CN215598269U - Lead frame line arc detects anchor clamps - Google Patents

Abstract

The utility model discloses a lead frame wire arc detection clamp which comprises a lead frame, a clamp bottom plate, a cover plate and a pressing assembly, wherein the lead frame comprises a substrate which is concave backwards, a wafer is arranged above the substrate, one ends of pins on the left side and the right side are connected with the wafer through wire bonding wire arcs, a clamping groove which is formed in the horizontal direction is formed in the surface of the clamp bottom plate, the substrate is clamped into the clamping groove, the lower surfaces of the pins are attached to the upper surface of the clamp bottom plate, the cover plate is arranged above the clamp bottom plate, two sides of the lower end of the cover plate are in inclined surface transition, a plurality of grooves are formed in the lower end of the cover plate, a convex block is formed between every two adjacent grooves, the pressing assembly is arranged at the upper end of the clamp bottom plate and is located on two sides of the cover plate, the pressing assembly comprises a pressing wheel, and the lower end of the pressing wheel is attached to the upper ends of the pins. The utility model can detect the height of the routing wire arc, correct the position of the routing wire arc exceeding limit, reduce the labor intensity of workers and improve the production efficiency.

Description

Lead frame line arc detects anchor clamps

Technical Field

The utility model relates to the technical field of lead frame clamps, in particular to a lead frame arc detection clamp.

Background

The sealing and testing process of the lead frame comprises die bonding, sintering (routing), plastic packaging, forming and testing, wherein the height of a routing wire arc of the lead frame is measured by a tool microscope after sintering (routing) to determine whether the routing wire arc is out of tolerance (namely whether the distance between the highest point of the routing wire arc and the surface of the plastic packaging body is less than 0.1mm, because the height of the plastic packaging body is 2.35mm, in other words, whether the distance A between the highest point of the routing wire arc and the bottom of the frame is more than 2.25mm or not), as shown in figure 1, the lead frame 1 comprises a plastic packaging body 11, a wafer 12, a routing wire arc 13, a substrate 14 and pins 15, under normal conditions, the plastic packaging body 11 surrounds the wafer 12 and the routing wire arc 13 inside, once the routing wire arc 13 is out of limit (namely, the distance between the bottom of the lead frame 1 and the highest point of the routing wire arc 13 is more than 2.25mm), the surface of the plastic packaging body 11 is exposed, an operator needs to pick up the routing arc 13 manually and then return, causing great resource waste and seriously affecting the productivity. Therefore, it is important to detect the height of the wire bonding arc 13 before plastic packaging. The method is generally used in the industry at present, the lead frame 1 to be detected is horizontally placed on a tool microscope carrier, and then the position of the lead frame 1 is corrected, reset and dimension measurement is carried out.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provide a lead frame wire loop detection clamp which can detect the height of a wire bonding wire loop and correct the position of the wire bonding wire loop exceeding the limit.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a lead frame line arc detection clamp comprises a lead frame, a clamp bottom plate, a cover plate and a pressing component, wherein the lead frame comprises a substrate which is concave backwards, a wafer is arranged above the substrate, the lead frame comprises 3 pins, the pins positioned in the middle are connected with the substrate, one ends of the pins on the left side and the right side are connected with the wafer through a routing line arc, a clamping groove which is formed along the horizontal direction is arranged on the surface of the clamp bottom plate, the substrate is clamped into the clamping groove, the lower surfaces of the pins are attached to the upper surface of the clamp bottom plate, the cover plate is arranged above the clamp bottom plate, two sides of the lower end of the cover plate are in transition through an inclined plane, a plurality of grooves are arranged at the lower end of the cover plate, a convex block is formed between every two adjacent grooves, the distance between the lower surface of the convex block and the bottom of the clamping groove is 2-2.25mm, the pressing component is arranged at the upper end of the clamp bottom plate, the pressing components are located on two sides of the cover plate and comprise pressing wheels, and the lower ends of the pressing wheels are attached to the upper ends of the pins.

Support and press the subassembly to include spring, screw, pin and pinch roller support, the pinch roller support passes through screw fixed mounting in the top of anchor clamps bottom plate, spring mounting is in the outside of screw, the spring both ends are the up end of butt screw head lower extreme face and pinch roller support respectively, the pin inserts the pinch roller support and fixes the pinch roller support, the pinch roller is installed in the place ahead of pinch roller support.

The groove is arranged in front of the cover plate, a gasket is arranged between the cover plate and the clamp bottom plate, and the gasket is located behind the cover plate.

