CN215502439U - Heat insulation assembly of electronic component and cooking utensil - Google Patents
Heat insulation assembly of electronic component and cooking utensil Download PDFInfo
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- CN215502439U CN215502439U CN202121827375.7U CN202121827375U CN215502439U CN 215502439 U CN215502439 U CN 215502439U CN 202121827375 U CN202121827375 U CN 202121827375U CN 215502439 U CN215502439 U CN 215502439U
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Abstract
The utility model discloses a heat insulation assembly of an electronic component, which comprises a shell with a heat insulation function, wherein a heating assembly is arranged in the shell, a support is arranged on the outer wall of the shell, an accommodating part is arranged on the support, and the electronic component is fixed in the accommodating part. Still disclose a cooking utensil, including outer pot, be provided with like above in the outer pot electronic components's thermal-insulated subassembly. According to the heat insulation assembly of the electronic component and the cooking utensil, the injection molded shell is arranged, the display board and the main board are respectively fixed on the side wall of the shell, so that circuit boards such as the main board and the display board are effectively isolated from a heat source, and the circuit boards are prevented from being damaged due to overheating.
Description
Technical Field
The utility model belongs to the technical field of household appliances, and particularly relates to a heat insulation assembly of an electronic component and a cooking appliance.
Background
With the improvement of living standard of people, products of cooking appliances such as various electric cookers, ovens, air fryer and the like are more abundant.
The display interface of the existing electric cooker is generally arranged at a cooker body, a display panel and a main board of the electric cooker are respectively arranged on a fixing support for fixing, and the cooker body of the electric cooker is not provided with a heat insulation support, and the display panel and the main board work under the high-temperature environment and cannot be effectively isolated from a heat source. The display panel and the main board are affected by heat sources for a long time, and the risk of damage of the used components exists.
Therefore, it is desirable to design a heat insulation assembly for electronic components and a cooking utensil to solve the above-mentioned problem of damage to the components.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem of damage of components used in a cooking appliance, the utility model provides a heat insulation assembly of electronic components and the cooking appliance, and aims to solve the problem that a display board and a main board in the cooking appliance are not damaged.
In order to achieve the purpose, the specific technical scheme of the heat insulation assembly of the electronic component is as follows:
the utility model provides an electronic components's thermal-insulated subassembly, is provided with heating element including the casing that has thermal-insulated function in the casing, is provided with the support on the outer wall of casing, is provided with the portion of holding on the support, and electronic components fixes in the portion of holding.
Furthermore, one side of the accommodating part is provided with a clamping part, the other side of the accommodating part is provided with a fixing part, one end of the electronic component and the clamping part are pre-fixed, and the other end of the electronic component and the fixing part are fixed, so that the electronic component is fixed on the support.
Further, a fixing buckle is convexly arranged on the outer wall of the shell, and a clamping groove is formed in the side wall of the fixing buckle; the fixing part comprises a fixing block and a screw column which are arranged at the bottom end of the support, the side wall of the electronic component slides to the fixing block through a clamping groove, the electronic component is abutted against the fixing block, and the electronic component is fixed on the support through a screw.
Furthermore, the clamping part comprises an elastic buckle, the fixing part comprises a fixed buckle and a screw column, the elastic buckle and the fixed buckle are arranged oppositely, the elastic buckle and the fixed buckle are arranged to protrude out of the outer wall of the shell, and a groove is formed in one side, opposite to the fixed buckle, of the elastic buckle; the fixed part is including setting up the fixed block in the support bottom, and electronic components's relative both sides wall inserts through the recess and slides to the fixed block, and electronic components's bottom and fixed block looks butt to it is fixed with electronic components and support.
Furthermore, one side of the fixed buckle is provided with a positioning rib, a clamping hole is formed in the electronic component, and the clamping hole of the electronic component is clamped and fixed with the positioning rib.
Further, the support is formed with square holding tank, and electronic components fixes in square holding tank.
Further, the housing is made of an injection molded material.
Further, the shell and the bracket are of an integrally formed structure.
Further, electronic components includes display panel and mainboard, and the mainboard is fixed to be set up on the outer wall of casing, and the display panel is fixed to be set up in the holding portion that the support formed.
A cooking utensil comprises an outer pot, wherein the heat insulation assembly of the electronic component is arranged in the outer pot.
