CN212112381U

CN212112381U - Computer host radiator

Info

Publication number: CN212112381U
Application number: CN202020955488.4U
Authority: CN
Inventors: 殷培超; 尹平臣; 殷武
Original assignee: Kunshan Aizhida Precision Hardware Co ltd
Current assignee: Kunshan Aizhida Precision Hardware Co ltd
Priority date: 2020-05-30
Filing date: 2020-05-30
Publication date: 2020-12-08
Anticipated expiration: 2030-05-30

Abstract

The utility model discloses a computer mainframe radiator, computer mainframe radiator includes quick-witted case, division board and No. two division boards, machine incasement chamber fixed mounting has a division board No. one, division board below fixed mounting has No. two division boards, No. one division board and No. two division boards all adopt aluminium system material, No. one division board and No. two division board surfaces all have the mounting bracket through the support mounting, the equal fixed heat absorption copper pipe of inlaying of mounting bracket inner chamber, and heat absorption copper pipe circulating pipe, machine incasement chamber bottom fixed mounting has the water tank, water tank inner chamber bottom fixed mounting has a semiconductor refrigeration piece No. one, semiconductor refrigeration piece one side fixed mounting has the circulating pump. The utility model discloses a water-cooling and air-cooling mutually support the mode and dispel the heat to the host computer, and water-cooling and air-cooling all adopt the semiconductor refrigeration piece to cool down to with the further radiating effect of promotion to the host computer.

Description

Computer host radiator

Technical Field

The utility model relates to a computer equipment technical field specifically is a computer mainframe radiator.

Background

A computer (computer) is commonly called a computer, is an electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has a memory function. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. A computer that is composed of a hardware system and a software system and does not have any software installed is called a bare metal. The computer can be divided into a super computer, an industrial control computer, a network computer, a personal computer and an embedded computer, and more advanced computers comprise a biological computer, a photon computer, a quantum computer and the like.

However, the existing computer host radiator has the following disadvantages in the use process:

the existing computer host radiator has a single radiating mode in the using process, and radiates the host at normal temperature, so that the radiating effect of the host is poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer mainframe radiator to solve current computer mainframe radiator in the above-mentioned background art and more single in the use radiating mode, and dispel the heat to the host computer under normal atmospheric temperature, thereby lead to the not good problem of radiating effect to the host computer.

In order to achieve the above object, the utility model provides a following technical scheme: a computer host radiator comprises a case, a first separation plate and a second separation plate, wherein the first separation plate is fixedly mounted in an inner cavity of the case, the second separation plate is fixedly mounted below the first separation plate, the first separation plate and the second separation plate are both made of aluminum materials, the surfaces of the first separation plate and the second separation plate are both provided with a mounting frame through supports, an inner cavity of the mounting frame is fixedly embedded with a heat absorption copper pipe and a heat absorption copper pipe circulating pipe, the bottom of the inner cavity of the case is fixedly mounted with a water tank, the bottom of the inner cavity of the water tank is fixedly mounted with a semiconductor refrigeration sheet, one side of the first semiconductor refrigeration sheet is fixedly mounted with a circulating pump, the water outlet end of the circulating pump is fixedly connected with the water inlet end of the heat absorption copper pipe, the water outlet end of the heat absorption copper pipe is fixedly connected with the water, can separate a plurality of regions with machine box inner chamber, and can install equipment such as mainboard through the mounting bracket of a division board and No. two division boards, can effectively promote the radiating effect to the host computer through the interval that increases between the erection equipment, carry out the water tank with the cooling water injection in, can extract and pour into the heat absorption copper pipe to the cooling water through the circulating pump, water tank inner chamber bottom fixed mounting has a semiconductor refrigeration piece simultaneously, the available semiconductor material's of a semiconductor refrigeration piece Peltier effect releases air conditioning, thereby can cool down the cooling water, thereby make the cooling water when circulating, can take away the heat of quick-witted incasement fast, thereby promote the radiating effect.

Preferably, fixed mounting has No. two semiconductor refrigeration pieces in the joint gap of a division board and No. two division boards and mounting bracket, the equal fixed mounting of No. two semiconductor refrigeration piece upper surfaces has the heat dissipation fan, utilizes semiconductor material's Peltier effect to release air conditioning through No. two semiconductor refrigeration pieces to can blow the air conditioning that releases to equipment such as mainboard through the through-hole through the heat dissipation fan, thereby with the further radiating effect of promotion to the host computer.

Preferably, the surface of the first separation plate and the surface of the second separation plate are fixedly provided with through holes, and cold air can be blown to the equipment such as the mainboard through the through holes.

Preferably, the side wall of the case is fixedly provided with heat dissipation holes, and the case can be ventilated through the heat dissipation holes.

Preferably, there is a dust cover one side of the heat dissipation holes, there are a negative plate in the dust cover, there are two sets of negative plates in the dust cover, the negative plate can release negative ions on the surface after power-on, and the negative ions can be absorbed by the negative ions in the dust, so that the dust is adsorbed on the surface of the negative plate, and the dust is effectively prevented from entering the machine case.

