CN215615658U - Welding column for improving tin-feeding rate of welding of DIP device - Google Patents
Welding column for improving tin-feeding rate of welding of DIP device Download PDFInfo
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- CN215615658U CN215615658U CN202122070759.5U CN202122070759U CN215615658U CN 215615658 U CN215615658 U CN 215615658U CN 202122070759 U CN202122070759 U CN 202122070759U CN 215615658 U CN215615658 U CN 215615658U
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- welding
- tin
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- dip device
- improving
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- 238000003466 welding Methods 0.000 title claims abstract description 100
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 18
- 230000000694 effects Effects 0.000 description 6
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a welding column for improving the tin-loading rate of a DIP device during welding, which comprises a connecting end and a welding end, wherein the connecting end is cylindrical, the welding end is arranged at the lower part of the connecting end, the cross section of the welding end is polygonal, and the welding end is inserted into a PIN hole. According to the utility model, the welding end is arranged at the lower part of the connecting end and adopts a polygon, and the direct contact area between the welding column and the copper foil is reduced by utilizing the gap between the polygon and the PIN hole, so that the heat loss is reduced, and the tin coating rate is improved.
Description
Technical Field
The utility model belongs to the technical field of DIP packaging, and particularly relates to a welding column for improving the tin-loading rate of a DIP device during welding.
Background
In the existing design, the types of DIP (dual inline-pin package) pins on a PCB are widely applied in the PCB design, but poor tin soldering is easy to occur when the PCBA is used for mounting; the prior technical scheme generally adopts the mode of reducing the number of welding layers of the DIP device and reducing heat dissipation to improve tinning, but because of the design requirements of capacitors, power connectors and the like of some DIPs, the problem of poor tinning cannot be solved by reducing the welding layers of the DIP device. Production can only be overcome by itself by the PCBA factory, but this causes a problem of reduced production efficiency.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide a welding column for improving the tin-applying rate of the welding of a DIP device.
In order to achieve the purpose, the utility model adopts the technical scheme that:
a welding column for improving the tin-loading rate of a DIP device in welding comprises a connecting end and a welding end, wherein the connecting end is cylindrical, the welding end is arranged at the lower part of the connecting end, the cross section of the welding end is polygonal, and the welding end is inserted into a PIN hole; the welding end adopts the polygon, utilizes the space between polygon and the PIN hole to reduce the direct contact area of welding post and copper foil to the thermal loss has been slowed down, has improved the tinning rate.
Preferably, the cross section of the welding end is a rhombus or a regular polygon, so that gaps between each side edge of the welding end and the PIN hole are kept equal, and the welding effect of the welding column is ensured.
As a further preferred aspect of the present technical solution, the lower portion of the welding end is a pointed structure, and during wave soldering, the structure with a pointed lower end and a thick middle portion can improve the tin-coating effect during welding.
As a further preferred of this technical scheme, welding end upper portion is equipped with the limiting plate, and the diameter of limiting plate is greater than the diameter in PIN hole, and the limiting plate is convenient for restrict the grafting degree of depth of welding end, has guaranteed welding end welded accuracy.
As a further optimization of the technical scheme, a shifting piece is arranged on the side face of the welding end, the upper end of the shifting piece is fixedly connected with the welding end, the lower end of the shifting piece is a free end, the shifting piece is a spring piece, the using amount of soldering tin is reduced by the shifting piece, the shifting piece enables the welding column to be inserted into PIN holes with different sizes, and the applicability of the welding column is enhanced.
As a further optimization of the technical scheme, the section of the shifting sheet is fan-shaped, the contact area of the welding column and the soldering tin is increased by the fan-shaped shifting sheet, the soldering end can grab the tin conveniently during wave soldering tin spraying, and the tin coating rate is improved.
As this technical scheme's further preferred, be equipped with a plurality of holding tanks on the welding end, the welding post inserts inside PIN downthehole back plectrum compression income holding tank inside, has avoided because of the welding end size is too big to cause can't insert the downthehole portion of PIN.
The utility model has the beneficial effects that:
1) according to the utility model, the welding end is arranged at the lower part of the connecting end and adopts a polygon, and the direct contact area between the welding column and the copper foil is reduced by utilizing the gap between the polygon and the PIN hole, so that the heat loss is reduced, and the tin coating rate is improved.
2) The cross section of the welding end is in a rhombic shape or a regular polygon shape, so that gaps between each side edge of the welding end and the PIN hole are kept equal, and the welding effect of the welding column is guaranteed.
3) The lower part of the welding end is of a pointed structure, and the structure with the pointed lower end and the thick middle part can improve the tin coating effect during welding during wave soldering.
4) Welding end upper portion is equipped with the limiting plate, and the diameter of limiting plate is greater than the diameter in PIN hole, and the limiting plate is convenient for restrict the grafting degree of depth of welding end, has guaranteed welding end welded accuracy.
5) The side face of the welding end is provided with the shifting piece, the upper end of the shifting piece is fixedly connected with the welding end, the lower end of the shifting piece is a free end, the shifting piece adopts the spring piece, the using amount of soldering tin is reduced by the shifting piece, the shifting piece enables the welding column to be inserted into PIN holes with different sizes, and the applicability of the welding column is enhanced.
