hard disk mounting structure can be further improved through the heat dissipation structure.

In some embodiments, the detachable connection of the housing and the cover plate is realized by: the shell is connected with the cover plate through screws, and/or the shell is provided with a sliding groove along the direction that the hard disk is inserted into the cavity, and the cover plate is provided with a sliding block matched with the sliding groove.

In some embodiments, the housing or cover plate is further provided with a second mounting structure for mounting the circuit board. Therefore, the circuit board can be stably installed in the cavity of the device body.

In some embodiments, a second sinking groove is formed in the cover plate at a position corresponding to the circuit board. From this, can avoid this high-efficient heat dissipation hard disk mounting structure's thickness too thick, simultaneously, can alleviate the weight of apron.

According to another aspect of the present invention, there is provided a hard disk mounting apparatus, comprising a circuit assembly for mounting a hard disk and the aforementioned high-efficiency heat-dissipation hard disk mounting structure; the circuit component comprises a circuit board, a hard disk interface, a universal data interface and a power interface, wherein the hard disk interface is electrically connected to the circuit board; the device body is provided with a second through hole which corresponds to the power interface and communicates the cavity with the outside.

During the use, can insert the cavity with the hard disk through first opening in, pass through the hard disk interface electricity with circuit board wherein and be connected, supply power for the circuit board through power source, can be connected with the circuit board and the electronic equipment of hard disk through general data line from this, realize the transmission of data between hard disk and the electronic equipment. When the hard disk is heated after being used for a long time, the other end of the hard disk exposed outside the cavity can accelerate the heat exchange efficiency between the hard disk and the environment, and the hard disk is prevented from being invalid due to overheating after being used for a long time; and because one end of the hard disk is exposed in the environment, the hard disk is convenient to assemble and disassemble.

Drawings

Fig. 1 is a schematic structural diagram of a high-efficiency heat dissipation hard disk mounting structure according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another view of the high-efficiency heat dissipation hard disk mounting structure shown in FIG. 1;

FIG. 3 is a schematic cross-sectional view along the A-A direction of the high-efficiency heat dissipation hard disk mounting structure shown in FIG. 2;

FIG. 4 is a schematic cross-sectional view taken along the direction B-B of the high-efficiency heat dissipation hard disk mounting structure shown in FIG. 2;

FIG. 5 is a schematic structural diagram of another perspective view of the high-efficiency heat dissipation hard disk mounting structure shown in FIG. 1;

FIG. 6 is a schematic structural diagram illustrating a disassembled state of the high-efficiency heat dissipation hard disk mounting structure shown in FIG. 1;

FIG. 7 is a structural diagram of another view angle of the high-efficiency heat dissipation hard disk mounting structure shown in FIG. 1 in a disassembled state;

FIG. 8 is a schematic structural diagram of a hard disk mounting apparatus according to an embodiment of the present invention;

FIG. 9 is a schematic cross-sectional view of the hard disk mounting apparatus shown in FIG. 8;

FIG. 10 is a structural view illustrating a disassembled state of the hard disk mounting device shown in FIG. 8;

FIG. 11 is a structural view from another perspective of a disassembled state of the hard disk mounting device shown in FIG. 8;

FIG. 12 is a schematic structural diagram illustrating a usage state of a hard disk mounting apparatus according to an embodiment of the present invention;

reference numerals: 20. a device body; 21. a housing; 211. a first sink tank; 2111. a first groove portion; 2112. a second groove portion; 212. a second opening; 213. a chute; 214. a second mounting structure; 215. a support portion; 216. a third mounting structure; 217. a partition plate; 22. a cover plate; 221. a first mounting structure; 222. a heat dissipation structure; 223. a slider; 224. a second sink tank; 201. a cavity; 2011. a first accommodating chamber; 2012. a second accommodating chamber; 2013. a third opening; 202. a first opening; 203. a first through hole; 204. a second through hole; 205. a third through hole; 30. a circuit component; 31. a circuit board; 32. a general data interface; 33. a hard disk interface; 34. a power interface; 35. a switch; 40. a hard disk; 50. and (4) screws.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Fig. 1 to 7 schematically show a high-efficiency heat-dissipating hard disk mounting structure according to an embodiment of the present invention.

