CN215579536U

CN215579536U - Chip mounting device for semiconductor laser

Info

Publication number: CN215579536U
Application number: CN202122066279.1U
Authority: CN
Inventors: 焦英豪; 秦冬爽; 吴文涛
Original assignee: Lewei Semiconductor Technology Jiaxing Co ltd
Current assignee: Lewei Semiconductor Technology Jiaxing Co ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-01-18
Anticipated expiration: 2031-08-30

Abstract

The utility model relates to the field of chip mounting equipment, and discloses a semiconductor laser chip mounting device which comprises a workbench, wherein an upright post is fixedly arranged on one side of the top of the workbench. The stand is inside to be seted up flutedly, and movable mounting has the elevating platform in the recess, and elevating platform one end bottom fixed mounting has the point and glues SMD head, and elevating platform one side is provided with the regulating wheel, and point is glued SMD first bottom and is provided with point and glues the paster cylinder. According to the chip picking and placing device, the rotating seat is fixedly arranged on the rotating disk, the mechanical arm is movably connected to the top of the rotating seat, the clamping head is fixedly arranged at one end of the mechanical arm, when the chip picking and placing device is used for picking and placing chips in the chip collecting plate onto the rotating disk, and meanwhile, the chips which are subjected to chip picking and placing in the rotating disk can be clamped and placed on the chip collecting plate, so that the chips can be prevented from being directly contacted by manpower, and the chips are prevented from being influenced by manual contact.

Description

Chip mounting device for semiconductor laser

Technical Field

The utility model relates to the field of chip mounting equipment, in particular to a semiconductor laser chip mounting device.

Background

Because the semiconductor Laser (LD) has the advantages of small volume, light weight, high electro-optic conversion efficiency, long service life, high reliability and the like, the LD has gradually replaced the use of gas and solid lasers in the fields of communication, medical treatment, display, industrial manufacture, security and the like, the application range of the LD is gradually expanded, and chip mounting is a surface mounting technology or a surface mounting technology, which is the most popular technology and process in the electronic assembly industry. Electronic circuit surface assembly techniques, known as surface mount or surface mount techniques. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.

The prior Chinese patent discloses a semiconductor laser chip mounting device, wherein the publication number of the authorization is CN212366414U, the publication date is 2020.06.22, the patent technology comprises a workbench, and a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the propulsion cylinder is arranged between the first linear guide rail, the heating platform is arranged on the first linear guide rail in a sliding mode, the propulsion cylinder is connected with and pushes and pulls the heating platform, and a heating groove and other structures are arranged on the heating platform, so that the problem of chip mounting accuracy is solved. But there is a problem in that the handling process requires manual contact with the chip for taking. In view of this situation, those skilled in the art have provided a semiconductor laser chip mounting device.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a chip mounting device of a semiconductor laser, which aims to solve the problem that the operation process proposed in the background art needs manual contact with a chip for taking.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a semiconductor laser chip paster device, includes the workstation, workstation bottom four corners fixedly connected with supporting leg is provided with the link between the supporting leg, and supporting leg bottom fixed mounting has the gasket, and workstation top one side fixed mounting has the stand. The stand is inside to be seted up flutedly, and movable mounting has the elevating platform in the recess, and elevating platform one end bottom fixed mounting has the point and glues SMD head, and elevating platform one side is provided with the regulating wheel, and point is glued SMD first bottom and is provided with point and glues the paster cylinder.

As a still further scheme of the utility model: the rotary disc is arranged on the surface of the top of the workbench, the rotary disc is provided with a plurality of supporting grooves, and the rotary disc can conveniently convey chips to be pasted to the bottom of the dispensing and pasting head.

As a still further scheme of the utility model: the bottom of the rotating disc is connected with a driving motor which is fixedly arranged at the bottom of the workbench, and the driving motor can provide power for the rotation of the rotating disc.

