CN215511761U - Silicon rod bidirectional cutting mechanism - Google Patents
Silicon rod bidirectional cutting mechanism Download PDFInfo
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- CN215511761U CN215511761U CN202121116276.8U CN202121116276U CN215511761U CN 215511761 U CN215511761 U CN 215511761U CN 202121116276 U CN202121116276 U CN 202121116276U CN 215511761 U CN215511761 U CN 215511761U
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- cutting
- silicon rod
- wire saw
- diamond wire
- gear train
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Abstract
The utility model provides a silicon rod bidirectional cutting mechanism which is applied to the field of cutting of brittle and hard materials and comprises a gear train panel, a cutting gear train and an annular diamond wire saw, wherein the cutting gear train is distributed on the gear train panel, the annular diamond wire saw is wound on a wire groove in the cutting gear train, one side of the annular diamond wire saw is a first cutting station, the other side of the annular diamond wire saw is a second cutting station, a first cutting groove and a second cutting groove are respectively formed in the gear train panel close to the first cutting station and the second cutting station, the first cutting station and the second cutting station can alternately cut different silicon rods, and meanwhile, a tensioning device from outside to inside is further arranged for realizing bidirectional cutting, so that the problems of resetting of a hollow stroke and low cutting efficiency in the prior art are solved.
Description
Technical Field
The utility model relates to the technical field of hard and brittle material cutting, in particular to cutting equipment for hard and brittle materials.
Background
In the prior art, brittle and hard materials such as stone, silicon crystal and the like are cut by adopting diamond. The cutting wheel train comprises a plurality of cutting wheels, and the diamond wire is in the wire casing of locating on the cutting wheel train for the closed annular line structure of cutting of head and the tail, and the diamond wire of drive is linear motion after the cutting wheel train is rotatory. The existing cutting mechanism can only cut in one direction generally, the reset idle stroke is not fully utilized, or the cutting operation mechanism is stopped after the cutting mechanism cuts in one direction and returns to cut after feeding, a waiting beat always exists, and the cutting efficiency is lower. And two guide wheels closest to the cutting surface generally avoid a tensioning wheel mechanism, generally a set of driven wheel mechanism and a set of driving wheel mechanism, and the tensioning mechanism is also generally tensioned from inside to outside, so that the bidirectional cutting device is not suitable for bidirectional cutting.
SUMMERY OF THE UTILITY MODEL
Therefore, the silicon rod bidirectional cutting mechanism needs to be provided, the problem that the existing cutting mechanism can only perform unidirectional cutting generally and does not fully utilize the reset idle stroke is solved, the cutting mechanism can be used for cutting by utilizing the reset stroke, namely, bidirectional cutting is performed, and the cutting efficiency is improved.
In order to achieve the above object, the present invention provides a silicon rod bidirectional cutting mechanism, comprising: the gear train panel driving mechanism, the gear train panel, the cutting gear train and the annular diamond wire saw are arranged on the gear train panel;
the cutting wheel train is arranged on the wheel train panel and comprises a first driving mechanism and a driving wheel;
the annular diamond wire saw is arranged in a wire groove on the cutting wheel train in a surrounding mode, one side of the annular diamond wire saw is a first cutting station, the other side of the annular diamond wire saw is a second cutting station, and the first cutting station and the second cutting station can alternately cut different silicon rods located on two sides of the wheel train panel;
the gear train panel is close to one side of first cutting station is provided with first cutting groove, the gear train panel is close to one side of second cutting station is provided with the second cutting groove.
Further, straining device has still been laid to the train panel, straining device with the annular diamond coping saw offsets around the annular outside of establishing, straining device follows the inboard extrusion tensioning in the annular outside of annular diamond coping saw the annular diamond coping saw.
The silicon rod clamping device comprises a silicon rod clamping mechanism, a clamping mechanism and a clamping mechanism, wherein the silicon rod clamping mechanism can move along the axis direction of the silicon rod, and is used for clamping the silicon rod so as to drive the silicon rod to move along the axis direction;
the clamping mechanism comprises a first clamping assembly and a second clamping assembly, wherein the first clamping assembly is close to the first cutting groove, and the second clamping assembly is close to the second cutting groove.