Referring to fig. 1, 3 and 5, the high-efficiency heat-dissipation hard disk mounting structure includes a device body 20; the device body 20 is integrally formed or processed with a cavity 201, and the cavity 201 is used for accommodating the circuit board 31 electrically connected with the hard disk 40 and accommodating one end of the hard disk 40; a first opening 202 for communicating the cavity 201 with the outside is formed in a side surface of the device body 20, so that the hard disk 40 is inserted into the cavity 201 through the first opening 202; the side surface of the device body 20 is further provided with a first through hole 203 for communicating the cavity 201 with the outside, and the first through hole 203 corresponds to the universal data interface 32 electrically connected to the circuit board 31.

When in use, the circuit board 31 electrically connected with the universal data interface 32 can be installed in the cavity 201. When the hard disk 40 needs to be used, the hard disk 40 is inserted into the cavity 201 through the first opening 202 and electrically connected to the circuit board 31 therein, so that the circuit board 31 connected with the hard disk 40 can be connected to an electronic device through a universal data line, and data transmission between the hard disk 40 and the electronic device is realized, and the electronic device can be a computer, for example. Because only one end of the hard disk 40 is inserted into the cavity 201, and the other end is exposed in the environment, when the hard disk 40 generates heat after being used for a long time, the heat emitted by the hard disk 40 can exchange heat with the environment through the end of the hard disk 40 outside the cavity 201 to accelerate the heat dissipation efficiency; moreover, a user can insert the hard disk 40 into the cavity 201 or take the hard disk 40 out of the cavity 201 by grasping one end of the hard disk 40 positioned outside the cavity 201, so that the hard disk assembly and disassembly efficiency of the high-efficiency heat dissipation hard disk installation structure is improved.

As one of the embodiments of the apparatus body 20, referring to fig. 6, the apparatus body 20 includes a case 21 and a cover plate 22; wherein, the housing 21 is integrally formed or processed with a first sinking groove 211 and a second opening 212 for communicating the first sinking groove 211 with the outside, and the first opening 202 is integrally formed or processed on the housing 21, the first opening 202 and the second opening 212 are configured to communicate the first sinking groove 211 with the outside, so that the circuit board 31 can be placed in the first sinking groove 211 through the first opening 202 or the second opening 212; the cover 22 detachably covers the second opening 212 of the housing 21 to enclose the cavity 201 between the cover 22 and the housing 21. So that the circuit board 31 is mounted and dismounted when the cover plate 22 is detached from the housing 21; in use, the circuit board 31 is shielded from the environment by the cover plate 22 and the housing 21 to protect the circuit board 31 from external influences. In a preferred embodiment, and with continued reference to FIG. 6, the first opening 202 is integrally formed or machined on one of the sides of the housing 21, the second opening 212 is integrally formed or machined on the side of the housing 21 adjacent to the side on which the first opening 202 is located, and the first and second openings 202 and 212 communicate with one another. Preferably, as shown in fig. 1 and fig. 5 to 7, the outer shape of the housing 21 is configured to be similar to the outer shape of the hard disk 40, so as to reduce the material consumption of the housing 21 and achieve the purpose of reducing the weight of the whole body.

In a preferred embodiment, as shown with reference to fig. 1 to 3 and 5, an end of the cover plate 22 extends toward a side facing away from the housing 21 to a position close to an end of the hard disk 40 accommodated in the cavity 201, and the cover plate 22 is provided so as to be able to contact the hard disk 40 inserted into the cavity 201 and electrically connected to the circuit board 31. From this, when using this high-efficient heat dissipation hard disk mounting structure, can place this high-efficient heat dissipation hard disk mounting structure into apron 22 and be located this high-efficient heat dissipation hard disk mounting structure's bottom to, apron 22 can give the hard disk 40 that holds in cavity 201 and support.

In a preferred embodiment, and as shown with reference to fig. 1-7, the cover plate 22 is provided with a first mounting structure 221 for removable attachment to the hard disk 40. Specifically, the first mounting structure 221 is implemented as a through hole integrally formed or machined on the cover plate 22 for the screw 50 to pass through, whereby the nail portion of the screw 50 can be screwed through the through hole to the screw hole of the hard disk 40 placed on the cover plate 22, thereby fixing the hard disk 40 to the cover plate 22.

