CN215527475U - Assembling structure of electrolytic capacitor - Google Patents
Assembling structure of electrolytic capacitor Download PDFInfo
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- CN215527475U CN215527475U CN202120920051.1U CN202120920051U CN215527475U CN 215527475 U CN215527475 U CN 215527475U CN 202120920051 U CN202120920051 U CN 202120920051U CN 215527475 U CN215527475 U CN 215527475U
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Abstract
The disclosure provides an assembly structure of an electrolytic capacitor, and belongs to the field of electronic equipment. The assembling structure of the electrolytic capacitor comprises a substrate, a first conductive bracket, a second conductive bracket and the electrolytic capacitor; the first conductive support and the second conductive support are positioned on the same board surface of the substrate and are connected with the substrate, and the first conductive support and the second conductive support are arranged at intervals along one side edge of the board surface; electrolytic capacitor includes main part and two pins, and the main part is located one side of base plate, and the main part lies in the face outside the planar orthographic projection of face place, and the pin is located the face at the planar orthographic projection of face place at least partially, and one in two pins links to each other with first electrically conductive support, and another links to each other with the electrically conductive support of second to need not punch on the base plate, directly be connected to two electrically conductive supports with two pins on, also connect more easily, made things convenient for electrolytic capacitor's installation.
Description
Technical Field
The disclosure relates to the field of electronic equipment, in particular to an assembling structure of an electrolytic capacitor.
Background
Electrolytic capacitors are one type of capacitors and are widely used in electrical equipment, and generally include a body and two pins for connection.
When the electrolytic capacitor is connected to the substrate, a hole is usually formed in the substrate, and then the lead of the electrolytic capacitor is inserted into the hole at the corresponding position on the substrate, and then the lead is bent and soldered.
The mode of punching holes on the substrate to connect the electrolytic capacitors has complex operation and wastes time and labor.
SUMMERY OF THE UTILITY MODEL
The embodiment of the disclosure provides an assembly structure of an electrolytic capacitor, which can facilitate the installation of the electrolytic capacitor. The technical scheme is as follows:
the embodiment of the disclosure provides an assembly structure of an electrolytic capacitor, which comprises a substrate, a first conductive bracket, a second conductive bracket and the electrolytic capacitor;
the first conductive support and the second conductive support are positioned on the same board surface of the substrate and are connected with the substrate, and the first conductive support and the second conductive support are arranged at intervals along one side edge of the board surface;
the electrolytic capacitor comprises a main body and two pins, wherein the main body is positioned on one side of the substrate, the orthographic projection of the main body on the plane of the board surface is positioned outside the board surface, at least part of the orthographic projection of the pins on the plane of the board surface is positioned in the board surface, one of the two pins is connected with the first conductive support, and the other pin is connected with the second conductive support.
Optionally, the distance from the first conductive support to the side edge is greater than the distance from the second conductive support to the side edge.
Optionally, the length of the pin connected to the first conductive support is greater than the length of the pin connected to the second conductive support.
Optionally, the first conductive support is in a shape of a Chinese character 'ji', a C-shape or a Z-shape, and the second conductive support has the same structure as the first conductive support.
Optionally, the pin connected to the first conductive support is located on the surface of the first conductive support away from the substrate; and the pins connected with the second conductive bracket are positioned on the surface of the second conductive bracket far away from the substrate.
Optionally, the height of the first conductive support is 2.5mm to 5mm, and the height of the second conductive support is 2.5mm to 5 mm.
Optionally, the widths of the first conductive support and the second conductive support in the extending direction of the pins are 2mm to 4 mm.
Optionally, the assembly structure of the electrolytic capacitor further includes a heat sink, the heat sink is located right below the substrate, at least a part of an orthographic projection of the heat sink on a plane where the plate surface is located outside the plate surface, and the heat sink is connected to the substrate.
Optionally, the surface of the heat sink close to the substrate has a groove, the electrolytic capacitor is located in the groove, and the electrolytic capacitor is bonded to the groove.
Optionally, the substrate is an aluminum substrate, a copper substrate, or a ceramic substrate.
