CN215575387U - Flexible printed circuit board and photoelectronic device - Google Patents
Flexible printed circuit board and photoelectronic device Download PDFInfo
- Publication number
- CN215575387U CN215575387U CN202120382975.0U CN202120382975U CN215575387U CN 215575387 U CN215575387 U CN 215575387U CN 202120382975 U CN202120382975 U CN 202120382975U CN 215575387 U CN215575387 U CN 215575387U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- test
- flexible printed
- printed circuit
- board body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a flexible printed circuit board and an optoelectronic device, wherein the flexible printed circuit board comprises a circuit board body and a test board, wherein one end of the circuit board body is connected with one end of the test board, and the other end of the circuit board body is used for being connected with an external circuit; the other end of the test board is used for being connected with an external test interface and leading the electric signal transmitted by the circuit board body to the external test interface. Because this flexible printed circuit board's test panel leads the signal of telecommunication of circuit board body conveying to outside test interface, consequently the pin of circuit board body can not direct and outside contact in the test process, is difficult for receiving pollution or damage, has improved external circuit electricity connection performance to the pin outward appearance of circuit has been guaranteed.
Description
Technical Field
The utility model relates to the field of electronic element electrical performance testing, in particular to a flexible printed circuit board and an optoelectronic device.
Background
A Flexible Printed Circuit (FPC) is a Printed Circuit made of an insulating base material having flexibility, can be freely bent, wound, and folded, and has a low cost, and has a characteristic of realizing a high-frequency performance and a small package size as an electrical connection structure for leading out an internal Circuit when an electronic component is packaged. For some packaged electronic components, the pins of the flexible printed circuit board meeting the packaging requirements of the packaged electronic components are smaller and thinner, and the space between the pins is small, so that when the outgoing electrical performance test is carried out, the test circuit board or the test interface can be directly contacted or welded and fixed with the outgoing pins of the flexible printed circuit board, the test operation is easy to pollute or damage the outgoing pins of the flexible printed circuit board, and the product yield is influenced.
Disclosure of Invention
In view of the above problems, it is necessary to provide a flexible printed circuit board to solve or partially solve the above problems, and the technical solution proposed by the present invention is as follows:
the utility model provides a flexible printed circuit board, which comprises a circuit board body and a test board, wherein one end of the circuit board body is connected with one end of the test board, and the other end of the circuit board body is used for being connected with an external circuit; the other end of the test board is used for being connected with an external test interface and leading the electric signal transmitted by the circuit board body to the external test interface.
Furthermore, the test board comprises a test pin group and a test lead, the test pin group is arranged on one side for being connected with an external test interface, and the test pin group is connected with the circuit board body through the test lead.
Further, the circuit board body includes the body wire and by the access pin group that body wire both ends are connected respectively, connect out the pin group, wherein: the access pin group is arranged on one side for connecting with an external circuit; the outgoing pin group is arranged on one side connected with the test board, and the outgoing pin group is connected with the test pin group through the test lead.
Furthermore, the distance between any two adjacent test pins of the test pin group is greater than the distance between any two adjacent outgoing pins of the outgoing pin group.
Furthermore, the side length of the test board at the side connected with the circuit board body is smaller than the side length of the test pin group at the side.
Further, the test board is trapezoidal at the connection part with the circuit board body.
Furthermore, the test board is also provided with a cutting positioning opening at the connection part with the circuit board body.
Furthermore, the circuit board body is also provided with a welding positioning port, and the welding positioning port is positioned on the side edge between the access pin group and the connection pin group.
Furthermore, a protective film is arranged on the surface of the lead-out pin group of the circuit board body.
On the other hand, the utility model also discloses an optoelectronic device, which comprises an optical device body and the flexible printed circuit board in any one of the schemes, wherein the optical device body is connected with one end of the circuit board body of the flexible printed circuit board, which is used for being connected with an external circuit, through the internal pin group.
Based on the technical scheme, compared with the prior art, the utility model has the beneficial effects that:
the flexible printed circuit board is provided with the test board on the traditional flexible printed circuit board, and the electric signal transmitted by the circuit board body is led to the external test interface, so that pins of the circuit board body cannot be directly contacted with the outside in the test process, and after the test is finished, the test board is cut off, and the circuit board body is reserved. In the utility model, the pins for electric connection on the circuit board body are not influenced in the test process, so that the problem that the pins of the traditional flexible printed circuit board are easily polluted or damaged in the test operation process is avoided, the good rate of the flexible printed circuit board as an electric connection member is improved, and the good rate of the electric connection performance of an external circuit is improved.
Drawings
Fig. 1 is a schematic structural diagram of a flexible printed circuit board according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another flexible printed circuit board according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of an optoelectronic device according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Example one
As shown in fig. 1, a flexible printed circuit board, as an electrical connection structure for leading out an internal circuit when encapsulating an electronic component, includes a circuit board body 10 and a test board 20, wherein one end of the circuit board body 10 is connected with the test board 20, and the other end is used for connecting with an external circuit; one end of the test board 20 is connected with the circuit board body 10, and the other end is used for being connected with an external test interface; the test board 20 is used for leading the electrical signals transmitted by the circuit board body 10 to an external test interface.
The flexible printed circuit board is provided with the test board on the traditional flexible printed circuit board, and the electric signal transmitted by the circuit board body is led to the external test interface, so that pins of the circuit board body cannot be directly contacted with the outside in the test process, and after the test is finished, the test board is cut off, and the circuit board body is reserved. In the scheme, the pins for electric connection on the circuit board body are not influenced in the test process, the problem that the pins of the traditional flexible printed circuit board are easily polluted or damaged in the test operation process is avoided, the good rate of the flexible printed circuit board as an electric connection member is improved, and the good rate of the electric connection performance of an external circuit is improved.
In some embodiments, as shown in fig. 1, the test board 20 includes a test pin group 21, a test wire 22, the test pin group 21 is disposed on the side for connecting with an external test interface, and the test pin group 21 is further connected with the circuit board body 10 through the test wire 22. In this embodiment, a test pin group 21 is disposed on the test board 20 to facilitate electrical connection with an external test interface.
In some embodiments, as shown in fig. 1, the circuit board body 10 includes a body wire 13, and an access pin group 11 and an exit pin group 12 respectively connected to two ends of the body wire 13, wherein: the access pin group 11 is arranged at one side for connecting with an external circuit; the group of outgoing pins 12 is disposed on a side connected to the test board 20, and the group of outgoing pins 12 is further connected to the group of test pins 21 through the test wires 22. In this embodiment, the two sides of the circuit board body 10 for electrical connection are respectively provided with an incoming pin group 11 and an outgoing pin group 12, so as to facilitate electrical connection between the circuit board body 10 and the circuits on the two sides.
In some embodiments, as shown in fig. 1, the pitch of any two adjacent test pins of the test pin group 21 is greater than the pitch of any two adjacent outgoing pins of the outgoing pin group 12. Preferably, the distance between any two adjacent test pins of the test pin group 21 is set according to an external test interface.
According to the scheme, the pin spacing during testing of the flexible printed circuit board is enlarged, so that the problem of difficult butt joint caused by small pin spacing is avoided; moreover, the distance between any two adjacent test pins of the test pin group 21 can be set to a size matched with the universal test interface, so that the universal test interface can be directly applied for butt joint, and the problem that a special test interface needs to be designed or an additional circuit adapter board needs to be used for switching is avoided.
In some embodiments, as shown in fig. 1, the side of the test board 20 connected to the circuit board body 10 has a smaller length than the side of the test pin group 21. The shape of the test board 20 of the present embodiment is convenient for cutting out the test board 20, and saves the material of the flexible printed circuit board.
Preferably, as shown in fig. 1, the shape of the board surface of the test board 20 at the connection position with the circuit board body 10 is trapezoidal, and the oblique sides of the two sides of the trapezoid can be used for limiting the position of the slot when the test board 20 is cut.
In some embodiments, as shown in fig. 2, the test board 20 is further provided with a cutting positioning opening 23 at a connection position with the circuit board body 10, which may be an opening on the test board 20 for limiting a slot during cutting to prevent an erroneous cutting.
In some embodiments, as shown in fig. 2, the circuit board body 10 is further provided with a soldering positioning opening 14, and the soldering positioning opening 14 is located on a side edge between the access lead group 11 and the access lead group 12 for soldering positioning of the flexible printed circuit board on an external circuit package casing. Preferably, the welding positioning opening 14 is arranged on each of two sides.
In some embodiments, as shown in fig. 2, the surface of the lead group 12 of the circuit board body 10 is provided with a protective film 15 for protecting the lead group 12 from contamination and highlighting the cutting line for alignment during cutting.
Example two
As shown in fig. 3, an optoelectronic device includes an optical device body 100 and a flexible printed circuit board 200 connected to each other. In some embodiments, the optoelectronic device may be an optical transmitter, and the optical device body mainly includes a laser emitting chip, a lens, an optical isolator, an adapter, and an internal circuit and a package housing, and pins of the internal circuit are connected to the flexible printed circuit board 200.
The flexible printed circuit board 200 includes a circuit board body 10 and a test board 20, wherein one end of the circuit board body 10 is connected to an internal pin of the optical device body 100, the other end of the circuit board body 10 is connected to the test board 20, one end of the test board 20 is connected to the circuit board body 10, and the other end is used for connecting to an external test interface; the test board 20 is used to lead the electrical signals transmitted by the circuit board body 10 to an external test interface.
The photoelectronic device of this embodiment includes optical device body and flexible printed circuit board, flexible printed circuit board includes circuit board body and survey test panel, the circuit board body is connected with the inside pin of optical device body, survey test panel and be used for leading the signal of telecommunication of circuit board body conveying to outside test interface, consequently the pin of circuit board body can not direct and outside contact in the testing process, and the back is accomplished in the test, cuts out and surveys the test panel, remains circuit board body and optical device body. The pin for external electric connection of the optoelectronic device is not influenced in the primary electric performance test process, the problem that the external pin of the traditional optoelectronic device is easily polluted or damaged in the factory electric performance test process is avoided, the factory product appearance of the optoelectronic device is ensured, and the product yield is improved.
In some embodiments, the test board 20 includes a test pin group 21, a test wire 22, the test pin group 21 is disposed on the side for connecting with an external test interface, and the test pin group 21 is further connected with the circuit board body 10 through the test wire 22. In this embodiment, a test pin group 21 is disposed on the test board 20 to facilitate electrical connection with an external test interface.
In some embodiments, the circuit board body 10 includes a body wire 13, and an access pin group 11 and an exit pin group 12 respectively connected to two ends of the body wire 13, wherein: the access pin group 11 is arranged at one side for connecting with an external circuit; the group of outgoing pins 12 is disposed on a side connected to the test board 20, and the group of outgoing pins 12 is further connected to the group of test pins 21 through the test wires 22. In the present embodiment, the incoming pin group 11 and the outgoing pin group 12 are respectively disposed on two sides of the circuit board body 10 for electrical connection, so as to facilitate electrical connection between the circuit board body 10 and the optical device body 100 and an external circuit.
In some embodiments, the pitch of any two adjacent test pins of the test pin group 21 is greater than the pitch of any two adjacent outgoing pins of the outgoing pin group 12. Preferably, the distance between any two adjacent test pins of the test pin group 21 is set according to an external test interface.
According to the scheme, the pin spacing during testing of the optical device is enlarged, so that the problem of difficult butt joint caused by small pin spacing is avoided; moreover, the distance between any two adjacent test pins of the test pin group 21 can be set to a size matched with the universal test interface, so that the universal test interface can be directly applied for butt joint, and the problem that a special test interface needs to be designed or an additional circuit adapter board needs to be used for switching is avoided.
In some embodiments, the side length of the test board 20 on the side connected to the circuit board body 10 is smaller than the side length of the test pin group 21. The shape of the test board 20 of the present embodiment is convenient for cutting out the test board 20, and saves the material of the flexible printed circuit board.
Preferably, the shape of the board surface of the test board 20 at the connection position with the circuit board body 10 is trapezoidal, and the inclined edges of two sides of the trapezoid can be used for limiting the position of the slot when the test board 20 is cut.
In some embodiments, the test board 20 is further provided with a cutting positioning opening 23 at a connection position with the circuit board body 10, which may be an opening on the test board 20 for limiting a slot during cutting to prevent erroneous cutting.
In some embodiments, the circuit board body 10 is further provided with a soldering positioning hole 14, and the soldering positioning hole 14 is located on a side edge between the incoming pin group 11 and the outgoing pin group 12 for soldering positioning of the flexible printed circuit board 200 on the optical device package housing. Preferably, the welding positioning opening 14 is arranged on each of two sides.
In some embodiments, the surface of the lead group 12 of the circuit board body 10 is provided with a protective film 15 for protecting the lead group 12 from contamination and highlighting the cutting line for alignment during cutting.
In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the utility model.
What has been described above includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent that the term "includes" is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term "comprising" as "comprising" is interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean a "non-exclusive or".
Claims (10)
1. A flexible printed circuit board is characterized by comprising a circuit board body and a test board, wherein one end of the circuit board body is connected with one end of the test board, and the other end of the circuit board body is used for being connected with an external circuit; the other end of the test board is used for being connected with an external test interface and leading the electric signal transmitted by the circuit board body to the external test interface.
