CN215679283U - Liquid cold wind cold integral type radiator - Google Patents

Liquid cold wind cold integral type radiator Download PDF

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Publication number
CN215679283U
CN215679283U CN202122449326.0U CN202122449326U CN215679283U CN 215679283 U CN215679283 U CN 215679283U CN 202122449326 U CN202122449326 U CN 202122449326U CN 215679283 U CN215679283 U CN 215679283U
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China
Prior art keywords
circulating pump
radiator
liquid
fan
fan shell
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CN202122449326.0U
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Chinese (zh)
Inventor
余江
余波
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Dongguan Kuiyuan Electronic Technology Co ltd
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Dongguan Kuiyuan Electronic Technology Co ltd
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Priority to CN202122449326.0U priority Critical patent/CN215679283U/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a liquid-cold-air cooling integrated radiator, which comprises a circulating pump, wherein the top of the circulating pump is clamped with a fan shell, a motor is embedded in the center position in the fan shell, the output end of the motor is connected with fan blades, the fan shell is circular (not limited to circular and can be square or horn-shaped), a water inlet and outlet pipe is connected to the outside of the circulating pump, and a heat absorption block is arranged at the bottom of the circulating pump; the top of the circulating pump is provided with the heat dissipation fan, and air generated by rotation of the fan exhausts air to the periphery of the circulating pump, so that peripheral electronic elements are dissipated, and meanwhile, liquid in the circulating pump flows to carry out liquid cooling heat dissipation by taking heat of the main chip out, and the integral liquid cooling air cooling heat dissipation effect is achieved.

Description

Liquid cold wind cold integral type radiator
Technical Field
The utility model relates to the technical field of radiators, in particular to a liquid-cold air-cooling integrated radiator.
Background
At present, a water-cooling radiator or an air-cooling radiator device is generally adopted as a heat radiator for cooling a computer CPU, a graphics card GPU and an electronic instrument chip device, and the heat radiation performance cannot achieve the effect or cannot give consideration to the heat radiation of related chips, so that a liquid-cooling and air-cooling integrated radiator is required to be used, the heat radiation of a main chip can be met, and the heat radiation of surrounding chips can be also given consideration to.
Nowadays, such kind of device in the market is various, can satisfy people's user demand basically, but the heat dissipation overall performance still has certain problem, and current liquid cooling or air-cooled radiator can not compromise the heat dissipation demand of chipset, and practicality is not strong enough with compatible comparison.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a liquid-cooling and air-cooling integrated radiator to solve the problem of poor radiating effect in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a cold integral type radiator of liquid cold wind, includes the circulating pump, there is fan shell at the top joint of circulating pump, the inside central point of fan shell puts and inlays and has the motor, the output of motor is connected with the flabellum, fan shell presents circularly (not limited to circularly, can be square and horn type), the outside connection inlet tube that has of circulating pump, the circulating pump has the connection outlet pipe, there is the heat absorption piece the circulating pump bottom.
Preferably, a radiator mounting support frame is arranged outside the circulating pump and supports the radiator.
Preferably, the radiator mounting support frame is provided with a mounting hole, a mounting bolt penetrates through the mounting hole, a spring is sleeved outside the mounting bolt, and the mounting bolt fixes the radiator on the circuit board.
Compared with the prior art, the utility model has the beneficial effects that: this liquid cooling forced air cooling integral type radiator is rational in infrastructure, has following advantage:
(1) through being provided with fan shell, flabellum and motor have realized the electronic component heat dissipation purpose around the main chip, do not set up this radiator fan on the current device circulating pump, can't be to the chip heat dissipation around the main chip, the radiating effect does not well lead to the wholeness ability to descend, consequently, be provided with fan shell at the top of circulating pump, then rotate through the starter motor, the motor just can make the flabellum rotate, the flabellum will make the air inhale the bottom of fan shell from the top of fan shell, then the air can be to airing exhaust all around, thereby dispel the heat to electronic component around, reach whole heat dissipation, promote the chip performance, the effect in extension electronic component life-span.
(2) The purpose of good fixing effect is realized by arranging the mounting bolts, the mounting holes and the springs. The spring is arranged outside the mounting bolt, when the mounting bolt is mounted on the mainboard, the spring enables the support frame to be pressed on the CPU or the chip all the time, and when external force or vibration force exists, the radiator keeps close to the chip due to the action of the spring, so that the effects of stability and no failure of heat dissipation performance are achieved.
(3) The heat dissipation of the main chip is further enhanced by arranging the water inlet pipe, the circulating pump and the water outlet pipe, and the purpose of improving the performance of the main chip is achieved. The inlet tube and the outlet pipe of the circulating pump are connected to the heat dissipation row and then communicated with the action of the circulating pump, so that the cooling liquid circulates in the radiator, and the heat dissipation performance of the device is enhanced.
Drawings
FIG. 1 is a schematic front perspective view of the present invention;
FIG. 2 is a schematic bottom perspective view of the present invention;
FIG. 3 is a schematic bottom view of the present invention;
fig. 4 is a schematic top view of the present invention.
In the figure: 1. a water inlet pipe; 2. a circulation pump; 3. installing a bolt; 4. mounting holes; 5. a radiator mounting support frame; 6. a spring; 7. a fan housing; 8. a fan blade; 9. a water outlet pipe; 10. A heat absorbing block; 11. an electric motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an embodiment of the present invention is shown: including circulating pump 2, circulating pump 2's top joint has fan shell 7, the inside central point of fan shell 7 puts and inlays and has motor 11, motor 11's output is connected with flabellum 8, fan shell 7 presents circularly (not limited to circular, can be square and horn type), 2 outside of circulating pump have the connection inlet tube 1, circulating pump 2 has connection outlet pipe 9, there is heat absorption piece 10 circulating pump 2 bottom.
Be provided with fan shell 7 at circulating pump 2's top, then rotate through starter motor 11, motor 11 will make flabellum 8 rotate, and flabellum 8 will make the air inhale the bottom of fan shell 7 from fan shell 7's top, then the air can be to airing exhaust all around to conveniently dispel the heat to electronic component on every side, the heat absorption piece 10 of circulating pump 2 bottom dispels the heat to main chip through the inner loop of liquid, thereby reaches whole radiating purpose and effect.
The heat sink mounting and supporting frame is characterized in that a heat sink mounting and supporting frame 5 is arranged outside the circulating pump 2, a mounting hole 4 is formed in the heat sink mounting and supporting frame 5, a mounting bolt 3 penetrates through the mounting hole 4, a spring 6 is sleeved outside the mounting bolt 3, the spring 6 is arranged outside the mounting bolt 3, when the mounting bolt 3 is mounted on a mainboard, the spring 6 enables a heat absorption block 10 to be pressed on a CPU all the time, when the mounting bolt 3 is not loose, the heat sink cannot be separated from the CPU due to the action of the spring 6, and the fixing effect is good.
One end of the water inlet pipe 1 and one end of the water outlet pipe 9 are connected to the circulating pump 2, the heat absorption block 10 on the bottom surface of the circulating pump 2 is in contact with the chip to absorb heat, the heat of the chip is dissipated to the heat dissipation row through the internal circulation of the liquid in the radiator, and the purpose of dissipating heat of the main chip is achieved through the circulation.
When the heat radiator is used, the heat radiator is placed on the mainboard and then is installed in the hole in the mainboard through the installation bolt 3, when the installation bolt 3 is installed on the mainboard, the spring 6 always enables the heat absorption block 10 to be pressed on the CPU, when the installation bolt 3 is loosened, the heat radiator cannot be separated from the CPU due to the effect of the spring 6, the fixing effect is good, the heat absorption block 10 on the bottom surface of the circulating pump 2 is contacted with the chip to absorb heat, the heat of the chip is brought to the heat dissipation row position to dissipate heat through the internal circulation of liquid in the heat radiator, the purpose of heat dissipation of the main chip is achieved through the circulation, then the motor 11 enables the fan blades 8 to rotate by starting the motor 11, the fan blades 8 enable air to be sucked into the bottom of the fan shell 7 from the top of the fan shell 7, then the air can be exhausted to the periphery, and therefore the heat dissipation of the surrounding electronic components is convenient, the heat absorption block 10 at the bottom of the circulating pump 2 dissipates heat to the main chip through the internal circulation of liquid, so that the purpose and effect of overall heat dissipation are achieved.

