CN215451338U

CN215451338U - Wafer positioning device of dry etching machine table and dry etching equipment

Info

Publication number: CN215451338U
Application number: CN202120863501.8U
Authority: CN
Inventors: 蒋定溪; 林科闯; 张广劲; 张文磊; 刘根亮
Original assignee: Xiamen Sanan Integrated Circuit Co Ltd
Current assignee: Xiamen Sanan Integrated Circuit Co Ltd
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2022-01-07
Anticipated expiration: 2031-04-25

Abstract

A wafer positioning device and a dry etching device of a dry etching machine comprise a cover body and a pressure plate; this lid passes through a plurality of connecting pieces and connects the pressure disk, and this pressure disk middle part is equipped with the through-hole in order to press in wafer surface edge, its characterized in that: an eccentric ring is also sleeved between the connecting piece and the pressure plate. The eccentric ring is used for limiting the great shaking of the defectiveness of the pressure plate during the action, so that the problems of poor etching uniformity and even breakage and the like caused by the deviation of the pressure plate can be effectively avoided.

Description

Wafer positioning device of dry etching machine table and dry etching equipment

Technical Field

The utility model relates to the field of etching equipment, in particular to a wafer positioning device of a dry etching machine table and dry etching equipment.

Background

Dry etching is a technique for etching a thin film by using the property of stronger chemical activity of plasma, and when gas exists in a plasma form, the dry etching has two characteristics: on one hand, the chemical activity of the gases in the plasma is much stronger than that of the gases in a normal state, and the gases can react with the materials more quickly by selecting proper gases according to the difference of the etched materials, so that the aim of etching removal is fulfilled; on the other hand, the electric field can be used for guiding and accelerating the plasma, so that the plasma has certain energy, and when the plasma bombards the surface of the etched object, atoms of the etched object material can be knocked out, thereby achieving the purpose of etching by utilizing physical energy transfer.

However, in the existing dry etching machine, the wafer is pressed down and fixed by the platen, and the platen (clamp) is connected by the bolt, and there is a gap between the bolt and the platen, so that the platen has a certain moving space. During the process operation, the pressing plate will shake during the pressing process, which causes unfixed pressing position and deviation within a certain range, so that the indentations on the process wafer are inconsistent, thereby resulting in poor etching uniformity of the process, and even causing risks such as chipping during large-amplitude deviation.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to overcome the defects that the position of a pressure plate is likely to deviate during the existing processing operation, so that the etching uniformity is not good, and even the risk of fragment and the like is caused, and provides a wafer positioning device of a dry etching machine and dry etching equipment.

The utility model adopts the following technical scheme:

a wafer positioning device of a dry etching machine comprises a cover body and a pressure plate; this lid is connected the pressure disk through a plurality of connecting pieces, and this pressure disk middle part is equipped with the through-hole, is equipped with the step in order to press in wafer surface edge in the through-hole, its characterized in that: an eccentric ring is also sleeved between the connecting piece and the pressure plate.

Preferably, the inner wall of the through hole is provided with a step, and the step is pressed on the edge of the surface of the wafer.

Preferably, the connecting pieces are arranged at intervals and distributed circumferentially around the center of the through hole.

Preferably, the minimum width of the eccentric ring faces to the center of the through hole and is located on a radial extension line of the through hole.

Preferably, the minimum width of the eccentric ring is 0.74mm to 0.86 mm.

Preferably, the maximum width of the eccentric ring is 1.15mm to 1.25 mm.

Preferably, the thickness of the eccentric ring is 3.4mm-3.6 mm.

Preferably, the eccentric ring is made of polytetrafluoroethylene.

Preferably, the pressure plate is correspondingly provided with a plurality of mounting holes, and the connecting pieces penetrate through the corresponding mounting holes; the eccentric rings are respectively sleeved between the connecting piece and the corresponding mounting hole.

A dry etching device comprises a machine table and the wafer positioning device of the dry etching machine table.

