CN215493291U - Gas sensor - Google Patents
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- CN215493291U CN215493291U CN202121540628.2U CN202121540628U CN215493291U CN 215493291 U CN215493291 U CN 215493291U CN 202121540628 U CN202121540628 U CN 202121540628U CN 215493291 U CN215493291 U CN 215493291U
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- 239000000463 material Substances 0.000 claims abstract description 141
- 238000010438 heat treatment Methods 0.000 claims abstract description 73
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- 239000007789 gas Substances 0.000 claims description 272
- 238000007084 catalytic combustion reaction Methods 0.000 claims description 13
- 239000000567 combustion gas Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 abstract description 10
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000011540 sensing material Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- 229910052707 ruthenium Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
The utility model discloses a gas sensor, relates to the technical field of gas detection, and is used for improving the compatibility of the gas sensor to gas-sensitive material layers made of different materials, thereby being beneficial to expanding the application range of the gas sensor. The gas sensor includes: a substrate and a sensing structure. The substrate is provided with a groove. The sensing structure is disposed on the substrate. The sensing structure comprises a heating plate, a gas-sensitive electrode and a gas-sensitive material layer. Wherein, the gas sensitive material layer is formed on the heating plate and is positioned above the groove. The gas-sensitive electrode is positioned between the gas-sensitive material layer and the heating plate and is used for measuring the resistance of the gas-sensitive material layer. A temperature measuring element is arranged in the heating plate and used for acquiring the temperature of the gas sensitive material layer.
Description
Technical Field
The utility model relates to the technical field of gas detection, in particular to a gas sensor.
Background
A gas sensor is a transducer that converts a certain gas volume fraction into a corresponding electrical signal. Specifically, when the gas sensor contacts the gas to be detected, the gas to be detected can be responded, sensed and analyzed, after a period of physical or chemical reaction, the non-electrical signal parameter information of the gas to be detected, such as gas type, gas composition, gas concentration and the like, can be converted into output in the form of an electrical signal through a certain conversion relation, and corresponding information can be obtained in a mode of reading a certain signal parameter of the electrical signal.
However, the compatibility of the conventional gas sensor is low, which is not favorable for the application of the gas sensor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a gas sensor, which is used for improving the compatibility of the gas sensor to gas sensitive material layers made of different materials, and is further beneficial to expanding the application range of the gas sensor.
In order to achieve the above object, the present invention provides a gas sensor comprising: a substrate and a sensing structure. The substrate is provided with a groove. The sensing structure is disposed on the substrate. The sensing structure comprises a heating plate, a gas-sensitive electrode and a gas-sensitive material layer. Wherein, the gas sensitive material layer is formed on the heating plate and is positioned above the groove. The gas-sensitive electrode is positioned between the gas-sensitive material layer and the heating plate and is used for measuring the resistance of the gas-sensitive material layer. A temperature measuring element is arranged in the heating plate and used for acquiring the temperature of the gas sensitive material layer.