The gear train panel driving mechanism is arranged on the gear train panel;
the gear train panel driving mechanism can drive the gear train panel, the cutting gear train and the annular diamond wire saw move together, successively face the first clamping component and the second clamping component move, so that the annular diamond wire saw successively is clamped in the first clamping component and the second clamping component to cut the silicon rod, and double-station alternate cutting is realized.
Further, the cutting device also comprises a second driving mechanism, and the cutting wheel train comprises more than two driving wheels;
the first driving mechanism is in transmission connection with the driving wheel close to the first cutting groove;
the second driving mechanism is in transmission connection with the driving wheel close to the second cutting groove; if the silicon rod is cut at the first cutting station, the annular diamond wire saw is driven to rotate by the first driving mechanism, and the second driving mechanism does not provide driving force;
if the silicon rod cuts at the second cutting station, the annular diamond wire saw is driven to rotate by the second driving mechanism, and the first driving mechanism does not provide driving force.
Further, when the annular diamond wire saw rotates, the annular diamond wire saw cuts the silicon rod downwards.
Further, the annular diamond wire saw can rotate to cut in a clockwise direction or a counterclockwise direction, the first driving mechanism drives one direction to be clockwise, and the second driving mechanism drives the other direction to be counterclockwise.
Further, the gear train panel is fixed;
clamping mechanisms are arranged beside the first cutting groove and the second cutting groove and used for clamping the silicon rod, and the clamping mechanisms can move along the axial direction of the silicon rod and the direction perpendicular to the axial direction of the silicon rod so as to drive the silicon rod to move;
the clamping mechanism comprises a first clamping assembly arranged close to the first cutting groove and a second clamping assembly arranged close to the second cutting groove;
the first clamping component and the second clamping component can clamp different silicon rods to be respectively close to the first cutting station and the second cutting station to cut synchronously or at intervals.
Be different from prior art, above-mentioned technical scheme sets up the cutting groove respectively in both sides on the cutting running mechanism of current diamond wire saw cutting machine, just the cutting groove corresponds respectively and is provided with the cutting station, cut the cutting groove with but relative movement between the cutting station, concrete accessible cutting running mechanism removes and successively is close to both sides the cutting station carries out two-way cutting, or drives the target work piece through work piece fixture and removes to be close to the cutting station and realize two-way cutting, and make full use of resets the stroke and cuts, improves cutting efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a cutting machine for cutting a gear train panel in an embodiment of the present application;
FIG. 2 is a front view of a cutting machine for moving and cutting a gear train panel in the embodiment of the present application;
FIG. 3 is a schematic diagram illustrating the movement and cutting of a gear train panel in the embodiment of the present application;
FIG. 4 is a schematic view of the structural position of the tensioning mechanism in the embodiment of the present application;
FIG. 5 is a schematic structural view of a cutting machine for cutting by moving a clamping mechanism according to an embodiment of the present application;
FIG. 6 is a front view of the cutting machine with the clamping mechanism moving to cut in the embodiment of the present application;
fig. 7 is a schematic structural diagram of a clamping mechanism in an embodiment of the present application.
Description of reference numerals:
1. a wheel train panel;
101. a first cutting groove;
102. and a second cutting groove.
2. A silicon rod;
3. an annular diamond wire saw;
31. a first cutting station;
32. a second cutting station;
4. a clamping mechanism;
41. a first clamping assembly;
42. a second clamping assembly.
