CN113370406A - Bidirectional cutting method for silicon crystal bar - Google Patents
Bidirectional cutting method for silicon crystal bar Download PDFInfo
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- CN113370406A CN113370406A CN202110565958.5A CN202110565958A CN113370406A CN 113370406 A CN113370406 A CN 113370406A CN 202110565958 A CN202110565958 A CN 202110565958A CN 113370406 A CN113370406 A CN 113370406A
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- crystal bar
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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Abstract
The invention provides a bidirectional cutting method of a silicon crystal bar, which is applied to the field of cutting of brittle and hard materials.
Description
Technical Field
The invention relates to the technical field of hard and brittle material cutting, in particular to a cutting method of a hard and brittle material.
Background
In the prior art, brittle and hard materials such as stone, silicon crystal and the like are cut by adopting diamond. The cutting wheel train comprises a plurality of cutting wheels, and the diamond wire is in the wire casing of locating on the cutting wheel train for the closed annular line structure of cutting of head and the tail, and the diamond wire of drive is linear motion after the cutting wheel train is rotatory. The existing cutting mechanism can only cut in one direction generally, the reset idle stroke is not fully utilized, or the cutting operation mechanism is stopped after the cutting mechanism cuts in one direction and returns to cut after feeding, a waiting beat always exists, and the cutting efficiency is lower. And two guide wheels closest to the cutting surface generally avoid a tensioning wheel mechanism, generally a set of driven wheel mechanism and a set of driving wheel mechanism, and the tensioning mechanism is also generally tensioned from inside to outside, so that the bidirectional cutting device is not suitable for bidirectional cutting.
Disclosure of Invention
Therefore, a silicon crystal bar bidirectional cutting method needs to be provided, the problem that the existing cutting mechanism can only perform unidirectional cutting generally and does not fully utilize the reset idle stroke is solved, bidirectional cutting is performed when the reset stroke of the cutting mechanism is used for cutting, and the cutting efficiency is improved.
In order to achieve the purpose, the invention provides a bidirectional cutting method for a silicon crystal bar, which uses an annular diamond wire saw to cut the silicon crystal bar, wherein one side of the annular diamond wire saw is provided with a first cutting station, and the other side of the annular diamond wire saw is provided with a second cutting station;
the bidirectional cutting method of the silicon crystal bar stock comprises the following steps: and clamping a silicon crystal bar stock at the first cutting station and the second cutting station, and cutting the silicon crystal bar stock through the first cutting station and the second cutting station.
Further, the step of clamping a silicon crystal bar stock at the first cutting station and the second cutting station and cutting the silicon crystal bar stock through the first cutting station and the second cutting station comprises the following steps:
s1, clamping a silicon crystal bar stock on one side of the annular diamond wire saw, and cutting the silicon crystal bar stock by using the first cutting station;
and S2, clamping another silicon crystal bar stock on the other side of the annular diamond wire saw during the cutting of the first cutting station, and cutting the another silicon crystal bar stock by using the second cutting station after the single cutting of the first cutting station is finished.
Further, the annular diamond wire saw is arranged on a cutting wheel system, the cutting wheel system is arranged on a wheel system panel, and a first cutting slot position and a second cutting slot position are arranged at two ends of the wheel system panel;
the cutting train includes a drive mechanism and drive wheel, the annular diamond coping saw encircle set up in the wire casing in the cutting train, the annular diamond coping saw is close to one side of first cutting trench is first cutting station, the annular diamond coping saw is close to one side of second cutting trench is the second cutting station, first cutting station with the second cutting station can cut in turn and be located the different silicon crystal bar stocks of train panel both sides.
Further, the cutting of the annular diamond wire saw also comprises the following steps:
s12, checking whether the annular diamond wire saw is tensioned or not;
s13, if the annular diamond wire saw is not tensioned, tensioning the annular diamond wire saw through a tensioning mechanism;
wherein, straining device with the annular diamond coping saw offsets around the annular outside of establishing, straining device follows the inboard extrusion tensioning in annular outside of annular diamond coping saw the annular diamond coping saw.