Compared with the prior art, the gas sensor provided by the utility model has the advantages that the gas-sensitive electrode is arranged between the gas-sensitive material layer and the heating plate, and the gas-sensitive electrode can measure the resistance of the gas-sensitive material layer, so that the material of the gas-sensitive material layer can be a conductive gas-sensitive material, and the resistance value of the conductive gas-sensitive material before and after the conductive gas-sensitive material contacts with gas to be detected can be measured through the gas-sensitive electrode, so that the information of parameters such as gas concentration representing the gas to be detected is converted into the resistance change of the gas-sensitive material layer, and the resistance change is output in the form of electric signals through the gas-sensitive electrode. Further, a gas sensitive material layer is formed on the heater plate. Meanwhile, the temperature measuring element is arranged in the heating plate and can acquire the temperature of the gas-sensitive material layer, so that the material of the gas-sensitive material layer can also be a catalytic combustion type gas-sensitive material, and the temperature value of the catalytic combustion type gas-sensitive material after being contacted with the gas to be detected can be acquired in a mode of measuring the temperature of the heating plate in contact with the gas-sensitive material layer through the temperature measuring element, so that the temperature change of the gas-sensitive material layer is converted from the information of parameters such as gas concentration and the like representing the gas to be detected, and the information is output in an electric signal form through the temperature measuring element. As can be seen from the above, the gas sensor provided by the present invention is provided with two detection elements, namely, a gas-sensitive electrode and a temperature measurement element, so that the material of the gas-sensitive material layer included in the gas sensor can be an electrically conductive gas-sensitive material or a catalytic combustion gas-sensitive material, that is, the gas sensor provided by the present invention has compatibility with the two gas-sensitive materials of different materials. In addition, in the actual application process, the gas sensitive material made of the corresponding material can be selected according to the actual requirement, so that the application range of the gas sensor is favorably expanded.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic structural diagram of a first gas sensor according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a second gas sensor provided in an embodiment of the present invention;
fig. 3 is a schematic view illustrating the distribution of a plurality of vent holes on the air permeable cover according to an embodiment of the present invention.
Reference numerals:
1 is a substrate, 11 is a groove, 12 is a mask layer,
2 is a sensing structure, 21 is a heating plate, 211 is a temperature measuring element,
212 is a support film, 213 is a heating element, 22 is a gas-sensitive electrode,
23 is a layer of gas-sensitive material,
3 is a ventilating cover body, 31 is a ventilating hole,
4 is a cavity.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed. In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
A gas sensor is a transducer that converts a certain gas volume fraction into a corresponding electrical signal. Specifically, when the gas sensor contacts the gas to be detected, the gas to be detected can be responded, sensed and analyzed, after a period of physical or chemical reaction, the non-electrical signal parameter information of the gas to be detected, such as gas type, gas composition, gas concentration and the like, can be converted into output in the form of an electrical signal through a certain conversion relation, and corresponding information can be obtained in a mode of reading a certain signal parameter of the electrical signal.
However, when the gas sensor has gas-sensitive material layers of different materials, the detection elements provided in the gas sensor are different. For example: under the condition that the material of the gas sensitive material layer of the gas sensor is a conductive gas sensitive material, the resistance value of the gas sensitive material layer can be changed before and after the gas sensitive material layer is contacted with gas to be detected in the working process of the gas sensor. Based on this, the detection element that this gas sensor has is the component that can measure the resistance of gas-sensitive material layer to follow-up resistance value before and after touching the gas that awaits measuring according to the gas-sensitive material layer determines information such as the concentration of the gas that awaits measuring. Another example is: under the condition that the material of the gas sensitive material layer of the gas sensor is a catalytic combustion type gas sensitive material, the temperature of the gas sensitive material layer can be changed before and after the gas sensitive material layer is contacted with gas to be detected in the working process of the gas sensor. Based on this, the detection element that this gas sensor has is the component that can measure the temperature of gas-sensitive material layer to follow-up according to the temperature value before and after the gas-sensitive material layer contacts the gas that awaits measuring, confirm information such as the concentration of gas that awaits measuring.
However, the existing gas sensor has a single detection element, cannot be compatible with gas sensitive material layers with different materials, and is not beneficial to the application of the gas sensor.
In order to solve the above technical problem, an embodiment of the present invention provides a gas sensor. The gas sensor is internally provided with two detection elements, namely a gas-sensitive electrode and a temperature measuring element, so that the gas sensor has compatibility with both a conductive gas-sensitive material and a catalytic combustion gas-sensitive material. In addition, in the actual application process, the gas sensitive material made of the corresponding material can be selected according to the actual requirement, so that the application range of the gas sensor is favorably expanded.
As shown in fig. 1 and 2, an embodiment of the present invention provides a gas sensor. The gas sensor includes: a substrate 1 and a sensing structure 2.