Claims (3)

1. The utility model provides a cold integral type radiator of liquid cold wind which characterized in that: including circulating pump (2), the top joint of circulating pump (2) has fan shell (7), the inside central point of fan shell (7) puts and inlays and has motor (11), the output of motor (11) is connected with flabellum (8), fan shell (7) present circular (not restricted to circular, can be square and horn type, circulating pump (2) outside have connection inlet tube (1), circulating pump (2) have and connect outlet pipe (9), there is heat absorption piece (10) circulating pump (2) bottom.
2. The integrated liquid-cooled and air-cooled radiator as claimed in claim 1, wherein: and a radiator mounting support frame (5) is arranged outside the circulating pump (2).
3. The integrated liquid-cooled and air-cooled radiator as claimed in claim 2, wherein: the radiator mounting support frame (5) is provided with a mounting hole (4), a mounting bolt (3) penetrates through the mounting hole (4), and a spring (6) is sleeved outside the mounting bolt (3).
CN202122449326.0U 2021-10-12 2021-10-12 Liquid cold wind cold integral type radiator Active CN215679283U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122449326.0U CN215679283U (en) 2021-10-12 2021-10-12 Liquid cold wind cold integral type radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122449326.0U CN215679283U (en) 2021-10-12 2021-10-12 Liquid cold wind cold integral type radiator

Publications (1)

Publication Number Publication Date
CN215679283U true CN215679283U (en) 2022-01-28

Family

ID=79968114

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122449326.0U Active CN215679283U (en) 2021-10-12 2021-10-12 Liquid cold wind cold integral type radiator

Country Status (1)

Country Link
CN (1) CN215679283U (en)

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