11. A tensioning mechanism;
111. a tensioning arm;
12. a driven wheel mechanism;
15. a drive mechanism;
151. a first drive mechanism;
152. a second drive mechanism.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. "vertical" is not strictly vertical, but is within the tolerance of the error. "parallel" is not strictly parallel but within the tolerance of the error.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
Referring to fig. 1 to 7, the present embodiment provides a bidirectional silicon rod cutting mechanism and a cutting method, including a gear train panel 1, a cutting gear train and a circular diamond wire saw 3. The wheel train panel 1 is provided with a cutting wheel train, the cutting wheel train comprises a first driving mechanism 151 and a driving wheel, the first driving mechanism 151 is connected with the corresponding driving wheel and drives the driving wheel to rotate, and the cutting wheel can be further included. The annular diamond wire saw 3 is wound in a wire groove on a wheel in the cutting wheel system, one side of the annular diamond wire saw 3 is a first cutting station 31, the other side of the annular diamond wire saw 3 is a second cutting station 32, specifically, the annular diamond wire saw 3 is close to one side of the L direction and is the first cutting station 31, and the side close to the R direction is the second cutting station 32.
Specifically, referring to fig. 1 and 2, a first cutting groove 101 is formed in one side of the wheel train panel 1 close to the first cutting station 31, and a second cutting groove 102 is formed in one side of the wheel train panel close to the second cutting station 32, specifically, the wheel train panel 1 may have an i-shaped outline, and two concave sides of the i-shaped outline are the positions of the first cutting groove 101 and the second cutting groove 102. Can set up the train panel actuating mechanism who is used for the drive panel to remove on the train panel 1, train panel actuating mechanism can be by the motor through modes such as belt, gear and slide rail drive train panel 1 and remove. Meanwhile, the gear train panel 1 can also be fixed on another movable plate in a bolt mode and the like, and the gear train panel 1 is driven by the plate to move.
The clamping mechanisms 4 are respectively arranged on two sides of the gear train panel 1 and beside the first cutting groove 101 and the second cutting groove 102, the clamping mechanisms 4 are used for clamping the silicon rods 2, and the gear train panel 1 and the clamping mechanisms 4 can move relatively to each other, so that the first cutting station 31 and the second cutting station 32 can respectively cut different silicon rods 2, and specific cutting can be carried out synchronously or sequentially and alternately. The above-mentioned relative movement is mainly a relative movement in the L or R direction. The raw material of the silicon rod 2 to be processed is a long cylinder, and can be cut in multiple sections in the length direction of the silicon rod 2 through the annular diamond wire saw 3, and the first cutting station 31 and the second cutting station 32 are specifically the parts of the annular diamond wire saw 3 which are in contact with and cut the silicon rod 2, namely, the first cutting station 31 and the second cutting station 32 are used for cutting the silicon rod 2.
Referring specifically to fig. 4, the cutting wheel train may specifically include a driven wheel mechanism 12, a driving wheel and a driving mechanism 15, the driven wheel mechanism 12 may specifically refer to a driven wheel without driving force, the driving wheel is connected with the driving mechanism 15 so as to obtain driving force, and the driving mechanism 15 may be a motor or the like for providing driving power. The annular diamond wire saw 3 is annularly wound in a wire groove in the cutting wheel system, the driving mechanism 15 can provide driving force to drive the annular diamond wire saw 3 to rotate, and then the driven wheel mechanism 12 rotates together under the driving of the linear motion of the annular diamond wire saw 3. In addition to providing one drive mechanism 15, the cutting train may also include more than two sets of drive mechanisms 15 and more than two drive wheels, with the first drive mechanism 151 being drivingly connected to the drive wheel adjacent the first cutting flute 101 and the second drive mechanism 152 being drivingly connected to the drive wheel adjacent the second cutting flute 102. When the silicon rod 2 is cut at the first cutting station 31, the ring-shaped diamond wire saw 3 is driven to rotate by the first driving mechanism 151, and the second driving mechanism 152 does not provide a driving force. When the silicon rod 2 is cut at the second cutting station 32, the ring-shaped diamond wire saw 3 is driven to rotate by the second driving mechanism 152, and the first driving mechanism 151 does not provide a driving force. When the ring-shaped diamond wire saw 3 rotates, the diamond wire saw 3 cuts the silicon rod 2 workpiece downwards, and the cutting can be more stable because the acting force of the diamond wire saw and the acting force of a roller frame and the like for arranging the silicon rod 2 are mutually offset.
