CN211607192U - Device heat sink generates heat - Google Patents
Device heat sink generates heat Download PDFInfo
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- CN211607192U CN211607192U CN202020202738.7U CN202020202738U CN211607192U CN 211607192 U CN211607192 U CN 211607192U CN 202020202738 U CN202020202738 U CN 202020202738U CN 211607192 U CN211607192 U CN 211607192U
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Abstract
The utility model relates to a heating device cooling device, which comprises a temperature acquisition device, a control module, a heating device and a cooling circulation system; the control module is respectively electrically connected with the temperature acquisition device and the cooling circulation system to realize signal acquisition and control; the heating device is arranged in the cooling circulation system, and the temperature acquisition device is arranged on the surface of the heating device to realize the detection of the temperature of the heating device. The temperature that gathers temperature sensor is compared through comparison circuit with the temperature that sets up, if gather the temperature and be higher than comparison temperature, then control module sends drive signal drive circulating pump and refrigerating plant work, if gather the temperature and be less than comparison temperature, then explain that the device that generates heat does not need the heat dissipation this moment, then can not send drive signal, cooling circulation system just works when needs the heat dissipation like this, then out of work when not needing the heat dissipation, both can reduce entire system's consumption, also can prolong system's life and improvement reliability and stability.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a device heat sink generates heat.
Background
The rapid development of the internet requires larger and larger data volume to be processed, and the power of the corresponding data processor is also larger and larger. Since the electronic circuits of the processor generate a large amount of heat during operation, the heat dissipation scheme becomes an important component of the processor.
The traditional air cooling heat dissipation method for the electronic circuit has the disadvantages of low efficiency, high energy consumption, high noise, occupied space and instability, and can not meet the requirements of large-scale electronic circuits. At this moment, the immersed cooling system comes by the turn, and the application number is: chinese patent application CN2019102527727 introduces a liquid-cooled server cabinet, which mainly comprises a cabinet body, and a server, a server shell, a heat exchanger, a cooling liquid, a spraying device and a support plate arranged in the cabinet body. The server is arranged in the server shell; the server shell is a container with an open upper end, and the lower end of the server shell is provided with at least one liquid outlet hole; the supporting plate is horizontally arranged in the cabinet body and divides the space in the cabinet body; the server housing is placed on the support plate; a hollow runner is arranged on the supporting plate; the cooling liquid is arranged in a gap between the server and the server shell and at the bottom of the cabinet body; the heat exchanger is used for exchanging heat and reducing the temperature of cooling liquid at the bottom of the cabinet body; the spraying device comprises a spraying pipeline, a spraying head and a pump.
Above-mentioned scheme can be better reduce the temperature of electron electrical apparatus heating element, but its structure is complicated, and it is big to take up an area of the space, can not gather the cabinet body temperature in real time moreover and carry out the temperature comparison, radiating purpose with the temperature control of the cabinet body under certain temperature can, and the coolant liquid all flows the heat dissipation at any time and any place in above-mentioned scheme and leads to the consumption of whole system very big.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's shortcoming, provide a device heat sink generates heat, solved the not enough that exists in the scheme of present heat sink.
The purpose of the utility model is realized through the following technical scheme: a heating device cooling device comprises a temperature acquisition device, a control module, a heating device and a cooling circulation system; the control module is respectively electrically connected with the temperature acquisition device and the cooling circulation system to realize signal acquisition and control; the heating device is arranged in the cooling circulation system, and the temperature acquisition device is arranged on the surface of the heating device to realize the detection of the temperature of the heating device.
Further, the cooling circulation system comprises a cabinet, a circulation pump and a refrigerating device; the cabinet, the circulating pump and the refrigerating device are sequentially connected through pipelines.
Furthermore, the side walls of the two ends of the cabinet are respectively provided with a first liquid inlet and a first liquid outlet, the side walls of the two ends of the circulating pump are respectively provided with a second liquid inlet and a second liquid outlet, and the side walls of the two ends of the refrigerating device are respectively provided with a third liquid inlet and a third liquid outlet;
the first liquid outlet is connected with the second liquid inlet, the second liquid outlet is connected with the third liquid inlet, and the third liquid outlet is connected with the first liquid inlet.
Furthermore, the cabinet is filled with insulating cooling liquid, and the heating device is placed in the insulating cooling liquid in the cabinet; the top of the cabinet is also provided with a sealing upper cover, and a lead of the temperature acquisition device penetrates through the sealing upper cover to be connected with a signal acquisition port of the control module.