As shown in fig. 1 and 2, the substrate 1 is provided with a groove 11. The sensing structure 2 is arranged on the substrate 1. The sensing structure 2 comprises a heater plate 21, a gas sensitive electrode 22 and a gas sensitive material layer 23. Wherein the gas sensitive material layer 23 is formed on the heater plate 21 above the recess 11. The gas sensing electrode 22 is located between the gas sensing material layer 23 and the heater plate 21, and is used to measure the resistance of the gas sensing material layer 23. The heating plate 21 has a temperature measuring element 211 therein, and the temperature measuring element 211 is used for acquiring the temperature of the gas sensitive material layer 23.
Specifically, the base may be a substrate on which a film layer is not formed. For example: the base may be a silicon substrate. Alternatively, the base may be a substrate on which some film layers are formed. For example: as shown in fig. 1, the substrate 1 has a first surface and a second surface which are oppositely disposed. The sensing structure 2 is formed on a first surface which the substrate 1 has. A mask layer 12 made of silicon dioxide or silicon nitride may be formed on the second surface of the substrate 1. Based on this, when the groove 11 is formed by etching from the side of the second surface of the substrate 1, the substrate 1 may be etched by the mask of the mask layer 12 to form the groove 11.
In addition, the depth of the groove formed in the substrate can be set according to actual requirements, and is not particularly limited here. For example: as shown in fig. 1, the groove 11 may penetrate the substrate 1 in a thickness direction of the substrate 1. Another example is: as shown in fig. 2, in the case where the depth direction of the groove 11 and the thickness direction of the substrate 1 are the same, the depth of the groove 11 may be smaller than the thickness of the substrate 1. In particular, the size and position of the groove can be set according to the size and position of the gas sensitive material layer included in the sensing structure. For example: the cross-sectional area of the groove opening of the groove is slightly larger than that of the gas sensitive material layer.
For the above sensing structure, the position of the heating plate included in the sensing structure on the substrate can be set according to actual requirements. For example: as shown in fig. 1, a heating plate 21 may be coated on the substrate 1. In this case, the contact area between the heating plate 21 and the substrate 1 is large, so that the heating plate 21 carrying the gas sensing electrode 22 and the gas sensing material layer 23 can be stably positioned on the substrate 1 provided with the groove 11, and the structural reliability of the gas sensor is improved. Another example is: the sensing structure may further comprise at least two cantilever beams (not shown in the figures). The heating plate is arranged above the groove and is connected with the substrate through at least two cantilever beams. In this case, during operation of the gas sensor, a portion of the heat generated by the heater plate is dissipated by heat conduction through the cantilever beam, rather than directly through the substrate. Because the contact area between the cantilever beam and the heating plate is smaller than that between the cantilever beam and the heating plate covered on the substrate, the heat generated by the heating plate can be utilized by the heating gas sensitive material layer in a heat conduction mode. Based on this, under the same condition of other factors, the heating plate can reduce the heat loss of heating plate through the suspension of two at least cantilever beams in the recess top to can reduce the power loss of heating plate, improve gas sensor's working property.
Wherein, under the condition that the sensing structure further comprises at least two cantilever beams, the specification and the number of the cantilever beams included in the sensing structure can be set according to the specification and the actual requirement of the heating plate, and are not specifically limited here. For example: under the great condition of the specification of hot plate, can suitably increase the number of the cantilever beam that the sensing structure includes, or increase the specification of cantilever beam to make the hot plate can stably set up in the recess top through the cantilever beam, improve gas sensor's structural reliability. In addition, the cantilever beam can be made of silicon dioxide, silicon nitride, silicon carbide or other materials.