2. The flexible printed circuit board of claim 1, wherein the test board comprises a group of test pins, a test wire, the group of test pins being disposed at the side for connection with an external test interface, the group of test pins being connected to the circuit board body through the test wire.
3. The flexible printed circuit board of claim 2, wherein the circuit board body comprises a body wire, and an incoming pin group and an outgoing pin group respectively connected to two ends of the body wire, wherein: the access pin group is arranged on one side for connecting with an external circuit; the outgoing pin group is arranged on one side connected with the test board, and the outgoing pin group is connected with the test pin group through the test lead.
4. The flexible printed circuit board of claim 3, wherein a pitch of any two adjacent test pins of the set of test pins is greater than a pitch of any two adjacent outgoing pins of the set of outgoing pins.
5. The flexible printed circuit board according to claim 4, wherein the side of the test board on the side connected to the circuit board body has a length smaller than that on the side of the test pin group.
6. The flexible printed circuit board of claim 5, wherein the test board has a trapezoidal shape at a connection with the circuit board body.
7. The flexible printed circuit board of claim 2, wherein the test board further has a cut-out at the connection with the circuit board body.
8. The flexible printed circuit board of claim 3, wherein the circuit board body further comprises a solder positioning opening, and the solder positioning opening is located on a side edge between the access lead group and the access lead group.
9. The flexible printed circuit board of claim 3, wherein the surface of the lead group of the circuit board body is provided with a protective film.
10. An optoelectronic device comprising an optical device body and the flexible printed circuit board of any one of claims 1 to 9, the optical device body being connected to the circuit board body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120382975.0U CN215575387U (en) | 2021-02-20 | 2021-02-20 | Flexible printed circuit board and photoelectronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120382975.0U CN215575387U (en) | 2021-02-20 | 2021-02-20 | Flexible printed circuit board and photoelectronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215575387U true CN215575387U (en) | 2022-01-18 |
Family
ID=79838426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120382975.0U Active CN215575387U (en) | 2021-02-20 | 2021-02-20 | Flexible printed circuit board and photoelectronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215575387U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116963386A (en) * | 2023-09-21 | 2023-10-27 | 成都光创联科技有限公司 | Flexible circuit board, testing system of optical device and testing method of optical device |
-
2021
- 2021-02-20 CN CN202120382975.0U patent/CN215575387U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116963386A (en) * | 2023-09-21 | 2023-10-27 | 成都光创联科技有限公司 | Flexible circuit board, testing system of optical device and testing method of optical device |
| CN116963386B (en) * | 2023-09-21 | 2024-01-05 | 成都光创联科技有限公司 | Flexible circuit board, testing system of optical device and testing method of optical device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7275937B2 (en) | Optoelectronic module with components mounted on a flexible circuit | |
| JP6430160B2 (en) | Optical module and optical module manufacturing method | |
| US7329052B2 (en) | Method of assembling optoelectronic devices and an optoelectronic device assembled according to this method | |
| CN215575387U (en) | Flexible printed circuit board and photoelectronic device | |
| US4953006A (en) | Packaging method and package for edge-coupled optoelectronic device | |
| WO2020192172A1 (en) | Optical module | |
| US7275962B1 (en) | Connector | |
| WO2018134967A1 (en) | Optical module and can package | |
| US9606312B2 (en) | Composite cable | |
| CN113281857A (en) | Optical semiconductor device and optical module | |
| CN114660742B (en) | Packaging structure of photoelectric module and photoelectric module using same | |
| JP3926724B2 (en) | Receptacle type optical transmission / reception module and receptacle type optical transmission / reception module | |
| CN109496068B (en) | Backlight module | |
| US8481854B2 (en) | Electronic component device and connector assembly having same | |
| TW201909436A (en) | Light module | |
| CN210837715U (en) | Surface-mounted dual in-line ceramic shell and power device | |
| US7029185B2 (en) | Optical chip module and optical chip module device | |
| CN112051646B (en) | Optical module | |
| CN210668367U (en) | Optical device | |
| US6803520B1 (en) | High speed to-package external interface | |
| CN214705465U (en) | Insulating support for fixing main line and auxiliary line | |
| CN213988868U (en) | Device and packaging structure | |
| CN219980808U (en) | Novel photoelectric switch | |
| CN212277578U (en) | Flat cable connector assembly | |
| CN212113688U (en) | Chip packaging structure and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |