CN215679291U - Heat radiator for be used for computer mainframe - Google Patents
Heat radiator for be used for computer mainframe Download PDFInfo
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- CN215679291U CN215679291U CN202121999443.8U CN202121999443U CN215679291U CN 215679291 U CN215679291 U CN 215679291U CN 202121999443 U CN202121999443 U CN 202121999443U CN 215679291 U CN215679291 U CN 215679291U
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Abstract
The utility model discloses a heat dissipation device for a computer mainframe, which comprises a heat dissipation mechanism, a heat dissipation mechanism and a control unit, wherein the heat dissipation mechanism comprises a case, an air inlet pipeline arranged at the upper end of the left side of an inner cavity of the case, an electric fan arranged in the inner cavity of the air inlet pipeline, a first soft magnetic strip arranged at the upper end of the left side of the case, a second soft magnetic strip arranged at the left side of the first soft magnetic strip, a dust screen arranged in the inner cavity of the second soft magnetic strip and a ventilation screen arranged at the top of the case. The utility model has the beneficial effects that the air inlet pipeline and the electric fan are used for conveying external air to the inner cavity of the case, so that the heat dissipation and cooling of the electric elements in the case are realized, the situation that the electric elements in the case are burnt due to overhigh temperature is avoided, and the air entering the case is filtered through the matching of the first soft magnetic strip, the second soft magnetic strip and the dust screen.
Description
Technical Field
The utility model relates to the technical field of computers, in particular to a heat dissipation device for a computer mainframe.
Background
The computer is commonly called computer, it is a modern electronic computer used for high-speed calculation, it can make numerical calculation and logic calculation, and also has memory function, it is a modern intelligent electronic equipment capable of operating according to program and automatically processing mass data at high speed, the computer is one of the most advanced scientific technology inventions in the twentieth century, its application field is expanded from the first military scientific research application to every field of society, and has formed a large-scale computer industry, and has driven the technological progress in the global range, so that it has initiated the deep social change, the computer can implement all operations of looking up data and storing data information, etc. by using with main machine box, nowadays the computer is extensively used in schools, enterprises and public institutions, and enters into common people, and becomes the necessary tool in information society, because the heat quantity produced by main machine when it is working is large, generally, direct blowing is adopted to cool, but some high-end game computers may cause the service life of components to be shortened due to overhigh temperature inside the case, so that a heat dissipation device for a computer mainframe case is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the utility model.
The present invention has been made in view of the above and/or other problems occurring in the conventional heat dissipation device for a computer main case.
Therefore, the problem to be solved by the present invention is that the host computer generates a large amount of heat during operation, and generally adopts a direct blowing manner to cool down, but some high-end game computers may cause the service life of components inside the case to be shortened due to an excessively high temperature.
In order to solve the technical problems, the utility model provides the following technical scheme: a heat dissipation device for a computer mainframe comprises a heat dissipation mechanism, a heat dissipation mechanism and a control mechanism, wherein the heat dissipation mechanism comprises a case, an air inlet pipeline arranged at the upper end of the left side of an inner cavity of the case, an electric fan arranged in the inner cavity of the air inlet pipeline, a first soft magnetic stripe arranged at the upper end of the left side of the case, a second soft magnetic stripe arranged at the left side of the first soft magnetic stripe, a dust screen arranged in the inner cavity of the second soft magnetic stripe, and a ventilation screen arranged at the top of the case;
the cooling mechanism comprises a water tank, a heat conduction fin arranged on the left side of the water tank, a water pump arranged at the lower end of the left side of the inner cavity of the case, and a heat exchange copper pipe arranged at the water outlet end of the water pump.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the case also comprises a handle and an upper end arranged on the left side of the dustproof net.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the first soft magnetic stripe and the dust screen are arranged in an opposite way by adopting different magnetic poles.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the dustproof net is embedded in the inner cavity of the second soft magnetic stripe and is matched with the handle for use.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the right side of the heat conduction fin penetrates through the inner cavity of the water tank and is matched with the water tank for use.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the number of the heat conduction fins is seven, and the heat conduction fins are equidistantly distributed on the left side of the water tank.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the water inlet end of the water pump is communicated with a water inlet pipe, and the left end of the water inlet pipe penetrates through the case and is communicated with the water tank.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: one end of the heat exchange copper pipe, which is far away from the water pump, penetrates through the case and is communicated with the water tank.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the ventilation net is embedded in the inner wall of the case and is matched with the electric fan for use.