The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:
set up first electrically conductive support and the electrically conductive support of second through same face at the base plate for connect electrolytic capacitor, when connecting electrolytic capacitor, electrolytic capacitor's main part is located the side of base plate, and electrolytic capacitor's pin extends to the one side of base plate from the side of base plate, and two pins link to each other with first electrically conductive support and the electrically conductive support of second respectively, thereby need not punch on the base plate, directly be connected to two electrically conductive supports with two pins on, also connect more easily, made things convenient for electrolytic capacitor's installation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an assembly structure of an electrolytic capacitor provided in an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another first conductive bracket provided in the embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of another first conductive bracket provided in the embodiment of the present disclosure.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," "third," and similar terms in the description and claims of the present disclosure are not intended to indicate any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.
Fig. 1 is a schematic structural diagram of an assembly structure of an electrolytic capacitor provided in an embodiment of the present disclosure. As shown in fig. 1, the assembly structure of the electrolytic capacitor includes a substrate 10, a first conductive support 20, a second conductive support 30, and an electrolytic capacitor 40.
The first conductive support 20 and the second conductive support 30 are located on the same board surface 10a of the substrate 10 and are connected to the substrate 10, and the first conductive support 20 and the second conductive support 30 are arranged at intervals along one side edge 10b of the board surface 10 a.
The electrolytic capacitor 40 includes a main body 401 and two pins 402, the main body 401 is located on one side of the substrate 10, an orthographic projection of the main body 401 on a plane of the board surface 10a is located outside the board surface 10a, an orthographic projection of the pins 402 on the plane of the board surface 10a is at least partially located inside the board surface 10a, one of the two pins 402 is connected to the first conductive support 20, and the other pin is connected to the second conductive support 30.
Set up first electrically conductive support and the electrically conductive support of second through same face at the base plate for connect electrolytic capacitor, when connecting electrolytic capacitor, electrolytic capacitor's main part is located the side of base plate, and electrolytic capacitor's pin extends to the one side of base plate from the side of base plate, and two pins link to each other with first electrically conductive support and the electrically conductive support of second respectively, thereby need not punch on the base plate, directly be connected to two electrically conductive supports with two pins on, also connect more easily, made things convenient for electrolytic capacitor's installation.
As shown in fig. 1, the first conductive bracket 20 has a shape of a Chinese character 'ji'. After the first conductive support 20 in the shape of a Chinese character 'ji' is connected to the substrate 10, a larger top surface can be provided for the connection of the pins 402, and two connection areas are provided between the first conductive support 20 and the substrate 10, so that the first conductive support 20 can be more stably and firmly connected to the surface of the substrate 10.
Fig. 2 is a schematic structural diagram of another first conductive bracket provided in the embodiment of the present disclosure. Also schematically shown in fig. 2 is the substrate 10 and the leads 402. As shown in fig. 2, the first conductive support 20 is C-shaped, and the bottom of the first conductive support 20 is connected to the substrate 10, and the top thereof can also provide a surface for the pins 402 to connect to. Fig. 3 is a schematic structural diagram of another first conductive bracket provided in the embodiment of the present disclosure. Also schematically shown in fig. 3 is the substrate 10 and the leads 402. As shown in fig. 3, the first conductive support 20 is Z-shaped, and the bottom of the first conductive support 20 is connected to the substrate 10, and the top thereof can also provide a surface for the pins 402 to connect to.
Alternatively, the second conductive support 30 has the same structure as the first conductive support 20, and the second conductive support 30 may have a shape of a Chinese character 'ji', a C-shape, or a Z-shape. The first conductive holder 20 and the second conductive holder 30 are illustrated as having a zigzag shape in the embodiment of the present disclosure.
Optionally, the first and second conductive brackets 20 and 30 are soldered to the substrate 10. The surface of the substrate 10 has pads, and the first conductive support 20 and the second conductive support 30 are respectively soldered to the surface of the substrate 10 and connected to the pads on the surface of the substrate 10, so that the first conductive support 20 and the second conductive support 30 are electrically connected to the circuit structure on the substrate 10. As an example, the substrate 10 may be an aluminum substrate, a copper substrate, or a ceramic substrate.
