CN215600862U - Anti-condensation dehumidification ring main unit based on micro heat pipe array - Google Patents
Anti-condensation dehumidification ring main unit based on micro heat pipe array Download PDFInfo
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- CN215600862U CN215600862U CN202120388147.8U CN202120388147U CN215600862U CN 215600862 U CN215600862 U CN 215600862U CN 202120388147 U CN202120388147 U CN 202120388147U CN 215600862 U CN215600862 U CN 215600862U
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Abstract
The anti-dewing and dehumidifying ring main unit based on the micro heat pipe array comprises a dehumidifying module based on the micro heat pipe array, wherein the dehumidifying module comprises the micro heat pipe array, a semiconductor refrigerating piece and a power supply connected with the semiconductor refrigerating piece; the dehumidification module is provided with a heating device for preventing the cold end micro heat pipe array from freezing; the other side of the hot end micro heat pipe array is attached to the inner wall surface of the cabinet body, and the heat productivity of the semiconductor refrigeration sheet is dissipated outside the cabinet from the wall surface of the cabinet body. The utility model has high heat transfer, cold transfer and dehumidification performance, automatic diagnosis and control, simple and convenient structural form, easy modularized application, easy reconstruction of the existing ring main unit, space saving and great significance for the large-scale and integrated application and development of the ring main unit, and realizes fan-free full-natural convection heat dissipation.
Description
Technical Field
The utility model relates to the field of anti-condensation and dehumidification of a ring main unit, in particular to a ring main unit which directly radiates air outside the ring main unit based on a micro heat pipe array and a wall surface of the ring main unit.
Background
As a power transformation and distribution device, the ring main unit solves the problem of high-density power load of regional enterprises and urban buildings, provides continuous, stable and reliable power supply, and has the characteristics and advantages of simple structure, coordination with the environment, reliable and safe operation and the like, so that the compact and modular ring main unit occupies a larger and larger area in power grid construction.
However, the actual problem can be proved by monitoring the moisture content in the ring main unit in real time, and the three curves sequentially represent the moisture content in the local incoming line cabinet, the moisture content in the whole space in the ring main unit and the moisture content in the outdoor air from top to bottom as shown in fig. 7.
Along with the temperature difference change of the operation environment, when the dew point temperature of the air in the local small space incoming cabinet is lower than the wall surface temperature, water vapor can be condensed out from the air and is attached to the wall surface of equipment, so that the condensation phenomenon is caused, and the change of the temperature and the humidity is an important reason for the condensation. Especially, in autumn and winter, the temperature difference between morning and evening is larger, the ring main unit condensation phenomenon is more serious, the safe operation of equipment is seriously influenced, and power failure and accidents are caused to frequently occur.
The conventional practice for the above problems is: firstly, the direct ventilation of inside and outside air of looped netowrk cabinet, but not working when ambient humidity is big, and easily receive the influence of outdoor air quality such as factors such as acid-base nature, dust. And secondly, the electric heating equipment is added in a local box body accessed by the cable, the content of water vapor in the air is only increased through heating, and the problem of dehumidification is not fundamentally solved. Thirdly, a semiconductor refrigerating device is added locally, but the heat exchange area is limited, the refrigerating and dehumidifying capacity is insufficient, and the occupied space of the device is large. And dehumidification measures such as a moisture repellent and the like are adopted, the effect is limited, moisture is difficult to discharge after water absorption, and the maintenance workload is large. At present, the mode can not realize the heat dissipation and dehumidification in a real sense from the aspects of space, dehumidification effect and other multi-factors.
Traditional looped netowrk cabinet's semiconductor dehumidifier needs the equipment cabinet to punch installation ventilation heat transfer pipeline, not only causes the destruction to the cabinet body, moreover owing to need set up the fan ventilation, has the potential safety hazard that the fan broke down. In addition, the cold end of the traditional semiconductor dehumidifier is very easy to freeze in a low-temperature environment, and after freezing, the dehumidifying function of the semiconductor is basically lost, and the damage of the dehumidifier can be caused.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that the existing traditional dehumidification mode cannot fundamentally solve the dewing problem of the ring main unit, the technical scheme of the utility model is as follows:
the anti-dewing and dehumidifying ring main unit based on the micro heat pipe array is characterized by comprising a dehumidifying module based on the micro heat pipe array, wherein the dehumidifying module comprises the micro heat pipe array, a semiconductor refrigerating piece and a power supply connected with the semiconductor refrigerating piece; the dehumidification module is provided with a heating device for preventing the cold end micro heat pipe array from freezing; the other side of the hot end micro heat pipe array is attached to the inner wall surface of the cabinet body, and the heat productivity of the semiconductor refrigeration sheet is dissipated outside the cabinet body through the wall surface of the cabinet body, so that the semiconductor dehumidification system with no fan and full natural convection heat dissipation is formed.
