CN215473684U - High silica glass fiber cloth reinforced polytetrafluoroethylene laminated board - Google Patents
High silica glass fiber cloth reinforced polytetrafluoroethylene laminated board Download PDFInfo
- Publication number
- CN215473684U CN215473684U CN202022681166.8U CN202022681166U CN215473684U CN 215473684 U CN215473684 U CN 215473684U CN 202022681166 U CN202022681166 U CN 202022681166U CN 215473684 U CN215473684 U CN 215473684U
- Authority
- CN
- China
- Prior art keywords
- glass fiber
- high silica
- fiber cloth
- silica glass
- polytetrafluoroethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The utility model relates to a high silica glass fiber cloth reinforced polytetrafluoroethylene laminated board, the laminated board is formed into an integral structure by laminating and curing 12 layers or 13 layers of high silica glass fiber cloth coated with polytetrafluoroethylene emulsion, the thickness of the laminated board is more than 2.85 mm and less than 3.15 mm; the thickness of the high silica glass fiber cloth is 0.25 mm, and the gram weight per square meter is 210-230 g; the model of the high silica glass fiber cloth is BW 7250-82; the solid content of the F4 emulsion is 58-62%, and the type is SFN-1. The reinforced polytetrafluoroethylene laminated board is made of the high silica glass fiber cloth, has the performances of high temperature resistance and high strength of the high silica glass fiber cloth, has very low dielectric strength and dielectric loss of a polytetrafluoroethylene material, has excellent rain erosion resistance and ablation resistance, and is suitable for printed circuit boards of electronic equipment.
Description
Technical Field
The utility model relates to the technical field of polytetrafluoroethylene laminated plates, in particular to a high silica fiberglass cloth reinforced polytetrafluoroethylene laminated plate.
Background
In the aerospace materials technology, in the year 01, a dielectric property research of a high silica glass fiber cloth reinforced Polytetrafluoroethylene (PTFE) composite material is published, and systematic experimental research on the influence of various factors such as the gel content, the forming pressure, the sintering temperature, the environmental humidity and the like of the high silica glass fiber cloth reinforced Polytetrafluoroethylene (PTFE) composite material on the dielectric property is carried out. The result shows that the dielectric constant of the high silica glass fiber cloth reinforced polytetrafluoroethylene composite material is changed within the range of 2.90-3.30 under the influence of the factors, wherein the environmental humidity is the main influencing factor.
The existing manufacturing process of the high silica glass fiber cloth reinforced polytetrafluoroethylene laminated board generally comprises the following steps: the method has the advantages of low production efficiency, small size and area and large influence on environmental humidity. The existing polytetrafluoroethylene glass fiber cloth copper-clad plate is formed by soaking alkali-free glass fiber cloth which is specially treated with polytetrafluoroethylene emulsion, sintering the alkali-free glass fiber cloth to prepare polytetrafluoroethylene glass fiber cloth, and compounding the polytetrafluoroethylene glass fiber cloth with a treated copper foil layer, has excellent electrical property and chemical stability, and is a novel high-temperature-resistant medium substrate. The polytetrafluoroethylene glass fiber cloth copper-clad plate has the advantages of small dielectric loss, low dielectric constant, small fluctuation along with temperature and frequency changes, wide use temperature range, lower friction coefficient and higher mechanical strength, can meet the requirements of microwave circuit boards, and is suitable for printed circuit boards of electronic equipment. The method is widely applied to the aspects of artificial satellites, spacecraft, rockets, missiles, radars, broadcast televisions and the like.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high silica glass fiber cloth reinforced polytetrafluoroethylene laminated board, which is prepared by adopting high silica glass fiber cloth, has the performances of high temperature resistance and high strength of the high silica glass fiber cloth, very low dielectric strength and dielectric loss of a polytetrafluoroethylene material, and excellent rain erosion resistance and ablation resistance.
The purpose of the utility model is realized by adopting the following technical scheme:
the laminated board is an integral structure formed by vacuum pressing and high-temperature curing of a plurality of layers of high silica glass fiber cloth coated with polytetrafluoroethylene emulsion on the surface, and the thickness of the laminated board is 2.85 mm and less than 3.15 mm.