The ring diamond wire saw 3 can rotate to cut along a clockwise direction or a counterclockwise direction, the first driving mechanism 151 drives one direction, and the second driving mechanism 152 drives the other direction, namely, the cutting rotation direction of the ring diamond wire saw 3 can be switched by the first driving mechanism 151 and the second driving mechanism 152. Specifically, when the first cutting groove 101 is used for cutting, the first driving mechanism 151 drives the circular diamond wire saw 3 to rotate, the second driving mechanism 152 is driven to rotate by the circular diamond wire saw 3 together with the driven wheel mechanism 12 without using a driving force, and at this time, the first driving mechanism 151 drives the circular diamond wire saw to rotate in the counterclockwise direction, so that the circular diamond wire saw 3 cuts the silicon rod 2 located at the first cutting station 31 downward.
Referring to fig. 3 and 4 in particular, the wheel train panel 1 is further provided with a tensioning mechanism 11, and the tensioning mechanism 11 is abutted against the outer side of the ring formed by the annular diamond wire saw 3 in a winding way. The length of the annular diamond wire saw 3 is fixed and wound on the wire grooves in the cutting wheel system, and the phenomena of tightness and the like can exist, so that the annular diamond wire saw 3 can be extruded to the inner side along the annular outer side of the annular diamond wire saw 3 through the tensioning mechanism 11, and the annular diamond wire saw 3 is extruded. The tensioning mechanism 11 can tension the circular diamond wire saw 3 through the structure of the tensioning arm 111, for example, a weight can be hung on one end of the tensioning arm 111, and the tensioning arm 111 is pressed down by the gravity of the weight itself to press the circular diamond wire saw 3.
Referring in particular to fig. 1, 3 and 5, performing the cutting of the silicon rod 2 requires moving the silicon rod 2 to the cutting station 31 or 32. Specifically, the silicon rod 2 can be placed on a roller support frame and conveyed to a designated position along a roller support member for cutting, the roller support frame can convey the silicon rod 2 along the length direction of the silicon rod 2, the silicon rod 2 is moved to the designated position (for example, beside a first cutting station 31) to wait for cutting, the wheel train panel 1 can be arranged on a sliding platform, the sliding platform is arranged on a sliding rail and can move along the direction of the sliding rail, and the sliding rail is arranged in parallel with the directions of L and R. The silicon rod 2 is firstly conveyed to a designated position (for example, the first cutting station 31) by the roller bracket, and the sliding platform driven by the driving device carries the gear train panel 1 to move along the sliding rail (for example, the L direction) to cut the silicon rod 2.
Further, the silicon rod 2 can be clamped by the clamping mechanism 4 and then moved and conveyed, specifically, the base of the clamping mechanism 4 can be arranged in a sliding groove, the sliding groove is arranged in parallel to the length direction of the silicon rod 2, and the base of the clamping mechanism 4 can move along the direction of the sliding groove so as to drive the clamping mechanism 4 to move along the length direction of the silicon rod 2 and convey the silicon rod 2. The gear train panel driving mechanism further comprises a clamping mechanism 4, the clamping mechanism 4 comprises a first clamping component 41 and a second clamping component 42, the first clamping component 41 is close to one side of the first cutting groove 101, the second clamping component 42 is close to one side of the second cutting groove 102, the clamping mechanism 4 can be a clamping jaw clamping mechanism and other devices, and the clamping mechanism 4 is used for clamping the silicon rod 2. The holding mechanism 4 can move along the length direction of the silicon rod 2, that is, the holding mechanism 4 can hold the silicon rod 2 and move along the length direction of the silicon rod 2, and further, the holding mechanism 4 can move along the length direction perpendicular to the silicon rod 2 as required, so that the silicon rod 2 can move in the L and R directions. The first clamping assembly 41 and the second clamping assembly 42 can clamp different silicon rods 2 to simultaneously or sequentially perform bidirectional cutting close to the first cutting groove 101 and the second cutting groove 102 respectively.
It should be noted that, although the above embodiments have been described herein, the utility model is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present invention.