Further, the step of cutting the silicon crystal ingot through the first cutting station and the second cutting station specifically includes:
s21, controlling the annular diamond wire saw to move towards a first direction, and enabling the first cutting station to cut the silicon crystal bar stock close to the first cutting groove to cut;
s22, after the first cutting station finishes single cutting, the annular diamond wire saw is controlled to move towards the second direction, so that the second cutting station cuts the silicon crystal bar stock close to the second cutting groove.
Further, a gear train panel driving mechanism is arranged on the gear train panel;
the edge is on a parallel with train panel direction is provided with the guided way, the base of train panel with guided way sliding connection, train panel actuating mechanism can drive the train panel cutting train with the annular diamond coping saw is followed the guided way removes, thereby makes first cutting station with the second cutting station is respectively to being close to first cutting trench with be close to the silicon crystal bar material of second cutting trench cuts successively.
Furthermore, a clamping mechanism is further arranged and comprises a first clamping component and a second clamping component, the first clamping component is close to the first cutting slot, and the second clamping component is close to the second cutting slot;
the cutting of the silicon crystal bar stock through the first cutting station and the second cutting station specifically comprises the steps of:
s21, clamping a silicon crystal bar stock by the first clamping assembly to be close to the first cutting station for cutting;
s22, clamping another silicon crystal bar stock by the second clamping assembly to be close to the second cutting station for cutting;
the steps S21 and S22 may be performed alternately in sequence or simultaneously.
Further, a first sliding rail is arranged in parallel to the length direction of the silicon crystal bar stock, a base of the clamping mechanism is arranged in the first sliding rail, and the clamping mechanism can move along the sliding rail so as to drive the silicon crystal bar stock to move along the length direction;
the second sliding rail is vertically arranged on the first sliding rail and is in sliding connection with the first sliding rail, and the second sliding rail and the clamping mechanism can move along the direction of the first sliding rail so as to drive the silicon crystal bar to be close to or far away from the cutting groove to complete cutting.
Further, the step of cutting the silicon crystal bar stock through the first cutting station and the second cutting station specifically comprises the steps of:
s21, enabling the first driving mechanism to rotate positively to drive the driving wheel to rotate, and enabling the annular diamond wire saw to rotate clockwise;
s22, the annular diamond wire saw and the silicon crystal bar stock are moved relatively, and the first cutting station is used for cutting the silicon crystal bar stock;
s23, reversely rotating the first driving mechanism, and driving the driving wheel to rotate, so that the annular diamond wire saw rotates in the counterclockwise direction;
and S24, the annular diamond wire saw and the silicon crystal bar stock are moved relatively, and the second cutting station is used for cutting the silicon crystal bar stock.
The first driving mechanism is in transmission connection with the driving wheel close to the first cutting slot; the second driving mechanism is in transmission connection with the driving wheel close to the second cutting groove;
the cutting of the silicon crystal bar stock through the first cutting station and the second cutting station specifically comprises the steps of:
s21, starting the first driving mechanism to rotate forward to drive the driving wheel close to the first cutting groove to rotate, so that the annular diamond wire saw rotates clockwise, and removing a power source connected with the second driving wheel;
s22, the gear train panel and the silicon crystal bar stock are moved relatively, and the first cutting station is used for cutting;
s23, removing a power source connected with the first driving mechanism, and recovering the power source of the second driving mechanism to enable the power source to reversely rotate to drive the driving wheel close to the second cutting groove to rotate so as to enable the annular diamond wire saw to rotate anticlockwise;
and S24, the gear train panel and the silicon crystal ingot are moved relatively, and cutting is carried out by using the second cutting station.
Further, including the gyro wheel support frame that is used for transporting silicon crystal bar stock, the gyro wheel support frame along the length direction setting of silicon crystal bar stock can drive silicon crystal bar stock moves along its length direction.