Furthermore, a cooling channel for the circulation of the insulating cooling liquid is arranged in the refrigerating device and used for rapidly reducing the temperature of the insulating cooling liquid flowing through the cooling channel.
Furthermore, the refrigerating device is a semiconductor refrigerating device, one side of the cooling channel is attached to the heat absorption surface of the semiconductor refrigerating device, and the heat dissipation surface of the semiconductor refrigerating device is provided with a heat dissipation device.
Further, the control module is electrically connected with the circulating pump and the semiconductor refrigerating device.
Furthermore, a comparison circuit is arranged in the control module, and the signals collected by the temperature collecting device are compared with the set temperature, and a driving signal is sent out according to the comparison result to drive the circulating pump and the refrigerating device to work.
Further, the heat generating device includes one of a server motherboard, an electronic device, and an integrated circuit module.
Further, the temperature acquisition device comprises a temperature sensor.
The utility model has the advantages of it is following: a heating device cooling device compares the temperature collected by a temperature sensor with the set temperature through a comparison circuit, if the collected temperature is higher than the comparison temperature, a control module sends a driving signal to drive a circulating pump and a refrigerating device to work, if the collected temperature is lower than the comparison temperature, the heating device does not need to dissipate heat at the moment, and the driving signal is not sent;
the circulating pump and the refrigerating device keep the insulating cooling liquid at a reasonable temperature, so that the cooling effect of the heating element of the electronic circuit is achieved, the structure of the prior art is simplified, and the volume of the whole set of cooling device is reduced; by utilizing semiconductor refrigeration and electronic control technology, the temperature of the heating element of the electronic circuit is always kept below a reasonable temperature, and the working time and the service life of the heating element of the electronic appliance are prolonged; through cell-phone APP's operation platform, monitor electronic circuit's the state of generating heat.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic sectional view of the cabinet structure of the present invention;
in the figure: 1-cabinet, 2-circulating pump, 3-refrigerating device, 4-control module, 11-first liquid inlet, 12-first liquid outlet, 13-sealing upper cover, 14-heating device, 15-insulating cooling liquid, 16-temperature collecting device, 21-second liquid inlet, 22-second liquid outlet, 31-third liquid inlet and 32-third liquid outlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to which the term refers must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention will be further described with reference to the accompanying drawings, but the scope of the invention is not limited to the following description.
As shown in fig. 1, a cooling device for a heating device comprises a cabinet 1, a circulation pump 2, a refrigerating device 3 and a control module 4, wherein the cabinet 1 is provided with a first liquid inlet 11 and a first liquid outlet 12, the circulation pump 2 is provided with a second liquid inlet 21 and a second liquid outlet 22, the refrigerating device 3 is provided with a third liquid inlet 31 and a third liquid outlet 32, and the first liquid outlet 12 and the second liquid inlet 21, the second liquid outlet 22 and the third liquid inlet 31, and the third liquid outlet 32 and the first liquid inlet 11 are sequentially connected through a pipeline; an insulating cooling liquid cooling channel is arranged in the refrigerating device 3 and used for rapidly reducing the temperature of the insulating cooling liquid flowing through the cooling channel. Through the work of circulating pump 2, insulating cooling liquid 15 is continuous to get into refrigerating plant internal cooling, and insulating cooling liquid 15 after the cooling pours into in the rack 1 into, and the work of so circulation ensures that the insulating cooling liquid temperature in the rack is in the best operating temperature scope of electronic circuit.
A temperature sensor is arranged in the cabinet 1, the temperature sensor is adhered to the surface of a heating element of the heating electronic circuit 14 and can directly measure the surface temperature of the heating element of the electronic circuit 14, and the temperature sensor 16 is electrically connected with the control module 4; the control module 4 is simultaneously electrically connected with the circulating pump 2 and the refrigerating device 3; the control module 4 is internally provided with a comparison circuit, and compares the signal collected from the temperature sensor 16 with the set optimal temperature to determine whether to send out a driving signal to drive the circulating pump 2 and the refrigerating device 3 to work. The refrigerating device 3 can adopt a semiconductor refrigerating sheet, and can also use the existing common refrigerating device. Adopt the semiconductor refrigeration piece, refrigeration efficiency is high, and area is little, and can be through the direct electric control of the mode of its P, N utmost point of control, easily realize accurate control refrigeration effect. The comparison circuit adopts the existing temperature comparison circuit, the utility model discloses do not do any improvement.
As shown in fig. 2, the electronic circuit and the insulating cooling liquid 15 are placed in the cabinet 1, and the electronic circuit 14 is immersed in the insulating cooling liquid 15; the temperature sensor is attached to the heating element of the electronic circuit 14. The side wall of the cabinet is provided with a first liquid inlet 11 and a first liquid outlet 12, hoses are respectively installed at the first liquid inlet 11 and the first liquid outlet 12, the hoses extend into the cabinet and are in contact with the insulating cooling liquid, and the contact positions of the hoses and the first liquid inlet 11 and the first liquid outlet 12 are sealed. The top of the cabinet 1 is provided with an upper sealing cover 13, and the upper sealing cover 13 is sealed at the contact position with the cabinet 1; the lead of the temperature sensor 16 passes through the sealing upper cover 13 to be connected with the signal acquisition port of the control module 4, and the lead of the temperature sensor 16 passes through the sealing upper cover 13 to be sealed.
Further, be provided with the information sending unit in control module 4, can be used for sending the information that cell-phone APP can receive, realize real-time temperature monitoring, can also fixedly be provided with level sensor in 1 rack, level sensor with the controller electricity is connected, can realize the real time monitoring of insulating liquid loss condition.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a device heat sink generates heat which characterized in that: comprises a temperature acquisition device (16), a control module (4), a heating device (14) and a cooling circulation system; the control module (4) is respectively electrically connected with the temperature acquisition device (16) and the cooling circulation system to realize signal acquisition and control; the heating device (14) is arranged in the cooling circulation system, and the temperature acquisition device (16) is arranged on the surface of the heating device (14) to realize the detection of the temperature of the heating device (14).
2. A heat generating device cooling device according to claim 1, characterized in that: the cooling circulation system comprises a cabinet (1), a circulation pump (2) and a refrigerating device (3); the equipment cabinet (1), the circulating pump (2) and the refrigerating device (3) are sequentially connected through pipelines.
3. A heat generating device cooling device according to claim 2, characterized in that: a first liquid inlet (11) and a first liquid outlet (12) are respectively formed in the side walls of two ends of the cabinet (1), a second liquid inlet (21) and a second liquid outlet (22) are respectively formed in the side walls of two ends of the circulating pump (2), and a third liquid inlet (31) and a third liquid outlet (32) are respectively formed in the side walls of two ends of the refrigerating device (3);
the first liquid outlet (12) is connected with the second liquid inlet (21), the second liquid outlet (22) is connected with the third liquid inlet (31), and the third liquid outlet (32) is connected with the first liquid inlet (11).
4. A heat generating device cooling device according to claim 2, characterized in that: insulating cooling liquid (15) is filled in the cabinet (1), and the heating device (14) is placed in the insulating cooling liquid (15) in the cabinet (1); the top of the cabinet (1) is also provided with a sealing upper cover (13), and a lead of the temperature acquisition device (16) penetrates through the sealing upper cover (13) to be connected with a signal acquisition port of the control module (4).
5. A heat generating device cooling device according to claim 2, characterized in that: and a cooling channel for the circulation of the insulating cooling liquid (15) is arranged in the refrigerating device (3) and is used for rapidly reducing the temperature of the insulating cooling liquid flowing through the cooling channel.
6. A heat generating device cooling device according to claim 5, characterized in that: the refrigerating device (3) is a semiconductor refrigerating device, one side of the cooling channel is attached to the heat absorption surface of the semiconductor refrigerating device, and the heat dissipation surface of the semiconductor refrigerating device is provided with a heat dissipation device.
7. A heat generating device cooling device according to claim 6, characterized in that: the control module (4) is electrically connected with the circulating pump (2) and the semiconductor refrigerating device.
8. A heat generating device cooling device according to claim 2, characterized in that: a comparison circuit is arranged in the control module (4), signals acquired by the temperature acquisition device (16) are compared with set temperatures, and driving signals are sent out according to comparison results to drive the circulating pump (2) and the refrigerating device (3) to work.
9. A heat generating device cooling device according to any one of claims 1 to 8, characterized in that: the heat generating device (14) includes one of a server motherboard, an electronic device, and an integrated circuit module.
10. A heat generating device cooling device according to any one of claims 1 to 8, characterized in that: the temperature acquisition device (16) comprises a temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020202738.7U CN211607192U (en) | 2020-02-24 | 2020-02-24 | Device heat sink generates heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020202738.7U CN211607192U (en) | 2020-02-24 | 2020-02-24 | Device heat sink generates heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211607192U true CN211607192U (en) | 2020-09-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020202738.7U Active CN211607192U (en) | 2020-02-24 | 2020-02-24 | Device heat sink generates heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211607192U (en) |
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2020
- 2020-02-24 CN CN202020202738.7U patent/CN211607192U/en active Active
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