As a preferable aspect of the heat dissipating apparatus for a computer main case according to the present invention, wherein: the heat exchange copper pipe is spiral and is matched with the water pump from bottom to top.
The utility model has the advantages that the air inlet pipeline and the electric fan are used for conveying external air to the inner cavity of the case, so as to cool the electric elements in the case in a heat dissipation way and avoid the electric elements in the case from being burnt due to overhigh temperature, the air entering the case is filtered through the matching of the first soft magnetic strip, the second soft magnetic strip and the dustproof net, so as to avoid the influence of dust in the air on the electric elements in the case to cause the abnormal operation of the elements, thereby prolonging the service life of the electric elements in the case, the ventilation net is used for discharging the air in the case, so as to improve the efficiency of cooling the inside of the case, the water tank and the heat conduction fins are used for cooling the water flow after cooling the inside of the case, so that the water flow in the water tank can be recycled, and the water pump and the heat exchange copper pipe are matched, the heat exchanger is used for conveying the inside of the water tank to the heat exchange copper pipe to flow, so that the heat on the surface of the heat exchange copper pipe can be absorbed, and the cooling effect on the inside of the case is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise. Wherein:
fig. 1 is an overall structural view of a heat dissipating device for a computer main body case.
FIG. 2 is a front view of a water tank and heat-conducting fins of a heat sink for a computer mainframe.
FIG. 3 is a left view of the first soft magnetic stripe of the heat sink for the computer case.
FIG. 4 is a view showing the structure of a second soft magnetic stripe and a dust screen of the heat dissipating device for a computer main case.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Furthermore, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the utility model. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Example 1
Referring to fig. 1 to 4, a first embodiment of the present invention provides a heat dissipation device for a computer mainframe, the heat dissipation device for a computer mainframe includes a heat dissipation mechanism 100, including a chassis 101, an air inlet duct 102 disposed at an upper left end of an inner cavity of the chassis 101, an electric fan 103 disposed at an inner cavity of the air inlet duct 102, a first soft magnetic stripe 104 disposed at an upper left end of the chassis 101, a second soft magnetic stripe 105 disposed at a left side of the first soft magnetic stripe 104, a dust screen 106 disposed at an inner cavity of the second soft magnetic stripe 105, and a ventilation screen 107 disposed at a top of the chassis 101.
The cooling mechanism 200 comprises a water tank 201, a heat conduction fin 202 arranged on the left side of the water tank 201, a water pump 203 arranged at the lower end of the left side of the inner cavity of the case 101, a heat exchange copper pipe 204 arranged at the water outlet end of the water pump 203, and an air inlet pipe 102 and an electric fan 103 for conveying external air to the inner cavity of the case 101, so as to cool down the electrical components inside the case 101 in a heat dissipation manner, thereby avoiding the situation that the electrical components inside the case 101 are burnt due to overhigh temperature, and the air entering the case 101 is filtered by the cooperation of a first soft magnetic stripe 104, a second soft magnetic stripe 105 and a dustproof net 106, thereby avoiding the phenomenon that the electrical components inside the case 101 are influenced by dust in the air, so as to prevent the components from being incapable of normally operating, thereby prolonging the service life of the electrical components inside the case 101, and discharging the air inside the case 101 through a breathable net 107, with this improvement to machine case 101 inside radiating efficiency, through water tank 201 and heat conduction wing 202, be used for carrying out the heat dissipation to the rivers after the inside cooling of machine case 101 and handle, so that the inside rivers of water tank 201 can cyclic utilization, cooperation through water pump 203 and heat transfer copper pipe 204, be used for flowing the inside of carrying to heat transfer copper pipe 204 inside of water tank 201, so that can absorb the heat on heat transfer copper pipe 204 surface, with this improvement to the inside cooling effect of machine case 101.