As a still further scheme of the utility model: the rotary plate is fixedly provided with a rotary seat, the top of the rotary seat is movably connected with a mechanical arm, and the mechanical arm arranged at the top can rotate through the rotary seat.

As a still further scheme of the utility model: the mechanical arm is composed of two sections of mutually connected supporting arms, a clamping head is fixedly mounted at one end of the mechanical arm, and the clamping head can be used for clamping a chip conveniently.

As a still further scheme of the utility model: chip collecting plate has been placed to workstation one side, has seted up a plurality of collecting grooves on the chip collecting plate, and chip collecting plate both ends are provided with the handle, through setting up chip collecting plate can place the chip of treating the paster and the chip of having accomplished the paster.

As a still further scheme of the utility model: the rotary disk is made of high-strength rubber materials, the buffer layer is arranged in the bearing groove, a gap is left between the rotary disk and the workbench and is not in contact with the rotary disk, the rotary disk is made of the high-strength rubber materials, the buffer layer is arranged in the bearing groove, the chip can be protected to a certain degree, and the chip is prevented from being damaged due to collision.

The utility model has the beneficial effects that:

1. according to the utility model, the rotary disc is arranged on the workbench, the rotary disc is provided with the plurality of supporting grooves, the bottom of the rotary disc is connected with the driving motor, the rotary disc is driven by the driving motor to rotate, chips to be processed in the supporting grooves can be sequentially conveyed to the positions below the dispensing and chip mounting heads, and then conveyed to the positions below the clamping heads after the chip mounting treatment is completed, and through the design, the chip mounting treatment efficiency can be improved;

2. according to the chip picking and placing device, the rotating seat is fixedly arranged on the rotating disk, the mechanical arm is movably connected to the top of the rotating seat, the clamping head is fixedly arranged at one end of the mechanical arm, when the chip picking and placing device is used for picking and placing chips in the chip collecting plate onto the rotating disk, and meanwhile, the chips which are subjected to chip picking and placing in the rotating disk can be clamped and placed on the chip collecting plate, so that the chips can be prevented from being directly contacted by manpower, and the chips are prevented from being influenced by manual contact.

Drawings

The utility model will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a semiconductor laser chip mounting device;

FIG. 2 is a schematic view of the swivel mount, robot arm, and gripper head of FIG. 1;

fig. 3 is an enlarged schematic view of a portion a of fig. 1.

In the figure: 1. a work table; 2. supporting legs; 3. a connecting frame; 4. a column; 5. a groove; 6. a lifting platform; 7. dispensing a chip mounting head; 8. an adjustment wheel; 9. a chip adhesive dispensing cylinder; 10. rotating the disc; 11. a bearing groove; 12. a drive motor; 13. a rotating base; 14. a mechanical arm; 15. a clamping head; 16. a collection plate; 17. collecting tank; 18. a handle.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention, and with reference to fig. 1 to 3, the embodiment of the present invention is as follows:

the utility model provides a semiconductor laser chip paster device, includes workstation 1, and 1 bottom four corners fixedly connected with supporting leg 2 of workstation is provided with link 3 between the supporting

leg

2, and 2 bottom fixed mounting of supporting leg have a gasket, and 1 top one side fixed mounting of workstation has stand 4. The inside recess 5 of having seted up of stand 4, movable mounting has elevating platform 6 in the

recess

5, and 6 one end bottom fixed mounting of elevating platform has some glue and pastes first 7, and 6 one side of elevating platform are provided with regulating wheel 8, and some glue are pasted first 7 bottoms of pasting and are provided with some glue paster cylinder 9.

In fig. 1 and 2: 1 top surface of workstation is provided with rotary disk 10, has seted up a plurality of support grooves 11 on the rotary disk 10, and rotary disk 10 bottom is connected with driving motor 12, and driving motor 12 fixed mounting is in 1 bottom of workstation, and rotary disk 10 fixed mounting has roating seat 13, and roating seat 13 top swing joint has arm 14, and through rotary disk 10 who sets up, can conveniently convey the chip of treating the paster to some glue paster head 7 bottoms.