In a preferred embodiment, a surface of at least one of the cover plate 22 and the case 21 corresponding to the hard disk 40 accommodated in the cavity 201 is provided with a heat dissipation structure 222, and the cover plate 22 and the case 21 provided with the heat dissipation structure 222 are made of a heat conductive material. For example, as shown in fig. 1, fig. 3, fig. 5 and fig. 6, the heat dissipation structure 222 is a protrusion integrally formed or machined on the cover plate 22, the protrusion may be in a strip shape, a dot shape or a block shape, one or more protrusions may be provided, the protrusion may be provided on the inner surface or the outer surface of the cover plate 22, and in order to maintain the surface of the cover plate 22 flat, when a plurality of protrusions are provided, the top surfaces of all the protrusions are flush. When the heat dissipation structure 222 is disposed on the housing 21, the specific implementation manner may be set with reference to the heat dissipation structure 222 disposed on the cover plate 22, and will not be described herein again. Thus, the heat dissipation performance of the high-efficiency heat dissipation hard disk mounting structure can be further improved by the heat dissipation structure 222.

In a preferred embodiment, as shown with reference to fig. 6, the housing 21 or cover plate 22 is further provided with a second mounting structure 214 for mounting the circuit board 31. Taking second mounting structure 214 disposed on housing 21 as an example, and referring to fig. 6, a specific embodiment of second mounting structure 214 is implemented as a screw hole machined on housing 21, so that the nail portion of screw 50 can pass through the through hole on circuit board 31 and then be screwed with the screw hole on housing 21, thereby fixing circuit board 31 on housing 21. When the second mounting structure 214 is disposed on the cover plate 22, the specific implementation manner may be set with reference to the second mounting structure 214 disposed on the housing 21, and will not be described in detail herein.

Preferably, a third mounting structure 216 for securing the cover 22 and the circuit board 31 is provided on the housing 21 or the cover 22. Taking the third mounting structure 216 provided on the housing 21 as an example, and referring to fig. 6 again, the third mounting structure 216 is provided in the first sunken groove 211 of the housing 21, and the third mounting structure 216 is specifically realized as a screw hole machined on the housing 21, and a through hole is integrally formed or machined on the cover plate 22 at a position corresponding to the screw hole, so that the nail portion of the screw 50 can pass through the through holes on the cover plate 22 and the circuit board 31 and then be screwed with the screw hole on the housing 21, thereby fixing the circuit board 31 and the cover plate 22 on the housing 21. When the third mounting structure 216 is disposed on the cover plate 22, the specific implementation manner may be set with reference to the third mounting structure 216 disposed on the housing 21, and a through hole is integrally formed or machined in the housing 21 at a position corresponding to the screw hole on the cover plate 22, so that the nail portion of the screw 50 can be screwed with the screw hole on the cover plate 22 after passing through the through holes on the housing 21 and the circuit board 31.

Preferably, as shown in fig. 6, a support 215 for supporting the circuit board 31 is further integrally formed or machined in the first sunken groove 211 of the housing 21, and one side of the circuit board 31 mounted in the first sunken groove 211 abuts against the support 215 and the opposite side thereof abuts against the cover plate 22.

In order to further protect the circuit board 31, as shown in fig. 6, the first sinking groove 211 is divided into a first groove portion 2111 and a second groove portion 2112 by the partition 217 connected to the side wall of the housing 21, and a third opening 2013 for communicating the first groove portion 2111 with the second groove portion 2112 is integrally formed or machined on the partition 217, the first groove portion 2111 is used for accommodating the circuit board 31, the second groove portion 2112 is used for accommodating one end of the hard disk 40, and the third opening 2013 is used for allowing the hard disk interface 33 connected to the circuit board 31 to pass through. Preferably, when any one of the second mounting structure 214, the third mounting structure 216, and the support portion 215 is further provided, as shown with continued reference to fig. 6, the second mounting structure 214, the third mounting structure 216, and the support portion 215 are provided in the first groove portion 2111. After the cover plate 22 is covered at the second opening 212 of the housing 21, due to the separation of the partition 217, the cavity 201 is divided into a first accommodating cavity 2011 mainly formed by the first groove portion 2111 and a second accommodating cavity 2012 mainly formed by the second groove portion 2112, the first through hole 203 communicates the first accommodating cavity 2011 with the outside, the first opening 202 communicates the second accommodating cavity 2012 with the outside, the circuit board 31 is accommodated in the first accommodating cavity 2011, and one end of the hard disk 40 is accommodated in the second accommodating cavity 2012.

