CN215452046U

CN215452046U - SMD structure that adds heat dissipation of laser diode

Info

Publication number: CN215452046U
Application number: CN202122054110.4U
Authority: CN
Inventors: 黄洁珍
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2022-01-07
Anticipated expiration: 2031-08-27

Abstract

The utility model provides a surface-mounted heating and radiating structure of a laser diode, which comprises a heat-conducting copper substrate, a heat-radiating copper braid, a radiating fin, a heat-insulating sleeve, a tube seat and electrode pins, wherein the electrode pins are arranged at the lower side of the tube seat, a tube cap is arranged at the upper side of the tube seat, a photoelectric diode is arranged in the tube cap, an electric heating plate is sleeved at the lower side of the annular side surface of the tube cap, the heat-insulating sleeve is sleeved at the annular side surface of the electric heating plate, a fixing sleeve is sleeved at the upper side of the annular side surface of the tube cap, the radiating fin is arranged at the annular side surface of the fixing sleeve, positioning clamping blocks are arranged at the left side and the right side of the annular side surface in the fixing sleeve, positioning sliding grooves are formed in the left side and the right side of the annular side surface of the tube cap, and the heat-conducting copper substrate is arranged at the upper end surface of the tube cap, the response speed of the laser diode in an extreme temperature environment is accelerated.

Description

SMD structure that adds heat dissipation of laser diode

Technical Field

The utility model relates to a surface-mounted heating and radiating structure of a laser diode, belonging to the technical field of laser diodes.

Background

Laser diodes include Single Heterojunction (SH), Double Heterojunction (DH), and Quantum Well (QW) laser diodes. The quantum well laser diode has the advantages of low threshold current and high output power, and is a mainstream product for market application. Compared with a laser, the laser diode has the advantages of high efficiency, small volume and long service life, but the output power is small (generally less than 2mW), the linearity is poor, and the monochromaticity is not good, so that the application of the laser diode in a cable television system is greatly limited, and multi-channel and high-performance analog signals cannot be transmitted. In the return module of the bidirectional optical receiver, a quantum well laser diode is generally used as a light source for uplink transmission.

Among the prior art, current laser diode is at the in-process that uses, start in low temperature environment is comparatively slow, it is long at least more than 30 minutes to carry out normal luminous time more than 25 ℃ to be about to laser diode heating, influence laser diode's normal use, when higher at the temperature, the inside heat that produces of laser diode can not be timely dispels the heat to the external world, the radiating effect is not good enough, lead to the damage of the inside components and parts of laser diode easily, the problem that the aforesaid appears is solved to the SMD heating and cooling structure of laser diode that is urgently needed now.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a patch type heating and radiating structure of a laser diode, which is used for solving the problems in the background technology.

In order to achieve the purpose, the utility model is realized by the following technical scheme: a surface-mounted heating and radiating structure of a laser diode comprises a heat-conducting copper substrate, a heat-radiating copper braid, radiating fins, a heat-insulating sleeve, a tube seat and electrode pins, wherein the electrode pins are installed on the lower side of the tube seat, a tube cap is installed on the upper side of the tube seat, a photodiode is arranged in the tube cap, an electric heating plate is sleeved on the lower side of the annular side surface of the tube cap, the heat-insulating sleeve is sleeved on the annular side surface of the electric heating plate, a fixing sleeve is sleeved on the upper side of the annular side surface of the tube cap, the radiating fins are arranged on the annular side surface of the fixing sleeve, positioning clamping blocks are arranged on the left side and the right side of the annular side surface in the fixing sleeve, positioning sliding grooves are formed in the left side and the right side of the annular side surface of the tube cap, the heat-conducting copper substrate is arranged on the upper end surface of the heat-conducting copper substrate, a radiating through hole is formed in the inner part of the upper end surface of the heat-conducting copper substrate, and the tube cap are provided with a fixing clamping seat, the heat-conducting copper base plate is provided with a heat-radiating copper braid at the joint of the heat-conducting copper base plate and the heat radiating fin, and a heat-conducting rod is arranged on the lower side inside the pipe cap.

Further, the inner diameter of the fixing sleeve is larger than the diameter of the pipe cap, a certain gap is formed between the fixing sleeve and the pipe cap, and heat conducting paste is filled in the gap.

Furthermore, the fin sets up the multiunit, and the multiunit the fin specification is the same, the multiunit the fin equidistance sets up in fixed sleeve annular side.