For the gas sensing electrode included in the sensing structure, the gas sensing electrode can be any electrode capable of measuring the resistance of the gas sensing material layer. For example: the gas sensing electrodes can be interdigital electrodes or parallel electrodes and the like. When the gas-sensitive electrode is an interdigital electrode, when the size of the interdigital electrode is reduced to be below the micron level, the weak resistance change between the interdigital electrodes can be sensitively detected, so that the interdigital electrode has higher sensitivity, the precision of the resistance value of the gas-sensitive material layer measured by the interdigital electrode can be improved, the accuracy of the output measurement result of the gas sensor can be improved, and accurate gas concentration and other parameters of the gas to be measured can be obtained based on the high-precision resistance value. Meanwhile, the sensitivity of the interdigital electrode can be improved due to the reduction of the size of the interdigital electrode, so that the miniaturization of the gas sensor is facilitated under the condition that the gas sensor is ensured to have higher precision.
For the gas sensitive material layer included in the sensing structure, the thickness of the gas sensitive material layer and the area of the gas sensitive material layer formed on the heating plate can be set according to actual requirements, and the thickness is not specifically limited here. Specifically, when the material of the gas sensitive material layer is a catalytic combustion type gas sensitive material, the larger the thickness of the gas sensitive material layer is, the longer the response time of the gas sensor is. And when the material of the gas sensitive material layer is a conductive gas sensitive material, the larger the thickness or width-to-length ratio of the gas sensitive material layer is, the smaller the resistance of the gas sensitive material layer is, and the lower the corresponding resistance thermal noise and flicker noise are, so that the extraction and detection of signals are facilitated, and the accuracy of the output measurement result of the gas sensor can be improved.
As for the temperature measuring element provided in the heating plate, the temperature measuring element may be any element capable of acquiring the temperature of the gas sensitive material layer, such as a temperature measuring resistor, a thermocouple, or the like, as long as the element can be applied to the gas sensor provided in the embodiment of the present invention.
In actual use, as shown in fig. 1 and 2, when the gas sensor is in operation, the heater plate 21 heats and catalyzes the gas sensitive material layer 23 located thereon. Because the gas sensitive material layer 23 is made of different materials, the working principle of the gas sensor and the types of gases which can be detected by the gas sensor are different, so that the material of the gas sensitive material layer 23 can be set according to the types and actual requirements of the gases to be detected by the gas sensor. For example: the material of the gas-sensitive material layer 23 may be an electrically conductive gas-sensitive material or a catalytic combustion gas-sensitive material. The conductive gas-sensitive material can be zinc oxide, tin oxide, indium oxide, and the like. The catalytic combustion type gas-sensitive material may be composed of a catalytically active material and a catalytic carrier. Wherein the catalytically active material is attached to a catalytic carrier. The catalytically active material may be a metal or metal oxide such as platinum, palladium, ruthenium, chromium, nickel, vanadium, manganese, iron, cobalt, or the like. The catalytic carrier can be a metal carrier, a ceramic carrier or a carbon fiber carrier. The material of the metal carrier may be nickel, nickel-chromium alloy, silicon-aluminum oxide, or the like. Based on this, under the condition that the material of the gas sensitive material layer 23 is a conductive gas sensitive material, the resistance values of the conductive gas sensitive material before contacting with the gas to be detected and after contacting with the gas to be detected and heating and catalyzing the conductive gas sensitive material through the heating plate 21 can be measured through the gas sensitive electrode 22, so that the information of parameters such as gas concentration representing the gas to be detected is converted into the resistance change of the gas sensitive material layer 23, and the resistance change is output in the form of an electric signal through the gas sensitive electrode 22. In addition, when the material of the gas sensitive material layer 23 is a catalytic combustion type gas sensitive material, the gas sensitive material layer 23 is formed on the heating plate 21, so that the heating plate 21 and the gas sensitive material layer 23 can transfer heat therebetween in a heat conduction manner, and the temperatures of the two can be equal after the two are balanced. Based on this, the temperature values of the catalytic combustion type gas sensitive material before contacting with the gas to be detected and after contacting with the gas to be detected and heating and catalyzing the catalytic combustion type gas sensitive material through the heating plate 21 can be obtained in a manner that the temperature measuring element 211 measures the temperature of the heating plate 21 contacting with the gas sensitive material layer 23, so that the information of parameters such as gas concentration representing the gas to be detected is converted into the temperature change of the gas sensitive material layer 23, and the temperature change is output in the form of an electric signal through the temperature measuring element 211.