As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following advantages:

1. according to the device and the equipment, the eccentric ring is sleeved between the connecting piece and the pressure plate to limit the great shaking of the defectiveness of the pressure plate during the action, so that the problems of poor etching uniformity caused by the deviation of the pressure plate and even the risk of fragment and the like can be effectively avoided.

2. According to the device and the equipment, the connecting pieces are arranged at intervals and distributed in a circumferential manner around the center of the through hole, the minimum width position of the eccentric ring faces the center of the through hole and is positioned on the radial extension line of the through hole, and when the pressure plate is subjected to force irresistance, the pressure plate can be actively leaned towards the center of the through hole, so that parts are prevented from being damaged.

3. According to the device and the equipment, the eccentric ring is made of polytetrafluoroethylene and the like, and the material has the advantages of chemical stability, corrosion resistance, sealing property, high lubrication non-sticking property, electrical insulation property, high temperature resistance, excellent ageing resistance and endurance, certain elasticity and buffering effect.

4. The device and the equipment are adopted for dry etching, so that the fragment rate is reduced, and the etching uniformity is improved.

Drawings

FIG. 1 is a block diagram of the present invention;

FIG. 2 is a perspective view of the present invention;

FIG. 3 is a view showing the construction of an eccentric ring according to the present invention;

FIG. 4 is a side view of FIG. 3;

FIG. 5 is a partial cross-sectional view of FIG. 1;

FIG. 6 is a schematic view of a platen pressing a wafer;

FIG. 7 is a comparative table of experiments with the apparatus of the present invention and the prior art apparatus;

wherein:

10. the device comprises a cover body, 20, a pressure plate, 21, a through hole, 22, a mounting hole, 23, a step, 30, a connecting piece, 40, an eccentric ring, 41, a minimum width position, 42, a maximum width position, 50, an objective table, 60 and a wafer.

Detailed Description

The utility model is further described below by means of specific embodiments.

In the description of the present invention, the directions or positional relationships indicated by "upper", "lower", "left", "right", "front", and "rear", etc. are used as the directions or positional relationships indicated on the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the device referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the scope of the present invention.

Referring to fig. 1 and 2, a wafer positioning device of a dry etching machine comprises a cover 10 and a platen 20; the cover 10 is connected to a platen 20 through a plurality of connecting members 30, the platen 20 has a through hole 21, a step is formed in the through hole to press the edge of the surface of the wafer 60, and an eccentric ring 40 is further sleeved between the connecting members 30 and the platen 20. The eccentric ring 40 is provided to restrict the rocking of the pressure plate 20 during operation.

In the present invention, the platen 20 can press down or up on the edge of the surface of the wafer 60, and the platen 20 can be connected to the bottom or top surface of the cover 10, according to the actual situation. In order to ensure that the through hole 21 of the platen 20 can press the edge of the surface of the wafer 60, a step 23 is provided to press the edge of the surface of the wafer 60, which includes the edge of the top surface of the wafer 60 and the edge of the side surface of the wafer 60 near the top surface.

Further, the connecting member 30 may be a bolt, a screw, or other conventional connecting structure. The connecting members 30 are spaced apart from each other and circumferentially distributed around the center of the through hole 21, so as to ensure a more stable and reliable connection between the platen 20 and the cover 10.

The pressure plate 20 is correspondingly provided with mounting holes 22, and a plurality of connecting pieces 30 are arranged on the corresponding mounting holes 22 in a penetrating way. The inner diameter of the mounting hole 22 is larger than the outer diameter of the connection member 20 so that there is a gap between the mounting hole 22 and the connection member 20. The number of the eccentric rings 40 may be the same as or different from that of the connecting members 30, and preferably, the eccentric rings 40 are respectively fitted in the gaps between the connecting members 30 and the corresponding mounting holes 22.