The utility model has the beneficial effects that: the height of the routing arc can be detected, the out-of-tolerance part of the routing arc is corrected, and the cold joint of the routing arc can be detected. When the wire bonding machine is used, the lead frame to be tested is only required to be placed into the clamping groove, the lead frame is pushed, and if the wire bonding wire arc is not bent and deformed after the lead frame is pushed out by the cover plate, the height of the wire bonding wire arc meets the requirement, so that the working efficiency of operators is improved; if the routing wire arcs are bent and deformed after the lead frame is pushed out by the cover plate, the height of the routing wire arcs is out of tolerance and corrected, the next packaging step can be continued, the reject ratio of products is reduced, company resources are saved, and the production cost is reduced; if the welding spots of the routing arcs are separated after the lead frame is pushed out by the cover plate, the routing arcs are indicated to be cold welding, so that the operation that the operators need to completely pick up the routing arcs and then do rework when processing defective products is omitted, and the labor intensity of the operators is reduced.

Drawings

FIG. 1 is a schematic diagram of lead frame wire loop height out-of-tolerance;

FIG. 2 is a schematic diagram of a lead frame after plastic package is completed;

FIG. 3 is a side view of FIG. 2;

FIG. 4 is a schematic structural view of the present invention;

FIG. 5 is a bottom view of FIG. 4;

FIG. 6 is an enlarged view of a portion of FIG. 5;

FIG. 7 is a side view of FIG. 4;

FIG. 8 is an enlarged view of a portion of FIG. 7;

FIG. 9 is a schematic view of a lead frame wire loop bend;

fig. 10 is a schematic view of the lead frame wire loop solder joint detachment.

In the figure: the lead frame 1, the plastic package body 11, the wafer 12, the routing wire arc 13, the substrate 14, the pin 15, the clamp bottom plate 2, the slot 21, the cover plate 3, the groove 31, the bump 32, the inclined plane 33, the gasket 4, the pressing component 5, the spring 51, the pressing wheel 52, the screw 53, the pin 54 and the pressing wheel support 55.

Detailed Description

The utility model is further described with reference to the accompanying drawings and the detailed description below:

the following description relating to orientations (up, down, left, right, front, rear, etc.) is made with reference to fig. 5.

As shown in fig. 2 to 10, a lead frame arc detection clamp includes a lead frame 1, a clamp bottom plate 2, a cover plate 3 and a pressing component 5, the lead frame 1 includes a substrate 14 recessed backward, a wafer 12 is installed above the substrate 14, the lead frame 1 includes 3 pins 15, the pins 15 located in the middle are connected with the substrate 14, one ends of the pins 15 on the left and right sides are connected with the wafer 12 through wire bonding arcs 13, a clamping groove 21 formed along the horizontal direction is formed in the surface of the clamp bottom plate 2, the substrate 14 is clamped into the clamping groove 21, and then the detection can be performed by pushing along the horizontal direction. The lower surface laminating anchor clamps bottom plate 2 of pin 15, apron 3 is installed in the top of anchor clamps bottom plate 2, and the lower extreme both sides of apron 3 pass through with inclined plane 33, and in the in-process that promotes lead frame 1 and get into the lower extreme of apron 3, inclined plane 33 plays the guide effect to routing arc 13. The lower end of the cover plate 3 is provided with a plurality of grooves 31, a bump 32 is formed between every two adjacent grooves 31, the shapes of the grooves 31 and the bumps 32 are trapezoidal and opposite in direction, the grooves 31 are big-end-up, and the bumps 32 are big-end-up, so that the moving direction of the routing arcs 13 can be guided more smoothly.

When the highest point of the routing wire arc 13 is flush with the surface of the pin 15, the value A is the minimum, and at the moment, A is 2 mm; when the distance between the highest point of the bonding wire loop 13 and the surface of the plastic package body 11 is 0.1mm, the value a is the largest, and at this time, a is 2.25mm, so the value a ranges from 2 to 2.25mm, that is, the distance between the lower surface of the bump 32 and the bottom of the slot 21 is 2 to 2.25 mm.

When A is more than or equal to 2 and less than or equal to 2.25mm, the lead frame 1 is pushed, and the routing wire arc 13 can smoothly pass through the lower end of the cover plate 3; and when A is larger than 2.25mm, the highest point of the routing arc 13 exceeds the lowest point of the cover plate 3, the lead frame 1 is pushed, the routing arc 13 is bent towards the opposite direction of pushing, the routing arc 13 is further bent every time the routing arc passes through one lug 32, as shown in fig. 9, after all the lugs 32 pass through, the bending degree of the routing arc 13 is obviously enlarged, and the height of the routing arc 13 is also corrected, so that the unqualified lead frame 1 reaches the qualified standard, secondly, the welding firmness of the routing arc 13 is detected, as shown in fig. 10, in the process of pushing the lead frame 1, the pulling force of the welding point between the routing arc 13 and the pin 15 and the wafer 12 is gradually increased due to the step bending of the routing arc 13, and if the welding point is a virtual welding point, the welding point of the routing arc 13 is not pulled, so that the welding point is separated.

The upper end of the clamp bottom plate 2 is provided with a pressing component 5, the pressing component 5 is a spring pressing wheel, the pressing component 5 is positioned on two sides of the cover plate 3, the pressing component 5 comprises a pressing wheel 52, and the lower end of the pressing wheel 52 is attached to the upper end of the pin 15.