Preferably, the hot end micro heat pipe array is located above, the cold end micro heat pipe array is located below, and the heating device is an electric heating film arranged at the bottom of the hot end micro heat pipe array. The specific power is comprehensively set according to the semiconductor power and the length proportion of the cold side/hot side micro heat pipe array, the technical method is that the semiconductor is kept normally open when the relative humidity is high (such as more than 60 percent), and the temperature of the cold side is always in a dehumidification state (such as the temperature is controlled to be 0-3 ℃) by controlling the starting and stopping of the electric heating film.
Preferably, a fin is attached to the wall surface of the cold end. When the temperature is lower in the looped netowrk cabinet under the low temperature weather, for preventing the cold side because the less temperature that leads to of condensation area is low excessively, the phenomenon of freezing that causes can be at the wall laminating fin of cold side micro heat pipe array, increase the heat transfer area and the area of condensation dehumidification of cold side wall, through rationally matching cold side and hot junction area proportion, semiconductor power, electric heating power realizes being applied to different regions, the effect of the anti-condensation dehumidification of the looped netowrk cabinet of different ambient temperature, the length proportion of cold side and hot junction is matchd in a flexible way more. Meanwhile, the semiconductor is kept normally open, so that the temperature of a cold side is always lower than the dew point temperature, and the initial state is kept; meanwhile, the influence of frequent starting and stopping of the semiconductor on the stable operation and the service life of the equipment is prevented.
Preferably, the fins are straight fins, serrated fins and/or louvered fins.
The module hot end utilizes the high heat conduction characteristic of the micro heat pipe array to realize the uniform heating of the hot end, and is attached to the inner wall surface, so that the natural heat dissipation area is large, and the problem of condensation on the inner side surface of the cabinet body caused by the rapid reduction of the outside air temperature of the cabinet body is prevented due to the increase of the temperature of the cabinet body.
The module cold junction utilizes the high heat conduction characteristic of little heat pipe array to realize the even quick cooling of cold junction, has increased the cooling dehumidification area, guarantees that the vapor in the air directly follows this device cold side condensation dehumidification in the cabinet, avoids condensing on each consumer surface.
The cold and hot both sides all utilize super heat conduction micro heat pipe array to dispel the heat and the condensation, replace traditional aluminium alloy, rely on natural convection heat transfer mass transfer, replace traditional fan form, raise the efficiency by a wide margin.
Preferably, the refrigerating surface of the semiconductor refrigerating sheet is attached to the upper part of the cold end by using heat-conducting silica gel, and the upper part of the cold end heat pipe is flush with the upper edge of the semiconductor or is twisted off and rubbed for a distance of 1-3cm or more; the heating surface of the semiconductor is attached to the lower part of one surface of the hot end micro heat pipe array by using heat conducting silica gel, the lower part of the hot end heat pipe is flush with the lower edge of the semiconductor or is twisted for a distance of 1-4cm or more, and the other surface of the micro heat pipe array is attached to the inner wall surface of the cabinet body by using heat conducting silica gel.
Preferably, the dehumidification module and the inner wall of the front panel of the local incoming line cabinet dehumidify the cable incoming line cabinet from a humidity source; and/or the side wall surface and the front surface of the ring main unit and/or the inner wall surface of the back plate are jointed. The problem of condensation on the wall surface of the cabinet body is solved.
The heat of the heating surface of the semiconductor is attached to the wall surface of the ring main unit or the incoming line cabinet through the hot end micro heat pipe array, so that the heat is dissipated outdoors or outside the cabinet, the heat dissipation with the outside is realized, and the problem that the normal operation of equipment is influenced due to the fact that the temperature is increased because the heat is directly dissipated into the cabinet by a conventional semiconductor dehumidifying device is solved. Meanwhile, the hot end micro heat pipe array of the semiconductor dehumidification module is attached to the wall surface of the ring main unit, so that the temperature of the wall surface of the ring main unit can be integrally increased, the temperature of the inner wall surface of the ring main unit is higher than the dew point temperature of air in the ring main unit, the wall surface is prevented from dewing, and all moisture in the air in the ring main unit is condensed on the cold side of the dehumidification module and is discharged outside the ring main unit through the condensed water tray.
