CN215510533U

CN215510533U - Wafer grinding, drying and detecting workbench

Info

Publication number: CN215510533U
Application number: CN202120997658.XU
Authority: CN
Inventors: 周一; 毕洪伟; 彭杰
Original assignee: Weike Saile Microelectronics Co Ltd
Current assignee: Weike Saile Microelectronics Co Ltd
Priority date: 2021-05-11
Filing date: 2021-05-11
Publication date: 2022-01-14
Anticipated expiration: 2031-05-11

Abstract

The utility model relates to the technical field of wafer manufacturing, and discloses a wafer grinding, drying and detecting workbench which comprises a base, wherein a grinding mechanism, a drying area, a wafer taking area and a detecting area are arranged on the base; the drying area comprises a drying groove and a blowing box, the blowing box is connected with an air outlet pipeline, a first blowing pipe and a second blowing pipe are connected to the air outlet pipeline in parallel, the first blowing pipe is communicated with a heater and a first adjusting valve, and the second blowing pipe is provided with a second adjusting valve; a plurality of upper drying pipes and lower drying pipes are communicated in the drying groove, the outlets of the upper drying pipes are arranged at the upper part of the drying groove, the outlets of the lower drying pipes are arranged at the lower part of the drying groove, the upper drying pipes are communicated with the second blowing pipes, and the lower drying pipes are communicated with the first blowing pipes; a spotlight is arranged on the base of the detection area, a piece taking suction pipe is arranged on the piece taking area, and the piece taking suction pipe is communicated with a negative pressure pump. The utility model can dry and detect the ground wafer, avoid the damage of the wafer and increase the qualification rate of the wafer.

Description

Wafer grinding, drying and detecting workbench

Technical Field

The utility model relates to the technical field of wafer manufacturing, in particular to a wafer grinding, drying and detecting workbench.

Background

The wafer is a high-specification precision product, which is expensive to manufacture and is also fragile. In the manufacturing process of the wafer, the steps of grinding, washing, drying, detecting and the like are required; in the process of grinding wafers, grinding disks are generally used for grinding the wafers, wherein the grinding disks are mainly made of nodular cast iron, and the grinding abrasives used are diamond abrasives.

The wafer is ground by the friction between the grinding disc and the grinding material, the friction force can reduce the wafer chipping amount, but the wafer and the grinding material are unstable, and if the grinding material is unevenly dispersed and a small amount of accumulation occurs, the wafer surface can be scratched, so that the wafer surface is damaged, and the standard required by a customer cannot be met. Therefore, after the wafer is ground, the impurities on the surface of the wafer need to be washed clean, then the surface of the wafer needs to be dried, and whether the surface of the wafer is scratched or not is observed and detected. At present, in the process of inspecting the wafer, tools such as a blower, a dial indicator and a spotlight are needed to be used so as to quickly check whether the surface of the wafer meets the requirements, and then judge whether the wafer needs to be reworked.

The patent with the application number of CN201922476624.1 discloses an inspection workbench for the surface state of a silicon wafer after grinding, which comprises a cleaning box body, wherein one end of the cleaning box body is provided with a drying platform frame, the other end of the cleaning box body is provided with an inspection workbench, a lifting support is arranged above the cleaning box body, a cleaning tank is arranged in the cleaning box body, a pesticide spray pipe is arranged in the cleaning tank, a lifting oil cylinder which is in bearing type nested connection with the cleaning tank is arranged between the two ends of the cleaning tank and the lifting support, the pesticide inlet pipe which is communicated with the pesticide spray pipe is arranged on the lifting oil cylinder at one end, a rotating motor which is in bearing type nested connection with the cleaning tank is arranged on the lifting oil cylinder at the other end, a high-brightness color lamp which is fastened with the lifting support through screws is arranged above the inspection workbench, although the detection probability of mechanical damage after grinding is increased, the adverse risk is effectively reduced, but the device is used for drying the wafer in the wafer drying detection process, the damage of the wafer is easily caused, and the qualification rate of the wafer is reduced.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a wafer grinding, drying and inspecting workbench, which can dry and inspect a ground wafer, avoid damage to the wafer, and increase the yield of the wafer.

The utility model solves the technical problems by the following technical means:

a wafer grinding, drying and detecting workbench comprises a base, wherein a grinding mechanism, a drying area, a wafer taking area and a detecting area are arranged on the base; the drying area comprises a drying groove and a blowing box, the blowing box is connected with an air outlet pipeline, a first blowing pipe and a second blowing pipe are connected to the air outlet pipeline in parallel, the first blowing pipe is communicated with a heater and a first adjusting valve, and the second blowing pipe is provided with a second adjusting valve; a plurality of upper drying pipes and lower drying pipes are communicated in the drying groove, the outlet of each upper drying pipe is arranged at the upper part of the drying groove, the outlet of each lower drying pipe is arranged at the lower part of the drying groove, the upper drying pipes are communicated with the second blowing pipes, and the lower drying pipes are communicated with the first blowing pipes; be provided with the spotlight on the base of detection zone, it is provided with on the district and gets the piece straw to get, it has the negative pressure pump to get piece straw intercommunication.

