CN215450121U

CN215450121U - Heat abstractor for computer mainframe

Info

Publication number: CN215450121U
Application number: CN202121868120.5U
Authority: CN
Inventors: 李志强
Original assignee: Suzhou Yufeng Network Technology Co ltd
Current assignee: Suzhou Yufeng Network Technology Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2022-01-07
Anticipated expiration: 2031-08-11

Abstract

The utility model relates to the technical field of computers and discloses a heat dissipation device for a computer mainframe, which comprises a box body, a dust screen body, a fan body, a circuit board body and a bottom shell, wherein a water tank is arranged in the bottom shell, the front part and the rear part of the left side of the water tank are respectively communicated with a conveying pipe and a discharge pipe, and a small water pump is arranged on the surface of the conveying pipe; the utility model can clean the dust screen on the surface of the mainframe box to keep the air inside the mainframe box circulating, and adopts two different modes to radiate the heat of the circuit board, thereby solving the problems that the dust screen of the mainframe box is easily covered by dust in the long-term use process, the meshes on the surface of the dust screen are blocked in a large area, the circulation rate of the air inside the mainframe is further influenced, and the heat radiation effect is greatly reduced, and simultaneously avoiding the conditions that the mainframe only adopts a fan to radiate the circuit board inside, the heat radiation effect is poor, and the temperature of the circuit board is easy to rise.

Description

Heat abstractor for computer mainframe

Technical Field

The utility model relates to the technical field of computers, in particular to a heat dissipation device for a computer mainframe.

Background

The computer is commonly called computer, is an electronic computer for high-speed calculation, can perform numerical calculation and logic calculation, and also has the function of storage and memory. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. A computer that is composed of a hardware system and a software system and does not have any software installed is called a bare metal.

In the using process of a computer, a circuit in the host computer generates higher temperature, the host computer needs to be radiated and cooled in time, the current host computer mostly adopts a fan to radiate heat, meanwhile, in order to avoid dust entering, a dust screen is usually additionally arranged on the surface of the host computer box, but the dust screen of the host computer box is easily covered by dust in the long-term use process, meshes on the surface of the dust screen are blocked in a large area, the circulation rate of air in the host computer is further influenced, the heat radiation effect is greatly reduced, the host computer only adopts the fan to radiate heat of a circuit board in the host computer, the heat radiation effect is poor, the temperature of the circuit board is easy to rise, therefore, the dust screen on the surface of the host computer box can be cleaned, the dust screen is prevented from being covered by dust, the air in the host computer box is kept circulating, and two different modes are adopted to radiate heat of the circuit board, the heat sink for computer mainframe with better heat dissipation effect solves the problem.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a heat dissipation device for a computer host, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a heat abstractor for computer mainframe, includes box, dust screen body, fan body, circuit board body and drain pan, the internally mounted of drain pan has the water tank, two punishments do not communicate around the water tank is left have conveyer pipe and calandria, the surface mounting of conveyer pipe has small-size water pump, the internally mounted of water tank has a plurality of heat conduction post, the bottom of circuit board body is provided with heat conduction silicone grease layer, the top of heat conduction post run through to the inside of box and with heat conduction silicone grease layer contact each other, electric telescopic handle is installed at the top of box inner chamber, electric telescopic handle's output shaft fixedly connected with knee, the left surface of box runs through and has seted up vertical groove, the other end bolt of knee has the diaphragm, the right side of diaphragm is provided with the brush.

As a further description of the above scheme, a collecting box is arranged on the left side of the box body, a fixing column is bolted to the right side of the collecting box, a through hole is formed in the left side of the box body, and the fixing column is slidably connected with the inner wall of the through hole.

As a further description of the above scheme, a fixed plate is bolted to the left side inside the box body, and a magnet is mounted at the top of the fixed plate and is used in cooperation with the fixed column.

As a further description of the above solution, a sealing ring is disposed above the surface of the heat conducting column, and the top of the sealing ring is adhered to the inner wall of the water tank.

As a further description of the above scheme, a plurality of temperature and humidity sensors are installed inside the box body, and the number of the temperature and humidity sensors is a plurality and are respectively installed on the left side of the inner cavity of the box body and the top of the inner cavity of the box body.

As a further description of the above solution, the whole of the heat conducting column is cylindrical, and the heat conducting column is made of an aluminum alloy material.