Preferably, when the dehumidification module is applied to a local cable inlet cabinet, the fins are attached to the outer side of the front wall surface.
Preferably, the dehumidification module is attached to one side of the inner wall surface of a detachable front panel with a visual window, the semiconductor is connected with a direct-current power supply, and a temperature and humidity sensing controller is installed in the cabinet. Aiming at the cable inlet cabinet with a small local space, the dehumidifying module based on the micro heat pipe array is attached to one side of the inner wall surface of the detachable front panel with the visual window, so that the condition of internal equipment is not influenced, the direct replacement of the front panel of the cable inlet cabinet in the conventional ring main unit is easy, and the occupied space and the equipment work are not influenced. The semiconductor dehumidification component is powered by a direct-current power supply, a temperature and humidity sensing controller is installed in the cabinet, and linkage starting and stopping of all dehumidification modules are realized according to temperature and humidity control, and intelligent automatic diagnosis monitoring operation is realized.
The utility model has the following technical effects:
the micro heat pipe arrays are used as core efficient heat transfer elements, a group of micro heat pipe arrays are respectively attached to the refrigerating surface and the heating surface of the semiconductor refrigerating sheet to form the anti-condensation dehumidifying part, and the micro heat pipe arrays on the cold side of the part can realize cooling, condensation and dehumidification, reduce the content of water vapor in air and avoid condensation in equipment and the interior; the micro heat pipe array on the hot side directly dissipates heat to the outside air through being attached to the wall surface of the cabinet body, the problem that the normal operation of equipment is influenced by temperature rise caused by the fact that the heat is directly dissipated into the cabinet by a conventional semiconductor dehumidifier is solved, the problem that the cabinet body is damaged by punching, ventilating and heat exchanging of the conventional dehumidifier through the equipment cabinet is also solved, the temperature of the wall surface of the cabinet body can be increased, the problem of condensation of the inner side surface of the cabinet body caused by sudden reduction of the outside air temperature of the cabinet body is solved, the moisture of the air in the cabinet is condensed on the cold side of the dehumidification module, and the air is discharged out of the cabinet body through the condensed water tray. The utility model is not only suitable for small space in the ring main unit, such as a local incoming cabinet, but also suitable for being installed on each wall surface of the ring main unit, is easy to install, does not occupy the space of internal equipment, and does not influence the maintenance of the opened door. Meanwhile, dehumidification automatic control is realized by monitoring the temperature and humidity of the air in the cabinet, and the whole system is formed by combining a direct-current power supply. The utility model has high heat transfer, cold transfer and dehumidification performance, automatic diagnosis and control, simple and convenient structural form, easy modularized application, easy reconstruction of the existing ring main unit, space saving and great significance for the large-scale and integrated application and development of the ring main unit, and realizes fan-free full-natural convection heat dissipation.
The length proportion of the micro heat pipe arrays at the cold end and the hot end of the dehumidification module needs to comprehensively consider the structures and the sizes of the wall surfaces of the ring main units and the cable incoming line cabinet with different specifications, and the semiconductor power is optimally selected according to the corresponding temperature and the relative humidity in the cabinet under the worst weather condition, and the length proportion and the semiconductor power need to be matched with each other to meet the dehumidification capacity in the cabinet.
Drawings
FIG. 1 is a diagram of a ring main unit equipped with a dehumidification module based on a micro heat pipe array;
FIG. 2 is a diagram of a local incoming cable cabinet equipped with a dehumidification module based on a micro heat pipe array;
FIG. 3 is a partial incoming cable cabinet view of a dehumidification module based on a micro heat pipe array equipped with fins;
FIG. 4 is a diagram of a dehumidification module with finned micro heat pipe arrays on the cold side;
FIG. 5 is a diagram of a dehumidification module based on a micro heat pipe array with an electric heating film mounted at the bottom of a hot end;
FIG. 6 is an enlarged view of a portion of FIG. 5;
fig. 7 is a graph of background art real-time monitoring moisture content.
The reference numbers list: 1-ring main unit; 2-cable incoming cabinet; 3-a dehumidification module; 4-a visualization window; 5-front panel; 6-hot end micro heat pipe array; a 7-semiconductor wafer; 8-cold end micro heat pipe array; 9-a condensate pipe; 10-a condensate tray; 11-cable entrance hole; 12-hot end fins; 13-cold end fins; 14-electrically heating the membrane.
Detailed Description
The utility model is described in detail below with reference to the accompanying figures 1-5 and specific examples.
Example 1
As shown in fig. 1-2, a high-voltage cable for urban power transmission is transmitted from the bottom of the ring main unit 1 to upper power transformation equipment through the cable inlet 11 from the cable inlet cabinet 2, and a visual window 4 is arranged on the front side of the cable inlet cabinet 2 for observing the conditions in the cable inlet cabinet. This embodiment is not influencing the maintenance of opening the door, does not occupy the basis in equipment space, realizes the anti-condensation dehumidification in the cabinet body and local high wet zone in limited little space.
The dehumidification module 3 is applied to the local cable incoming cabinet 2, as shown in fig. 2, the heating surface of the semiconductor wafer 7 is adhered to the bottom of one surface of the hot end micro heat pipe array 6 by using heat-conducting silica gel, and the distance between the semiconductor wafer 7 and the bottom can be adjusted according to the performance of the micro heat pipe array. The other side of the hot end micro heat pipe array 6 is attached to the inner wall surface of the front panel 5 of the cable incoming cabinet 2 through heat conducting silica gel, heat generated by the hot side is dissipated through the front wall surface, the heat dissipation area is increased, the cold end micro heat pipe array 8 is attached to the refrigerating surface of a semiconductor through the heat conducting silica gel, and the high heat conduction and cold conduction capacity of the micro heat pipe array is utilized to realize uniform cooling of the cold side wall surface, dehumidify humid air in a local small space, reduce the content of vapor in the air and avoid condensation in upper equipment. Then the condensed water drops on the cold side wall surface flow down along the wall surface and fall into a condensed water tray 10, and when certain condensed water amount is accumulated, the condensed water drops are discharged out of the cabinet body along a condensed water pipe 9.
Example 2
As shown in fig. 3, in the other structure, like in embodiment 1, when the temperature of the hot-side wall surface is too high, the hot-side fins 12 may be attached to the outer side of the front plate 5, and different types of fins may be selected according to the temperature condition, so as to increase the heat dissipation area; when the cold end temperature is too low or the dehumidification area needs to be increased, different types of cold end fins 13 can be attached to the cold side wall surface. And optimizing and matching according to different working environments inside the cabinet body.
Example 3
Similar to the foregoing embodiment, the dehumidification module 3 is applied to the front, rear, left and right wall surfaces of the ring main unit 1 by adopting the same heat and cold transfer principle, as shown in the right side of fig. 1, the hot end can raise the temperature of the attached wall surface, thereby preventing the problem of condensation on the inner side surface of the cabinet body caused by the rapid decrease of the outside air temperature of the cabinet body; the cold end dehumidifies air in the whole space of the ring main unit 1, condensed water of each component is discharged outside the ring main unit along a water pipe through a water condensation tray, cold end fins 13 can be additionally arranged according to the temperature and the dehumidification capacity of the cold end heat pipe, as shown in fig. 4, meanwhile, an electric heating film 14 with certain power can be additionally arranged at the bottom of the hot end micro heat pipe array, as shown in fig. 5 and 6, specific power is comprehensively set according to the semiconductor power and the length proportion of the cold side/the cold side micro heat pipe array, the technical method is characterized in that the semiconductor is kept normally open when the relative humidity is high (such as more than 60%), and the temperature of the cold side is always in a dehumidification state (such as the temperature is controlled to be 0-3 ℃) by controlling the starting and stopping of the electric heating film.