Preferably, louvre inner chamber fixed mounting has the ion fan, there is the dust collecting tank dust cover bottom through spout swing joint, and the ion fan can blow into quick-witted incasement through the louvre with ion wind to can carry out electrostatic elimination to the equipment of quick-witted incasement, avoid static to cause the damage to equipment such as mainboard, the air flow rate of quick-witted incasement can be accelerated to ion wind simultaneously, plays the effect of cooling, can store the dust of collecting through the dust collecting tank.

The utility model provides a computer mainframe radiator possesses following beneficial effect:

(1) the utility model discloses a division board and No. two division boards mutually support, can separate a plurality of regions with the chassis inner chamber, and can install equipment such as mainboard through the mounting bracket of division board and No. two division boards, can effectively promote the radiating effect to the host computer through the interval that increases between the erection equipment, it carries out the water tank to inject the cooling water in, can extract and pour into the heat absorption copper pipe to the cooling water through the circulating pump in, water tank inner chamber bottom fixed mounting has a semiconductor refrigeration piece simultaneously, the Peltier effect of the usable semiconductor material of a semiconductor refrigeration piece releases air conditioning, thereby can cool down the cooling water, thereby make the cooling water when circulating, can take away the heat of quick-witted incasement fast, thereby promote the radiating effect.

(2) The utility model discloses a No. two semiconductor refrigeration pieces utilize semiconductor material's Peltier effect to release air conditioning to can blow the air conditioning that releases to equipment such as mainboard through the through-hole through the heat dissipation fan, thereby with the radiating effect of further promotion to the host computer.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of the structure of the heat absorbing copper pipe of the present invention;

fig. 3 is a schematic diagram of the dust removing structure of the present invention.

In the figure: 1. a chassis; 101. a first divider plate; 102. a second divider plate; 2. a mounting frame; 201. a heat absorbing copper pipe; 202. a water tank; 203. a first semiconductor refrigeration chip; 204. a circulation pump; 3. a second semiconductor refrigerating sheet; 301. a heat dissipation fan; 302. a through hole; 4. heat dissipation holes; 401. a dust cover; 402. a cathode plate; 403. an ion blower; 404. a dust collecting groove.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1-3, the utility model provides a technical solution: the utility model provides a computer mainframe radiator, computer mainframe radiator includes quick-witted case 1, division board 101 and No. two

division boards

102, 1 inner chamber fixed mounting of machine case has division board 101 No. one, division board 101 below fixed mounting has No. two division boards 102, division board 101 and No. two division boards 102 all adopt aluminium system material, No. one division board 101 and No. two division board 102 surfaces all have mounting bracket 2 through the support mounting, 2 inner chambers of mounting bracket all fix inlay have heat absorption copper pipe 201, and heat absorption copper pipe 201 circulating pipe, machine case 1 inner chamber bottom fixed mounting has

water tank

202, 202 inner chamber bottom fixed mounting of water tank has semiconductor refrigeration piece 203 No. one, semiconductor refrigeration piece 203 one side fixed mounting has circulating pump 204, and circulating pump 204 outlet end is fixed continuous with heat absorption copper pipe 201 water inlet end, the outlet end of heat absorption copper pipe 201 is fixed continuous with water tank 202, through No. one division board 101 and No. two division boards 102 mutually support, can separate a plurality of regions with quick-witted case 1 inner chamber, and can install equipment such as mainboard through mounting bracket 2 of a division board 101 and No. two division boards 102, can effectively promote the radiating effect to the host computer through increasing the interval between the erection equipment, pour into the cooling water into and carry out in the water tank 202, can extract and pour into heat absorption copper pipe 201 through circulating pump 204 in the cooling water, simultaneously water tank 202 inner chamber bottom fixed mounting has a semiconductor refrigeration piece 203, the Peltier effect of the usable semiconductor material of a semiconductor refrigeration piece 203 releases air conditioning, thereby can cool down the cooling water, thereby make the cooling water when circulating, can take away the heat in quick-witted case 1 fast, thereby promote the radiating effect.

Preferably, fixed mounting has No. two semiconductor refrigeration pieces 3 in the connecting gap of a division board 101 and No. two division boards 102 and mounting bracket 2, No. two equal fixed mounting in semiconductor refrigeration piece 3 upper surface has heat dissipation fan 301, utilizes the Peltier effect of semiconductor material to release air conditioning through No. two semiconductor refrigeration pieces 3 to can blow the air conditioning that releases to equipment such as mainboard through-hole 302 through heat dissipation fan 301, thereby with the further radiating effect of promotion to the host computer.

Preferably, through holes 302 are fixedly formed in the surfaces of the first partition plate 101 and the second partition plate 102, and cold air can be blown to the equipment such as the mainboard through the through holes 302.

Preferably, the side wall of the case 1 is fixedly provided with heat dissipation holes 4, and the case 1 can be ventilated through the heat dissipation holes 4.

