CN215576513U

CN215576513U - Heat radiation base for computer

Info

Publication number: CN215576513U
Application number: CN202121374919.9U
Authority: CN
Inventors: 蔡颖
Original assignee: Tianjin Baijunxing Technology Co ltd
Current assignee: Tianjin Baijunxing Technology Co ltd
Priority date: 2021-06-21
Filing date: 2021-06-21
Publication date: 2022-01-18
Anticipated expiration: 2031-06-21

Abstract

The utility model discloses a heat dissipation base for a computer, which comprises a heat dissipation base shell, wherein the heat dissipation base shell is of a rectangular structure, a refrigerating wafer placing groove is formed in the center of the inner part of the heat dissipation base shell, a heat dissipation plate clamping shoulder is fixedly arranged on the inner wall of the lower side of the refrigerating wafer placing groove, a bottom heat dissipation plate is fixedly arranged on the inner side of the lower side of the refrigerating wafer placing groove, the edge of the bottom heat dissipation plate is clamped on the upper side of the heat dissipation plate clamping shoulder, a plurality of semiconductor refrigerating wafers are fixedly arranged at the upper end of the bottom heat dissipation plate in the refrigerating wafer placing groove, and a foldable grid plate is rotatably connected to one side of the upper end of the refrigerating wafer placing groove. The utility model discloses a heat dissipation base for a computer, which cools the lower area of the computer through the arrangement of a semiconductor refrigeration wafer, and cold air enters the computer along with the heat dissipation system of the computer to cool the computer, so that the heat dissipation base still has a remarkable cooling effect under the condition of higher environmental temperature.

Description

Heat radiation base for computer

Technical Field

The utility model relates to the field of computer accessories, in particular to a heat dissipation base for a computer.

Background

The notebook is limited by the mechanism limitation of the notebook, along with the increasingly thinner and more enhanced functionality of the notebook, the heat dissipation problem of the notebook in use becomes the first problem of influencing the working efficiency and the service life of components, and if a certain heat dissipation device is not used in an auxiliary way, the notebook is easy to operate slowly and even the components are damaged by a fan and a heat dissipation port of the notebook.

Current notebook heat abstractor, thereby use the motor to drive the fan usually and accelerate the circulation of air of notebook and play the purpose of cooling with higher speed, but this kind of structure is confirmed comparatively obviously, the flabellum can produce great noise at the during operation, the improvement noise along with the radiating effect also can be bigger, and when fan cooling used in the environment of sweltering heat, the computer is inside and under the external environment condition that is the high temperature, the circulation of air can not play the radiating effect with higher speed, to the above-mentioned problem, propose the heat dissipation base for the computer.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a heat dissipation base for a computer.

In order to achieve the purpose, the utility model adopts the following technical scheme: a heat dissipation base for a computer comprises a heat dissipation base shell, wherein the heat dissipation base shell is of a rectangular structure, a refrigerating wafer placing groove is formed in the center of the inner portion of the heat dissipation base shell, a heat dissipation plate clamping shoulder is fixedly arranged on the inner wall of the lower side of the refrigerating wafer placing groove, a bottom heat dissipation plate is fixedly arranged inside the refrigerating wafer placing groove by the lower side, the edge of the bottom heat dissipation plate is clamped on the upper side of the heat dissipation plate clamping shoulder, a plurality of semiconductor refrigerating wafers are fixedly arranged at the upper end of the bottom heat dissipation plate inside the refrigerating wafer placing groove, a foldable grid plate is rotatably connected to one side of the upper end of the refrigerating wafer placing groove, the foldable grid plate and the heat dissipation base shell are in the same shape, supporting rod placing grooves are formed in the front side and the rear side of the end face of the heat dissipation base shell, which is far away from the end connected with the foldable grid plate, and foldable supporting rods are rotatably connected inside the supporting rod placing grooves, and supporting rod clamping seats are fixedly arranged at the positions of the lower end surface of the foldable grid plate, which are opposite to the foldable supporting rods.

As a further description of the above technical solution:

collapsible waffle slab rotates the fixed waffle slab pivot that is provided with of one end of being connected with heat dissipation base casing, heat dissipation base casing upper end and the fixed waffle slab rotation seat that is provided with of waffle slab pivot relative department, the waffle slab pivot is rotated and is set up inside the waffle slab rotation seat.

As a further description of the above technical solution:

the foldable support rod comprises a support rod body, wherein the upper end of the support rod body is fixedly connected with a support rod head, the lower end of the support rod body is fixedly connected with a support rod rotating shaft, and the support rod head is clamped with a support rod clamping seat.

As a further description of the above technical solution:

the inside bottom of bracing piece standing groove is rotated and is connected collapsible bracing piece department and all fixedly is provided with the bracing piece and rotate the seat, the bracing piece pivot is rotated and is set up inside the relative bracing piece rotates the seat.

As a further description of the above technical solution:

the bottom heat dissipation plate comprises a heat dissipation plate body, and a plurality of heat dissipation plate heat dissipation columns are fixedly arranged on the lower end face of the heat dissipation plate body.

As a further description of the above technical solution:

two anti-skidding supporting seats are fixedly arranged on two sides of the lower end face of the radiating base shell.

As a further description of the above technical solution:

and silicone grease is coated on the upper end face of the bottom heat dissipation plate.

As a further description of the above technical solution:

the bottom heat dissipation plate is made of copper.

The utility model has the following beneficial effects:

compared with the prior art, the device cools the lower area of the computer through the arrangement of the semiconductor refrigeration wafer, the cold air enters the computer along with the heat dissipation system of the computer, the computer is cooled, and the obvious cooling effect is still achieved under the condition of higher ambient temperature.

Compared with the prior art, the device does not generate noise during working through the arrangement of the semiconductor refrigeration wafer, and is particularly suitable for office areas or night use.

Compared with the prior art, the device has no moving part, and the device is wholly foldable and convenient to carry and transport.

Drawings

Fig. 1 is a side view of a heat dissipation base for a computer according to the present invention;

fig. 2 is a side sectional view of a heat dissipation base for a computer according to the present invention;

FIG. 3 is a rear view of a heat sink base for a computer according to the present invention;

FIG. 4 is an isometric view of a heat sink housing of the heat sink base for a computer according to the present invention;

fig. 5 is an isometric view of a bottom heat sink plate of a heat sink base for a computer according to the present invention.

Illustration of the drawings:

1. a grid plate rotating seat; 2. a grid plate rotating shaft; 3. a heat dissipation base housing; 4. a foldable grid plate; 5. a foldable support bar; 6. a support rod clamping seat; 7. an anti-skid supporting seat; 8. a support rod rotating seat; 9. a bottom heat dissipation plate; 10. a semiconductor refrigeration chip; 11. a support rod head; 12. a support rod body; 13. a support rod rotating shaft; 14. a support rod placing groove; 15. a refrigeration wafer placing groove; 16. the heat dissipation plate is clamped with the shoulder; 17. a heat dissipation plate body; 18. the heat dissipation plate is provided with a heat dissipation column.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, one embodiment of the present invention is provided: a heat dissipation base for a computer comprises a heat dissipation base shell 3, wherein the heat dissipation base shell 3 is of a rectangular structure, a refrigeration wafer placing groove 15 is formed in the center of the inner portion of the heat dissipation base shell 3, a heat dissipation plate clamping shoulder 16 is fixedly arranged on the inner wall of the lower side of the refrigeration wafer placing groove 15, a bottom heat dissipation plate 9 is fixedly arranged in the refrigeration wafer placing groove 15 close to the lower side, the edge of the bottom heat dissipation plate 9 is clamped on the upper side of the heat dissipation plate clamping shoulder 16, a plurality of semiconductor refrigeration wafers 10 are fixedly arranged at the upper end of the bottom heat dissipation plate 9 in the refrigeration wafer placing groove 15, a foldable grid plate 4 is rotatably connected to one side of the upper end of the refrigeration wafer placing groove 15, the foldable grid plate 4 and the heat dissipation base shell 3 are in the same shape, supporting rod placing grooves 14 are formed in the front side and the back side of the end, far away from the end connected with the foldable grid plate 4, and foldable supporting rods 5 are rotatably connected in the supporting rod placing grooves 14, the lower end face of the foldable grid plate 4 is fixed with a support rod clamping seat 6 opposite to the foldable support rod 5.

