CN215675905U - Semiconductor refrigeration plant's intelligent warning heat-insulating assembly - Google Patents

Semiconductor refrigeration plant's intelligent warning heat-insulating assembly Download PDF

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Publication number
CN215675905U
CN215675905U CN202121848583.5U CN202121848583U CN215675905U CN 215675905 U CN215675905 U CN 215675905U CN 202121848583 U CN202121848583 U CN 202121848583U CN 215675905 U CN215675905 U CN 215675905U
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China
Prior art keywords
semiconductor refrigeration
bevel gear
heat insulation
driving
fan
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CN202121848583.5U
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Chinese (zh)
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杨伟
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Shenzhen Diweixin Electronic Technology Co ltd
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Shenzhen Diweixin Electronic Technology Co ltd
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Abstract

The utility model discloses an intelligent alarm heat insulation assembly of semiconductor refrigeration equipment, which comprises a semiconductor refrigeration piece, wherein a heat insulation layer is arranged in the semiconductor refrigeration piece, an intelligent temperature alarm is arranged in the heat insulation layer, the intelligent temperature alarm is connected with a sensing probe, a first upright post and a second upright post are arranged on the top surface of the semiconductor refrigeration piece, the top ends of the first upright post and the second upright post are connected with a top plate, and the top surface of the top plate is connected with a driving shell The telescopic rod and the fan move transversely to adjust the position of the fan.