Furthermore, filter screens are arranged on the first air blowing pipe and the second air blowing pipe. The filter screen can filter and clean the impurities of the gas blown out from the blow box, and the impurities are prevented from polluting the wafer.

Further, the cross-sectional area of the upper part of the drying groove is larger than that of the lower part of the drying groove. So, design the drying groove for decurrent inclined plane structure, the setting on inclined plane is convenient for water and is flowed down fast downwards, avoids water gathering in the drying groove.

Further, be provided with the light trough on the base, the bottom fixedly connected with lamp stand of light trough, it has the lamp handle to articulate on the lamp stand, the one end that the lamp stand was kept away from to the lamp handle articulates there is the connecting rod, the one end that the lamp handle was kept away from to the connecting rod is articulated with the spotlight. In the detection process, a spotlight is needed to be used for irradiating the wafer and observing the condition of the surface of the wafer; the spotlight is a three-section hinged structure of the lamp handle, the connecting rod and the spotlight, and when the spotlight is not used, the spotlight can be folded and installed in the lamp groove of the base, so that the spotlight is prevented from being damaged when objects are stored.

Further, the bottom in stoving groove is provided with the logical groove with the stoving groove intercommunication, it is provided with the water receiving case to lead to inslot gliding. The structure of the similar drawer of water receiving tank, gliding setting are in leading to the inslot, when drying, from the gathering of water that leaves on the wafer in the water receiving tank, after blowing, take out its water receiving tank, can fall the water in the water receiving tank to the sanitization, then install in the bottom of stoving groove.

Furthermore, the lamp handle is connected with the lamp holder in a spherical hinge mode. The spherical hinge connection can rotate the direction of the lamp handle, so that the direction angle of the spotlight can be adjusted, and the direction of the spotlight can be conveniently adjusted.

The utility model has the beneficial effects that:

1. according to the utility model, the drying area, the spotlight and the wafer taking area are combined with each other and designed in the grinding workbench, after the wafer is ground, the wafer is taken out, then the wafer is put into the drying groove, the upper surface of the wafer is dried by cold air, and the lower surface of the wafer is dried by hot air, so that the condition that the wafer is damaged due to overlarge wind power caused by directly using a blower is avoided.

2. In the drying process, the wafer surface is dried by adopting an up-and-down blowing and cold-hot alternating blowing mode, the moisture on the wafer surface is quickly gathered and blown downwards by adopting cold air, and then the wafer surface is dried from the lower part by using hot air, so that a small amount of moisture at the bottom of the wafer can be quickly dried.

3. The wafer taking device and the spotlight are arranged on the workbench, so that the surface of the wafer can be detected immediately after the wafer is dried, the phenomenon that the wafer is taken to the detection table for detection is reduced, and the detection time is saved.

Drawings

FIG. 1 is a schematic top view of a wafer polishing, drying and inspecting table according to the present invention;

FIG. 2 is a diagram of the connection among the air outlet duct, the first air blowing pipe, the second air blowing pipe, the upper drying pipe and the lower drying pipe in FIG. 1;

FIG. 3 is a schematic view of a partial cross-sectional structure of the drying slot in FIG. 1;

FIG. 4 is a schematic view of the connection of the spotlight to the base at the detection zone of FIG. 1;

fig. 5 is a schematic view of the spotlight of fig. 4 after stretching.

The device comprises a base 1, a grinding disc 2, a drying groove 3, a blowing box 4, an air outlet pipeline 5, a switch valve 6, a first blowing pipe 7, a second blowing pipe 8, a filter screen 9, a heater 10, a first adjusting valve 11, a second adjusting valve 12, an upper drying pipe 13, a lower drying pipe 14, a water receiving box 15, a lamp groove 16, a lamp holder 17, a lamp handle 18, a connecting rod 19, a spotlight 20, a clamping plug 21 and a piece taking suction pipe 22.

Detailed Description

The utility model will be described in detail below with reference to the following drawings:

as shown in FIGS. 1 to 5

A wafer grinding, drying and detecting workbench comprises a base 1, wherein a grinding mechanism, a drying area, a wafer taking area and a detecting area are arranged on the base 1; the grinding mechanism is the same as the 2-type grinding mechanism of the grinding disc which is commonly used at present, and the description is omitted here. Grinding disk 2 sets up in the middle part of base 1, and the drying zone setting is in the left side of grinding disk 2, gets piece district and detection zone setting on the right side of grinding disk 2.