When the heat exchanger is used, firstly, the electric fan 103 and the water pump 203 are respectively started through the external controller, external air is conveyed to the inside of the case 101 through the air inlet pipeline 102 by the electric fan 103, so that the temperature of electric elements inside the case 101 is reduced, the air inside the case 101 can be discharged to the outside of the case 101 through the air permeable net 107, and then the inside of the case 101 is circularly radiated, in addition, when the air enters the air inlet pipeline 102, dust in the air is firstly filtered through the dust screen 106, so that the influence of the dust on the machinery inside the case 101 is avoided, meanwhile, the water pump 203 is started, the water pump 203 conveys water flow inside the water tank 201 to the inside of the heat exchange copper pipe 204 through the water inlet pipe, when the water flow flows inside the heat exchange copper pipe 204, the heat is absorbed and flows into the inside of the water tank 201 from the other side of the heat exchange copper pipe 204, at the moment, the heat in the water flow inside the water tank 201 is guided out through the heat guide fins 202 to reduce the temperature in the water flow, thereby facilitating the continuous cooling of the interior of the cabinet 101.
Example 2
Referring to fig. 1 to 3, a second embodiment of the present invention is different from the first embodiment in that:
specifically, the chassis 101 further includes a handle 108 disposed at an upper end of a left side of the dust screen 106, and the dust screen 106 is conveniently detached by disposing the handle 108, so that the dust screen 106 is conveniently cleaned.
Specifically, the first soft magnetic stripe 104 and the dust screen 106 are disposed opposite to each other with different magnetic poles.
Specifically, the dust screen 106 is embedded in the inner cavity of the second soft magnetic stripe 105, and is used in cooperation with the handle 108, and through the dust screen 106, the dust in the air is filtered, so that the dust in the air is prevented from entering the inside of the case 101, and the electrical component cannot normally operate.
Specifically, the right side of the heat-conducting fin 202 penetrates into the inner cavity of the water tank 201, and is used in cooperation with the water tank 201.
Specifically, the number of the heat-conducting fins 202 is seven, and the heat-conducting fins are equidistantly distributed on the left side of the water tank 201.
During the use, when the adnexed dust of dust screen 106 surface is too much, pull down second soft magnetic stripe 105 and dust screen 106 from first soft magnetic stripe 104's surface through handle 108 to this can wash dust screen 106, when installing dust screen 106, with the laminating of second soft magnetic stripe 105 and first soft magnetic stripe 104, so that first soft magnetic stripe 104 and the soft magnetic stripe 105 of second adsorb, and then can install dust screen 106.
Example 3
Referring to fig. 1 and 2, a third embodiment of the present invention, which differs from the first two embodiments, is:
specifically, the end intercommunication of intaking of water pump 203 has the inlet tube, and the left end of inlet tube run through quick-witted case 101 and communicate with water tank 201, through setting up the inlet tube for cooperation water pump 203 carries the inside of heat transfer copper pipe 204 with the inside rivers of water tank 201, with this can circulate the cooling to the inside of quick-witted case 101.
Specifically, one end of the heat exchange copper pipe 204, which is far away from the water pump 203, penetrates through the case 101 and is communicated with the water tank 201.
Specifically, the ventilation net 107 is embedded in the inner wall of the chassis 101, and is used in cooperation with the electric fan 103.
Specifically, the heat exchange copper pipe 204 is spirally arranged from bottom to top and is matched with the water pump 203 for use.
When the heat exchanger is used, firstly, the electric fan 103 and the water pump 203 are respectively started through the external controller, external air is conveyed to the inside of the case 101 through the air inlet pipeline 102 by the electric fan 103, so that the temperature of electric elements inside the case 101 is reduced, the air inside the case 101 can be discharged to the outside of the case 101 through the air permeable net 107, and then the inside of the case 101 is circularly radiated, in addition, when the air enters the air inlet pipeline 102, dust in the air is firstly filtered through the dust screen 106, so that the influence of the dust on the machinery inside the case 101 is avoided, meanwhile, the water pump 203 is started, the water pump 203 conveys water flow inside the water tank 201 to the inside of the heat exchange copper pipe 204 through the water inlet pipe, when the water flow flows inside the heat exchange copper pipe 204, the heat is absorbed and flows into the inside of the water tank 201 from the other side of the heat exchange copper pipe 204, at the moment, the heat in the water flow inside the water tank 201 is guided out through the heat guide fins 202 to reduce the temperature in the water flow, with this favourable temperature reduction to the inside of quick-witted case 101 is constantly, when the dust that adheres to on the surface of dust screen 106 was too much, pull down second soft magnetic stripe 105 and dust screen 106 from the surface of first soft magnetic stripe 104 through handle 108 to this can wash dust screen 106, when installing dust screen 106, with the laminating of second soft magnetic stripe 105 with first soft magnetic stripe 104, so that first soft magnetic stripe 104 and the soft magnetic stripe 105 of second adsorb, and then can install dust screen 106.
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (10)
1. A heat dissipation device for a computer mainframe, comprising: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the heat dissipation mechanism (100) comprises a case (101), an air inlet pipeline (102) arranged at the upper end of the left side of an inner cavity of the case (101), an electric fan (103) arranged in the inner cavity of the air inlet pipeline (102), a first soft magnetic stripe (104) arranged at the upper end of the left side of the case (101), a second soft magnetic stripe (105) arranged at the left side of the first soft magnetic stripe (104), a dust screen (106) arranged in the inner cavity of the second soft magnetic stripe (105), and a ventilation screen (107) arranged at the top of the case (101);
the cooling mechanism (200) comprises a water tank (201), a heat conduction fin (202) arranged on the left side of the water tank (201), a water pump (203) arranged at the lower end of the left side of the inner cavity of the case (101), and a heat exchange copper pipe (204) arranged at the water outlet end of the water pump (203).
2. The heat dissipating apparatus for a computer main chassis according to claim 1, wherein: the case (101) further comprises a handle (108) and an upper end arranged on the left side of the dustproof net (106).
3. The heat dissipating apparatus for a computer main chassis according to claim 2, wherein: the first soft magnetic strip (104) and the dust screen (106) are arranged in an opposite way by adopting different magnetic poles.
4. The heat dissipating apparatus for a computer main chassis according to claim 3, wherein: the dustproof net (106) is embedded in the inner cavity of the second soft magnetic strip (105) and is matched with the handle (108) for use.
5. The heat dissipating device for a computer main body as claimed in any one of claims 1 to 4, wherein: the right side of the heat conduction fin (202) penetrates through the inner cavity of the water tank (201) and is matched with the water tank (201) for use.
6. The heat dissipating apparatus for a computer main chassis according to claim 5, wherein: the number of the heat conduction fins (202) is seven, and the heat conduction fins are distributed on the left side of the water tank (201) at equal intervals.
7. The heat dissipating apparatus for a computer main chassis according to claim 6, wherein: the water inlet end of the water pump (203) is communicated with a water inlet pipe, and the left end of the water inlet pipe penetrates through the case (101) and is communicated with the water tank (201).
8. The heat dissipating device for a computer main body case as claimed in any one of claims 2 to 3 and 7, wherein: one end, far away from the water pump (203), of the heat exchange copper pipe (204) penetrates through the case (101) and is communicated with the water tank (201).
9. The heat dissipating apparatus for a computer main chassis according to claim 8, wherein: the ventilation net (107) is embedded in the inner wall of the case (101) and is matched with the electric fan (103) for use.
10. The heat dissipating device for a computer mainframe according to any one of claims 1, 6 and 9, wherein: the heat exchange copper pipe (204) is spiral from bottom to top and is matched with the water pump (203) for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121999443.8U CN215679291U (en) | 2021-08-24 | 2021-08-24 | Heat radiator for be used for computer mainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121999443.8U CN215679291U (en) | 2021-08-24 | 2021-08-24 | Heat radiator for be used for computer mainframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215679291U true CN215679291U (en) | 2022-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121999443.8U Active CN215679291U (en) | 2021-08-24 | 2021-08-24 | Heat radiator for be used for computer mainframe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215679291U (en) |
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2021
- 2021-08-24 CN CN202121999443.8U patent/CN215679291U/en active Active
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