Furthermore, one end of the heat conducting rod is fixed on the electric heating plate, the heat conducting rod penetrates through the pipe cap and extends into the pipe cap, five layers of the heat conducting rod are arranged, multiple groups of the heat conducting rod are arranged on each layer, and the heat conducting rod is of an equal-angle installation structure.

Furthermore, the inner diameters of the fixed clamping seats are the same as the diameter of the pipe cap, and the inner diameter of the heat dissipation through hole is larger than the inner diameter of the pipe cap.

Furthermore, four groups of heat dissipation copper woven belts are arranged, the specifications of the four groups of heat dissipation copper woven belts are the same, and the four groups of heat dissipation copper woven belts are symmetrically arranged on the front side, the rear side, the left side and the right side of the joint of the heat conduction copper substrate and the radiating fins respectively.

The utility model has the beneficial effects that: according to the surface-mounted heating and radiating structure of the laser diode, due to the addition of the heat-conducting copper substrate, the heat-radiating copper braid, the radiating fins, the positioning fixture block, the positioning chute, the electric heating plate, the heat-conducting rod and the fixing sleeve, the laser diode can be effectively heated and radiated in different temperature environments, the heating and radiating structure is reasonable, the using effect of the laser diode is better, and the response speed of the laser diode in an extreme temperature environment is accelerated.

Drawings

Other features, objects and advantages of the utility model will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural diagram of a surface-mounted heating and radiating structure of a laser diode according to the present invention;

FIG. 2 is a front cross-sectional view of a laser diode surface mount heat dissipation structure of the present invention;

FIG. 3 is a top view of a surface mount type heating and dissipating structure of a laser diode according to the present invention;

FIG. 4 is a top cross-sectional view of a laser diode surface mount heat dissipation structure of the present invention;

FIG. 5 is a schematic structural diagram of a heat sink in a surface mount type heating and dissipating structure of a laser diode according to the present invention;

in the figure: 1-heat conducting copper substrate, 2-heat radiating copper woven tape, 3-heat radiating fin, 4-heat insulating sleeve, 5-tube seat, 6-electrode pin, 7-fixing clamping seat, 8-heat radiating through hole, 9-photodiode, 10-tube cap, 11-positioning clamping block, 12-positioning sliding groove, 13-electric heating plate, 14-heat conducting rod, 15-fixing sleeve and 151-heat conducting paste.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

Referring to fig. 1-5, the present invention provides a technical solution: a surface-mounted heat radiating structure of a laser diode comprises a heat conducting copper substrate 1, a heat radiating copper woven belt 2, a heat radiating fin 3, a heat insulating sleeve 4, a tube seat 5 and electrode pins 6, wherein the electrode pins 6 are installed on the lower side of the tube seat 5, a tube cap 10 is installed on the upper side of the tube seat 5, a photoelectric diode 9 is arranged in the tube cap 10, an electric heating plate 13 is sleeved on the lower side of the annular side surface of the tube cap 10, the heat insulating sleeve 4 is sleeved on the annular side surface of the electric heating plate 13, a fixing sleeve 15 is sleeved on the upper side of the annular side surface of the tube cap 10, the heat radiating fin 3 is arranged on the annular side surface of the fixing sleeve 15, positioning fixture blocks 11 are arranged on the left side and the right side of the annular side surface of the tube cap 10, positioning chutes 12 are arranged inside the left side and the right side of the annular side surface of the tube cap 10, the heat conducting copper substrate 1 is arranged on the upper end surface of the heat conducting copper substrate 1, a heat radiating through hole 8 is arranged on the connecting part of the heat conducting copper substrate 1 and the tube cap 10, and a fixing fixture seat 7 is arranged on the connecting part of the tube cap 10, the heat-conducting copper base plate 1 is provided with heat dissipation copper meshbelt 2 with fin 3 junction, and the inside downside of tube cap 10 is provided with heat conduction stick 14, and this design can carry out effectual heating heat dissipation to laser diode in different temperature environment, heating and heat dissipation rational structure for laser diode's result of use is better, has accelerated the response speed of laser diode in extreme temperature environment.

The internal diameter of the fixing sleeve 15 is larger than the diameter of the pipe cap 10, the heat conducting paste 151 is filled between the fixing sleeve 15 and the pipe cap 10, the heat inside the pipe cap 10 can be rapidly transmitted to the radiating fins 3 through high heat conduction, and the radiating speed is improved.

The heat dissipation copper meshbelt 2 is provided with four groups, and four groups of heat dissipation copper meshbelts 2 specifications are the same, four groups of heat dissipation copper meshbelts 2 are symmetrically installed in four sides all around of heat conduction copper base plate 1 and fin 3 junction respectively, and fin 3 sets up the multiunit, and 3 specifications of multiunit fin are the same, and the 3 equidistance of multiunit fin set up in the 15 annular sides of fixed sleeve, can distribute away the inside heat of laser diode fast through multiunit fin 3, has improved laser diode's radiating efficiency.