Alternatively, the first conductive bracket 20 and the second conductive bracket 30 may each be a metal structural member, such as metal copper, aluminum, and the like. The metal has good conductive performance and good ductility, and the first conductive support 20 and the second conductive support 30 are convenient to manufacture. As an example, in the embodiment of the present disclosure, T2 copper is used as a material to manufacture the first conductive bracket 20 and the second conductive bracket 30. In manufacturing, the first conductive bracket 20 and the second conductive bracket 30 may be manufactured by stamping.
As shown in fig. 1, the pins 402 connected to the first conductive support 20 are located on the surface of the first conductive support 20 away from the substrate 10. The pins 402 connected to the second conductive support 30 are located on the surface of the second conductive support 30 remote from the substrate 10.
By providing the surface connection pins 402 on the first conductive support 20 and the second conductive support 30, the top surfaces of the first conductive support 20 and the second conductive support 30 are more easily connected and more convenient to operate.
As shown in fig. 1, the height h of the first conductive support 20 is 2.5mm to 5mm, and the height h of the second conductive support 30 is 2.5mm to 5 mm. The height is convenient for placing the electrolytic capacitor 40, the pins 402 are convenient for welding with the first conductive bracket 20 and the second conductive bracket 30, and the cost for packaging and manufacturing the braid is low. By way of example, in the disclosed embodiment, the height of the first conductive bracket 20 and the height of the second conductive bracket 30 are both 4 mm.
As shown in fig. 1, the widths d of the first conductive support 20 and the second conductive support 30 in the extending direction of the leads 402 are 2mm to 4 mm.
The widths of the first conductive support 20 and the second conductive support 30 are too small, the contact areas between the first conductive support 20 and the pin 402 and the second conductive support 30 are too small, the connection is not firm enough, and the too large widths of the first conductive support 20 and the second conductive support 30 occupy too much space on the surface of the substrate 10, which affects the installation of other devices. The width of 2 mm-4 mm can make the pins 402 firmly connected to the first conductive support 20 and the second conductive support 30, and does not occupy too much space. As an example, in the embodiment of the present disclosure, the width of the first conductive bracket 20 and the width of the second conductive bracket 30 are both 3 mm.
As shown in fig. 1, the distance from the first conductive support 20 to the side edge 10b is greater than the distance from the second conductive support 30 to the side edge 10 b.
Since the distance between the two pins 402 of the electrolytic capacitor 40 is limited, if the first conductive bracket 20 and the second conductive bracket 30 are placed side by side, it is difficult to space the first conductive bracket 20 and the second conductive bracket 30 from each other, and the installation is difficult. The first conductive bracket 20 and the second conductive bracket 30 are staggered, and installation is easier.
As shown in fig. 1, the length of the pin 402 connected to the first conductive bracket 20 is greater than the length of the pin 402 connected to the second conductive bracket 30. The two pins 402 of the electrolytic capacitor 40 have polarities and are not connected reversely when being connected, and the two pins 402 of the electrolytic capacitor 40 are set to have different lengths, so that the polarities of the two pins 402 can be distinguished conveniently, and the two pins can be connected with the first conductive bracket 20 and the second conductive bracket 30 respectively conveniently.
Optionally, the assembling structure of the electrolytic capacitor further includes a heat sink 50. The heat sink 50 is located on a surface of the substrate 10 away from the first conductive support 20, i.e. the heat sink 50 is located directly below the substrate 10. At least a part of the orthographic projection of the heat sink 50 on the plane of the plate surface 10a is located outside the plate surface 10a, and the heat sink 50 is connected with the substrate 10. The heat sink 50 can dissipate heat from the electrolytic capacitor 40 and the substrate 10, and reduce the temperature of the electrolytic capacitor 40 and the substrate 10.
As shown in fig. 1, the surface of the heat sink 50 near the substrate 10 has a groove 50a, and the electrolytic capacitor 40 is located in the groove 50 a. The groove 50a can limit the electrolytic capacitor 40, and can increase the contact area between the electrolytic capacitor 40 and the radiator 50, so that the electrolytic capacitor 40 can radiate heat more quickly.