Be different from prior art, above-mentioned technical scheme sets up the cutting groove respectively in both sides on the cutting running mechanism of current diamond wire saw cutting machine, just the cutting groove corresponds respectively and is provided with the cutting station, cut the cutting groove with but relative movement between the cutting station, concrete accessible cutting running mechanism removes and successively is close to both sides the cutting station carries out two-way cutting, or drives the target work piece through work piece fixture and removes to be close to the cutting station and realize two-way cutting, and make full use of resets the stroke and cuts, improves cutting efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a cutting machine for cutting a gear train panel in an embodiment of the present application;
FIG. 2 is a front view of a cutting machine for moving and cutting a gear train panel in the embodiment of the present application;
FIG. 3 is a schematic diagram illustrating the movement and cutting of a gear train panel in the embodiment of the present application;
FIG. 4 is a schematic view of the structural position of the tensioning mechanism in the embodiment of the present application;
FIG. 5 is a schematic structural view of a cutting machine for cutting by moving a clamping mechanism according to an embodiment of the present application;
FIG. 6 is a front view of the cutting machine with the clamping mechanism moving to cut in the embodiment of the present application;
FIG. 7 is a schematic structural view of a clamping mechanism in an embodiment of the present application;
fig. 8 is a flow chart of a method for bidirectionally cutting a silicon crystal ingot according to an embodiment of the present invention.
Description of reference numerals:
1. a wheel train panel;
101. a first cutting slot position;
102. a second cutting slot.
2. Silicon crystal bar stock;
3. an annular diamond wire saw;
31. a first cutting station;
32. a second cutting station;
4. a clamping mechanism;
41. a first clamping assembly;
42. a second clamping assembly.
11. A tensioning mechanism;
111. a tensioning arm;
12. a driven wheel mechanism;
15. a drive mechanism;
151. a first drive mechanism;
152. a second drive mechanism.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. "vertical" is not strictly vertical, but is within the tolerance of the error. "parallel" is not strictly parallel but within the tolerance of the error.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
Referring to fig. 1 to 8, the present embodiment provides a bidirectional cutting method for silicon crystal bar stock, the bidirectional cutting method for silicon crystal bar stock uses a circular diamond wire saw 3 to cut silicon crystal bar stock 2, the circular diamond wire saw 3 has a first cutting station 31 on one side and a second cutting station 32 on the other side, the bidirectional cutting method for silicon crystal bar stock comprises the following steps: the silicon ingot 2 is clamped at the first cutting station 31 and the second cutting station 32, and the silicon ingot 2 is cut by the first cutting station 31 and the second cutting station 32.
The device in the cutting method comprises a wheel train panel 1, a cutting wheel train and a ring-shaped diamond wire saw 3. The wheel train panel 1 is provided with a cutting wheel train, the cutting wheel train comprises a first driving mechanism 151 and a driving wheel, the first driving mechanism 151 is connected with the corresponding driving wheel and drives the driving wheel to rotate, and the cutting wheel can be further included. The annular diamond wire saw 3 is wound in a wire groove on the middle wheel of the cutting wheel train, and specifically, one side, close to the L direction, of the annular diamond wire saw 3 is a first cutting station 31, and one side, close to the R direction, of the annular diamond wire saw 3 is a second cutting station 32.
Specifically, referring to fig. 1 and 2, a first cutting slot 101 is formed in one side of the wheel train panel 1 close to the first cutting station 31, and a second cutting slot 102 is formed in one side of the wheel train panel close to the second cutting station 32, specifically, the wheel train panel 1 may have an i-shaped outline, and two concave sides of the i-shaped outline are the positions of the first cutting slot 101 and the second cutting slot 102. Can set up the train panel actuating mechanism who is used for the drive panel to remove on the train panel 1, train panel actuating mechanism can be by the motor through modes such as belt, gear and slide rail drive train panel 1 and remove. Meanwhile, the gear train panel 1 can also be fixed on another movable plate in a bolt mode and the like, and the gear train panel 1 is driven by the plate to move.
The clamping mechanisms 4 are respectively arranged on two sides of the wheel train panel 1 and beside the first cutting groove position 101 and the second cutting groove position 102, the clamping mechanisms 4 are used for clamping the silicon crystal bar stocks 2, and the wheel train panel 1 and the clamping mechanisms 4 can move relatively, so that the first cutting station 31 and the second cutting station 32 can respectively cut different silicon crystal bar stocks 2, and specific cutting can be carried out synchronously or sequentially and alternately. The above-mentioned relative movement is mainly a relative movement in the L or R direction. The silicon crystal bar stock 2 to be processed is a long cylinder, and can be cut in multiple sections in the length direction of the silicon crystal bar stock 2 through the annular diamond wire saw 3, and the first cutting station 31 and the second cutting station 32 are specifically the parts of the annular diamond wire saw 3 which are in contact with and cut by the silicon crystal bar stock 2, namely the first cutting station 31 and the second cutting station 32 are used for cutting the silicon crystal bar stock 2.
Referring specifically to fig. 4, the cutting wheel train may specifically include a driven wheel mechanism 12, a driving wheel and a driving mechanism 15, the driven wheel mechanism 12 may specifically refer to a driven wheel without driving force, the driving wheel is connected with the driving mechanism 15 so as to obtain driving force, and the driving mechanism 15 may be a motor or the like for providing driving power. The annular diamond wire saw 3 is annularly wound in a wire groove in the cutting wheel system, the driving mechanism 15 can provide driving force to drive the annular diamond wire saw 3 to rotate, and then the driven wheel mechanism 12 rotates together under the driving of the linear motion of the annular diamond wire saw 3. In addition to providing one set of driving mechanism 15, the cutting wheel train may further include more than two sets of driving mechanisms 15 and more than two driving wheels, wherein the first driving mechanism 151 is in transmission connection with the driving wheel near the first cutting slot 101, and the second driving mechanism 152 is in transmission connection with the driving wheel near the second cutting slot 102. When the silicon ingot 2 is cut at the first cutting station 31, the ring-shaped diamond wire saw 3 is driven to rotate by the first drive mechanism 151, and the second drive mechanism 152 does not provide a driving force. When the silicon ingot 2 is cut at the second cutting station 32, the ring-shaped diamond wire saw 3 is driven to rotate by the second drive mechanism 152, and the first drive mechanism 151 does not provide a driving force. When the ring-shaped diamond wire saw 3 rotates, the diamond wire saw 3 cuts the silicon crystal bar 2 workpiece downwards, and the cutting can be more stable because the acting force of the roller frame and the like for arranging the silicon crystal bar 2 is counteracted.
The ring diamond wire saw 3 can rotate to cut along a clockwise direction or a counterclockwise direction, the first driving mechanism 151 drives one direction, and the second driving mechanism 152 drives the other direction, namely, the cutting rotation direction of the ring diamond wire saw 3 can be switched by the first driving mechanism 151 and the second driving mechanism 152. Specifically, when the first cutting groove 101 is used for cutting, the first driving mechanism 151 drives the circular diamond wire saw 3 to rotate, the second driving mechanism 152 is driven to rotate by the circular diamond wire saw 3 together with the driven wheel mechanism 12 without using a driving force, and at this time, the first driving mechanism 151 drives the circular diamond wire saw to rotate in the counterclockwise direction so that the circular diamond wire saw 3 cuts the silicon crystal bar 2 located at the first cutting station 31 downward.
Referring to fig. 3 and 4 in particular, the wheel train panel 1 is further provided with a tensioning mechanism 11, and the tensioning mechanism 11 is abutted against the outer side of the ring formed by the annular diamond wire saw 3 in a winding way. The length of the annular diamond wire saw 3 is fixed and wound on the wire grooves in the cutting wheel system, and the phenomena of tightness and the like can exist, so that the annular diamond wire saw 3 can be extruded to the inner side along the annular outer side of the annular diamond wire saw 3 through the tensioning mechanism 11, and the annular diamond wire saw 3 is extruded. The tensioning mechanism 11 can tension the circular diamond wire saw 3 through the structure of the tensioning arm 111, for example, a weight can be hung on one end of the tensioning arm 111, and the tensioning arm 111 is pressed down by the gravity of the weight itself to press the circular diamond wire saw 3.
Referring specifically to fig. 1, 3 and 5, cutting of the silicon ingot 2 requires moving the silicon ingot 2 to the cutting station 31 or 32. Specifically, the silicon crystal ingot 2 may be placed on a roller support frame and conveyed to a designated position along a roller support member for cutting, and the roller support frame may convey the silicon crystal ingot 2 in the length direction of the silicon crystal ingot 2, move to the designated position (for example, beside the first cutting station 31), and wait for cutting. Be provided with train panel actuating mechanism on the train panel 1, be provided with the guided way along being on a parallel with 1 direction of train panel, the base of train panel 1 with guided way sliding connection, train panel actuating mechanism can drive train panel 1 cutting train and annular diamond coping saw 3 are followed the guided way removes to make first cutting station 31 and second cutting station 32 successively cut silicon crystal bar 2 that is close to first cutting groove position 101 and is close to second cutting groove position 102 respectively. The guide rails are arranged parallel to the L and R directions. The silicon crystal ingot 2 is conveyed to a specified position (for example, a first cutting station 31) by the roller bracket, and the train wheel panel 1 is driven by the train wheel panel driving device to move along the guide rail (for example, in the L direction) to cut the silicon crystal ingot 2.
Further, the silicon crystal bar stock 2 can be clamped by the clamping mechanism 4 and then moved and conveyed, specifically, the base of the clamping mechanism 4 can be arranged in a first sliding track, the first sliding track is arranged in parallel with the length direction of the silicon crystal bar stock 2, and the clamping mechanism 4 can move along the sliding track so as to drive the silicon crystal bar stock 2 to move along the length direction of the silicon crystal bar stock 2;
the second sliding track is vertically arranged on the first sliding track, the second sliding track is connected with the first sliding track in a sliding mode, and the second sliding track and the clamping mechanism 4 can move along the direction of the first sliding track so as to drive the silicon crystal bar stock 2 to be close to or far away from the first cutting groove position 101 and/or the second cutting groove position 102 to complete cutting.
The gear train panel driving mechanism further comprises a clamping mechanism 4, the clamping mechanism 4 comprises a first clamping assembly 41 and a second clamping assembly 42, the first clamping assembly 41 is close to one side of the first cutting groove position 101, the second clamping assembly 42 is close to one side of the second cutting groove position 102, the clamping mechanism 4 can be a clamping jaw clamping mechanism and other devices, and the clamping mechanism 4 is used for clamping the silicon crystal bar stock 2. The clamping mechanism 4 can move along the length direction of the silicon crystal bar stock 2, namely the clamping mechanism 4 can clamp the silicon crystal bar stock 2 to move along the length direction of the silicon crystal bar stock 2, and further, the clamping mechanism 4 can also move along the length direction vertical to the silicon crystal bar stock 2 as required to realize the movement of the silicon crystal bar stock 2 in the L and R directions. The first clamping assembly 41 and the second clamping assembly 42 can clamp different silicon crystal bar stocks 2 to simultaneously or sequentially perform bidirectional cutting close to the first cutting slot 101 and the second cutting slot 102 respectively.
As shown in fig. 8, a method for bidirectionally cutting a silicon crystal bar stock by using the above-mentioned mechanism for bidirectionally cutting a silicon crystal bar stock comprises the following steps:
s1, operating the first clamping assembly 41 to clamp the first silicon crystal bar 2 to be cut to wait for the cutting of the annular diamond wire saw 3;
s2, operating the second clamping assembly 42 to clamp the second silicon crystal bar 2 to be cut to wait for the cutting of the annular diamond wire saw 3;
s3, starting the driving mechanism 15 to drive the annular diamond wire saw 3 to rotate;
s4, enabling the first cutting station 31 to cut the first silicon crystal bar stock 2 to be cut;
and S5, the second cutting station 32 cuts the second silicon crystal bar stock 2 to be cut.
In the above operation method, the relative movement among the train wheel panel 1, the first clamping assembly 41 and the second clamping assembly 42 can be realized by the movement of the train wheel panel 1, and also can be realized by the movement of the first clamping assembly 41 and the second clamping assembly 42. Namely, the steps S4 and S5 are specifically implemented as follows:
in the first mode, the gear train panel driving mechanism drives the gear train panel 1 to move along the L direction, so that the annular diamond wire saw 3 (namely the first cutting station 31) close to one side of the L direction cuts the first silicon crystal bar 2 to be cut;
through train panel actuating mechanism drives train panel 1 and removes along the R direction, makes the annular diamond wire saw 3 (being second cutting station 32) that is close to R direction one side to the second silicon crystal bar 2 of waiting to cut.
The first cutting station 31 and the second cutting station 32 can alternately move in the directions L and R to cut different silicon crystal bar stocks 2 in the first mode, so that bidirectional cutting is realized.
In the second way, the first silicon crystal bar stock 2 to be cut can be clamped by operating the first clamping assembly 41 and moved to the R direction to be close to the first cutting station 31 for cutting;
the second holding assembly 42 is operated to hold the second silicon crystal ingot 2 to be cut and move in the direction L close to the second cutting station 32 for cutting.
According to the second mode, the first clamping assembly 41 and the second clamping assembly 42 can synchronously or sequentially and alternately drive the silicon crystal bar stock 2 to be clamped to be cut, so that bidirectional simultaneous/alternate cutting is realized.
After performing one cutting pass according to the steps of S1-S5, a plurality of bidirectional cutting passes can be performed in the same manner, and the following operations can be performed before another cutting pass is started after the cutting pass is completed:
s6, operating the first clamping assembly 41 in S1 to drive the first silicon crystal bar 2 to be cut to move forward for a certain distance along the axial direction, wherein the position has a gap after the first round of cutting;
s6, repeating the step S4 to cut;
s7, operating the second clamping assembly 42 in S2 to drive the second silicon crystal bar 2 to be cut to move forward for a certain distance along the axial direction, wherein the position has a gap after the first round of cutting;
s8, repeating the step S5 to cut;
and S9, repeating the steps S1-S8 in a circulating manner to perform cutting.
By the aid of the mode, multi-section cutting of the whole silicon crystal bar 2 can be achieved, bidirectional cutting can be achieved by each section of cutting, and cutting efficiency is improved.
It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present invention.
Claims (11)
1. The bidirectional cutting method for the silicon crystal bar is characterized in that an annular diamond wire saw is used for cutting the silicon crystal bar, a first cutting station is arranged on one side of the annular diamond wire saw, and a second cutting station is arranged on the other side of the annular diamond wire saw;
the bidirectional cutting method of the silicon crystal bar stock comprises the following steps: and clamping a silicon crystal bar stock at the first cutting station and the second cutting station, and cutting the silicon crystal bar stock through the first cutting station and the second cutting station.
2. The method for bidirectionally cutting silicon crystal bar stock as claimed in claim 1, wherein said silicon crystal bar stock is held at said first cutting station and said second cutting station, and said silicon crystal bar stock is cut by said first cutting station and said second cutting station, comprising the steps of:
s1, clamping a silicon crystal bar stock on one side of the annular diamond wire saw, and cutting the silicon crystal bar stock by using the first cutting station;
and S2, clamping another silicon crystal bar stock on the other side of the annular diamond wire saw during the cutting of the first cutting station, and cutting the another silicon crystal bar stock by using the second cutting station after the single cutting of the first cutting station is finished.
3. The method of claim 1, wherein the ring-shaped diamond wire saw is mounted on a cutting wheel train, the cutting wheel train is mounted on a wheel train panel, and the first cutting groove and the second cutting groove are formed at two ends of the wheel train panel;
the cutting train includes a drive mechanism and drive wheel, the annular diamond coping saw encircle set up in the wire casing in the cutting train, the annular diamond coping saw is close to one side of first cutting trench is first cutting station, the annular diamond coping saw is close to one side of second cutting trench is the second cutting station, first cutting station with the second cutting station can cut in turn and be located the different silicon crystal bar stocks of train panel both sides.
4. The method of claim 1, wherein the cutting with the circular diamond wire saw further comprises the following steps:
s12, checking whether the annular diamond wire saw is tensioned or not;
s13, if the annular diamond wire saw is not tensioned, tensioning the annular diamond wire saw through a tensioning mechanism;
wherein, straining device with the annular diamond coping saw offsets around the annular outside of establishing, straining device follows the inboard extrusion tensioning in annular outside of annular diamond coping saw the annular diamond coping saw.
5. The method of claim 3, wherein the step of cutting the silicon crystal ingot through the first cutting station and the second cutting station comprises:
s21, controlling the annular diamond wire saw to move towards a first direction, and enabling the first cutting station to cut the silicon crystal bar stock close to the first cutting groove to cut;
s22, after the first cutting station finishes single cutting, the annular diamond wire saw is controlled to move towards the second direction, so that the second cutting station cuts the silicon crystal bar stock close to the second cutting groove.