In fig. 1 and 2: arm 14 comprises two sections interconnect's support arm, 14 one end fixed mounting of arm has holding head 15, chip collecting plate 16 has been placed to 1 one side of workstation, a plurality of collecting grooves 17 have been seted up on chip collecting plate 16, chip collecting plate 16 both ends are provided with handle 18, rotary disk 10 uses the high strength rubber material to make, the inside buffer layer that is provided with of bearing groove 11, leave the gap contactless between rotary disk 10 and the workstation 1, arm 14 and holding head 15 through setting up, can press from both sides the chip clamp in the chip collecting plate 16 and place rotary disk 10, also can press from both sides the chip clamp of accomplishing the paster in the rotary disk 10 and place on chip collecting plate 16 simultaneously.

The working principle of the utility model is as follows: arm 14 drives holding head 15 and rotates, clamp the chip of treating on the chip collecting plate 16 and play and place in the support groove 11 on the rotary disk 10, start some glue paster cylinder 9, some glue paster head 7 moves down under the drive of elevating platform 6 simultaneously, carry out paster processing to the chip on the rotary disk 10, rotary disk 10 rotates under driving motor 12's drive, convey the chip that does not have the paster in proper order below some glue paster head 7, the chip that the paster was accomplished is then clamped by holding head 15, place in the collecting vat 17 on the chip collecting plate 16, whole work is accomplished in proper order, the whole paster of the chip on the chip collecting plate 16 is accomplished the back, the staff carries out the change of chip collecting plate 16.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to or changed within the scope of the present invention.

Claims

1. A semiconductor laser chip mounting device comprises a workbench (1) and is characterized in that four corners of the bottom of the workbench (1) are fixedly connected with supporting legs (2), connecting frames (3) are arranged among the supporting legs (2), gaskets are fixedly arranged at the bottoms of the supporting legs (2), and a stand column (4) is fixedly arranged on one side of the top of the workbench (1);

the adhesive dispensing chip mounter is characterized in that a groove (5) is formed in the stand column (4), a lifting table (6) is movably mounted in the groove (5), a dispensing chip mounting head (7) is fixedly mounted at the bottom of one end of the lifting table (6), a regulating wheel (8) is arranged on one side of the lifting table (6), and a dispensing chip mounting air cylinder (9) is arranged at the bottom of the dispensing chip mounting head (7).

2. The semiconductor laser chip mounting device according to claim 1, wherein a rotating disc (10) is arranged on the top surface of the worktable (1), and a plurality of supporting grooves (11) are formed on the rotating disc (10).

3. A semiconductor laser chip mounting device according to claim 2, wherein the bottom of the rotary disk (10) is connected with a driving motor (12), and the driving motor (12) is fixedly arranged at the bottom of the worktable (1).

4. A semiconductor laser chip mounting device according to claim 2, wherein the rotary disk (10) is fixedly provided with a rotary base (13), and the top of the rotary base (13) is movably connected with a mechanical arm (14).

5. A semiconductor laser chip mounting device according to claim 4, wherein the mechanical arm (14) is composed of two sections of support arms connected with each other, and a clamping head (15) is fixedly installed at one end of the mechanical arm (14).

6. The semiconductor laser chip mounting device according to claim 1, wherein a chip collecting plate (16) is disposed on one side of the worktable (1), a plurality of collecting grooves (17) are formed in the chip collecting plate (16), and handles (18) are disposed at two ends of the chip collecting plate (16).

7. The semiconductor laser chip mounting device according to claim 2, wherein the rotating disc (10) is made of high-strength rubber, a buffer layer is arranged inside the supporting groove (11), and a gap is left between the rotating disc (10) and the workbench (1) so as not to contact the rotating disc.