CN215698972U - Accurate cutting device of semiconductor - Google Patents
Accurate cutting device of semiconductor Download PDFInfo
- Publication number
- CN215698972U CN215698972U CN202122343637.9U CN202122343637U CN215698972U CN 215698972 U CN215698972 U CN 215698972U CN 202122343637 U CN202122343637 U CN 202122343637U CN 215698972 U CN215698972 U CN 215698972U
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- Prior art keywords
- semiconductor
- sliding
- cutting device
- electric telescopic
- rod
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000005520 cutting process Methods 0.000 title claims abstract description 34
- 239000000428 dust Substances 0.000 claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 241000883990 Flabellum Species 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a semiconductor precise cutting device which comprises a bottom plate and a fixing frame, wherein a placing table is arranged on the upper surface of the bottom plate, clamping blocks are arranged on two sides of the upper surface of the placing table, one end of each clamping block is rotatably connected with a screw rod, one end of the fixing frame is provided with a first sliding chute, the inner wall of the first sliding chute is fixedly connected with a hydraulic cylinder, the output end of the hydraulic cylinder is provided with a first sliding block, the bottom end of the first sliding block is fixedly connected with an electric telescopic rod, the other end of the electric telescopic rod is provided with a semiconductor laser cutter, and the side wall of the electric telescopic rod is provided with two sliding dust collection mechanisms; according to the technical scheme provided by the utility model, the dust generated during the cutting of the semiconductor can be absorbed by arranging the sliding dust collection mechanism, so that the influence of the dust on the purity of the semiconductor is reduced, and the cutting accuracy is improved; the clamping blocks can limit the position of the semiconductor and have stability during processing.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a semiconductor precise cutting device.
Background
The semiconductor industry is concerned with the design, development, manufacture and sale of small electronic parts and chips, which are present in almost every modern technology device we use, and on notebook computers, computers or smart phones we use daily, where semiconductors play an important role.
In semiconductor manufacturing applications, semiconductor dicing is essential, and the quality of the dicing of a semiconductor wafer directly determines whether the semiconductor is acceptable. When the existing semiconductor cutting device is used for scribing or cutting a semiconductor, dust generated during cutting needs to be continuously cleaned, so that the influence of the dust on the purity of the semiconductor is avoided, however, most of cutting devices cannot thoroughly clean the dust, and the dust is not comprehensive enough, so that the cutting accuracy is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a semiconductor precise cutting device aiming at the defects in the prior art so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an accurate cutting device of semiconductor, includes bottom plate and mount, the bottom plate upper surface is provided with places the platform, it all is provided with the grip block to place bench surface both sides, grip block one end is rotated and is connected with the screw rod, the mount both sides are provided with the installation section of thick bamboo, the screw rod with installation section of thick bamboo looks adaptation, the mount is U type structure, first spout has been seted up to mount one end, first spout inner wall fixedly connected with pneumatic cylinder, the output of pneumatic cylinder is provided with first slider, first slider matches sliding connection in first spout, first slider bottom fixedly connected with electric telescopic handle, the electric telescopic handle other end is provided with semiconductor laser cutter, the electric telescopic handle lateral wall is provided with two slip dust absorption mechanisms.
Optionally, a sponge pad is arranged on the surface of the clamping block, which is in contact with the semiconductor.
Optionally, the screw rod is in threaded connection with the installation cylinder, a handle is arranged at one end of the screw rod, and one end of the handle is fixedly connected to one end of the screw rod.
Optionally, the sliding dust collection mechanism comprises a sliding assembly and a dust collection assembly.
Optionally, the sliding assembly comprises a cross rod, a second sliding groove, a second sliding block and a connecting rod, the cross rod is fixedly connected to the side wall of the electric telescopic rod, the second sliding groove is formed in the bottom surface of the cross rod, the second sliding block is slidably connected to the second sliding groove, the connecting rod is fixedly connected to the bottom end of the second sliding block, and the cross rod is parallel to the clamping block.