Claims (8)
1. A bidirectional silicon rod cutting mechanism is characterized by comprising: the gear train panel, the cutting gear train and the annular diamond wire saw are arranged on the gear train panel;
the cutting wheel train is arranged on the wheel train panel and comprises a first driving mechanism and a driving wheel;
the annular diamond wire saw is arranged in a wire groove on the cutting wheel train in a surrounding mode, one side of the annular diamond wire saw is a first cutting station, the other side of the annular diamond wire saw is a second cutting station, and the first cutting station and the second cutting station can alternately cut different silicon rods located on two sides of the wheel train panel;
the gear train panel is close to one side of first cutting station is provided with first cutting groove, the gear train panel is close to one side of second cutting station is provided with the second cutting groove.
2. The silicon rod bidirectional cutting mechanism according to claim 1, wherein a tensioning mechanism is further disposed on the gear train panel, the tensioning mechanism abuts against an outer side of a ring around which the annular diamond wire saw is disposed, and the tensioning mechanism presses and tensions the annular diamond wire saw along the outer side of the ring to the inner side.
3. The bidirectional cutting mechanism for silicon rods as set forth in claim 1, further comprising a holding mechanism movable in the direction of the axis of the silicon rod, the holding mechanism being adapted to hold the silicon rod and thereby move the silicon rod in the direction of the axis;
the clamping mechanism comprises a first clamping assembly and a second clamping assembly, wherein the first clamping assembly is close to the first cutting groove, and the second clamping assembly is close to the second cutting groove.
4. The bidirectional cutting mechanism for silicon rods as set forth in claim 3, further comprising a train wheel panel driving mechanism disposed on the train wheel panel;
the gear train panel driving mechanism can drive the gear train panel, the cutting gear train and the annular diamond wire saw move together, successively face the first clamping component and the second clamping component move, so that the annular diamond wire saw successively is clamped in the first clamping component and the second clamping component to cut the silicon rod, and double-station alternate cutting is realized.
5. The bidirectional cutting mechanism for silicon rods as set forth in claim 1, further comprising a second drive mechanism, and wherein the cutting train comprises more than two of the drive wheels;
the first driving mechanism is in transmission connection with the driving wheel close to the first cutting groove;
the second driving mechanism is in transmission connection with the driving wheel close to the second cutting groove; if the silicon rod is cut at the first cutting station, the annular diamond wire saw is driven to rotate by the first driving mechanism, and the second driving mechanism does not provide driving force;
if the silicon rod cuts at the second cutting station, the annular diamond wire saw is driven to rotate by the second driving mechanism, and the first driving mechanism does not provide driving force.
6. The silicon rod bidirectional cutting mechanism of claim 5, wherein the annular diamond wire saw cuts the silicon rod downward as the annular diamond wire saw rotates.
7. The bidirectional cutting mechanism for silicon rods as set forth in claim 5, wherein the circular diamond wire saw is rotatable to cut in either a clockwise or counterclockwise direction, the first drive mechanism driving one direction clockwise and the second drive mechanism driving the other direction counterclockwise.
8. The silicon rod bidirectional cutting mechanism of claim 1, wherein the gear train panel is stationary;
clamping mechanisms are arranged beside the first cutting groove and the second cutting groove and used for clamping the silicon rod, and the clamping mechanisms can move along the axial direction of the silicon rod and the direction perpendicular to the axial direction of the silicon rod so as to drive the silicon rod to move;
the clamping mechanism comprises a first clamping assembly arranged close to the first cutting groove and a second clamping assembly arranged close to the second cutting groove;
the first clamping component and the second clamping component can clamp different silicon rods to be respectively close to the first cutting station and the second cutting station to cut synchronously or at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121116276.8U CN215511761U (en) | 2021-05-24 | 2021-05-24 | Silicon rod bidirectional cutting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121116276.8U CN215511761U (en) | 2021-05-24 | 2021-05-24 | Silicon rod bidirectional cutting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215511761U true CN215511761U (en) | 2022-01-14 |
Family
ID=79805042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121116276.8U Active CN215511761U (en) | 2021-05-24 | 2021-05-24 | Silicon rod bidirectional cutting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215511761U (en) |
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2021
- 2021-05-24 CN CN202121116276.8U patent/CN215511761U/en active Active
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