The foldable grid plate 4 is fixedly provided with a grid plate rotating shaft 2 at one end rotatably connected with a radiating base shell 3, a grid plate rotating seat 1 is fixedly arranged at the upper end of the radiating base shell 3 opposite to the grid plate rotating shaft 2, the grid plate rotating shaft 2 is rotatably arranged in the grid plate rotating seat 1, the foldable support rod 5 comprises a support rod body 12, the upper end of the support rod body 12 is fixedly connected with a support rod head 11, the lower end of the support rod body 12 is fixedly connected with a support rod rotating shaft 13, the support rod head 11 is clamped with a support rod clamping seat 6, the lower end inside a support rod placing groove 14 is rotatably connected with the foldable support rod 5 and is fixedly provided with a support rod rotating seat 8, the support rod rotating shaft 13 is rotatably arranged in the opposite support rod rotating seat 8, a bottom radiating plate 9 comprises a radiating plate body 17, and a plurality of radiating plate radiating columns 18 are fixedly arranged on the lower end surface of the radiating plate body 17, both sides of the lower end face of the heat dissipation base shell 3 are fixedly provided with two anti-skidding supporting seats 7, the upper end face of the bottom heat dissipation plate 9 is coated with silicone grease, and the bottom heat dissipation plate 9 is made of copper.

The working principle is as follows: the device is when using, with device switch on, and lift collapsible grid plate 4, rotate collapsible bracing piece 5 and make collapsible bracing piece 5 and collapsible grid plate 4 joint expand the device, semiconductor refrigeration wafer 10 work, semiconductor refrigeration wafer 10 top absorbs the heat and releases in the below, semiconductor refrigeration wafer 10 below heat conduction to bottom heating panel 9 and give off the air through heating panel heat dissipation post 18, inside the cooling air gets into the computer along with notebook self cooling system above semiconductor refrigeration wafer 10, cool down to the computer, it is showing to reach the cooling effect, the noise is little, mesh such as portable.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. Heat dissipation base for computer, including heat dissipation base casing (3), its characterized in that: the heat dissipation base shell (3) is of a rectangular structure, a refrigeration wafer placing groove (15) is formed in the center of the interior of the heat dissipation base shell (3), a heat dissipation plate clamping shoulder (16) is fixedly arranged on the inner wall of the lower side of the refrigeration wafer placing groove (15), a bottom heat dissipation plate (9) is fixedly arranged in the refrigeration wafer placing groove (15) by the lower side, the edge of the bottom heat dissipation plate (9) is clamped on the upper side of the heat dissipation plate clamping shoulder (16), a plurality of semiconductor refrigeration wafers (10) are fixedly arranged at the upper end of the bottom heat dissipation plate (9) in the refrigeration wafer placing groove (15), a foldable grid plate (4) is rotatably connected to one side of the upper end of the refrigeration wafer placing groove (15), the foldable grid plate (4) and the heat dissipation base shell (3) are in the same shape, and supporting rod placing grooves (14) are formed in the front side and the rear side of the upper end face of the heat dissipation base shell (3) far away from one end connected with the foldable grid plate (4), the inner part of the supporting rod placing groove (14) is rotatably connected with a foldable supporting rod (5), and a supporting rod clamping seat (6) is fixedly arranged at the position, opposite to the foldable supporting rod (5), of the lower end face of the foldable grid plate (4).

2. The heat dissipating base of claim 1, wherein: collapsible waffle slab (4) rotate the fixed waffle slab pivot (2) that is provided with of one end of being connected with heat dissipation base casing (3), heat dissipation base casing (3) upper end is fixed with waffle slab rotation seat (1) with waffle slab pivot (2) department of being relative, waffle slab pivot (2) are rotated and are set up inside waffle slab rotation seat (1).

3. The heat dissipating base of claim 1, wherein: foldable support pole (5) are including the bracing piece body of rod (12), the equal fixedly connected with bracing piece pole head (11) in the bracing piece body of rod (12) upper end, the equal fixedly connected with bracing piece pivot (13) of the bracing piece body of rod (12) lower extreme, bracing piece pole head (11) and bracing piece cassette (6) joint.

4. The heat dissipating base of claim 3, wherein: the bottom end in the supporting rod placing groove (14) is rotatably connected with the foldable supporting rod (5) and is fixedly provided with a supporting rod rotating seat (8), and the supporting rod rotating shaft (13) is rotatably arranged in the relative supporting rod rotating seat (8).

5. The heat dissipating base of claim 1, wherein: bottom heating panel (9) are including heating panel plate body (17), heating panel plate body (17) lower extreme facial features is fixed and is provided with a plurality of heating panel heat dissipation posts (18).

6. The heat dissipating base of claim 1, wherein: two anti-skidding supporting seats (7) are fixedly arranged on two sides of the lower end face of the radiating base shell (3).

7. The heat dissipating base of claim 1, wherein: and silicone grease is coated on the upper end face of the bottom heat dissipation plate (9).

8. The heat dissipating base of claim 1, wherein: the bottom heat dissipation plate (9) is made of copper.