Description

Semiconductor refrigeration plant's intelligent warning heat-insulating assembly
Technical Field
The utility model relates to the technical field of semiconductor refrigeration equipment, in particular to an intelligent alarm heat insulation assembly of semiconductor refrigeration equipment.
Background
Semiconductor refrigeration piece, also called thermoelectric refrigeration piece, its concrete theory of operation is the Peltier effect that utilizes semiconductor material, when the galvanic couple that the direct current established ties through two kinds of different semiconductor materials, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can realize refrigerated purpose, because semiconductor refrigeration piece has two kinds of functions of refrigeration and heating, and heating power is very high, consequently in semiconductor refrigeration equipment's course of operation, the fault rate of heating end is high, prior art center generally can set up an intelligent temperature alarm at the heating end and to its temperature real-time supervision, avoid heating end temperature to appear unusually and cause equipment trouble, bring for the maintenance.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem and provides an intelligent alarm heat insulation assembly of semiconductor refrigeration equipment.
In order to solve the technical problems, the technical scheme provided by the utility model is as follows: an intelligent alarm heat insulation assembly of semiconductor refrigeration equipment comprises a semiconductor refrigeration sheet, wherein a heat insulation layer is arranged in the semiconductor refrigeration sheet, an intelligent temperature alarm is arranged in the heat insulation layer and is connected with a sensing probe, the top surface of the semiconductor refrigerating sheet is provided with a first upright post and a second upright post, the top ends of the first upright post and the second upright post are connected with a top plate, the top surface of the top plate is connected with a driving shell, a driving shaft is arranged in the driving shell and is in transmission connection with a driving wheel, the driving wheel is connected with the driven wheel through a belt in a transmission way, the driven wheel is connected with the driven shaft in a transmission way, the bottom surface of the top plate is connected with the block body, a groove is arranged in the block body, a screw is arranged in the groove, the driving shaft and the driven shaft are both connected with the screw through a bevel gear structure, the screw rod is connected with the sliding block in a sliding mode, the sliding block is connected with the telescopic rod, and the end portion of the telescopic rod is connected with the fan shell.
As an improvement, the bevel gear structure comprises a first bevel gear, the driving shaft and the driven shaft penetrate through the top plate and are in transmission connection with the first bevel gear, the first bevel gear is meshed with a second bevel gear, the second bevel gear is in transmission connection with a rotating shaft, and the rotating shaft penetrates through the side wall of the block body and is connected with a screw rod.
As an improvement, a fixing frame is arranged in the fan shell, a fan is arranged on the fixing frame, and a through hole is formed in the bottom surface of the fan shell.
As an improvement, the first bevel gear and the second bevel gear are provided with protective shells.
As an improvement, the top end of the driving shaft penetrates through the top wall of the driving shell and is connected with a knob.
Compared with the prior art, the utility model has the advantages that: according to the utility model, the heat insulation layer for carrying out heat insulation protection on the intelligent temperature alarm is arranged at the heating end and the refrigerating end of the semiconductor refrigerating sheet, so that the heat transfer between the heating end and the refrigerating end is reduced, the intelligent temperature alarm is protected against heat insulation, the intelligent temperature alarm is prevented from being damaged, the fan radiates heat to the semiconductor refrigerating sheet, the telescopic rod can adjust the height of the fan, and the screw rod can drive the sliding block, the telescopic rod and the fan to move transversely and adjust the position of the fan.
Drawings
FIG. 1 is a schematic view of an intelligent alarm and thermal insulation assembly of a semiconductor refrigeration device of the present invention.
FIG. 2 is a schematic view of a fan housing of an intelligent alarm and thermal insulation assembly of a semiconductor refrigeration device of the present invention.
As shown in the figure: 1. a semiconductor refrigeration sheet; 2. a thermal insulation layer; 3. an intelligent temperature alarm; 4. a sensing probe; 5. a first upright post; 6. a second upright post; 7. a top plate; 8. a drive case; 9. a knob; 10. a drive shaft; 11. a driving wheel; 12. a belt; 13. a driven wheel; 14. a driven shaft; 15. a first bevel gear; 16. a second bevel gear; 17. a rotating shaft; 18. a protective shell; 19. a block body; 20. a groove; 21. a screw; 22. a slider; 23. a telescopic rod; 24. a fan housing; 25. a fixed mount; 26. a fan; 27. and a through hole.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
With reference to the attached drawings, an intelligent alarm heat insulation assembly of semiconductor refrigeration equipment comprises a semiconductor refrigeration piece 1, a heat insulation layer 2 is arranged in the semiconductor refrigeration piece 1, an intelligent temperature alarm 3 is arranged in the heat insulation layer 2, the intelligent temperature alarm 3 is connected with a sensing probe 4, a first upright post 5 and a second upright post 6 are arranged on the top surface of the semiconductor refrigeration piece 1, the top ends of the first upright post 5 and the second upright post 6 are connected with a top plate 7, the top surface of the top plate 7 is connected with a driving shell 8, a driving shaft 10 is arranged in the driving shell 8, the driving shaft 10 is in transmission connection with a driving wheel 11, the driving wheel 11 is in transmission connection with a driven wheel 13 through a belt 12, the driven wheel 13 is in transmission connection with a driven shaft 14, the bottom surface of the top plate 7 is connected with a block 19, a groove 20 is arranged in the block 19, a screw 21 is arranged in the groove 20, and the driving shaft 10 and the driven shaft 14 are both connected with the screw 21 through a bevel gear structure, the screw 21 is connected with a sliding block 22 in a sliding mode, the sliding block 22 is connected with an expansion rod 23, and the end portion of the expansion rod 23 is connected with a fan shell 24.
The bevel gear structure comprises a first bevel gear 15, the driving shaft 10 and the driven shaft 14 both penetrate through the top plate 7 and are in transmission connection with the first bevel gear 15, the first bevel gear 15 is meshed with a second bevel gear 16, the second bevel gear 16 is in transmission connection with a rotating shaft 17, and the rotating shaft 17 penetrates through a side wall connecting screw 21 of a block 19.
A fixing frame 25 is arranged in the fan shell 24, a fan 26 is arranged on the fixing frame 25, a through hole 27 is formed in the bottom surface of the fan shell 24, and the through hole 27 facilitates ventilation.
The first bevel gear 15 and the second bevel gear 16 are provided with protective shells 18, and the protective shells 18 protect the first bevel gear 15 and the second bevel gear 16.
The top end of the driving shaft 10 penetrates through the top wall of the driving shell 8 and is connected with a knob 9.
When the semiconductor refrigeration sheet cooling device is implemented specifically, the fan 26 dissipates heat of the semiconductor refrigeration sheet 1, the expansion link 23 can adjust the height of the fan 26, the knob 9 is rotated to drive the driving shaft 10 and the driving wheel 11 to rotate, the driven wheel 13 and the driven shaft 14 are driven to rotate through the belt 12, the bevel gear I15 and the bevel gear II 16 rotate to drive the screw rod 21 to rotate, and the screw rod 21 rotates to drive the sliding block 22, the expansion link 23 and the fan 26 to move transversely to adjust the position of the fan 26.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims (5)