As can be seen from the above, the gas sensor provided in the embodiment of the present invention is provided with two detection elements, i.e., a gas-sensitive electrode and a temperature measurement element, so that the material of the gas-sensitive material layer included in the gas sensor can be a conductive gas-sensitive material or a catalytic combustion gas-sensitive material, that is, the gas sensor provided in the embodiment of the present invention has compatibility with the two gas-sensitive materials with different materials. In addition, in the actual application process, the gas sensitive material made of the corresponding material can be selected according to the actual requirement, so that the application range of the gas sensor is favorably expanded.
In one example, where the sensing structure further comprises at least two cantilever beams, the at least two cantilever beams may be symmetrically disposed about a center of the heating plate. Based on this, can the atress even through the hot plate of two at least cantilever beam suspensions above the recess, improve gas sensor's structural stability.
Of course, the at least two cantilever beams may be disposed between the heating plate and the substrate in other manners as long as the gas sensor provided by the embodiment of the present invention can be applied.
In one example, where the sensing structure further comprises at least two cantilever beams, the cantilever beams may be L-shaped cantilever beams, folded-back cantilever beams, or straight cantilever beams. It should be understood that when the cantilever beam is an L-shaped cantilever beam or a folded cantilever beam, the cantilever beam is an accordion structure. At the moment, the cantilever beam has higher fracture toughness, so the heating plate can be stably positioned above the groove, and the structural reliability of the gas sensor is improved. In addition, because the distance between the heating plate and the substrate is a fixed value, when the cantilever beam is a linear type cantilever beam, the length of the cantilever beam is smaller, so that the structure of the gas sensor is simpler.
In one example, as shown in fig. 1 and 2, the gas sensor may further include a gas permeable cover 3. The gas-permeable cover 3 is disposed on the substrate 1 or the heater plate 21 and at least above the gas-sensitive material layer 23. A cavity 4 is arranged between the gas permeable cover body 3 and the gas sensitive material layer 23. It should be understood that, in the case that the gas sensor further includes the gas permeable cover 3, and the gas permeable cover 3 is at least located above the gas sensitive material layer 23, the cavity 4 is formed between the gas permeable cover 3 and the gas sensitive material layer 23, and the gas permeable cover 3 is gas permeable, so that the cavity 4 is an open cavity. Based on this, the gas in the cavity 4 and the gas in the test environment can exchange gas through the open cavity, so as to detect parameters such as the concentration of the gas to be tested in the test environment. In addition, the existence of the gas permeable cover body 3 can separate most of moisture in the testing environment outside the gas permeable cover body 3, so that the moisture in the testing environment is prevented from contacting with the gas sensitive material layer 23 to influence the accuracy of the testing result, and the sensitivity of the gas sensor is improved.
Specifically, the material of the air permeable cover may be set according to actual requirements, and is not specifically limited herein. For example: the material of the air permeable cover body can be silicon, metal, silicon carbide and other materials. The shape and specification of the gas-sensitive material layer can be set according to the shape and specification of the gas-sensitive material layer and actual requirements. Further, as shown in fig. 1 and 2, in the case where the heating plate 21 is covered on the substrate 1, the above-mentioned permeable cover 3 may be provided on the heating plate 21. And in the case where the heating plate is disposed above the groove by at least two cantilever beams, the above-mentioned permeable cover may be disposed on the substrate. Specifically, the permeable cover body can be arranged on the substrate or the heating plate in a bonding mode, an embedding mode, a bonding mode and the like. Wherein, when ventilative lid bonding is on basement or hot plate, can be so that ventilative lid fastening connection is on basement or hot plate, when improving gas sensor's structural reliability, can also shorten the distance between the upper surface of hot plate and the internal surface of ventilative lid for gas sensor's volume reduces, is favorable to realizing gas sensor's miniaturization. Further, the air-permeable cover may be a cover having an air vent formed therein. Alternatively, the permeable cover may be a cover that is in open connection with the substrate or the heating plate.