Compared with the prior art, the utility model has the following beneficial effects:

the dust screen cleaning device can clean the dust screen on the surface of the mainframe box, prevent the dust screen from being covered by dust, and keep the air inside the mainframe box circulating, and adopts two different modes to dissipate heat of the circuit board, so that the heat dissipation effect is better, the problems that the dust screen of the mainframe box is easily covered by dust in the long-term use process, the meshes on the surface of the dust screen are blocked in a large area, the circulation rate of the air inside the mainframe is further influenced, and the heat dissipation effect is greatly reduced are solved, and meanwhile, the conditions that the heat dissipation effect is poor and the temperature of the circuit board is easily increased when the mainframe only adopts a fan to dissipate the heat of the circuit board inside are avoided.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is an elevational, cross-sectional view of the structure of the present invention;

FIG. 3 is a left sectional view of a partial structure of the case of the present invention;

FIG. 4 is a top sectional view of the bottom case according to the present invention;

fig. 5 is a perspective view of a part of the present invention.

In the figure: 1. a box body; 2. a dust screen body; 3. a fan body; 4. a circuit board body; 5. a bottom case; 6. a water tank; 7. a delivery pipe; 8. arranging pipes; 9. a small-sized water pump; 10. a heat-conducting column; 11. a thermally conductive silicone layer; 12. an electric telescopic rod; 13. bending a rod; 14. a transverse plate; 15. a brush; 16. a vertical groove; 17. a collection box; 18. fixing a column; 19. a through hole; 20. a fixing plate; 21. a magnet; 22. a seal ring; 23. temperature and humidity sensor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, a heat dissipation device for a computer host comprises a case 1, a dust screen body 2, a fan body 3, a circuit board body 4 and a bottom case 5, wherein a water tank 6 is installed inside the bottom case 5, a delivery pipe 7 and a discharge pipe 8 are respectively communicated with the front and back of the left side of the water tank 6, a small water pump 9 is installed on the surface of the delivery pipe 7, a plurality of heat conduction columns 10 are installed inside the water tank 6, a heat conduction silicone layer 11 is arranged at the bottom of the circuit board body 4, the top ends of the heat conduction columns 10 penetrate through the inside of the case 1 and are in contact with the heat conduction silicone layer 11, an electric telescopic rod 12 is installed at the top of the inner cavity of the case 1, an output shaft of the electric telescopic rod 12 is fixedly connected with a bent rod 13, a vertical groove 16 is formed in the surface of the left side of the case 1, a transverse plate 14 is bolted at the other end of the bent rod 13, a brush 15 is arranged at the right side of the transverse plate 14, and the device can clean the dust screen on the surface of the case, avoid the dust screen to be covered by the dust, make the inside air of mainframe box keep circulating, and adopt two kinds of different modes to dispel the heat to the circuit board, the radiating effect is better, the dust screen of having solved present mainframe box is covered by the dust easily in long-term use, the mesh on dust screen surface appears the large tracts of land and blocks up, and then influences the circulation rate of the inside air of host computer, cause the problem that the radiating effect discounted greatly, avoided the host computer to only adopt the fan to dispel the heat to inside circuit board simultaneously, the radiating effect is not good enough, the easy situation that risees of temperature of circuit board.

Referring to fig. 1 and 2, a collecting box 17 is arranged on the left side of the box body 1, a fixing post 18 is bolted to the right side of the collecting box 17, a through hole 19 is formed in the left side of the box body 1, the fixing post 18 is slidably connected with the inner wall of the through hole 19, the collecting box 17 can collect part of dust falling in the cleaning process through the arrangement of the collecting box 17, the fixing post 18 and the through hole 19, and the fixing post 18 can be inserted into the through hole 19, so that the collecting box 17 is initially fixed on the surface of the box body 1.

Referring to fig. 2, a fixing plate 20 is bolted to the left side of the interior of the box body 1, a magnet 21 is mounted at the top of the fixing plate 20, the magnet 21 is used in cooperation with the fixing posts 18, and through the arrangement of the transverse plate 14 and the magnet 21, after the fixing posts 18 pass through the through holes 19, the magnet 21 can be adsorbed and fixed on the fixing posts 18, so that the collecting box 17 is firmly fixed.

Referring to fig. 2, a sealing ring 22 is disposed above the surface of the heat conducting column 10, the top of the sealing ring 22 is adhered to the inner wall of the water tank 6, and the sealing ring 22 seals the penetrating portion between the heat conducting column 10 and the water tank 6 to prevent water inside the water tank 6 from leaking out.

Referring to fig. 2 and 3, a plurality of temperature and humidity sensors 23 are installed inside the box body 1, the number of the temperature and humidity sensors 23 is a plurality, and the temperature and humidity sensors 23 are respectively installed on the left side of the inner cavity of the box body 1 and the top of the inner cavity of the box body 1, and the temperature and humidity inside the box body 1 can be monitored through the arrangement of the temperature and humidity sensors 23.