1. The utility model provides a semiconductor refrigeration plant's thermal-insulated subassembly of intelligence warning, includes semiconductor refrigeration piece (1), its characterized in that: the semiconductor refrigeration device is characterized in that a heat insulation layer (2) is arranged in the semiconductor refrigeration piece (1), an intelligent temperature alarm (3) is arranged in the heat insulation layer (2), the intelligent temperature alarm (3) is connected with a sensing probe (4), a first stand column (5) and a second stand column (6) are arranged on the top surface of the semiconductor refrigeration piece (1), a top plate (7) is connected with the top ends of the first stand column (5) and the second stand column (6), a driving shell (8) is connected with the top surface of the top plate (7), a driving shaft (10) is arranged in the driving shell (8), the driving shaft (10) is in transmission connection with a driving wheel (11), the driving wheel (11) is in transmission connection with a driven wheel (13) through a belt (12), the driven wheel (13) is in transmission connection with a driven shaft (14), a block body (19) is connected with the bottom surface of the top plate (7), a groove (20) is arranged in the block body (19), and a screw rod (21) is arranged in the groove (20), the driving shaft (10) and the driven shaft (14) are connected with a screw rod (21) through bevel gear structures, the screw rod (21) is connected with a sliding block (22) in a sliding mode, the sliding block (22) is connected with a telescopic rod (23), and the end portion of the telescopic rod (23) is connected with a fan shell (24).
2. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 1, wherein: the bevel gear structure comprises a first bevel gear (15), the driving shaft (10) and the driven shaft (14) are connected with the first bevel gear (15) in a transmission mode through the top plate (7), the first bevel gear (15) is meshed with a second bevel gear (16), the second bevel gear (16) is connected with the rotating shaft (17) in a transmission mode, and the rotating shaft (17) penetrates through the side wall of the block body (19) and is connected with the screw rod (21).
3. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 1, wherein: the fan is characterized in that a fixing frame (25) is arranged in the fan shell (24), a fan (26) is arranged on the fixing frame (25), and a through hole (27) is formed in the bottom surface of the fan shell (24).
4. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 2, wherein: the first bevel gear (15) and the second bevel gear (16) are provided with protective shells (18).
5. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 1, wherein: the top end of the driving shaft (10) penetrates through the top wall of the driving shell (8) to be connected with a knob (9).
CN202121848583.5U 2021-08-09 2021-08-09 Semiconductor refrigeration plant's intelligent warning heat-insulating assembly Active CN215675905U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121848583.5U CN215675905U (en) 2021-08-09 2021-08-09 Semiconductor refrigeration plant's intelligent warning heat-insulating assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121848583.5U CN215675905U (en) 2021-08-09 2021-08-09 Semiconductor refrigeration plant's intelligent warning heat-insulating assembly

Publications (1)

Publication Number Publication Date
CN215675905U true CN215675905U (en) 2022-01-28

Family

ID=79984315

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121848583.5U Active CN215675905U (en) 2021-08-09 2021-08-09 Semiconductor refrigeration plant's intelligent warning heat-insulating assembly

Country Status (1)

Country Link
CN (1) CN215675905U (en)

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