Preferably, a dust cover 401 is fixedly mounted on one side of the heat dissipation hole 4, a cathode plate 402 is fixedly mounted in an inner cavity of the dust cover 401, two sets of cathode plates 402 are arranged in the cathode plate 402, the cathode plate 402 is fixedly mounted in an inner cavity of the dust cover 401, two sets of cathode plates 402 are arranged in the cathode plate 402, anions can be released from the surface of the cathode plate 402 after the cathode plate 402 is electrified, and the anions can absorb the cations in the dust, so that the dust is adsorbed on the surface of the cathode plate 402, and the dust is effectively prevented from entering the case.

Preferably, 4 inner chamber fixed mounting of louvre have ion fan 403, there is dust collecting tank 404 dust cover 401 bottom through spout swing joint, and ion fan 403 can blow into quick-witted incasement 1 with ion wind through louvre 4 to can carry out electrostatic elimination to the equipment in quick-witted case 1, avoid static to cause the damage to equipment such as mainboard, the air flow rate in quick-witted case 1 can be accelerated to ion wind simultaneously, play the effect of cooling, can store the dust of collecting through dust collecting tank 404.

It should be noted that, when the computer host radiator works, the first partition plate 101 and the second partition plate 102 are matched with each other, the inner cavity of the case 1 can be divided into a plurality of areas, the equipment such as a mainboard can be installed through the installation frame 2 of the first partition plate 101 and the second partition plate 102, the heat dissipation effect on the host can be effectively improved by increasing the interval between the installation equipment, cooling water is injected into the water tank 202, the cooling water can be extracted through the circulating pump 204 and injected into the heat absorption copper pipe 201, meanwhile, the first semiconductor refrigeration piece 203 is fixedly installed at the bottom of the inner cavity of the water tank 202, the first semiconductor refrigeration piece 203 can release cold air by utilizing the Peltier effect of semiconductor materials, so that the cooling water can be cooled, and when the cooling water is circulated, the heat in the case 1 can be quickly taken away, and the heat dissipation effect is improved; cold air is released by the second semiconductor refrigerating sheet 3 by using the Peltier effect of the semiconductor material, and the released cold air can be blown to equipment such as a mainboard through the through hole 302 by the heat dissipation fan 301, so that the heat dissipation effect on the host machine is further improved; the inner cavity of the dust cover 401 is fixedly provided with the cathode plates 402, and the cathode plates 402 are provided with two groups, the surface of the cathode plates 402 can release anions after being electrified, and the anions can absorb the cations in the dust, so that the dust is adsorbed on the surface of the cathode plates 402, and the dust is effectively prevented from entering the case 1; ion fan 403 can blow into quick-witted incasement 1 with ion wind through louvre 4 to can carry out electrostatic elimination to the equipment in quick-witted case 1, avoid static to cause the damage to equipment such as mainboard, the air flow rate in quick-witted case 1 can be accelerated to ion wind simultaneously, plays the effect of cooling, can store the dust of collecting through dust collecting tank 404.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A kind of computer host computer heat sink, characterized by: the computer host radiator comprises a case (1), a first partition plate (101) and a second partition plate (102), wherein a first partition plate (101) is fixedly mounted in an inner cavity of the case (1), a second partition plate (102) is fixedly mounted below the first partition plate (101), the first partition plate (101) and the second partition plate (102) are made of aluminum, a mounting frame (2) is mounted on the surfaces of the first partition plate (101) and the second partition plate (102) through supports, a heat absorption copper pipe (201) is fixedly inlaid in an inner cavity of the mounting frame (2), a circulating pipe of the heat absorption copper pipe (201) is arranged, a water tank (202) is fixedly mounted at the bottom of the inner cavity of the case (1), a semiconductor refrigerating sheet (203) is fixedly mounted at the bottom of the inner cavity of the water tank (202), and a circulating pump (204) is fixedly mounted on one side of the semiconductor refrigerating sheet, and the water outlet end of the circulating pump (204) is fixedly connected with the water inlet end of the heat absorption copper pipe (201), and the water outlet end of the heat absorption copper pipe (201) is fixedly connected with the water tank (202).

2. The heat sink of claim 1, wherein: fixed mounting has No. two semiconductor refrigeration pieces (3) in the joint gap of a division board (101) and No. two division boards (102) and mounting bracket (2), the equal fixed mounting of No. two semiconductor refrigeration piece (3) upper surface has heat dissipation fan (301).

3. The heat sink of claim 2, wherein: through holes (302) are fixedly formed in the surfaces of the first separation plate (101) and the second separation plate (102).

4. The heat sink of claim 1, wherein: the side wall of the case (1) is fixedly provided with heat dissipation holes (4).

5. The heat sink of claim 4, wherein: a dust cover (401) is fixedly mounted on one side of the heat dissipation hole (4), a cathode plate (402) is fixedly mounted in the inner cavity of the dust cover (401), and two sets of the cathode plate (402) are arranged.

6. The heat sink of claim 5, wherein: the dust cover is characterized in that an ion fan (403) is fixedly mounted in the inner cavity of the heat dissipation hole (4), and a dust collection groove (404) is movably connected to the bottom of the dust cover (401) through a sliding groove.