The dehumidification system is actually measured in a high-precision enthalpy difference laboratory at different length proportions, and the dehumidification contents of different semiconductor powers at different temperatures and humidity are used as data support, so that the optimization model selection is carried out in different regions. The test under the high temperature and high humidity condition for a certain area is as follows:
| numbering | Specification of semiconductor component | Amount of dehumidification after 5h | Amount of dehumidification for 1h |
| 101 | 20W, cold side 200mm, hot side 1000mm | 14.4g | 2.88g |
| 102 | 15W, cold side 200mm, hot side 700mm | 11.5g | 2.3g |
| 103 | 20W, cold side 200mm, hot side 350mm | 4.1g | 0.82g |
| 104 | 20W, cold side 200mm, hot side 700mm | 18.2g | 3.64g |
According to the anti-condensation dehumidification system of the ring main unit based on the micro heat pipe array, the direct-current voltages of all dehumidification devices are kept consistent and are connected into a direct-current power supply in a parallel connection mode, the temperature and the humidity which are the most unfavorable to air in the ring main unit are monitored, the dehumidification system is automatically controlled, all modules are started and stopped simultaneously, and the control is simple and easy to achieve. And the system is combined with a direct current power supply to form the whole system. The utility model has high heat transfer, cold transfer and dehumidification performance, automatic diagnosis and control, simple and convenient structural form, easy modularized application, easy reconstruction of the existing ring main unit, space saving and great significance for the large-scale and integrated application and development of the ring main unit, and realizes fan-free full-natural convection heat dissipation.
Claims (8)
1. The anti-dewing and dehumidifying ring main unit based on the micro heat pipe array is characterized by comprising a dehumidifying module based on the micro heat pipe array, wherein the dehumidifying module comprises the micro heat pipe array, a semiconductor refrigerating piece and a power supply connected with the semiconductor refrigerating piece; the dehumidification module is provided with a heating device for preventing the cold end micro heat pipe array from freezing; the other side of the hot end micro heat pipe array is attached to the inner wall surface of the cabinet body, and the heat productivity of the semiconductor refrigeration sheet is dissipated outside the cabinet from the wall surface of the cabinet body.
2. The ring main unit as claimed in claim 1, wherein fins are attached to the wall surface of the cold end micro heat pipe array and/or the hot end micro heat pipe array.
3. The ring main unit as claimed in claim 2, wherein the fins are straight fins, saw-toothed fins or louvered fins.
4. The ring main unit as claimed in claim 1, wherein the hot end micro heat pipe array is located above, the cold end micro heat pipe array is located below, and the heating device is an electrical heating film disposed at the bottom of the hot end micro heat pipe array.
5. The ring main unit as claimed in claim 4, wherein the refrigerating surface of the semiconductor refrigerating sheet is attached to the upper portion of the cold end micro heat pipe array by using heat conductive silica gel, and the upper portion of the cold end micro heat pipe array is flush with or twisted away from the upper edge of the semiconductor refrigerating sheet by a distance of at least 1 cm; and attaching the heating surface of the semiconductor refrigerating sheet to the lower part of one surface of the hot end micro heat pipe array by using heat-conducting silica gel, wherein the lower part of the hot end micro heat pipe array is parallel to or at least 1cm away from the lower edge of the semiconductor refrigerating sheet, and the other surface of the hot end micro heat pipe array is attached to the inner wall surface of the cabinet body by using heat-conducting silica gel.
6. The ring main unit as claimed in claim 1, wherein the dehumidification module is attached to an inner wall of a front panel, a side wall, a front side and/or an inner wall of a back panel of the local incoming line cabinet.
7. The ring main unit as claimed in claim 1, wherein the dehumidification module is applied to a local cable cabinet, and fins are attached to an outer side of a front wall surface.
8. The ring main unit as claimed in claim 1, wherein the dehumidifying module is attached to one side of an inner wall surface of a detachable front panel with a visual window, the semiconductor refrigerating sheet is connected to a direct current power supply, and a temperature and humidity sensing controller is installed in the ring main unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120388147.8U CN215600862U (en) | 2021-02-22 | 2021-02-22 | Anti-condensation dehumidification ring main unit based on micro heat pipe array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120388147.8U CN215600862U (en) | 2021-02-22 | 2021-02-22 | Anti-condensation dehumidification ring main unit based on micro heat pipe array |
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| CN215600862U true CN215600862U (en) | 2022-01-21 |
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| CN202120388147.8U Active CN215600862U (en) | 2021-02-22 | 2021-02-22 | Anti-condensation dehumidification ring main unit based on micro heat pipe array |
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2021
- 2021-02-22 CN CN202120388147.8U patent/CN215600862U/en active Active
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