On heat conduction stick 14's one end was fixed in electric heating plate 13, heat conduction stick 14 runs through inside pipe cap 10 stretches into pipe cap 10, heat conduction stick 14 is provided with five layers, every layer of heat conduction stick 14 is provided with the multiunit, every layer of multiunit heat conduction stick 14 is equal angle mounting structure, can transmit the heat that electric heating plate 13 produced fast to pipe cap 10 inside through multiunit heat conduction stick 14, can carry out quick auxiliary heating to laser diode, make laser diode can quick response in low temperature environment.

As an embodiment of the present invention: when the laser diode needs to be heated, firstly, the electric heating plate 13 is connected with an external power supply through a lead, then the electric heating plate 13 is started through the external power supply, heat generated by the electric heating plate 13 is transferred to the inside of the pipe cap 10, the heat of the electric heating plate 13 can be quickly transferred to the inside of the pipe cap 10 through the heat conducting rod 14, and the laser diode can be subjected to auxiliary heating, so that the laser diode can reach the temperature required by normal light emission more quickly, and the laser diode can respond quickly in a low-temperature environment; when needing to dispel the heat to laser diode, can be with the inside heat of pipe cap 10 leading-in fixed sleeve 15 fast through heat conduction, can evenly transmit the heat to fin 3 through fixed sleeve 15 in, then can distribute away the heat fast through multiunit fin 3, can share the heat in the fin 3 through heat dissipation copper meshbelt 2 and transmit to heat conduction copper base plate 1 in and distribute away the heat through heat conduction copper base plate 1, improved the radiating efficiency to laser diode.

While there have been shown and described what are at present considered the fundamental principles and essential features of the utility model and its advantages, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a SMD of laser diode adds heat radiation structure, includes heat conduction copper base plate, heat dissipation copper meshbelt, fin, insulation support, tube socket and electrode pin, its characterized in that: electrode pin is installed to the tube socket downside, the pipe cap is installed to the tube socket upside, the inside photodiode that is provided with of pipe cap, pipe cap annular side downside cover is equipped with the electrical heating board, electrical heating board annular side cover is equipped with insulation support, pipe cap annular side upside cover is equipped with fixed sleeve, fixed sleeve annular side is provided with the fin, the annular side left and right sides is provided with the positioning fixture block in the fixed sleeve, the inside division of pipe cap annular side left and right sides is equipped with the location spout, the pipe cap up end is provided with the heat conduction copper base plate, the inside heat dissipation through-hole that has seted up of heat conduction copper base plate up end, heat conduction copper base plate is provided with fixed cassette with the pipe cap junction, heat conduction copper base plate is provided with the heat dissipation copper meshbelt with the fin junction, the inside downside of pipe cap is provided with the heat conduction stick.

2. The patch type heating and heat dissipating structure of a laser diode according to claim 1, wherein: the inner diameter of the fixing sleeve is larger than the diameter of the pipe cap, a certain gap is formed between the fixing sleeve and the pipe cap, and heat conducting paste is filled in the gap.

3. The patch type heating and heat dissipating structure of a laser diode according to claim 1, wherein: the fin sets up the multiunit, and the multiunit the fin specification is the same, the multiunit the fin equidistance sets up in fixed sleeve annular side.

4. The patch type heating and heat dissipating structure of a laser diode according to claim 1, wherein: one end of the heat conducting rod is fixed on the electric heating plate, the heat conducting rod penetrates through the pipe cap and extends into the pipe cap, five layers of the heat conducting rod are arranged, each layer of the heat conducting rod is provided with multiple groups, and each layer of the multiple groups of the heat conducting rod is of an equal-angle installation structure.

5. The patch type heating and heat dissipating structure of a laser diode according to claim 1, wherein: the inner diameters of the fixing clamping seats are the same as the diameter of the pipe cap, and the inner diameter of the heat dissipation through hole is larger than the inner diameter of the pipe cap.

6. The patch type heating and heat dissipating structure of a laser diode according to claim 1, wherein: the heat dissipation copper woven belts are arranged in four groups, the specifications of the four groups of heat dissipation copper woven belts are the same, and the four groups of heat dissipation copper woven belts are symmetrically arranged on the front side, the rear side, the left side and the right side of the joint of the heat conduction copper substrate and the heat dissipation fins respectively.