For example, as shown in fig. 1 to 3, in the case that the breathable cover body 3 is a cover body on which the vent holes 31 are provided, at least one set of vent hole groups may be opened on the top of the breathable cover body 3. Each set of vents comprises a plurality of vents 31 communicating with the cavity 4.
Specifically, the number of the vent hole groups formed in the top of the vent cover body and the number of the vent holes included in each vent hole group may be set according to actual requirements, and are not specifically limited herein. It can be understood that, under the corresponding condition of other factors, the greater the number of sets of vent hole groups formed at the top of the vent cover body and the number of vent holes included in each set of vent hole groups, the more favorable the exchange between the gas to be tested in the test environment and the gas in the cavity is, so as to improve the sensitivity of the gas sensor.
In addition, the distance between adjacent vent hole groups, the distance between adjacent vent holes, and the arrangement mode among a plurality of vent holes included in each vent hole group can also be set according to actual requirements. For example: the distance between adjacent sets of vents may be equal. At the moment, the distribution among the vent hole groups on the top of the breathable cover body is regular, and more vent hole groups are favorably arranged on the breathable cover body. But the distance between adjacent vents may also be equal. At this moment, the distance between the adjacent air vents is equal, so that the distribution of the air vents on the air vent body is more regular, gas in each area in the cavity can be favorably exchanged with gas to be tested in a test environment through the corresponding air vents, the sensitivity of the gas sensor can be improved, and the working performance of the gas sensor is improved. As for the arrangement mode among the plurality of vent holes, the geometric centers of the plurality of vent holes included in the same group of vent hole groups can be distributed on the top of the breathable cover body in a rectangular, parallelogram, hexagonal or circular shape. Of course, the geometric centers of the plurality of vent holes included in the same set of vent holes may be distributed on the top of the vent cover body in other shapes as long as the gas sensor provided by the embodiment of the utility model can be applied.
In the case where the air permeable cover is a cover having an air vent, the air vent may be provided on a side wall of the air permeable cover, in addition to the top of the cover. Specifically, the setting position of the vent hole on the breathable cover body can be set according to actual requirements.
In one example, as shown in fig. 1 and 2, the heating plate 21 further has a support film 212 and a heating element 213. The heating element 213 and the temperature sensing element 211 are both disposed within the support film 212. The heating element 213 is located above the groove 11 for heating the support film 212.
Specifically, the shape and structure of the support film may be set with reference to the shape and structure of the heating plate described above. The material of the support film can be silicon oxide, silicon nitride, silicon, aluminum oxide, silicon carbide and other materials with good heat conduction effect, so that heat generated by the heating element is transferred to the gas sensitive material layer in a heat conduction mode, and the sensitivity of the gas sensor is improved. Specifically, the support film may have a single-layer structure or a stacked-layer structure. When the support film has a single-layer structure, the support film may be a silicon oxide support film, a silicon nitride support film, a silicon carbide support film, or the like. When the support film is a stacked structure, the support film may be a stacked structure of silicon oxide/silicon nitride or the like.
For the heating element, the heating element may be any element capable of heating the support film. For example: the heating element may be a heating resistor. The heating resistor can be made of metal conductive materials such as platinum, aluminum or copper, and can also be made of non-metal conductive materials such as doped polysilicon.