In a preferred embodiment, as shown in fig. 3 and 7, a second sunken groove 224 is integrally formed or machined in the cover plate 22 at a position corresponding to the circuit board 31. Therefore, the high-efficiency heat dissipation hard disk mounting structure can be prevented from being too thick, and the weight of the cover plate 22 can be reduced.

In a specific embodiment, the detachable connection of the housing 21 and the cover plate 22 is implemented by at least one of a screw 50 connection and a sliding block 223 connection of the sliding groove 213. The specific implementation manner of the connection of the screw 50 may be implemented with reference to the arrangement manner of the third mounting structure 216, or a screw hole may be processed on the side wall of the housing 21 where the second groove portion 2112 is provided or on the partition 217, and a through hole may be integrally formed or processed at a position on the cover plate 22 corresponding to the screw hole, so that the nail portion of the screw 50 may pass through the through hole to be in threaded connection with the housing 21, thereby fixing the cover plate 22 on the housing 21. As shown in fig. 4 and 6, the sliding groove 213 is integrally formed or machined on the housing 21 along the direction in which the hard disk 40 is inserted into the cavity 201, and the sliding block 223 adapted to the sliding groove 213 is integrally formed or machined on the cover, specifically, the sliding grooves 213 are disposed on two opposite sides of the end portion of the housing 21 close to the second opening 212, so as to ensure that the sliding block 223 on the cover can move smoothly under the guiding action of the two sliding grooves 213.

In a preferred embodiment, referring to fig. 4, at least one of a second through hole 204 and a third through hole 205 for communicating the cavity 201 with the outside are further integrally formed or machined on the device body 20; the second through hole 204 corresponds to the power interface 34 electrically connected to the circuit board 31, and the third through hole 205 corresponds to the switch 35 electrically connected to the circuit board 31 for controlling the connection and disconnection of the circuit board 31 to and from the power interface 34. Preferably, when the apparatus body 20 is composed of the case 21 and the cover 22, as shown in fig. 6, at least one of the first through hole 203, the second through hole 204, and the third through hole 205 is provided on the case 21. In a preferred embodiment, as shown in fig. 6, a first through hole 203, a second through hole 204, and a third through hole 205 are provided on the side of the housing 21 opposite to where the first opening 202 is provided, so that the structure of the hard disk mounting device is compact.

In a preferred embodiment, a foot pad is further disposed on the surface of the cover plate 22 facing away from the cavity 201, the foot pad protrudes toward one side facing away from the cavity 201, and when the high-efficiency heat dissipation hard disk mounting structure is placed on a table top, the foot pad plays a supporting role. The callus on sole generally adopts elastic material to make, for example adopt materials such as rubber, silica gel or foam to make the callus on sole can play absorbing effect. The foot pad can be detachably or non-detachably arranged on the cover plate 22, and when the cover plate 22 is further provided with a through hole, the foot pad can be covered on the through hole.

Fig. 8 to 12 schematically show a hard disk mounting device according to an embodiment of the present invention. As shown in the figure, the hard disk mounting device comprises a circuit assembly 30 for mounting a hard disk 40 and the high-efficiency heat-dissipation hard disk mounting structure; the circuit assembly 30 includes a circuit board 31, a hard disk interface 33 electrically connected to the circuit board 31, a universal data interface 32, and a power interface 34, wherein the hard disk interface 33 is disposed in the cavity 201 and faces the first opening 202; the device body 20 is integrally formed or machined with a second through hole 204 corresponding to the power interface 34 and communicating the cavity 201 with the outside.

When the portable electronic device is used, the hard disk 40 can be inserted into the cavity 201 through the first opening 202 (see fig. 12), and is electrically connected to the circuit board 31 therein through the hard disk interface 33, and power is supplied to the circuit board 31 through the power interface 34, so that the circuit board 31 connected with the hard disk 40 can be connected to the electronic device through a universal data line, and data transmission between the hard disk 40 and the electronic device is realized. When the hard disk 40 generates heat after being used for a long time, the other end of the hard disk 40 exposed outside the cavity 201 can accelerate the heat exchange efficiency between the hard disk 40 and the environment, and the hard disk 40 is prevented from being overheated and losing efficacy after being used for a long time; and one end of the hard disk 40 is exposed to the environment, so that the hard disk 40 is convenient to assemble and disassemble.

What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the utility model.