The heat insulation assembly of the electronic component has the following advantages that:
(1) according to the heat insulation assembly of the electronic component and the cooking utensil, the injection molded shell is arranged, the display board and the main board are respectively fixed on the side wall of the shell, so that circuit boards such as the main board and the display board are effectively isolated from a heat source, and the circuit boards are prevented from being damaged due to overheating.
(2) Through setting up mainboard, display panel simultaneously on the casing, reduce the support of fixed mainboard and display panel, set up mainboard and display panel and casing integrated into one piece, reduce part quantity, reduce cost.
Drawings
FIG. 1 is a schematic view of the overall structure of a first embodiment of a heat shield assembly for an electronic component according to the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a front view of a first embodiment of a thermal shield assembly for an electronic component of the present invention;
FIG. 4 is a schematic view showing the overall structure of a second embodiment of the heat shield assembly for an electronic component according to the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4;
fig. 6 is a schematic view showing the overall structure of a third embodiment of the heat shield assembly for electronic components according to the present invention.
The notation in the figure is:
1. a housing; 2. fixing the buckle; 3. positioning ribs; 4. a screw post; 5. elastic buckle; 6. accommodating grooves; 7. a fixed part; 8. and (5) fixing blocks.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical features mentioned in the different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other.
The heat insulation assembly for electronic components and the cooking utensil of the present invention will be described with reference to fig. 1 to 6.
The utility model provides a heat insulation assembly of an electronic component, and particularly, the heat insulation assembly of the electronic component can be applied to a cooking utensil, and of course, the electronic component can also be arranged in other application fields, and is not particularly limited herein. In the field of cooking appliances, such as electric cookers, electric pressure cookers and the like, electronic components are arranged in the main cooking appliances. Use electric rice cooker as an example, current electronic components sets up on electric rice cooker, electric rice cooker includes the outer pot of interior pot, interior pot and outer pot are the metal material, interior pot is placed in the outer pot, the bottom of outer pot sets up heating element, thereby heating element heats interior pot, electronic components generally fixes on outer pot through the support, at this moment, heating element starts, heating element transmits the heat to electronic components through the interior pot of metal material on, electronic components works under the bad border of high temperature, do not effectively keep apart the heat source with the heat source, electronic components is heated for a long time, there is the risk that makes component damage.
The electronic component provided by the present invention is mainly a display panel and a main board, and may be other components, which is not specifically limited herein. The embodiment of the utility model mainly integrates the display panel and the main board on the shell 1.
The heat insulation assembly for the electronic component provided by the utility model provides specific explanation of three embodiments, and the three embodiments are respectively explained below.
As shown in fig. 1 to 3, a first embodiment of a heat insulation assembly for an electronic component according to the present invention is disclosed.
Specifically, electronic components's thermal-insulated subassembly is provided with heating element including the casing that has thermal-insulated function, casing 1's bottom surface, is provided with the support on casing 1's the outer wall, is provided with the portion of holding on the support, and electronic components sets up in the portion of holding. The injection-molded housing 1 is made of a material that is generally thermally insulating, mainly to prevent heat generated by the heating assembly from being transferred to the electronic components. Of course, the material of the housing 1 is not limited to the injection-molded housing 1, and the non-conductive metal housing 1 may be used as long as it can block the heating generated by the heating assembly, and is not particularly limited herein.
Further, the casing 1 with the heat insulation function can be an injection molding casing 1, and can also be provided with double-side metal partition plates, and the double-layer metal partition plates are provided with cavities, so that the casing 1 with the heat insulation function has the heat insulation function for materials, or has the heat insulation function in structure.
Further, one side of the accommodating part is provided with a clamping part, the other side of the accommodating part is provided with a fixing part 7, and after one end of the electronic component and the clamping part are pre-fixed, the other end of the electronic component and the fixing part 7 are fixed, so that the electronic component is fixed on the support.
Specifically, the clamping part comprises a fixed buckle 2, the fixed buckle 2 is arranged to protrude out of the outer wall of the shell 1, and a clamping groove is formed in the side wall of the fixed buckle 2; the bottom that fixed part 7 includes the support is provided with fixed block 8, and electronic components's lateral wall passes through the draw-in groove and slides to fixed block 8, and electronic components and fixed block 8 looks butt to it is fixed with electronic components and support joint.
Further, fixed part 7 still includes screw post 4, is provided with the internal thread on the screw post 4, through screw with electronic components and screw post 4 fixed connection to set up electronic components in the portion of holding of support is fixed.
Specifically, the fixed buckle 2 protrudes out of the outer wall of the shell 1, and the height of the fixed buckle 2 is greater than that of the screw column 4.
Preferably, the fixing block 8 is in an L shape, and one side wall of the fixing block 8 is fixedly connected with the bottom wall of the housing 1, so that the other side wall of the fixing block 8 is abutted to the electronic component.
As shown in fig. 4 and 5, a second embodiment of the heat insulation assembly for electronic components provided by the utility model is disclosed.
Concretely, electronic components's thermal-insulated subassembly is provided with heating element including casing 1 of moulding plastics, the bottom surface of casing 1 of moulding plastics, is provided with the support on casing 1's the outer wall, is provided with the portion of holding on the support, and electronic components sets up in the portion of holding.
Further, one side of the accommodating part is provided with a clamping part, the other side of the accommodating part is provided with a fixing part 7, and after one end of the electronic component and the clamping part are pre-fixed, the other end of the electronic component and the fixing part 7 are fixed, so that the electronic component is fixed on the support.
Furthermore, the clamping part comprises an elastic buckle 5, the fixing part 7 comprises a fixed buckle 2, the elastic buckle 5 and the fixed buckle 2 are arranged oppositely, the elastic buckle 5 and the fixed buckle 2 are arranged to protrude out of the outer wall of the shell 1, a groove is arranged on one side of the elastic buckle 5 opposite to the fixed buckle 2, one end of the electronic component is clamped with the groove of the fixed buckle 2, and the other end of the electronic component is clamped and fixed with the elastic buckle 5; the fixing part 7 comprises a fixing block 8 arranged at the bottom of the support, two opposite side walls of the electronic component are inserted into the fixing block 8 through grooves and slide to the fixing block 8, and the bottom end of the electronic component is abutted to the fixing block 8, so that the electronic component and the support are fixed.
Furthermore, one side of the fixed buckle 2 is provided with a positioning rib 3, a clamping hole is formed in the electronic component, and the clamping hole of the electronic component is fixedly connected with the positioning rib 3 in a clamping mode.
Specifically, when assembling electronic components on the support, with electronic components's one end and the draw-in groove of fixed buckle 2 to the joint, another lateral wall of electronic components and the recess of elasticity buckle 5 are buckled mutually to fix electronic components on the support.
As shown in fig. 6, a third embodiment of the heat insulation assembly for electronic components according to the present invention is disclosed.
Concretely, electronic components's thermal-insulated subassembly is provided with heating element including casing 1 of moulding plastics, the bottom surface of casing 1 of moulding plastics, is provided with the support on casing 1's the outer wall, is provided with the portion of holding on the support, and electronic components sets up in the portion of holding.
Further, one side of the accommodating part is provided with a clamping part, the other side of the accommodating part is provided with a fixing part 7, and after one end of the electronic component and the clamping part are pre-fixed, the other end of the electronic component and the fixing part 7 are fixed, so that the electronic component is fixed on the support.
Further, the support is formed with square holding tank 6, and electronic components fixes in square holding tank 6. The shape of the square receiving groove 6 is adapted to the shape of the display panel, however, the shape of the receiving groove 6 may be configured in other shapes, and is not limited in detail.
Furthermore, the clamping part comprises an elastic buckle 5, the fixing part 7 comprises a fixed buckle 2, the elastic buckle 5 and the fixed buckle 2 are arranged oppositely, the elastic buckle 5 and the fixed buckle 2 are arranged to protrude out of the outer wall of the shell 1, a groove is arranged on one side of the elastic buckle 5 opposite to the fixed buckle 2, one end of the electronic component is clamped with the groove of the fixed buckle 2, and the other end of the electronic component is clamped and fixed with the elastic buckle 5; the fixing part 7 comprises a fixing block 8 arranged at the bottom of the support, two opposite side walls of the electronic component are inserted into the fixing block 8 through grooves and slide to the fixing block 8, and the bottom end of the electronic component is abutted to the fixing block 8, so that the electronic component and the support are fixed. Fixed buckle 2 sets up in one side of holding tank 6, and one side of fixed buckle 2 is provided with the reference column, and screw post 4 sets up the opposite side at holding tank 6. When one end of the electronic component is clamped with the fixing buckle 2, the other end of the electronic component is fixedly connected with the screw column 4.
