CN215637055U - Ultrahigh-power ceramic substrate LED packaging structure - Google Patents
Ultrahigh-power ceramic substrate LED packaging structure Download PDFInfo
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- CN215637055U CN215637055U CN202121675155.7U CN202121675155U CN215637055U CN 215637055 U CN215637055 U CN 215637055U CN 202121675155 U CN202121675155 U CN 202121675155U CN 215637055 U CN215637055 U CN 215637055U
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- Prior art keywords
- ceramic substrate
- heat dissipation
- aluminum sheet
- fixed part
- packaging structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 239000000919 ceramic Substances 0.000 title claims abstract description 53
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 40
- 238000005096 rolling process Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000004093 laser heating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides an ultrahigh-power ceramic substrate LED packaging structure which comprises a shell, a ceramic substrate, a plurality of LED lamps, a heat dissipation assembly and a telescopic mechanism, wherein the heat dissipation assembly comprises a telescopic heat dissipation aluminum sheet and two heat dissipation fans, the shell comprises a fixed part connected with the ceramic substrate and a movable part movably connected with the fixed part, a plurality of heat dissipation holes are formed in the joint of the movable part and the fixed part, a clamping groove is formed in the joint of the fixed part and the movable part, and the telescopic mechanism is arranged between the fixed part and the movable part. Above-mentioned ultrahigh power ceramic substrate LED packaging structure, during the use, telescopic machanism pushes away the removal portion for flexible heat dissipation aluminum sheet expandes, has increased heat radiating area, and the heat that rethread radiator fan will stretch out and draw back the heat dissipation aluminum sheet transmission and come is followed the louvre and is effluvium, because of the louvre of both sides is accomodate in the joint inslot of fixed part when not using, can increase the hole and the quantity of louvre, has improved the radiating effect.
Description
Technical Field
The utility model relates to the technical field, in particular to an ultra-high power ceramic substrate LED packaging structure.
Background
The ceramic substrate is a sheet material based on electronic ceramics and forms a supporting base for the membrane circuit element and the external attaching and cutting element. According to different application fields of ceramic substrates, the ceramic substrates are divided into HIC (hybrid integrated circuit) ceramic substrates, focusing potentiometer ceramic substrates, laser heating fixing ceramic substrates, chip resistor substrates, network resistor substrates and the like; according to different processing modes, ceramic substrates are divided into two categories, namely mould pressing sheets and laser scribing sheets. The ceramic substrate material is widely applied to the fields of power electronics, LED packaging, multi-chip modules and the like due to excellent heat conductivity and air tightness.
Current ceramic substrate LED, in order to raise the power, corresponding can set up good heat dissipation mechanism to in time give off the heat that the LED during operation produced, so that ceramic substrate LED can keep the super high power operation, but, current heat dissipation mechanism, generally through set up heat dissipation mechanism and heat dissipation aluminum sheet in the casing and dispel the heat, outside the heat is difficult to give off the casing, the radiating effect is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an ultrahigh-power ceramic substrate LED packaging structure to solve the problem of poor heat dissipation effect of the existing ceramic substrate LED.
The utility model provides an ultrahigh-power ceramic substrate LED packaging structure which comprises a shell, a ceramic substrate arranged in the shell, a plurality of LED lamps arranged at the upper end of the ceramic substrate, a heat dissipation assembly and a telescopic mechanism, wherein the heat dissipation assembly comprises a telescopic heat dissipation aluminum sheet connected with the ceramic substrate and two heat dissipation fans arranged on two sides of the telescopic heat dissipation aluminum sheet, the shell comprises a fixed part connected with the ceramic substrate and a moving part movably connected with the fixed part, a plurality of heat dissipation holes are formed in the joint of the moving part and the fixed part, a clamping groove is formed in the joint of the fixed part and the moving part, and the telescopic mechanism is arranged between the fixed part and the moving part.
Above-mentioned ultrahigh power ceramic substrate LED packaging structure, during the use, telescopic machanism pushes away the removal portion for flexible heat dissipation aluminum sheet expandes, has increased heat radiating area, and the heat that rethread radiator fan will stretch out and draw back the heat dissipation aluminum sheet transmission and come is followed the louvre and is effluvium, because of the louvre of both sides is accomodate in the joint inslot of fixed part when not using, can increase the hole and the quantity of louvre, has improved the radiating effect.
Furthermore, flexible radiator aluminum sheet include fixed aluminum sheet and with the activity aluminum sheet of fixed aluminum sheet piston connection, fixed aluminum sheet with ceramic substrate connects, two radiator fan locates respectively the both sides of activity aluminum sheet.
Further, telescopic machanism include flexible motor and with the telescopic link that flexible motor is connected, flexible motor with the removal portion is connected.
Furthermore, an auxiliary cooling fan is arranged at one end, far away from the ceramic substrate, of the telescopic cooling aluminum sheet.
Furthermore, a lampshade is arranged on the outer side of the LED lamp.
Further, two sides of the moving part are provided with at least two balls.
Furthermore, a rolling groove is formed in the position, corresponding to the ball, in the clamping groove.
Drawings
Fig. 1 is a schematic cross-sectional view of an ultra-high power ceramic substrate LED package structure according to a first embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1 at circle A;
fig. 3 is a schematic cross-sectional view of an ultra-high power ceramic substrate LED package structure according to a second embodiment of the utility model.