Optionally, the groove 50a is a circular arc groove. The body 401 of the electrolytic capacitor 40 is generally cylindrical, and the arc-shaped grooves can better fit the side walls of the body 401 of the electrolytic capacitor 40.
Alternatively, the electrolytic capacitor 40 is bonded to the groove 50 a. For example, the body 401 of the electrolytic capacitor 40 is bonded to the groove 50a by dispensing, so as to improve the anti-vibration capability of the electrolytic capacitor 40, and to prevent the connection between the pin 402 and the first conductive bracket 20 and the second conductive bracket 30 from being broken due to an excessive force.
The above description is intended to be exemplary only and not to limit the present disclosure, and any modification, equivalent replacement, or improvement made without departing from the spirit and scope of the present disclosure is to be considered as the same as the present disclosure.
Claims (10)
1. An assembling structure of an electrolytic capacitor is characterized by comprising a substrate (10), a first conductive bracket (20), a second conductive bracket (30) and an electrolytic capacitor (40);
the first conductive support (20) and the second conductive support (30) are located on the same board surface (10a) of the substrate (10) and are connected with the substrate (10), and the first conductive support (20) and the second conductive support (30) are arranged at intervals along one side edge (10b) of the board surface (10 a);
the electrolytic capacitor (40) comprises a main body (401) and two pins (402), wherein the main body (401) is located on one side of the substrate (10), the orthographic projection of the main body (401) on the plane of the plate surface (10a) is located outside the plate surface (10a), the orthographic projection of the pins (402) on the plane of the plate surface (10a) is at least partially located in the plate surface (10a), one of the two pins (402) is connected with the first conductive support (20), and the other pin is connected with the second conductive support (30).
2. The arrangement, as set forth in claim 1, characterized in that the first electrically conductive support (20) has a greater distance from the side (10b) than the second electrically conductive support (30).
3. The mounting structure according to claim 2, wherein the length of the pin (402) connected to the first conductive bracket (20) is greater than the length of the pin (402) connected to the second conductive bracket (30).
4. Assembly structure according to any one of claims 1 to 3, characterized in that said first electrically conductive support (20) is of a zigzag, C or Z shape and said second electrically conductive support (30) has the same structure as said first electrically conductive support (20).
5. The mounting structure according to any one of claims 1 to 3, wherein the pins (402) connected to the first conductive support (20) are located on the surface of the first conductive support (20) remote from the substrate (10); the pins (402) connected with the second conductive bracket (30) are positioned on the surface of the second conductive bracket (30) far away from the substrate (10).
6. The mounting structure according to any one of claims 1 to 3, wherein the first conductive bracket (20) has a height of 2.5mm to 5mm, and the second conductive bracket (30) has a height of 2.5mm to 5 mm.
7. The mounting structure according to any one of claims 1 to 3, wherein the first conductive bracket (20) and the second conductive bracket (30) have a width in a direction in which the lead (402) extends of 2mm to 4 mm.
8. The assembly structure according to any one of claims 1 to 3, further comprising a heat sink (50), wherein the heat sink (50) is located directly below the substrate (10), at least a part of an orthographic projection of the heat sink (50) on the plane of the board surface (10a) is located outside the board surface (10a), and the heat sink (50) is connected to the substrate (10).
9. The mounting structure according to claim 8, wherein the surface of the heat sink (50) adjacent to the substrate (10) has a recess (50a), the electrolytic capacitor (40) is located in the recess (50a), and the electrolytic capacitor (40) is bonded to the recess (50 a).
10. The mounting structure according to any one of claims 1 to 3, wherein the substrate (10) is an aluminum substrate, a copper substrate or a ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120920051.1U CN215527475U (en) | 2021-04-28 | 2021-04-28 | Assembling structure of electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120920051.1U CN215527475U (en) | 2021-04-28 | 2021-04-28 | Assembling structure of electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215527475U true CN215527475U (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120920051.1U Active CN215527475U (en) | 2021-04-28 | 2021-04-28 | Assembling structure of electrolytic capacitor |
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| CN (1) | CN215527475U (en) |
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2021
- 2021-04-28 CN CN202120920051.1U patent/CN215527475U/en active Active
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