The drying area comprises a drying groove 3 and a blowing box 4, the blowing box 4 of the embodiment is blown nitrogen, the blowing box 4 is connected with an air outlet pipeline 5, a switch valve 6 is arranged on the air outlet pipeline 5, the air outlet pipeline 5 is connected with a first blowing pipe 7 and a second blowing pipe 8 through a three-way pipe, filter screens 9 are arranged on the first blowing pipe 7 and the second blowing pipe 8, the first blowing pipe 7 is communicated with a heater 10 and a first regulating valve 11, and the second blowing pipe 8 is provided with a second regulating valve 12; four upper drying pipes 13 and two lower drying pipes 14 are communicated in the drying groove 3, the outlet of the upper drying pipe 13 is arranged at the upper part of the drying groove 3, the outlet of the lower drying pipe 14 is arranged at the lower part of the drying groove 3, the upper drying pipe 13 is communicated with the second blowing pipe 8, and the lower drying pipe 14 is communicated with the first blowing pipe 7. The cross-sectional area of the upper part of the drying tub 3 is larger than that of the lower part of the drying tub 3. The bottom of drying groove 3 is provided with the logical groove that communicates with drying groove 3, leads to the inslot gliding water receiving tank 15 that is provided with.

Be equipped with light trough 16 on the base 1 of detection zone, bolt fixedly connected with lamp stand 17 is passed through to light trough 16's bottom, and it has lamp handle 18 to articulate on the lamp stand 17, and the one end that lamp handle 18 kept away from lamp stand 17 articulates there is connecting rod 19, and the one end that lamp handle 18 was kept away from to connecting rod 19 articulates there is spotlight 20, and wherein, lamp handle 18 is connected for the ball pivot with lamp stand 17's articulated mode.

The sheet taking area is provided with a sheet taking suction pipe 22, and the sheet taking suction pipe 22 is communicated with a negative pressure pump.

The using method of the utility model is as follows:

in the wafer polishing, the wafer is placed on the polishing disk 2 and polished, and after the polishing is completed, the chuck 21 is placed in the baking bath 3, and then the wafer is placed on the chuck 21.

Then the switch valve 6 and the second regulating valve 12 are opened, the first regulating valve 11 is closed, nitrogen enters the second blowing pipe 8 from the air outlet pipeline 5, is filtered by the filter screen 9, and then blows out cold air from the four upper drying pipes 13, the cold air quickly gathers moisture on the upper surface of the wafer and blows the moisture downwards, and the water flows downwards into the water receiving tank 15 below the drying groove 3.

And opening the first regulating valve 11, closing the second regulating valve 12, opening the heater 10, introducing nitrogen into the first air blowing pipe 7 from the air outlet pipeline 5, filtering by the filter screen 9, blowing hot air out of the two lower drying pipes 14 to evaporate a small amount of water possibly existing on the lower surface of the wafer, and after the wafer is dried, closing the switch valve 6, the first regulating valve 11 and the heater 10.

After the wafer is dried, the chuck 21 and the wafer are taken out, the wafer is required to be taken out separately when the wafer is inspected, the wafer is inserted into a gap between the wafers by using a suction tube 22 during the taking-out process, the wafer is sucked out of the chuck 21 by the operation of a negative pressure pump, the wafer is irradiated by using a spotlight 20, and the condition of the surface of the wafer is observed and inspected.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the utility model as defined in the appended claims. The techniques, shapes, and configurations not described in detail in the present invention are all known techniques.

Claims

1. A wafer grinding, drying and detecting workbench comprises a base, wherein a grinding mechanism, a drying area, a wafer taking area and a detecting area are arranged on the base; the method is characterized in that: the drying area comprises a drying groove and a blowing box, the blowing box is connected with an air outlet pipeline, a first blowing pipe and a second blowing pipe are connected to the air outlet pipeline in parallel, the first blowing pipe is communicated with a heater and a first adjusting valve, and the second blowing pipe is provided with a second adjusting valve; a plurality of upper drying pipes and lower drying pipes are communicated in the drying groove, the outlet of each upper drying pipe is arranged at the upper part of the drying groove, the outlet of each lower drying pipe is arranged at the lower part of the drying groove, the upper drying pipes are communicated with the second blowing pipes, and the lower drying pipes are communicated with the first blowing pipes; be provided with the spotlight on the base of detection zone, it is provided with on the district and gets the piece straw to get, it has the negative pressure pump to get piece straw intercommunication.

2. The wafer grinding, drying and detecting workbench according to claim 1, characterized in that: and filter screens are arranged on the first air blowing pipe and the second air blowing pipe.

3. The wafer grinding, drying and detecting workbench according to claim 2, characterized in that: the cross-sectional area of the upper part of the drying groove is larger than that of the lower part of the drying groove.

4. The wafer grinding, drying and detecting workbench according to claim 1, characterized in that: be provided with the light trough on the base, the bottom fixedly connected with lamp stand of light trough, it has the lamp handle to articulate on the lamp stand, the one end that the lamp stand was kept away from to the lamp handle articulates there is the connecting rod, the one end that the lamp handle was kept away from to the connecting rod is articulated with the spotlight.

5. The wafer grinding, drying and detecting workbench according to claim 4, wherein: the bottom in stoving groove is provided with the logical groove that communicates with the stoving groove, it is provided with the water receiving case to lead to inslot gliding.

6. The wafer grinding, drying and detecting workbench according to claim 4, wherein: the lamp handle is connected with the lamp holder in a spherical hinge mode.