Optionally, the dust absorption subassembly includes suction nozzle, hose, shell, electronic air exhauster, flabellum and dust bag, suction nozzle fixed connection be in the connecting rod other end, the hose both ends respectively with the suction nozzle with shell fixed connection, electronic air exhauster fixed connection be in the shell inner wall, the flabellum sets up the output of electronic air exhauster.
Optionally, the suction nozzle is semicircular, and the opening of the suction nozzle is an oblique opening.
Compared with the prior art, the utility model provides a semiconductor precise cutting device, which has the following beneficial effects:
1. according to the utility model, the two sliding dust collection mechanisms are arranged on the side wall of the electric telescopic rod, so that dust generated during the cutting of the semiconductor can be absorbed, the influence of the dust on the purity of the semiconductor is effectively reduced, and the cutting accuracy is improved; all set up the grip block placing bench upper surface both sides, accessible manual control handle adjusting screw adjusts the position of grip block, and then carries out position limitation to the semiconductor through the grip block and makes the semiconductor have more stability in the course of working, and then improves the accuracy of cutting.
2. According to the utility model, the sponge pad is arranged on the contact surface of the clamping block and the semiconductor, so that the semiconductor can be prevented from being worn in the fixing process; meanwhile, the sliding dust collection mechanism comprises a sliding assembly, so that the position of a suction nozzle in the dust collection assembly can be adjusted to adjust the dust collection range, and dust can be more comprehensively absorbed; the position of the semiconductor laser cutter can be adjusted through the action of the hydraulic cylinder on the sliding block and the electric telescopic rod.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the mounting structure of the clamping block of the present invention;
FIG. 3 is a schematic view of the sliding dust-absorbing mechanism of the present invention;
FIG. 4 is a side view of a suction nozzle constructed in accordance with the present invention.
In the figure: 1. a base plate; 2. a placing table; 3. a fixed mount; 4. a first chute; 5. a hydraulic cylinder; 6. a first slider; 7. an electric telescopic rod; 8. a laser cutter; 9. a cross bar; 10. a connecting rod; 11. a suction nozzle; 12. a handle; 13. a screw; 14. mounting the cylinder; 15. a clamping block; 16. a sponge cushion; 17. a second chute; 18. a second slider; 19. a hose; 20. a housing; 21. an electric exhaust fan; 22. a fan blade; 23. a dust collecting bag.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be further noted that, unless otherwise specifically stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected through an intermediate medium, or connected through the insides of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-4, in this embodiment: an accurate semiconductor cutting device comprises a bottom plate 1 and a fixing frame 3, wherein a placing table 2 is arranged on the upper surface of the bottom plate 1, the two sides of the upper surface of the placing table 2 are both provided with a clamping block 15, one end of the clamping block 15 is rotationally connected with a screw 13, the two sides of the fixed mount 3 are provided with mounting cylinders 14, the screw 13 is matched with the mounting cylinders 14, the fixing frame 3 is of a U-shaped structure, one end of the fixing frame 3 is provided with a first chute 4, the inner wall of the first chute 4 is fixedly connected with a hydraulic cylinder 5, the output end of the hydraulic cylinder 5 is provided with a first slide block 6, the first slide block 6 is connected in the first sliding chute 4 in a matching and sliding way, the bottom end of the first sliding block 6 is fixedly connected with an electric telescopic rod 7, the other end of the electric telescopic rod 7 is provided with a semiconductor laser cutter 8, and the side wall of the electric telescopic rod 7 is provided with two sliding dust collection mechanisms; the screw 13 can be manually controlled by arranging the clamping block 15 to adjust the position of the clamping block 15, so that the position of the semiconductor is limited, the semiconductor has stability in the processing process, and the cutting accuracy is improved; the hydraulic cylinder 5 is arranged to act on the first sliding block 6 so as to adjust the position of a semiconductor laser cutter 8 arranged at the other end of the electric telescopic rod 7; set up electric telescopic handle 7 and also can adjust the distance of laser cutting ware 8 and semiconductor, the convenient cutting.
Further, a sponge pad 16 is arranged on the surface of the clamping block 15, which is in contact with the semiconductor; the provision of the foam-rubber cushion 16 prevents the semiconductor from being worn by the holding block 15 during the fixing process, while making it more stable during the processing.
Further, the screw 13 is in threaded connection with the mounting cylinder 14, a handle 12 is arranged at one end of the screw 13, and one end of the handle 12 is fixedly connected to one end of the screw 13; the position of the clamping block 15 is adjusted by adjusting the screw rod 13 through the manual control handle 12, and therefore the position of the semiconductor is limited.
Further, the sliding dust collection mechanism comprises a sliding assembly and a dust collection assembly; through setting up the dust absorption mechanism that slides and can absorb the dust that semiconductor produced when the cutting, reduce the influence that the dust caused to semiconductor purity.
Further, the sliding assembly comprises a cross rod 9, a second sliding groove 17, a second sliding block 18 and a connecting rod 10, the cross rod 9 is fixedly connected to the side wall of the electric telescopic rod 7, the second sliding groove 17 is formed in the bottom surface of the cross rod 9, the second sliding block 18 is slidably connected into the second sliding groove 17, the connecting rod 10 is fixedly connected to the bottom end of the second sliding block 18, and the cross rod 9 is parallel to the clamping block 15; through setting up the slip subassembly, second slider 18 slides in second spout 17, drives the removal of connecting rod 10 and then adjusts the position of connecting rod 10 one end fixed connection suction nozzle 11 promptly dust absorption scope, makes it absorb many-sided to the dust.
Further, the dust collection assembly comprises a suction nozzle 11, a hose 19, a housing 20, an electric suction fan 21, fan blades 22 and a dust collection bag 23, the suction nozzle 11 is fixedly connected to the other end of the connecting rod 10, two ends of the hose 19 are respectively fixedly connected with the suction nozzle 11 and the housing 20, the electric suction fan 21 is fixedly connected to the inner wall of the housing 20, and the fan blades 22 are arranged at the output end of the electric suction fan 21; dust generated during semiconductor cutting is absorbed in time through the suction nozzle 11 and then reaches the dust collection bag 23 through the hose 19, so that the dust can be collected and cleaned in a centralized manner.
Further, the suction nozzle 11 is in a semicircular ring shape, and the opening shape of the suction nozzle 11 is an oblique opening; the semi-circular suction nozzle 11 is arranged at the periphery of the semiconductor laser cutter 8, so that dust generated in the cutting process of the semiconductor can be timely and comprehensively cleaned; meanwhile, the suction nozzle 11 is set to be in an inclined opening shape, so that dust can be absorbed more thoroughly and cleanly.
The working principle and the using process of the utility model are as follows: when the semiconductor cutting machine is used, a semiconductor is placed on the placing table 2, the clamping block 15 is adjusted by manually controlling the handle 12 and adjusting the screw rod 13, and then the position of the semiconductor is limited, so that the semiconductor has stability during cutting and the cutting is more accurate; the sponge cushion 16 is arranged on the contact surface of the clamping block 15 and the semiconductor, so that the semiconductor can be prevented from being worn in the fixing process of the clamping block 15, the sponge cushion acts on the first sliding block 6 through the hydraulic cylinder 5, the position of the semiconductor laser cutter 8 arranged at the other end of the electric telescopic rod 7 is adjusted, and meanwhile, the electric telescopic rod 7 can also adjust the distance between the laser cutter 8 and the semiconductor, so that the semiconductor laser cutter is convenient to cut; electric telescopic handle 7's lateral wall is provided with two slip dust absorption mechanisms and can absorbs the dust that the semiconductor produced man-hour, the influence of dust to semiconductor purity has been avoided, accuracy nature when also having improved the semiconductor cutting, slip dust absorption mechanism contains slip subassembly and dust absorption subassembly, wherein set up the slip subassembly and can carry out position control to suction nozzle 11 in the dust absorption subassembly, make the dust absorption scope wider thoroughly clear up the dust, suction nozzle 11 is half circular form and can thoroughly clear up the dust for the slant opening simultaneously.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor accurate cutting device which characterized in that: the device comprises a bottom plate (1) and a fixing frame (3), wherein a placing table (2) is arranged on the upper surface of the bottom plate (1), clamping blocks (15) are arranged on two sides of the upper surface of the placing table (2), one end of each clamping block (15) is rotatably connected with a screw rod (13), mounting cylinders (14) are arranged on two sides of the fixing frame (3), the screw rods (13) are matched with the mounting cylinders (14), the fixing frame (3) is of a U-shaped structure, one end of the fixing frame (3) is provided with a first sliding chute (4), the inner wall of the first sliding chute (4) is fixedly connected with a hydraulic cylinder (5), the output end of the hydraulic cylinder (5) is provided with a first sliding block (6), the first sliding block (6) is matched and slidably connected into the first sliding chute (4), an electric telescopic rod (7) is fixedly connected to the bottom end of the first sliding block (6), and a semiconductor laser cutter (8) is arranged at the other end of the electric telescopic rod (7), the side wall of the electric telescopic rod (7) is provided with two sliding dust collection mechanisms.
2. The semiconductor precision cutting device according to claim 1, characterized in that: and a sponge pad (16) is arranged on the surface of the clamping block (15) which is in contact with the semiconductor.
3. The semiconductor precision cutting device according to claim 1, characterized in that: the screw rod (13) is in threaded connection with the mounting cylinder (14), a handle (12) is arranged at one end of the screw rod (13), and one end of the handle (12) is fixedly connected to one end of the screw rod (13).
4. The semiconductor precision cutting device according to claim 1, characterized in that: the sliding dust collection mechanism comprises a sliding assembly and a dust collection assembly.
5. The semiconductor precision cutting device according to claim 4, wherein: the sliding assembly comprises a cross rod (9), a second sliding groove (17), a second sliding block (18) and a connecting rod (10), the cross rod (9) is fixedly connected to the side wall of the electric telescopic rod (7), the second sliding groove (17) is formed in the bottom surface of the cross rod (9), the second sliding block (18) is slidably connected to the second sliding groove (17), the connecting rod (10) is fixedly connected to the bottom end of the second sliding block (18), and the cross rod (9) is parallel to the clamping block (15).
6. The semiconductor precision cutting device according to claim 5, wherein: dust collection assembly includes suction nozzle (11), hose (19), shell (20), electronic air exhauster (21), flabellum (22) and dust bag (23), suction nozzle (11) fixed connection be in connecting rod (10) other end, hose (19) both ends respectively with suction nozzle (11) with shell (20) fixed connection, electronic air exhauster (21) fixed connection be in shell (20) inner wall, flabellum (22) set up the output of electronic air exhauster (21).
7. The semiconductor precision cutting device according to claim 6, wherein: the suction nozzle (11) is in a semicircular annular shape, and the opening of the suction nozzle (11) is in an oblique opening shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122343637.9U CN215698972U (en) | 2021-09-27 | 2021-09-27 | Accurate cutting device of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122343637.9U CN215698972U (en) | 2021-09-27 | 2021-09-27 | Accurate cutting device of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215698972U true CN215698972U (en) | 2022-02-01 |
Family
ID=80025217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122343637.9U Expired - Fee Related CN215698972U (en) | 2021-09-27 | 2021-09-27 | Accurate cutting device of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215698972U (en) |
-
2021
- 2021-09-27 CN CN202122343637.9U patent/CN215698972U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220201 |