Referring to fig. 2 and 4, the heat conducting pillar 10 is generally cylindrical, the heat conducting pillar 10 is made of aluminum alloy, and the heat conducting pillar 10 is made of aluminum alloy, so that the aluminum alloy has good heat conducting performance, good corrosion resistance and weldability, and is light and low in cost, which is beneficial to reducing the cost and weight of the device.

The working principle is as follows: when the heat dissipation device is used, firstly, the conveying pipe 7 and the calandria 8 are externally connected with a water source and a water conveying pipeline, then the small water pump 9 is started, water with lower temperature enters the water tank 6 through the conveying pipe 7 and is in contact with the heat conduction column 10, heat generated by the circuit board body 4 in the operation process can be transmitted to the heat conduction column 10 through the heat conduction silicone layer 11, then the water entering the water tank 6 absorbs the heat of the heat conduction column 10, the temperature of the circuit board body 4 is reduced, meanwhile, the fan body 3 can be started, externally connected air enters the box body 1 through the dustproof net body 2, the flowing air can take away the heat on the surface of the circuit board body 4, the temperature of the circuit board body 4 is reduced, two different modes are adopted for heat dissipation, the heat dissipation effect is improved, and the temperature of the circuit board is not easy to rise; when the more dust of surface covering at dust screen body 2, alright open electric telescopic handle 12, its output shaft extension and drive curved bar 13 and diaphragm 14 together descend, diaphragm 14 falls through the brush 15 with the dust of gathering on dust screen body 2 surface when descending, when diaphragm 14 moves to the below, make electric telescopic handle 12's output shaft shrink, then diaphragm 14 gets back to the top again, electric telescopic handle 12's output shaft extension once more afterwards, and make brush 15 descend once more and clear up, clear up like this reciprocal, avoid the dust screen to be covered by the dust, the circulation rate of quick-witted incasement portion air has been guaranteed, promote the radiating effect, when not needing to clear up the dust screen simultaneously, can be at the surface paste of vertical groove 16, in order to prevent that the dust from entering from vertical groove 16.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat abstractor for computer mainframe, includes box (1), dust screen body (2), fan body (3), circuit board body (4) and drain pan (5), its characterized in that: a water tank (6) is arranged in the bottom shell (5), the front part and the rear part of the left side of the water tank (6) are respectively communicated with a delivery pipe (7) and a discharge pipe (8), a small water pump (9) is arranged on the surface of the conveying pipe (7), a plurality of heat-conducting columns (10) are arranged inside the water tank (6), the bottom of the circuit board body (4) is provided with a heat-conducting silicone grease layer (11), the top end of the heat conducting column (10) penetrates into the box body (1) and is contacted with the heat conducting silicone layer (11), an electric telescopic rod (12) is arranged at the top of the inner cavity of the box body (1), an output shaft of the electric telescopic rod (12) is fixedly connected with a bent rod (13), the novel multifunctional garbage bin is characterized in that a vertical groove (16) is formed in the surface of the left side of the bin body (1) in a penetrating mode, a transverse plate (14) is bolted to the other end of the bent rod (13), and a brush (15) is arranged on the right side of the transverse plate (14).

2. The heat sink according to claim 1, wherein: the novel garbage bin is characterized in that a collecting box (17) is arranged on the left side of the bin body (1), a fixing column (18) is bolted to the right side of the collecting box (17), a through hole (19) is formed in the left side of the bin body (1), and the fixing column (18) is connected with the inner wall of the through hole (19) in a sliding mode.

3. The heat sink according to claim 2, wherein: a fixing plate (20) is bolted to the left side inside the box body (1), a magnet (21) is installed at the top of the fixing plate (20), and the magnet (21) is matched with the fixing column (18) for use.

4. The heat sink according to claim 1, wherein: and a sealing ring (22) is arranged above the surface of the heat conducting column (10), and the top of the sealing ring (22) is bonded with the inner wall of the water tank (6).

5. The heat sink according to claim 1, wherein: the temperature and humidity monitoring box is characterized in that a plurality of temperature and humidity sensors (23) are mounted inside the box body (1), and the number of the temperature and humidity sensors (23) is a plurality and are respectively mounted on the left side of an inner cavity of the box body (1) and the top of the inner cavity of the box body (1).

6. The heat sink according to claim 1, wherein: the whole of the heat conduction column (10) is cylindrical, and the heat conduction column (10) is made of aluminum alloy.