CN215680649U

CN215680649U - Wafer clamping device

Info

Publication number: CN215680649U
Application number: CN202121966382.5U
Authority: CN
Inventors: 吕龙; 洪超; 张守成; 陈怡福
Original assignee: Muehlbauer Technologies Wuxi Co ltd
Current assignee: Muehlbauer Technologies Wuxi Co ltd
Priority date: 2021-08-20
Filing date: 2021-08-20
Publication date: 2022-01-28
Anticipated expiration: 2031-08-20

Abstract

The utility model discloses a wafer clamping device which comprises a shell and a connecting plate arranged on the shell, wherein the shell is of a U-shaped structure, the connecting plate is clamped on one side of the shell, a second clamping jaw is arranged at one end, away from the connecting plate, of the shell, a sliding groove is formed in one side, facing the second clamping jaw, of the connecting plate, a positioning plate is arranged in the middle of the inside of the sliding groove, a top plate is connected to the bottom of the positioning plate, a sliding groove is formed in the top plate, a correlation sensor is arranged in the sliding groove, an air cylinder is arranged beside the sliding groove, a first clamping jaw is arranged on the end face, facing away from the air cylinder, of the positioning plate, a groove is formed in the end face, facing the second clamping jaw, of the first clamping jaw, and a rubber pad is arranged in the groove. This device is got to wafer clamp through simple structural design, is convenient for maintain the device when using and dismantles, makes things convenient for operation personnel's use.

Description

Wafer clamping device

Technical Field

The utility model belongs to the technical field of wafer processing equipment, and particularly relates to a wafer clamping device.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The wafer usually needs to go through many processes and finally forms the product, and in the course of working, the carrier is used for laying the wafer, and the device is transported to corresponding station with pressing from both sides to get.

The existing clamping device is used for clamping a carrier at a specific angle generally, the flexibility of the clamping device is not high, when the position of the carrier deviates, the problems of insufficient clamping force and the like easily occur between the clamping device and the carrier, and the relative sliding between the clamping device and the carrier is caused to affect the normal operation of equipment after long-time use.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer clamping device to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a device is got to wafer clamp, includes the shell and sets up the connecting plate on the shell, the shell has the connecting plate for U type structure and one side joint, the one end that the connecting plate was kept away from to the shell is provided with the second clamping jaw, the spout has been seted up towards one side of second clamping jaw to the connecting plate, and the inside of spout is provided with the locating plate between two parties, the bottom of locating plate is connected with the roof, the sliding tray has been seted up on the roof, the internally mounted of sliding tray has the correlation sensor, the side of sliding tray is provided with the cylinder, the locating plate is kept away from and is installed on a side end face of cylinder with first clamping jaw.

Preferably, a groove is formed in the end face of one side, facing the second clamping jaw, of the first clamping jaw, and a rubber pad is arranged inside the groove.

Preferably, a plurality of connecting holes are formed in an array on the end face of one side, far away from the shell, of the connecting plate.

Preferably, the second clamping plate is provided with a clamping groove, the outer wall of the cylinder is provided with a convex plate, and the convex plate is provided with a limiting rod matched with the clamping groove.

Preferably, the shell is provided with a plurality of mounting holes, and a plurality of pneumatic tubes connected with the cylinder are arranged in the mounting holes.

The utility model has the technical effects and advantages that: according to the wafer clamping device, the correlation sensor is arranged in the sliding groove, when the first clamping jaw and the second clamping jaw clamp a wafer, a detected signal is transmitted to the controller through the correlation sensor, so that the movement of the device is controlled, and the operation efficiency of the device is improved; through setting up shell and cylinder and mutually supporting, be convenient for install the device when using fixedly, make things convenient for the operation personnel to maintain the change. This device is got to wafer clamp through simple structural design, is convenient for maintain the device when using and dismantles, makes things convenient for operation personnel's use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the housing structure of the present invention;

fig. 3 is a schematic view of a card slot structure of the present invention.

In the figure: 1 shell, 10 sliding grooves, 100 mounting holes, 101 pneumatic tubes, 102 air cylinders, 103 connecting plates, 104 sliding blocks, 105 top plates, 106 first clamping jaws, 107 second clamping jaws, 108 opposite-emission sensors, 109 rubber pads, 110 connecting holes, 112 positioning plates, 115 clamping grooves, 116 limiting rods and 117 convex plates.

Detailed Description

The present invention will be described in detail with reference to the drawings in the following embodiments, but the scope of the present invention is not limited to the following embodiments, and all simple equivalent changes and modifications made by the claims and the contents of the specification of the present invention are within the scope of the present invention.

