CN215493751U

CN215493751U - Pre-assembly clamp of spring probe for testing semiconductor chip

Info

Publication number: CN215493751U
Application number: CN202122052144.XU
Authority: CN
Inventors: 吉小飞
Original assignee: Suzhou Dick Microelectronics Co ltd
Current assignee: Suzhou Dick Microelectronics Co ltd
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2022-01-11
Anticipated expiration: 2031-08-27

Abstract

The utility model discloses a pre-assembly fixture of a spring probe for testing a semiconductor chip, which comprises an arrangement plate, a guide plate and a bottom plate, wherein the surface of the arrangement plate is provided with an arrangement groove, and the arrangement groove is used for placing parts to be assembled; the bottom plate is provided with a fixing groove for fixing parts; the guide plate is provided with a guide through hole, the upper end of the guide through hole is connected with the arrangement groove, and the lower end of the guide through hole is connected with the fixing groove. The horizontal cross-sectional area of the upper end of the guide through hole is larger than or equal to the horizontal cross-sectional area of the arrangement groove, and the horizontal cross-sectional area of the lower end of the guide through hole is smaller than or equal to the horizontal cross-sectional area of the upper surface of the fixing groove. The preassembly fixture disclosed by the utility model utilizes three plastic plates, namely the arrangement plate, the guide plate and the bottom plate, to form a set of preassembly fixture which can be recycled, has a simple structure, and greatly improves preassembly efficiency.

Description

Pre-assembly clamp of spring probe for testing semiconductor chip

Technical Field

The utility model relates to an assembly clamp, in particular to a preassembly clamp of a spring probe for a semiconductor chip test.

Background

The spring probe is internally provided with a precise spring structure which comprises a needle head, a spring and a needle tube. Due to the special structure and size of the spring probe, the process of forming the finished probe by processing and assembling all the components in batches is complex, wherein pre-assembly is a very important link, how to quickly and efficiently complete the pre-assembly is achieved, and the capacity and the cost of a manufacturing plant are directly determined. The traditional preassembly requires manual operation by workers at present, has low efficiency and seriously influences the capacity of a factory.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above disadvantages, an object of the present invention is to provide a pre-assembly fixture for a spring probe for testing a semiconductor chip, which can effectively improve pre-assembly efficiency, increase productivity of a manufacturing plant, and save cost.

In order to achieve the above purposes, the utility model adopts the technical scheme that: a pre-assembly fixture of a spring probe for testing a semiconductor chip comprises an arrangement plate, a guide plate and a bottom plate, wherein an arrangement groove is formed in the surface of the arrangement plate and used for placing parts to be assembled; the bottom plate is provided with a fixing groove for fixing parts; the guide plate is provided with a guide through hole, the upper end of the guide through hole is connected with the arrangement groove, and the lower end of the guide through hole is connected with the fixing groove.

Furthermore, the horizontal cross-sectional area of the upper end of the guide through hole is larger than or equal to the horizontal cross-sectional area of the arrangement groove, and the horizontal cross-sectional area of the lower end of the guide through hole is smaller than or equal to the horizontal cross-sectional area of the upper surface of the fixing groove.

Further, the guide through hole comprises a first through hole and a second through hole, the first through hole is connected with the fixing groove, the second through hole is connected with the first through hole, and the cross sectional area of the upper end of the second through hole in the horizontal direction is larger than that of the lower end of the second through hole in the horizontal direction.

Furthermore, the guide through hole further comprises a third through hole, the third through hole is connected with the second through hole, and the cross sectional area of the third through hole in the horizontal direction is larger than that of the second through hole in the horizontal direction.

Further, the guide plate comprises a first guide plate and a second guide plate, the first guide plate is connected with the arrangement plate, and the second guide plate is connected with the bottom plate.

Furthermore, the upper surface of the first guide plate is provided with a protruding part, the lower surface of the arrangement plate is provided with a groove, and the size and the position of the protruding part correspond to those of the groove.

Furthermore, the cross section area of the second through hole in the vertical direction is a right trapezoid, the upper bottom of the right trapezoid is connected with the first through hole, and the lower bottom of the right trapezoid is connected with the third through hole.

The pre-assembling fixture has the beneficial effects that the pre-assembling fixture capable of being recycled is formed by three plastic plates, the structure is simple, and the pre-assembling efficiency is greatly improved.

Drawings

FIG. 1 is a perspective view of a fixture for spring probe pre-assembly in accordance with a preferred embodiment of the present invention;

FIG. 2 is a perspective view of an alignment plate according to a preferred embodiment of the present invention;

FIG. 3 is a perspective view of the fixture for spring probe pre-assembly with the alignment plate removed in accordance with a preferred embodiment of the present invention;

FIG. 4 is a cross-sectional view of a fixture for spring probe pre-assembly in accordance with a preferred embodiment of the present invention.

In the figure: 1. arranging the plates; 11. arranging grooves; 12. a groove; 2. a guide plate; 21. a guide through hole; 211. a first through hole; 212. a second through hole; 213. a third through hole; 22. a first guide plate; 23. a second guide plate; 24. a boss portion; 3. a base plate; 31. and fixing the grooves.

Detailed Description

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.

