CN215644455U

CN215644455U - Novel IGBT module assembly structure

Info

Publication number: CN215644455U
Application number: CN202120290329.1U
Authority: CN
Inventors: 谢龙飞; 骆健; 王豹子; 姚二现; 杨金龙; 刘克明
Original assignee: Nanruilianyan Semiconductor Co ltd
Current assignee: Nanruilianyan Semiconductor Co ltd
Priority date: 2021-02-01
Filing date: 2021-02-01
Publication date: 2022-01-25
Anticipated expiration: 2031-02-01

Abstract

The invention relates to a novel IGBT module assembling structure which comprises a bottom plate, a soldering lug and a ceramic copper-clad plate (DBC), wherein the soldering lug is arranged between the bottom plate and the DBC, one side of the bottom plate, which faces the soldering lug, is provided with a plurality of positioning columns, the DBC is provided with a plurality of positioning holes, the positioning columns correspond to the positioning holes in position, one end of each positioning column extends into the corresponding positioning hole, the difference between the height of each positioning column and the depth of each positioning hole is smaller than the thickness of the soldering lug, and the soldering lug is used for connecting the bottom plate and the DBC during welding. The module realizes rapid and accurate assembly by reasonably relating to the positions and the sizes of the positioning columns and the positioning holes.

Description

Novel IGBT module assembly structure

Technical Field

The invention relates to a novel IGBT module assembling structure, and belongs to the field of power semiconductor devices.

Background

An IGBT (insulated gate bipolar transistor) can withstand high voltage and supply large current, and is convenient to control, and is a core device of power electronic equipment. In the packaging process of the IGBT module, the DBC and the bottom plate are connected by welding to form a heat dissipation channel of the IGBT module, and the reliability of the IGBT module is directly influenced by the welding quality of the heat dissipation channel. In the welding process, the assembly of a ceramic copper clad laminate (DBC), a soldering lug and a base plate is completed by using a tool, and finally, welding is completed by using welding equipment.

The existing technical scheme has high requirement on the position matching precision among the ceramic copper clad laminate (DBC), the soldering lug and the bottom plate, and often needs to manually adjust the positions among the ceramic copper clad laminate (DBC), the soldering lug, the bottom plate and the tool after assembly, thereby consuming time and labor energy, having slight error, easily causing the problems of uneven welding layer, flow welding, surfacing welding, tool adhesion and the like, and influencing the welding quality.

Disclosure of Invention

The invention provides a novel IGBT module assembling structure, which can realize rapid and accurate assembly by reasonably relating to the positions and sizes of positioning columns and positioning holes, in order to avoid the problem of low welding quality caused by low matching precision of all parts in an IGBT module.

The technical scheme adopted by the invention is as follows: the utility model provides an IGBT module assembly structure, includes bottom plate, soldering lug and ceramic copper-clad plate, the soldering lug is arranged in the bottom plate with between the ceramic copper-clad plate the bottom plate is provided with a plurality of reference columns towards one side of soldering lug be provided with a plurality of locating holes on the ceramic copper-clad plate, reference column and locating hole position are corresponding, reference column one end extends to in the locating hole, the height of reference column with the difference of the degree of depth of locating hole is less than the thickness of soldering lug, the soldering lug is used for connecting when welding the bottom plate with the ceramic copper-clad plate.

Further, the bottom plate is Cu or AlSiC.

Furthermore, the bottom plate is a long direction plate, and the positioning columns are arranged at the corner positions of the rectangular plate.

Furthermore, the soldering lug is a rectangular plate and is arranged in an inner frame defined by the positioning columns.

Furthermore, a through hole is formed in the soldering lug, and the positioning column penetrates through the through hole and extends into the positioning hole.

Furthermore, one side of the DBC facing the bottom plate is a copper layer, and the positioning hole is arranged in the copper layer.

Furthermore, the diameter of the positioning column is 0.5-1 mm.

Furthermore, the diameter of the positioning hole is 1-1.5 mm.

Furthermore, the soldering lug is a rectangular soldering lug, and four corners of the soldering lug are cut at an angle of 45 degrees.

The beneficial effects produced by the invention comprise: according to the invention, through the self-positioning function of the base plate, the soldering lug and the ceramic copper clad laminate (DBC), accurate assembly can be realized rapidly, the sliding problem of the soldering lug and the ceramic copper clad laminate (DBC) is solved, an assembler does not need to adjust the relative positions of the ceramic copper clad laminate (DBC), the soldering lug and the base plate, meanwhile, a tool is saved, the complexity of an assembly process is reduced, and the assembly efficiency is improved. In the welding process, due to the matching and supporting relation of the positioning columns and the positioning holes, the thickness uniformity of the whole welding layer is effectively improved, and the phenomena of continuous welding, surfacing and tool adhesion caused by position drift are solved.

Drawings

FIG. 1 is a schematic structural diagram of an IGBT module according to the present invention;

FIG. 2(a) is a side view of the base plate of the present invention;

FIG. 2(b) is a top view of the base plate of the present invention;

FIG. 3 is a view showing the structure of a bonding pad according to the present invention;

FIG. 4 is a structural diagram of a DBC in the present invention;

in the figure, the base plate 1, the base plate 2, the soldering lug 3, the ceramic copper-clad plate 4, the positioning column 5, the positioning hole 6 and the corner cut are shown.

Detailed Description

The present invention is explained in further detail below with reference to the drawings and the specific embodiments, but it should be understood that the scope of the present invention is not limited to the specific embodiments.

As shown in fig. 1-4, the IGBT module of the invention includes a bottom plate 1, a bonding pad 2 and a ceramic copper clad laminate (DBC) 3, wherein the bonding pad 2 is disposed between the bottom plate 1 and the ceramic copper clad laminate (DBC) 3, a plurality of positioning posts 4 are disposed on one side of the bottom plate 1 facing the bonding pad 2, a plurality of positioning holes 5 are disposed on the ceramic copper clad laminate (DBC) 3, the positioning posts 4 correspond to the positioning holes 5, one end of the positioning posts 4 extends into the positioning holes 5, a difference between a height of the positioning posts 4 and a depth of the positioning holes 5 is smaller than a thickness of the bonding pad 2, a height of the positioning posts 4 is set to be h1, a thickness of the bonding pad 2 is set to be h2, a depth of the positioning holes 5 is h3, and h1-h3 is required to be smaller than h2, and the bonding pad 2 is used for connecting the bottom plate 1 and the ceramic copper clad laminate (DBC) 3 during welding.

Specifically, the bottom plate 1 is made of Cu or AlSiC, the bottom plate of the low-voltage IGBT module is made of Cu, and the bottom plate of the high-voltage IGBT module is made of AlSiC.

Specifically, bottom plate 1 is rectangular shaped plate, reference column 4 is arranged in the corner position of rectangular shaped plate. The soldering lug 2 is arranged in an inner frame formed by the positioning columns 4 in a surrounding mode. In some embodiments, a through hole may be further disposed on the soldering lug 2, and the positioning post 4 extends into the positioning hole 5 through the through hole.

Specifically, one side of the ceramic copper clad laminate (DBC) 3 facing the base plate 1 is a copper layer, and the positioning hole 5 is arranged in the copper layer.

Specifically, the diameter of the positioning column 4 is 0.5-1 mm.

Specifically, the diameter of the positioning hole 5 is 1-1.5mm, so that the IGBT module heat dissipation performance is ensured while the positioning hole and the positioning column are easy to assemble.

Specifically, soldering lug 2 is rectangle soldering lug 2, 45 chamfers 6 are made at four angles of soldering lug 2.

During welding, the implementation process comprises the following steps:

firstly, the bottom plate 1 is placed, the soldering lug 2 is placed on the bottom plate 1, positioning is achieved through matching of four cutting corners of the soldering lug 2 and a positioning column 4 of the bottom plate 1, the DBC3 is placed on the soldering lug 2, positioning is achieved through matching of a positioning hole 5 of a lower copper layer of a ceramic copper-clad plate (DBC) 3 and the positioning column 4 of the bottom plate 1, and in the whole assembling process, an assembling tool of the traditional technical scheme is omitted. Through the matching of the positioning column 4 of the bottom plate 1 and the positioning hole 5 of the ceramic copper-clad plate (DBC) 3, the thickness uniformity of the whole welding layer is effectively improved, the sliding problems of the soldering lug 2 and the ceramic copper-clad plate (DBC) 3 are solved, and the problems of continuous welding, surfacing welding, tool adhesion and the like are solved, so that the assembly efficiency is improved, and the welding quality is improved.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the claimed invention.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the content of the embodiment. It will be apparent to those skilled in the art that various changes and modifications can be made within the technical scope of the present invention, and any changes and modifications made are within the protective scope of the present invention.

Claims

1. The utility model provides a novel IGBT module assembly structure which characterized in that: including bottom plate (1), soldering lug (2) and ceramic copper-clad plate (3), soldering lug (2) are arranged in bottom plate (1) with between ceramic copper-clad plate (3) bottom plate (1) is provided with a plurality of reference columns (4) towards one side of soldering lug (2) be provided with a plurality of locating holes (5) on ceramic copper-clad plate (3), reference column (4) and locating hole (5) position are corresponding, reference column (4) one end extends to in locating hole (5), the reference column (4) highly with the difference of the degree of depth of locating hole (5) is less than the thickness of soldering lug (2), connect when soldering lug (2) are used for the welding bottom plate (1) with ceramic copper-clad plate (3).

2. The novel IGBT module assembly structure according to claim 1, characterized in that: the bottom plate (1) is Cu or AlSiC.

3. The novel IGBT module assembly structure according to claim 1, characterized in that: the bottom plate (1) is a rectangular plate, and the positioning columns (4) are arranged at the corner positions of the rectangular plate.

4. The novel IGBT module assembly structure according to claim 3, characterized in that: the soldering lug (2) is a rectangular plate, and the soldering lug (2) is arranged in an inner frame surrounded by the positioning columns (4).

5. The novel IGBT module assembly structure according to claim 1, characterized in that: the soldering lug (2) is provided with a through hole, and the positioning column (4) penetrates through the through hole and extends into the positioning hole (5).

6. The novel IGBT module assembly structure according to claim 1, characterized in that: the copper-clad plate (3) is characterized in that one side of the copper-clad plate facing the base plate (1) is a copper layer, and the positioning hole (5) is arranged in the copper layer.

7. The novel IGBT module assembly structure according to claim 1, characterized in that: the diameter of the positioning column (4) is 0.5-1 mm.

8. The novel IGBT module assembly structure according to claim 1, characterized in that: the diameter of the positioning hole (5) is 1-1.5 mm.

9. The novel IGBT module assembly structure according to claim 1, characterized in that: the soldering lug (2) is a rectangular soldering lug (2), and four corners of the soldering lug (2) are provided with 45-degree cutting angles (6).