Description of the main element symbols:
| |
10 | LED lamp | 30 | |
50 |
| |
11 | |
40 | |
51 |
| |
111 | Telescopic |
41 | |
52 |
| Moving |
12 | Fixed |
411 | |
60 |
| |
121 | |
412 | Auxiliary |
70 |
| |
20 | |
42 |
The following detailed description will further illustrate the utility model in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Several embodiments of the utility model are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and fig. 2, a first embodiment of the present invention provides an ultra-high power ceramic substrate LED package structure, which includes a housing 10, a ceramic substrate 20 disposed in the housing 10, and a plurality of LED lamps 30 arranged on the upper end of the ceramic substrate 20, a heat dissipation assembly 40 and a telescoping mechanism 50, the heat dissipation assembly 40 includes a telescopic heat dissipation aluminum sheet 41 connected to the ceramic substrate 20 and two heat dissipation fans 42 disposed at both sides of the telescopic heat dissipation aluminum sheet 41, the housing 10 includes a fixed portion 11 connected to the ceramic substrate 30 and a movable portion 12 movably connected to the fixed portion 11, the joint of the movable part 12 and the fixed part 11 is provided with a plurality of heat dissipation holes 121, the joint of the fixed part 11 and the movable part 12 is provided with a clamping groove 111, and the telescopic mechanism 50 is arranged between the fixed part 11 and the movable part 12.
Above-mentioned ultrahigh power ceramic substrate LED packaging structure, during the use, telescopic machanism 50 backs up removal portion 12, make flexible heat dissipation aluminum sheet 41 expand, heat radiating area has been increased, the heat that rethread radiator fan 42 will stretch out and draw back heat dissipation aluminum sheet 41 and transmit and come is followed louvre 121 and is dispelled, accomodate in the joint groove 111 of fixed part 11 when not using because of the louvre 121 of both sides, can increase the hole and the quantity of louvre 121, and in worry that the dust gets into casing 10 from louvre 121, and the radiating effect is improved.
Specifically, in this embodiment, the telescopic heat dissipation aluminum sheet 41 includes a fixed aluminum sheet 411 and a movable aluminum sheet 412 connected to the fixed aluminum sheet 411 in a piston manner, the fixed aluminum sheet 411 is connected to the ceramic substrate 51, and the two heat dissipation fans 42 are respectively disposed on two sides of the movable aluminum sheet 412 to achieve the telescopic function of the telescopic heat dissipation aluminum sheet 41.
Specifically, in this embodiment, the telescopic mechanism 50 includes a telescopic motor 51 and a telescopic rod 52 connected to the telescopic motor 51, and the telescopic motor 51 is connected to the moving part 12 to drive the housing 10 to unfold or fold.
Referring to fig. 3, a difference between the second embodiment and the first embodiment of the present invention is that in the second embodiment, an auxiliary heat dissipation fan 70 is disposed at an end of the telescopic heat dissipation aluminum sheet 41 away from the ceramic substrate 20 to quickly draw out heat in the telescopic heat dissipation aluminum sheet 41, so as to realize quick heat dissipation of the ceramic substrate 20.
Specifically, in this embodiment, a lampshade 60 is disposed on an outer side of the LED lamp 30 to play a role of dust prevention and water prevention.
Specifically, in the present embodiment, at least two balls (not shown) are disposed on two sides of the moving portion 12 to improve the moving smoothness of the moving portion 12.
Specifically, in the present embodiment, a rolling groove (not shown) is provided in the position corresponding to the ball inside the snap groove 111 to further improve the moving smoothness of the moving part 12.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The utility model provides an ultrahigh power ceramic substrate LED packaging structure, includes the casing, locates ceramic substrate in the casing, and locates a plurality of LED lamps of ceramic substrate upper end, its characterized in that still includes radiator unit and telescopic machanism, radiator unit include with ceramic substrate connects flexible heat dissipation aluminum sheet with locate two radiator fan of flexible heat dissipation aluminum sheet both sides, the casing include with ceramic substrate connects the fixed part and with fixed part swing joint's removal portion, the removal portion with the fixed part junction is equipped with a plurality of louvres, the fixed part with the junction of removal portion is equipped with the joint groove, telescopic machanism locate the fixed part with between the removal portion.
2. The ultra-high power ceramic substrate LED packaging structure of claim 1, wherein the flexible heat dissipation aluminum sheet comprises a fixed aluminum sheet and a movable aluminum sheet connected with the fixed aluminum sheet in a piston manner, the fixed aluminum sheet is connected with the ceramic substrate, and two heat dissipation fans are respectively disposed on two sides of the movable aluminum sheet.
3. The ultra-high power ceramic substrate LED packaging structure of claim 1, wherein the telescoping mechanism comprises a telescoping motor and a telescoping rod connected with the telescoping motor, the telescoping motor being connected with the moving part.
4. The ultra-high power ceramic substrate LED package structure of claim 1, wherein an auxiliary heat dissipation fan is disposed at an end of the flexible heat dissipation aluminum sheet away from the ceramic substrate.
5. The ultra-high power ceramic substrate LED packaging structure of claim 1, wherein a lampshade is arranged on the outer side of the LED lamp.
6. The ultra-high power ceramic substrate LED package structure of claim 1, wherein at least two balls are disposed on two sides of the moving portion.
7. The ultra-high power ceramic substrate LED packaging structure of claim 6, wherein a rolling groove is arranged in the clamping groove at a position corresponding to the rolling ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121675155.7U CN215637055U (en) | 2021-07-22 | 2021-07-22 | Ultrahigh-power ceramic substrate LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121675155.7U CN215637055U (en) | 2021-07-22 | 2021-07-22 | Ultrahigh-power ceramic substrate LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215637055U true CN215637055U (en) | 2022-01-25 |
Family
ID=79891570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121675155.7U Expired - Fee Related CN215637055U (en) | 2021-07-22 | 2021-07-22 | Ultrahigh-power ceramic substrate LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215637055U (en) |
-
2021
- 2021-07-22 CN CN202121675155.7U patent/CN215637055U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220125 |