6. The method of claim 5, wherein a train wheel panel driving mechanism is provided on the train wheel panel;
the edge is on a parallel with train panel direction is provided with the guided way, the base of train panel with guided way sliding connection, train panel actuating mechanism can drive the train panel cutting train with the annular diamond coping saw is followed the guided way removes, thereby makes first cutting station with the second cutting station is respectively to being close to first cutting trench with be close to the silicon crystal bar material of second cutting trench cuts successively.
7. The method of claim 2 or 3, further comprising a clamping mechanism, wherein the clamping mechanism comprises a first clamping assembly and a second clamping assembly, the first clamping assembly is adjacent to the first cutting slot, and the second clamping assembly is adjacent to the second cutting slot;
the cutting of the silicon crystal bar stock through the first cutting station and the second cutting station specifically comprises the steps of:
s21, clamping a silicon crystal bar stock by the first clamping assembly to be close to the first cutting station for cutting;
s22, clamping another silicon crystal bar stock by the second clamping assembly to be close to the second cutting station for cutting;
the steps S21 and S22 may be performed alternately in sequence or simultaneously.
8. The method according to claim 7, wherein a first slide rail is provided parallel to the length direction of the silicon crystal ingot, and a base of the holding mechanism is provided in the first slide rail, and the holding mechanism is movable along the slide rail to move the silicon crystal ingot in the length direction;
the second sliding rail is vertically arranged on the first sliding rail and is in sliding connection with the first sliding rail, and the second sliding rail and the clamping mechanism can move along the direction of the first sliding rail so as to drive the silicon crystal bar to be close to or far away from the cutting groove to complete cutting.
9. The method for bidirectionally cutting silicon crystal bar stock as claimed in claim 1, wherein said cutting of silicon crystal bar stock by said first cutting station and said second cutting station comprises the steps of:
s21, enabling the first driving mechanism to rotate positively to drive the driving wheel to rotate, and enabling the annular diamond wire saw to rotate clockwise;
s22, the annular diamond wire saw and the silicon crystal bar stock are moved relatively, and the first cutting station is used for cutting the silicon crystal bar stock;
s23, reversely rotating the first driving mechanism, and driving the driving wheel to rotate, so that the annular diamond wire saw rotates in the counterclockwise direction;
and S24, the annular diamond wire saw and the silicon crystal bar stock are moved relatively, and the second cutting station is used for cutting the silicon crystal bar stock.
10. The method of claim 3 or 9 further comprising a second drive mechanism and two drive wheels, wherein said first drive mechanism is drivingly connected to said drive wheels adjacent said first cutting slot; the second driving mechanism is in transmission connection with the driving wheel close to the second cutting groove;
the cutting of the silicon crystal bar stock through the first cutting station and the second cutting station specifically comprises the steps of:
s21, starting the first driving mechanism to rotate forward to drive the driving wheel close to the first cutting groove to rotate, so that the annular diamond wire saw rotates clockwise, and removing a power source connected with the second driving wheel;
s22, the gear train panel and the silicon crystal bar stock are moved relatively, and the first cutting station is used for cutting;
s23, removing a power source connected with the first driving mechanism, and recovering the power source of the second driving mechanism to enable the power source to reversely rotate to drive the driving wheel close to the second cutting groove to rotate so as to enable the annular diamond wire saw to rotate anticlockwise;
and S24, the gear train panel and the silicon crystal ingot are moved relatively, and cutting is carried out by using the second cutting station.
11. The method of claim 1, comprising a roller support for carrying the silicon crystal ingot, wherein the roller support is disposed along the length of the silicon crystal ingot to move the silicon crystal ingot along the length.
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| CN202110565958.5A CN113370406A (en) | 2021-05-24 | 2021-05-24 | Bidirectional cutting method for silicon crystal bar |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114523156A (en) * | 2022-04-21 | 2022-05-24 | 南通宏耀锅炉辅机有限公司 | Thermocouple sleeve cutting machine for boiler temperature measurement |
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Application publication date: 20210910 |