Further, the housing 1 and the bracket are of an integrally formed structure. Electronic components includes display panel and mainboard, and the mainboard is fixed to be set up on the outer wall of casing 1, and the display panel is fixed to be set up in the holding portion that the support formed.
The heat insulation assembly of the electronic component is specifically explained through three embodiments, the display board and the main board are respectively fixed on the side wall of the shell 1 by arranging the injection molding shell 1, and the circuit boards such as the main board and the display board are effectively isolated from a heat source, so that the circuit boards are prevented from being damaged due to overheating. Through setting up mainboard, display panel simultaneously on casing 1, reduce the support of fixed mainboard and display panel, set up mainboard and display panel and casing 1 integrated into one piece, reduce part quantity, reduce cost.
In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. The utility model provides an electronic components's thermal-insulated subassembly which characterized in that, is provided with heating element including the casing that has thermal-insulated function in the casing, is provided with the support on the outer wall of casing, is provided with the portion of holding on the support, and electronic components fixes in the portion of holding.
2. The heat insulation assembly for the electronic component as claimed in claim 1, wherein the accommodating portion is provided with a locking portion at one side thereof and a fixing portion at the other side thereof, and one end of the electronic component is pre-fixed to the locking portion and the other end thereof is fixed to the fixing portion, thereby fixing the electronic component to the bracket.
3. The heat insulation assembly for the electronic component as claimed in claim 2, wherein a fixing buckle is convexly arranged on the outer wall of the shell, and a clamping groove is formed in the side wall of the fixing buckle; the fixing part comprises a fixing block and a screw column which are arranged at the bottom end of the support, the side wall of the electronic component slides to the fixing block through a clamping groove, the electronic component is abutted against the fixing block, and the electronic component is fixed on the support through a screw.
4. The heat insulation assembly for the electronic component as claimed in claim 2, wherein the engaging portion comprises an elastic buckle, the fixing portion comprises a fixing buckle and a screw column, the elastic buckle and the fixing buckle are oppositely arranged, the elastic buckle and the fixing buckle are protruded out of the outer wall of the shell, and a groove is formed in one side of the elastic buckle opposite to the fixing buckle; the fixed part is including setting up the fixed block in the support bottom, and electronic components's relative both sides wall inserts through the recess and slides to the fixed block, and electronic components's bottom and fixed block looks butt to it is fixed with electronic components and support.
5. The heat insulation assembly of the electronic component as claimed in claim 3 or 4, wherein one side of the fixing buckle is provided with a positioning rib, the electronic component is provided with a clamping hole, and the clamping hole of the electronic component is clamped and fixed with the positioning rib.
6. A thermal insulation assembly for an electronic component as claimed in claim 2, wherein the holder is formed with a square-shaped receiving groove, and the electronic component is fixed in the square-shaped receiving groove.
7. A thermal isolation assembly for electronic components as claimed in claim 1, wherein the housing is made of an injection molded material.
8. A thermal insulating assembly for electronic components as claimed in claim 1, wherein the housing and the support are of one-piece construction.
9. The heat insulation assembly for the electronic component as claimed in claim 1, wherein the electronic component includes a display panel and a main board, the main board is fixedly disposed on an outer wall of the housing, and the display panel is fixedly disposed in the receiving portion formed by the bracket.
10. A cooking appliance comprising an outer pot in which a heat insulation assembly of an electronic component as claimed in any one of claims 1 to 9 is disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121827375.7U CN215502439U (en) | 2021-08-05 | 2021-08-05 | Heat insulation assembly of electronic component and cooking utensil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121827375.7U CN215502439U (en) | 2021-08-05 | 2021-08-05 | Heat insulation assembly of electronic component and cooking utensil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215502439U true CN215502439U (en) | 2022-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121827375.7U Active CN215502439U (en) | 2021-08-05 | 2021-08-05 | Heat insulation assembly of electronic component and cooking utensil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215502439U (en) |
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2021
- 2021-08-05 CN CN202121827375.7U patent/CN215502439U/en active Active
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