Referring to fig. 1-4, the preassembly fixture of the spring probe for testing a semiconductor chip in the embodiment includes an arrangement plate 1, a guide plate 2 and a bottom plate 3, wherein a protruding portion 24 is disposed on an upper surface of the guide plate 2, a groove 12 is disposed on a lower surface of the arrangement plate 1, the protruding portion 24 corresponds to the groove 12 in size and position, and the arrangement tube is positioned by the protruding portion 24 and the groove 12. The surface of the arrangement plate 1 is provided with an arrangement groove 11, and the arrangement groove 11 is used for placing parts to be assembled; the bottom plate 3 is provided with a fixing groove 31 for fixing parts; the guide plate is provided with a guide through hole 21, the upper end of the guide through hole 21 is connected with the arrangement groove 11, and the lower end of the guide through hole 21 is connected with the fixing groove 31. In operation, the component is first placed in the arrangement groove 11, and the component falls into the fixing groove 31 through the guide hole 21. The shape of the upper end of the guide hole 21 is similar to that of the arrangement groove 11, the horizontal cross-sectional area of the upper end of the guide through hole 21 is larger than or equal to that of the arrangement groove 11, and the horizontal cross-sectional area of the lower end of the guide through hole 21 is smaller than or equal to that of the upper surface of the fixing groove 31. The deflector divide into first deflector 22 and second deflector 23, first deflector 22 with arrange board 1 and connect, second deflector 23 with bottom plate 3 is connected, if some spare parts card is in direction through-hole 21, can make the smooth landing of spare part to the fixed slot 31 in through the first deflector 22 of translation under the thrust of first deflector lateral wall.

The guide through hole 21 of the present embodiment includes a first through hole 211 and a second through hole 212, the first through hole 211 is connected to the fixing groove 31, the second through hole 212 is connected to the first through hole 211, and a horizontal cross-sectional area of an upper end of the second through hole 212 is larger than a horizontal cross-sectional area of a lower end of the second through hole 212. Further, the guiding through hole 21 further includes a third through hole 213, the third through hole 213 is connected to the second through hole 212, and a horizontal cross-sectional area of the third through hole 213 is larger than a horizontal cross-sectional area of the second through hole 212. The cross-sectional area of the second through hole 212 in the vertical direction is a right trapezoid, the upper bottom of the right trapezoid is connected with the first through hole 211, and the lower bottom of the right trapezoid is connected with the third through hole 213.

The working process is as follows: placing the parts on the arrangement plate 1, enabling the parts meeting the conditions to fall into the arrangement groove 11, making the arrangement groove 11 with the contour similar to that of the parts on the arrangement plate, taking away the parts which do not fall into the arrangement groove 11, and further completing the large-scale screening of the parts. The guide plate 2 is covered on the arrangement plate 1, and then covered with the bottom plate 3 to form a sandwich structure. The vertical direction is turned for 180 degrees, the whole fixture is vibrated and knocked, so that the parts in the arrangement plate 1 can slide into the bottom plate 3 along the guide through holes 21 of the guide plate under the action of gravity, the arrangement plate 1 and the guide plate 2 are removed, and the parts are left in the fixing grooves 31 of the bottom plate 3 to finish the preassembly work.

The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. The pre-assembly fixture of the spring probe for the semiconductor chip test is characterized by comprising an arrangement plate (1), a guide plate (2) and a bottom plate (3), wherein an arrangement groove (11) is formed in the surface of the arrangement plate (1), and the arrangement groove (11) is used for placing parts to be assembled; the bottom plate (3) is provided with a fixing groove (31) for fixing parts; the guide plate is provided with a guide through hole (21), the upper end of the guide through hole (21) is connected with the arrangement groove (11), and the lower end of the guide through hole (21) is connected with the fixing groove (31).

2. The pre-assembly jig of spring probe for testing semiconductor chips as claimed in claim 1, wherein the horizontal cross-sectional area of the upper end of the guide through-hole (21) is equal to or greater than the horizontal cross-sectional area of the alignment groove (11), and the horizontal cross-sectional area of the lower end of the guide through-hole (21) is equal to or less than the horizontal cross-sectional area of the upper surface of the fixing groove (31).

3. The pre-assembly jig of a spring probe for testing a semiconductor chip according to claim 1, wherein the guide through hole (21) comprises a first through hole (211) and a second through hole (212), the first through hole (211) is connected to the fixing groove (31), the second through hole (212) is connected to the first through hole (211), and a horizontal cross-sectional area of an upper end of the second through hole (212) is larger than a horizontal cross-sectional area of a lower end of the second through hole (212).

4. The pre-assembly fixture of a spring probe for testing a semiconductor chip as claimed in claim 3, wherein the guiding through hole (21) further comprises a third through hole (213), the third through hole (213) is connected with the second through hole (212), and the horizontal cross-sectional area of the third through hole (213) is larger than the horizontal cross-sectional area of the second through hole (212).

5. The pre-assembly jig of the spring probe for testing the semiconductor chip as set forth in claim 4, wherein the guide plate (2) is divided into a first guide plate (22) and a second guide plate (23), the first guide plate (22) is connected to the array plate (1), and the second guide plate (23) is connected to the base plate (3).

6. The pre-assembly fixture of the spring probe for testing the semiconductor chip as claimed in claim 5, wherein the guiding plate (2) is provided with a protruding portion (24) on the upper surface, the arrangement plate (1) is provided with a groove (12) on the lower surface, and the size and the position of the protruding portion (24) correspond to those of the groove (12).

7. The pre-assembly fixture of a spring probe for testing a semiconductor chip as set forth in claim 6, wherein the second through hole (212) has a right trapezoid cross-sectional area in a vertical direction, an upper base of the right trapezoid is connected to the first through hole (211), and a lower base of the right trapezoid is connected to the third through hole (213).