Claims (17)

1. The high-efficiency heat dissipation hard disk mounting structure is characterized by comprising a device body;

the device body is provided with a circuit board used for accommodating the circuit board electrically connected with the hard disk and a cavity used for accommodating one end of the hard disk;

a first opening for inserting the hard disk into the cavity is formed in the side face of the device body;

the side surface of the device body is also provided with a first through hole which corresponds to the general data interface of the circuit board and communicates the cavity with the outside.

2. The high efficiency heat dissipating hard disk mounting structure according to claim 1, wherein the device body comprises:

the circuit board fixing device comprises a shell, a first fixing device and a second fixing device, wherein the shell is provided with a first sinking groove and a second opening for communicating the first sinking groove with the outside, the first opening is arranged on the shell and can be used for communicating the first sinking groove with the outside, so that the circuit board can be placed in the first sinking groove through the first opening or the second opening;

and the cover plate is detachably covered on the second opening of the shell, and the cover plate and the shell enclose the cavity.

3. The structure of claim 2, wherein the first opening is provided on one side surface of the casing, the second opening is provided on an adjacent side surface of the casing to the side surface on which the first opening is provided, and the first opening and the second opening are communicated with each other.

4. The high efficiency heat dissipating hard disk mounting structure according to claim 2, wherein an end of the cover plate extends toward a side away from the housing to a position close to an end of a hard disk accommodated in the cavity, and the cover plate is provided to be capable of contacting a hard disk inserted into the cavity and electrically connected to the circuit board.

5. A high efficiency heat dissipating hard disk mounting structure as recited in claim 3, wherein an end of said cover plate extends toward a side away from said housing to a position close to an end of a hard disk accommodated in said cavity, and said cover plate is provided to be capable of contacting a hard disk inserted into said cavity and electrically connected to said circuit board.

6. The mounting structure for a hard disk with high heat dissipation efficiency as recited in claim 2, wherein the cover plate is provided with a first mounting structure detachably connected to the hard disk.

7. The mounting structure for a high-efficiency heat-dissipating hard disk according to claim 3, wherein the cover plate is provided with a first mounting structure detachably connected to the hard disk.

8. The mounting structure for a high-efficiency heat-dissipating hard disk according to claim 4, wherein the cover plate is provided with a first mounting structure detachably connected to the hard disk.

9. The mounting structure for a hard disk with high heat dissipation efficiency as recited in claim 5, wherein the cover plate is provided with a first mounting structure detachably connected to the hard disk.

10. The structure of any one of claims 2 to 9, wherein a surface of at least one of the cover plate and the casing corresponding to the hard disk accommodated in the cavity is provided with a heat dissipation structure, and the cover plate and the casing provided with the heat dissipation structure are made of a heat conductive material.

11. The structure for mounting a high-efficiency heat-dissipating hard disk according to any one of claims 2 to 9, wherein the detachable connection of the housing and the cover plate is realized by: the shell is connected with the cover plate through screws, and/or a sliding groove is formed in the direction, along which the hard disk is inserted into the cavity, of the shell, and a sliding block matched with the sliding groove is arranged on the cover plate.

12. The high-efficiency heat-dissipation hard disk mounting structure according to claim 10, wherein the detachable connection of the casing and the cover plate is realized by: the shell is connected with the cover plate through screws, and/or a sliding groove is formed in the direction, along which the hard disk is inserted into the cavity, of the shell, and a sliding block matched with the sliding groove is arranged on the cover plate.

13. The mounting structure for a high-efficiency heat-dissipating hard disk according to any one of claims 2 to 9, wherein the casing or the cover plate is further provided with a second mounting structure for mounting the circuit board.

14. The mounting structure for a high efficiency heat dissipating hard disk of claim 10, wherein the housing or cover plate is further provided with a second mounting structure for mounting the circuit board.

15. The structure of any one of claims 2 to 9, wherein a second sinking groove is formed in a position of the cover plate corresponding to the circuit board.

16. The mounting structure for a high-efficiency heat-dissipating hard disk according to claim 10, wherein a second sinking groove is formed at a position of the cover plate corresponding to the circuit board.

17. A hard disk mounting apparatus comprising a circuit assembly for mounting a hard disk and the high-efficiency heat-dissipating hard disk mounting structure of any one of claims 1 to 16; wherein,

the circuit component comprises a circuit board, a hard disk interface, a universal data interface and a power interface, wherein the hard disk interface is electrically connected to the circuit board, and the hard disk interface is arranged in the cavity and faces the first opening;

the device body is provided with a second through hole which corresponds to the power interface and communicates the cavity with the outside.

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