As a preferred technical scheme of the utility model, the thickness of the high silica glass fiber cloth coated with the polytetrafluoroethylene emulsion on the surface is 0.25 mm, and the gram weight per square meter is 210-230 g.
In a preferred embodiment of the present invention, the laminate is formed by hot-pressing and laminating 12 or 13 layers of high silica glass fabric coated with polytetrafluoroethylene emulsion on the surface.
As a preferable technical scheme of the utility model, the high silica glass fiber cloth has the model number of BW 7250-82.
As a preferable technical scheme of the utility model, the polytetrafluoroethylene emulsion is polytetrafluoroethylene concentrated dispersion (F4 emulsion), the solid content of the F4 emulsion is 58-62%, and the type is SFN-1.
The utility model has the beneficial effects that: compared with the prior art, the high silica glass fiber cloth is dried to remove the water of the grey cloth, then passes through a prepared polytetrafluoroethylene emulsion tank with a prepared concentration, and is subjected to four-time coating, impregnation and repeated drying, then is subjected to pre-sintering treatment to remove the surfactant in the polytetrafluoroethylene emulsion remained on the adhesive tape to prepare the polytetrafluoroethylene high silica glass fiber adhesive tape, and then is subjected to cutting, lamination, vacuum lamination and high-temperature curing compounding to obtain the high silica glass fiber cloth reinforced polytetrafluoroethylene laminated board.
The reinforced polytetrafluoroethylene laminated board prepared from the high silica glass fiber cloth has the performances of high temperature resistance and high strength of the high silica glass fiber cloth, very low dielectric strength and dielectric loss of a polytetrafluoroethylene material, excellent rain erosion resistance and ablation resistance, excellent heat insulation, flame retardance and electromagnetic wave transmission performance, and is suitable for printed circuit boards of electronic equipment. Can be widely applied to the aspects of artificial satellites, space ships, rockets, missiles, radars, broadcast televisions and the like.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a partially enlarged schematic view at a in fig. 1.
In the figure: 1. laminate, 2, high silica fiberglass cloth, 3, polytetrafluoroethylene coating.
Detailed Description
The utility model will be further described with reference to the following detailed description of embodiments and with reference to the accompanying drawings in which:
as shown in figures 1 and 2, the high silica glass fiber cloth reinforced polytetrafluoroethylene laminated board 1 is an integral structure formed by laminating and curing a plurality of layers of high silica glass fiber cloth 2 coated with polytetrafluoroethylene emulsion on the surface, the thickness of the laminated board 1 is more than 2.5 mm and less than 3.5 mm, and the surface of the laminated board 1 is provided with a polytetrafluoroethylene coating 3.
In a preferred embodiment, the thickness of the high silica glass fiber cloth 2 is 0.25 mm, and the gram weight per square meter is 210 g to 230 g. The laminated board 1 is formed by hot-pressing and compounding 12 layers or 13 layers of high silica glass fiber cloth 2 coated with polytetrafluoroethylene emulsion on the surface, and the thickness of the laminated board 1 is larger than 2.85 mm and smaller than 3.15 mm. The high silica glass fiber cloth 2 of the embodiment has the model number of BW 7250-82; the polytetrafluoroethylene emulsion is polytetrafluoroethylene concentrated dispersion (F4 emulsion), the solid content of the F4 emulsion is 58-62%, and the type is SFN-1.
The above-mentioned embodiments are only used for illustrating the conception and technical features of the present invention, and the purpose thereof is to make the technical solution and implementation manner of the present invention known to those skilled in the art, and the protection scope of the present invention is not limited thereby. All equivalents and changes equivalent to the technical solution of the present invention should be covered within the protection scope of the present invention.
Claims (5)
1. A high silica glass fiber cloth reinforced polytetrafluoroethylene laminated board is characterized in that: the laminated board is of an integral structure formed by multiple layers of high silica glass fiber cloth coated with polytetrafluoroethylene emulsion on the surface through vacuum lamination and high-temperature curing, and the thickness of the laminated board is larger than 2.85 mm and smaller than 3.15 mm.