The pressing component 5 comprises a spring 51, a screw 53, a pin 54 and a pinch roller support 55, the pinch roller support 55 is fixedly mounted above the clamp bottom plate 2 through the screw 53, the spring 51 is mounted on the outer side of the screw 53, two ends of the spring 51 are respectively abutted to the lower end face of the head of the screw 53 and the upper end face of the pinch roller support 55, the pin 54 is inserted into the pinch roller support 55 and fixes the pinch roller support 55, and the pinch roller 52 is mounted in front of the pinch roller support 55.

When the detection is carried out, the lead frame 1 is pushed to move horizontally, when the lead frame 15 is pushed to be located below the pressing wheel 52, the pressing wheel 52 is jacked up by the lead 15, the spring 51 is compressed, the spring 51 applies downward force to the pressing wheel 52, the lower end of the pressing wheel 52 always abuts against the upper end of the lead 15, the two sides abut against the combined action of the pressing components 5, the lead frame 1 is ensured to be tightly attached to the bottom of the clamping groove 21 of the clamp bottom plate 2 when being pushed out to slide, the cover plate 3 is enabled to stably pass through the bottom of the clamping groove 21, and poor size stability caused by warping deformation of the lead frame 1 is prevented.

The groove 31 is arranged in front of the cover plate 3, the position of the groove 31 is over against the routing arc 13 of the lead frame 1, a gasket 4 is arranged between the cover plate 3 and the clamp bottom plate 2, and the gasket 4 is positioned behind the cover plate 3. The spacer 4 has various thicknesses to adjust the distance between the lower end of the protrusion 32 and the slot 21, so that the applicability of the present invention is enhanced.

When the wire bonding device is used, the lead frame 1 to be tested is only required to be placed into the clamping groove 21, the lead frame 1 is pushed, and if the wire bonding arcs 13 are not bent and deformed after the lead frame 1 is pushed out by the cover plate 3, the height of the wire bonding arcs 13 meets the requirement, so that the working efficiency of operators is improved; if the routing wire arcs 13 are bent and deformed after the lead frame 1 is pushed out by the cover plate 3, the height of the routing wire arcs 13 is out of tolerance and corrected, the next packaging step can be continued, the reject ratio of products is reduced, the company resources are saved, and the production cost is reduced; if the welding points of the routing arcs 13 are separated after the lead frame 1 is pushed out by the cover plate 3, the routing arcs 13 are indicated to be virtual welding, so that the operation personnel needs to completely pick up the routing arcs 13 and then do rework when processing defective products is omitted, and the labor intensity of the personnel is reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (3)

1. The utility model provides a lead frame line arc detects anchor clamps which characterized in that: including lead frame (1), anchor clamps bottom plate (2), apron (3) and support and press subassembly (5), lead frame (1) is including concave substrate (14) backward, wafer (12) are installed to the top of substrate (14), lead frame (1) includes 3 pin (15), and pin (15) that are located the centre link to each other with substrate (14), the left and right sides be connected through routing arc (13) between the one end of pin (15) and wafer (12), the surface of anchor clamps bottom plate (2) is equipped with a draw-in groove (21) of seting up along the horizontal direction, draw-in groove (21) are gone into to substrate (14) card, the upper surface of the lower surface laminating anchor clamps bottom plate (2) of pin (15), the top in anchor clamps bottom plate (2) is installed in apron (3), the lower extreme both sides of apron (3) pass through with inclined plane (33), the lower extreme of apron (3) is equipped with a plurality of recess (31), adjacent two form a lug (32) between recess (31), the distance between lower surface and draw-in groove (21) bottom of lug (32) is 2-2.25mm, the upper end of anchor clamps bottom plate (2) is installed and is pressed subassembly (5), it is located the both sides of apron (3) to press subassembly (5), it includes pinch roller (52) to press subassembly (5), the upper end of the lower extreme laminating pin (15) of pinch roller (52).

2. The lead frame wire loop inspection fixture of claim 1, wherein: the pressing component (5) comprises a spring (51), a screw (53), a pin (54) and a pinch roller support (55), the pinch roller support (55) is fixedly arranged above the clamp bottom plate (2) through the screw (53), the spring (51) is arranged on the outer side of the screw (53), two ends of the spring (51) are respectively abutted to the lower end face of the head of the screw (53) and the upper end face of the pinch roller support (55), the pin (54) is inserted into the pinch roller support (55) and fixes the pinch roller support (55), and the pinch roller (52) is arranged in front of the pinch roller support (55).

3. The lead frame wire loop inspection fixture of claim 1, wherein: the groove (31) is formed in the front of the cover plate (3), a gasket (4) is arranged between the cover plate (3) and the clamp bottom plate (2) in a cushioning mode, and the gasket (4) is located behind the cover plate (3).

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