It is noted that the heating element 213 is located above the recess 11, as shown in fig. 1 and 2. At this time, when the heating element 213 heats the support film 212, the gas sensitive material layer 23 above the groove 11 can be effectively and purposefully heated and catalyzed, so as to prevent the heat generated by the heating element 213 from being dissipated through the heat conduction of the substrate, reduce the power loss of the heating element 213, and improve the working performance of the gas sensor.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A gas sensor, comprising:
a substrate; a groove is formed in the substrate;
and a sensing structure disposed on the substrate; the sensing structure comprises a heating plate, a gas-sensitive electrode and a gas-sensitive material layer; wherein,
the gas-sensitive material layer is formed on the heating plate and is positioned above the groove; the gas-sensitive electrode is positioned between the gas-sensitive material layer and the heating plate and is used for measuring the resistance of the gas-sensitive material layer; and a temperature measuring element is arranged in the heating plate and is used for acquiring the temperature of the gas sensitive material layer.
2. The gas sensor according to claim 1, wherein the gas-sensitive material layer is made of an electrically conductive gas-sensitive material or a catalytic combustion gas-sensitive material.
3. The gas sensor of claim 1, wherein the heater plate overlies the substrate; or,
the sensing structure further comprises at least two cantilever beams; the heating plate is arranged above the groove and is connected with the substrate through at least two cantilever beams.
4. The gas sensor of claim 3, wherein the at least two cantilevered beams are symmetrically disposed about a center of the heater plate.
5. The gas sensor of claim 3, wherein the cantilever beam is an L-shaped cantilever beam, a folded-back cantilever beam, or a straight cantilever beam.
6. The gas sensor according to any one of claims 1 to 5, further comprising a gas permeable cover; the gas-permeable cover body is arranged on the substrate or the heating plate and at least positioned above the gas-sensitive material layer; and a cavity is arranged between the gas-permeable cover body and the gas-sensitive material layer.
7. The gas sensor according to claim 6, wherein the top of the gas permeable cover body is provided with at least one set of vent holes; each set of vent holes includes a plurality of vent holes in communication with the cavity.
8. The gas sensor according to claim 7, wherein the geometric centers of the plurality of vent holes included in the same set of vent holes are distributed on the top of the gas permeable cover in a rectangular, parallelogram, hexagonal or circular shape; and/or the presence of a gas in the gas,
the distances between the adjacent vent hole groups are equal; and/or the presence of a gas in the gas,
the distance between the adjacent vent holes is equal.
9. The gas sensor of claim 6, wherein the gas permeable cover is bonded to the substrate or the heater plate.
10. The gas sensor according to any one of claims 1 to 5, wherein the heating plate further has a support film and a heating element; the heating element and the temperature measuring element are both arranged in the supporting film; the heating element is positioned above the groove and used for heating the support film; and/or the presence of a gas in the gas,
the gas-sensitive electrode is an interdigital electrode.
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| CN202121540628.2U CN215493291U (en) | 2021-07-06 | 2021-07-06 | Gas sensor |
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| CN202121540628.2U CN215493291U (en) | 2021-07-06 | 2021-07-06 | Gas sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114594141A (en) * | 2022-02-21 | 2022-06-07 | 清华大学 | Integrated electronic nose sensing structure and use method thereof |
| CN114720509A (en) * | 2022-06-08 | 2022-07-08 | 苏州芯镁信电子科技有限公司 | Gas detection assembly and preparation method thereof |
| CN116854023A (en) * | 2023-09-05 | 2023-10-10 | 北京六知科技有限公司 | MEMS semiconductor chip and preparation method thereof |
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2021
- 2021-07-06 CN CN202121540628.2U patent/CN215493291U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114594141A (en) * | 2022-02-21 | 2022-06-07 | 清华大学 | Integrated electronic nose sensing structure and use method thereof |
| CN114720509A (en) * | 2022-06-08 | 2022-07-08 | 苏州芯镁信电子科技有限公司 | Gas detection assembly and preparation method thereof |
| CN116854023A (en) * | 2023-09-05 | 2023-10-10 | 北京六知科技有限公司 | MEMS semiconductor chip and preparation method thereof |
| CN116854023B (en) * | 2023-09-05 | 2023-12-05 | 北京六知科技有限公司 | MEMS semiconductor chip and preparation method thereof |
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