CN215546169U - 一种高度可调的焊接治具 - Google Patents
一种高度可调的焊接治具 Download PDFInfo
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- CN215546169U CN215546169U CN202120921008.7U CN202120921008U CN215546169U CN 215546169 U CN215546169 U CN 215546169U CN 202120921008 U CN202120921008 U CN 202120921008U CN 215546169 U CN215546169 U CN 215546169U
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- 238000003466 welding Methods 0.000 title claims abstract description 31
- 230000002457 bidirectional effect Effects 0.000 claims description 7
- 229920003266 Leaf® Polymers 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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CN202120921008.7U CN215546169U (zh) | 2021-04-30 | 2021-04-30 | 一种高度可调的焊接治具 |
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CN202120921008.7U CN215546169U (zh) | 2021-04-30 | 2021-04-30 | 一种高度可调的焊接治具 |
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CN215546169U true CN215546169U (zh) | 2022-01-18 |
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CN202120921008.7U Active CN215546169U (zh) | 2021-04-30 | 2021-04-30 | 一种高度可调的焊接治具 |
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2021
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240718 Address after: Room C, 20th Floor, 228 Haifang Road, Jing'an District, Shanghai 200041 Patentee after: Lu Zhenlei Country or region after: China Address before: 215300 building 3, No. 18, Chengbei Chuangxin Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan xuneng Electronics Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240907 Address after: No. 133 Dongzheng Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201304 Patentee after: Shanghai Yichong Building Materials Co.,Ltd. Country or region after: China Address before: Room C, 20th Floor, 228 Haifang Road, Jing'an District, Shanghai 200041 Patentee before: Lu Zhenlei Country or region before: China |