As shown in fig. 1-3, the device comprises a housing 1 and a connecting plate 103 arranged on the housing 1, the housing 1 is of a U-shaped structure, the connecting plate 103 is clamped on one side of the housing 1, a second clamping jaw 107 is arranged at one end of the housing 1 away from the connecting plate 103, a sliding groove is formed in one side of the connecting plate 103 facing the second clamping jaw 107, the housing 1 and the cylinder 102 are arranged to cooperate with each other, so that the device can be conveniently installed and fixed during use, and is convenient for an operator to maintain and replace, a positioning plate 112 is arranged in the sliding groove in the middle, a top plate 105 is connected to the bottom of the positioning plate 112, a sliding groove 10 is formed in the top plate 105, a correlation sensor 108 is installed in the sliding groove 10, the cylinder 102 is arranged beside the sliding groove 10, a first clamping jaw 106 is installed on one side end face of the positioning plate 112 away from the cylinder 102, and a correlation sensor 108 is arranged in the sliding groove 10, when the first clamping jaw 106 and the second clamping jaw 107 clamp the wafer, the detected signal is transmitted to the controller through the shooting sensor 108, so that the movement of the device is controlled, and the operation efficiency of the device is improved.

A groove is formed in the end face of one side of the first clamping jaw 106 facing the second clamping jaw 107, and a rubber pad 109 is arranged inside the groove.

A plurality of connecting holes 110 are arranged in an array on the end face of one side of the connecting plate 103 far away from the shell 1.

A clamping groove 115 is formed in the end face of one side of the shell 1, a convex plate 117 is mounted on the outer wall of the air cylinder 102, and a limiting rod 116 matched with the clamping groove 115 is arranged on the convex plate 117.

A plurality of mounting holes 100 are formed in the other end surface of the housing 1, and a plurality of pneumatic tubes 101 connected to a cylinder 102 are provided in the mounting holes 100.

The working principle is as follows: this wafer presss from both sides device, when the installation, through setting up the connecting hole 110 on the connecting plate 103 and mutually supporting with external bolt, install the cylinder 102 that will use between shell 1 and second splint 114, with slider 104 joint on locating plate 112, through roof 105 and the cylinder 102 interconnect of setting between shell 1 and second splint 114, with pneumatic tube 101 and external gas circuit interconnect, when using, promote roof 105 through cylinder 102 and remove, through mutually supporting of first clamping jaw 106 and second clamping jaw 107, it is fixed to carry out the centre gripping to external wafer. The device is electrically connected with an external main controller and 220V mains supply, and the main controller can be a computer or other equipment in the prior art. The wafer clamping device is reasonable in design, simple in structure, high in practicability and capable of being widely used.

Finally, it should be noted that: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a device is got to wafer clamp, includes shell (1) and connecting plate (103) of setting on shell (1), its characterized in that: shell (1) is U type structure and one side joint has connecting plate (103), the one end that connecting plate (103) were kept away from in shell (1) is provided with second clamping jaw (107), the spout has been seted up towards one side of second clamping jaw (107) in connecting plate (103), and the inside of spout is provided with locating plate (112) between two parties, the bottom of locating plate (112) is connected with roof (105), sliding tray (10) have been seted up on roof (105), the internally mounted of sliding tray (10) has correlation sensor (108), the side of sliding tray (10) is provided with cylinder (102), locating plate (112) keep away from on the terminal surface of one side of cylinder (102) install with first clamping jaw (106).

2. The wafer picking apparatus as claimed in claim 1, wherein: a groove is formed in the end face, facing the second clamping jaw (107), of one side of the first clamping jaw (106), and a rubber pad (109) is arranged inside the groove.

3. The wafer picking apparatus as claimed in claim 1, wherein: and a plurality of connecting holes (110) are formed in an array mode on the end face of one side, far away from the shell (1), of the connecting plate (103).

4. The wafer picking apparatus as claimed in claim 1, wherein: a clamping groove (115) is formed in the end face of one side of the shell (1), a convex plate (117) is installed on the outer wall of the air cylinder (102), and a limiting rod (116) matched with the clamping groove (115) is arranged on the convex plate (117).

5. The wafer picking apparatus as claimed in claim 1, wherein: a plurality of mounting holes (100) are formed in the end face of the other side of the shell (1), and a plurality of air pressure pipes (101) connected with air cylinders (102) are arranged in the mounting holes (100).