In practical applications, the connecting members 30 are uniformly distributed around the periphery of the through hole 21 and close to the edge of the platen 20. Referring to fig. 3 and 4, the eccentric ring 40 has inner and outer rings that are not concentric, with the width between the inner and outer rings varying, with a maximum width 42 and a minimum width 41. The minimum width of the eccentric ring 40 is 0.74mm-0.86mm, the maximum width is 1.15mm-1.25mm, the thickness is 3.4mm-3.6mm, the size of the eccentric ring can be reasonably set according to the size of the pressure plate and the bolt, and the utility model is not limited to this.

The eccentric ring 40 of the present invention is made of elastic material such as polytetrafluoroethylene, and the material has chemical stability, corrosion resistance, sealing property, high lubrication non-stick property, electrical insulation property, high temperature resistance and excellent aging resistance and endurance.

When the utility model is installed, the minimum width part 41 faces to the center of the through hole 21 and is positioned on the radial extension line of the through hole 21. I.e. with the minimum width 41 facing inwards and the maximum width 42 facing outwards. When the pressure plate 20 is subjected to an ineffectiveness force, the pressure plate will be actively leaned toward the center of the through hole 21, and the eccentric ring 40 has elasticity, so that the parts will not be damaged.

The utility model also provides a dry etching device, which comprises a machine table, wherein the machine table is provided with related devices of the conventional dry etching device, the related devices comprise a reaction cavity, an object stage 50, a lifting device, an exciting coil, a bias voltage supply device and the like which are arranged in the reaction cavity, and the wafer positioning device also comprises the wafer positioning device.

The object stage 50 is used for placing the wafer 60, the cover 10 is disposed above the object stage 50, and the lifting device is used for connecting and driving the cover 10 to lift, so as to drive the platen 20 to press the wafer 60 to realize positioning, see fig. 5.

The dry etching apparatus (new version of clamp) according to the present invention was compared with the existing dry etching apparatus (old version of clamp) without the eccentric ring 40. Taking 100 wafers in the process to deposit 1um SiO2 film as an example, 10 batches of the film are divided, 10 wafers in each batch; the film thickness values before and after the collection operation were measured according to the same process operation, respectively, to obtain the table shown in fig. 6. The wafer breakage rate is X (the number of broken pieces and unfilled corner pieces)/10 (the total number of pieces), the rate uniformity is (U% (wafer1) + U% (wafer2) + … U% (wafer10))/10, and U% (wafer1) represents the rate uniformity of deposition of the wafer numbered 1 in the batch.

The experimental data show that: the improved equipment has the advantages that the fragment rate is reduced to 0, and the etching rate uniformity is improved by 10 times.

The above description is only an embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any insubstantial modifications made by using the design concept should fall within the scope of infringing the present invention.

Claims

1. A wafer positioning device of a dry etching machine comprises a cover body and a pressure plate; this lid is connected the pressure disk through a plurality of connecting pieces, and this pressure disk middle part is equipped with the through-hole, is equipped with the step in order to press in wafer surface edge in the through-hole, its characterized in that: an eccentric ring is also sleeved between the connecting piece and the pressure plate.

2. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the connecting pieces are arranged at intervals and distributed circumferentially around the center of the through hole.

3. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the minimum width position of the eccentric ring faces to the center of the through hole and is positioned on a radial extension line of the through hole.

4. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the minimum width of the eccentric ring is 0.74mm-0.86 mm.

5. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the maximum width of the eccentric ring is 1.15mm-1.25 mm.

6. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the thickness of the eccentric ring is 3.4mm-3.6 mm.

7. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the eccentric ring is made of polytetrafluoroethylene.

8. The wafer positioning device of the dry etching machine as claimed in claim 1, wherein: the pressure plate is correspondingly provided with a plurality of mounting holes, and the connecting pieces penetrate through the corresponding mounting holes; the eccentric rings are respectively sleeved between the connecting piece and the corresponding mounting hole.

9. The dry etching equipment comprises a machine table and is characterized in that: the wafer positioning device of the dry etching machine station as claimed in any one of claims 1 to 8.