6) The plectrum cross-section is fan-shaped, and fan-shaped plectrum has increased the area of contact of welding post with soldering tin, and the welding end snatchs tin when the wave-soldering tin spraying of being convenient for has improved the tinning rate.
7) Be equipped with a plurality of holding tanks on the welding end, the welding post inserts inside PIN downthehole portion back plectrum compression income holding tank inside, has avoided leading to the fact unable downthehole portion of inserting PIN because of the welding end size is too big.
Drawings
FIG. 1 is a schematic diagram of a solder post structure for improving the solder tin-on rate of a DIP device according to the present invention.
FIG. 2 is a schematic structural diagram of a soldering column with a removed pick for improving the tin-on rate in soldering of a DIP device.
FIG. 3 is a front view of a bond post for increasing the solder tin-on rate of a DIP device in accordance with the present invention.
Fig. 4 is a bottom view of a solder post of the present invention for increasing the solder tin-on rate of DIP devices.
In the figure: 1. a connecting end; 2. welding the end; 3. a limiting plate; 4. a shifting sheet; 5. accommodating grooves;
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1 to 4, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
A welding column for improving the tin-loading rate of a DIP device comprises a connecting end 1 and a welding end 2, wherein the connecting end 1 is cylindrical, the welding end 2 is arranged on the lower portion of the connecting end 1, the cross section of the welding end 2 is polygonal, and the welding end 2 is inserted into a PIN hole; the welding end 2 is polygonal, and the direct contact area of the welding column and the copper foil is reduced by utilizing the gap between the polygon and the PIN hole, so that the heat loss is reduced, and the tin coating rate is improved.
In this embodiment, the cross section of the welding end 2 is a rhombus or a regular polygon, so that gaps between each side edge of the welding end 2 and the PIN hole are kept equal, and the welding effect of the welding column is ensured.
In this embodiment, the lower portion of the soldering terminal 2 is a pointed structure, and during wave soldering, the lower end is pointed, and the middle is thick, so that the tin applying effect during soldering can be improved.
In this embodiment, 2 upper portions of welding end are equipped with limiting plate 3, and the diameter of limiting plate 3 is greater than the diameter in PIN hole, and limiting plate 3 is convenient for restrict the grafting degree of depth of welding end 2, has guaranteed the accuracy of welding end 2 welding.
In this embodiment, 2 sides of welding end are equipped with plectrum 4, and 4 upper ends of plectrum and 2 fixed connection of welding end, 4 lower extremes of plectrum are the free end, plectrum 4 adopts the spring leaf, and plectrum 4 has reduced the use amount of soldering tin, and plectrum 4 makes the welding post can insert in the PIN hole of equidimension not, has strengthened the suitability of welding post.
In this embodiment, 4 sections of plectrum are fan-shaped, and fan-shaped plectrum 4 has increased the area of contact of welding post with soldering tin, and welding end 2 snatchs tin when the wave-soldering tin spraying of being convenient for, has improved the rate of tinning.
In this embodiment, be equipped with a plurality of holding tanks 5 on the welding end 2, the welding post inserts that the downthehole portion of PIN is inside rear plectrum 4 compression income holding tank 5, has avoided leading to the fact unable downthehole portion of inserting PIN because of 2 oversize welding ends.
The foregoing is merely exemplary and illustrative of the present invention, and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the utility model as defined in the accompanying claims.
Claims (7)
1. The utility model provides an improve welding post of tin rate on DIP device welding, includes link and welding end, its characterized in that, the link is cylindrical, the welding end sets up the lower part at the link, and the welding end cross-section is the polygon, the welding end is pegged graft inside PIN hole.
2. The bonding post for improving the solder bonding yield of a DIP device according to claim 1, wherein the cross section of the bonding end is a diamond or a regular polygon.
3. The bonding post for improving the solder bonding yield of a DIP device as claimed in claim 1, wherein said lower portion of the bonding end is a pointed structure.
4. The welding post for improving the tin-on-solder rate of the DIP device as claimed in claim 1, wherein a limiting plate is arranged on the upper part of the welding end, and the diameter of the limiting plate is larger than that of the PIN hole.
5. The welding column for improving the tin-on-welding rate of the DIP device as claimed in claim 4, wherein a shifting piece is arranged on the side surface of the welding end, the upper end of the shifting piece is fixedly connected with the welding end, the lower end of the shifting piece is a free end, and the shifting piece is a spring piece.
6. The bonding post for improving the solder bonding yield of a DIP device according to claim 5, wherein the section of the pick is fan-shaped.
7. The bonding post for improving the tin-on-bonding rate of the DIP device as claimed in claim 4 or 5, wherein the bonding end is provided with a plurality of accommodating grooves, and the poking piece is compressed into the accommodating grooves after the bonding post is inserted into the PIN hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122070759.5U CN215615658U (en) | 2021-08-30 | 2021-08-30 | Welding column for improving tin-feeding rate of welding of DIP device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122070759.5U CN215615658U (en) | 2021-08-30 | 2021-08-30 | Welding column for improving tin-feeding rate of welding of DIP device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215615658U true CN215615658U (en) | 2022-01-25 |
Family
ID=79904864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122070759.5U Active CN215615658U (en) | 2021-08-30 | 2021-08-30 | Welding column for improving tin-feeding rate of welding of DIP device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215615658U (en) |
-
2021
- 2021-08-30 CN CN202122070759.5U patent/CN215615658U/en active Active
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