2. The high silica fiberglass cloth reinforced polytetrafluoroethylene laminate according to claim 1, wherein: the thickness of the high silica glass fiber cloth coated with the polytetrafluoroethylene emulsion on the surface is 0.25 mm, and the gram weight per square meter is 210-230 g.
3. The high silica fiberglass cloth reinforced polytetrafluoroethylene laminate according to claim 1, wherein: the laminated board is formed by hot-pressing and compounding 12 layers or 13 layers of high silica glass fiber cloth coated with polytetrafluoroethylene emulsion on the surface.
4. The high silica fiberglass cloth reinforced polytetrafluoroethylene laminate according to claim 1, wherein: the high silica glass fiber cloth is BW 7250-82.
5. The high silica fiberglass cloth reinforced polytetrafluoroethylene laminate according to claim 1, wherein: the polytetrafluoroethylene emulsion is a polytetrafluoroethylene concentrated dispersion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022681166.8U CN215473684U (en) | 2020-11-18 | 2020-11-18 | High silica glass fiber cloth reinforced polytetrafluoroethylene laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022681166.8U CN215473684U (en) | 2020-11-18 | 2020-11-18 | High silica glass fiber cloth reinforced polytetrafluoroethylene laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215473684U true CN215473684U (en) | 2022-01-11 |
Family
ID=79716854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022681166.8U Active CN215473684U (en) | 2020-11-18 | 2020-11-18 | High silica glass fiber cloth reinforced polytetrafluoroethylene laminated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215473684U (en) |
-
2020
- 2020-11-18 CN CN202022681166.8U patent/CN215473684U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100417951B1 (en) | Printed wiring board and prepreg for printed wiring board | |
| WO2021035914A1 (en) | Manufacturing method for multi-layer flexible circuit board, and product thereof | |
| CN114670512B (en) | Polytetrafluoroethylene flexible copper-clad plate containing glass fibre cloth and its preparation method | |
| TWI684516B (en) | High-frequency composite circuit substrate and method for preparing the same | |
| CN215473684U (en) | High silica glass fiber cloth reinforced polytetrafluoroethylene laminated board | |
| CN111050469A (en) | High-heat-resistance high-CTI lead-free copper-clad plate and preparation method thereof | |
| CN106751711B (en) | Fluorine-substituted vinyl polymer resin composition, prepreg and laminate | |
| WO2021035917A1 (en) | Method for compression forming high-frequency circuit board material layer structure, and product thereof | |
| CN111844958A (en) | Preparation method of novel material layer structure of circuit board and product thereof | |
| KR100823998B1 (en) | Copper clad laminate, printed circuit board and manufacturing method of ccl | |
| CN110662348A (en) | Composite high-frequency substrate with high Dk and low Df characteristics and preparation method thereof | |
| JP3153511B2 (en) | Printed wiring board and method of manufacturing the same | |
| CN115503306A (en) | Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process | |
| CN108040423A (en) | A kind of preparation process of copper-clad plate | |
| CN112248595A (en) | Insulating plate and preparation method thereof, laminated plate and preparation method and application thereof | |
| CN202878803U (en) | Low-density and light-weight laminated board | |
| CN111867279A (en) | Manufacturing method of multilayer double-sided rigid-flex board and product thereof | |
| CN215121302U (en) | Combined type high frequency base plate | |
| WO1993024314A1 (en) | Thermally conductive printed circuit board | |
| GB2169240A (en) | Sandwich structure laminate for printed circuit board substrate | |
| CN218399750U (en) | Aramid paper and glass fiber cloth composite copper-clad plate | |
| CN212344177U (en) | Multilayer flexible circuit board | |
| CN212344178U (en) | Multi-layer double-sided rigid-flex board | |
| CN211297123U (en) | Combined PCB board | |
| JPH05291711A (en) | Board for high-frequency circuit use |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |