CN215447789U - Wafer profile measuring instrument - Google Patents

Abstract

The utility model relates to the technical field of wafer detection, and discloses a wafer profile measuring instrument, which comprises: the detection device comprises a shell, a detection cavity and a detection device, wherein the detection cavity is arranged inside the shell; the bearing device comprises a carrier plate, one side of the carrier plate extends into the detection cavity, a detection notch is formed in one side, close to the detection cavity, of the carrier plate, and a wafer is placed on the surface of the carrier plate and extends to the outer side of the detection notch; the detection device is arranged in the detection cavity and comprises a first camera arranged above the detection notch and a second camera arranged on one side of the detection notch. This technical scheme carries out the image extraction collection to the wafer through adopting first camera and second camera in detecting the cavity, and detection efficiency promotes greatly to setting up through the safety cover can reduce external illumination to the influence that detects, improve greatly and detect the accuracy.

Description

Wafer profile measuring instrument

Technical Field

The utility model relates to the technical field of wafer detection, in particular to a wafer profile measuring instrument.

Background

The production process flow of the wafer comprises the following steps: in a large aspect, wafer production includes two major steps of boule fabrication and chip fabrication, which can be further divided into the following major processes (wherein boule fabrication includes only the first process, and the rest of the wafer fabrication is all referred to as post-processing of column slicing): the method comprises the steps of crystal bar growth, crystal bar cutting and detection, outer diameter grinding, slicing, round edge grinding, surface layer grinding, etching, defect removal, polishing, cleaning, inspection and packaging, and in the process flows, the detection of polished wafers is particularly important.

After a wafer is polished, contour detection of appearance (thickness, angle, depth and the like) of the wafer is needed, particularly, contour detection is carried out on the wafer with a notch or a notch, most of existing measuring instruments are in a contact type or adopt a microscope to carry out image detection, and the detection of the wafer by the two modes has certain limitation; meanwhile, many detection devices detect under the condition of natural light, and a certain image is easily generated on the detection result.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a wafer profile measuring instrument.

The utility model is realized by the following technical scheme:

a wafer profile measuring instrument, comprising:

the detection device comprises a shell, a detection cavity and a detection device, wherein the detection cavity is arranged inside the shell;

the bearing device comprises a carrier plate, one side of the carrier plate extends into the detection cavity, a detection notch is formed in one side, close to the detection cavity, of the carrier plate, and a wafer is placed on the surface of the carrier plate and extends to the outer side of the detection notch;

the detection device is arranged in the detection cavity and comprises a first camera arranged above the detection notch and a second camera arranged on one side of the detection notch.

Among the above-mentioned technical scheme, at first place the wafer in the surface of support plate and make the waiting of wafer detect the region protrusion to the outside of detection breach, when the wafer that has the notch needs to be detected, first camera carries out image acquisition to the chamfer condition of notch, appearance outline, the angle of notch, and the second camera carries out image acquisition to the thickness of wafer, limit, then carries out the analysis and compares to accomplish and detect.

The utility model is further provided with: the detection cavity is also provided with a protective cover outside, and the protective cover is detachably connected with the shell.

Among the above-mentioned technical scheme, safety cover detachably is connected with the casing, thereby after being fixed in the support plate with the wafer, cover the safety cover isolated natural light, can improve detection accuracy to a great extent.

The utility model is further provided with: the surface of the carrier plate is also provided with a limiting mechanism at one side close to the detection notch, the limiting mechanism comprises at least one group of limiting components, the limiting components comprise two limiting holes symmetrically arranged on the surface of the carrier plate, and guide pillars are placed in the limiting holes;

the surface of the support plate is provided with a sliding groove, a pressing wheel is rotationally arranged in the sliding groove, a rubber sleeve is wrapped outside the pressing wheel, and the pressing wheel can be close to or far away from the detection gap.

Among the above-mentioned technical scheme, the setting of spacing hole and guide pillar, one is in order to fix the wafer, and its two also can adjust spacing hole and guide pillar according to the actual specification of wafer to satisfy the detection of different specification wafers.

The utility model is further provided in that the guide post comprises:

the fixed shaft is placed in the limiting hole;

the dwang, the dwang cover is located the fixed axle is outside.

Among the above-mentioned technical scheme, the purpose of guide pillar is for spacing, and the fixed axle outside is located to the dwang cover, and when the wafer rotated, the dwang also can rotate along with the wafer, can prevent like this to cause wearing and tearing and damage to the wafer in the testing process.

The utility model is further configured that a sliding mechanism is further arranged at the lower end of the carrier plate, and the sliding mechanism comprises:

the fixing frame is arranged below the support plate;

the sliding block is arranged in the fixed frame in a sliding manner;

the sliding assembly comprises a connecting block and a sliding plate fixed at the upper end of the connecting block, the sliding plate can slide on the surface of the fixing frame, and the pinch roller is fixed above the sliding plate through a connecting shaft;

clockwork spring, clockwork spring's one end with the sliding block is connected, clockwork spring's the other end is connected with the installation axle, the installation axle is located the support plate below is close to the one side of detecting the breach.

Among the above-mentioned technical scheme, the pinch roller set up in the upper end of sliding plate, the sliding plate belongs to sliding assembly's partly, and the sliding plate then removes on the surface of mount, and the setting of connecting block and sliding block can guarantee that the removal of sliding block is more steady, and clockwork spring is connected with sliding block and installation axle respectively, can guarantee like this that the pinch roller presss from both sides the tight wafer clamp, prevents the offset of wafer.

The utility model is further provided with: the detection device is characterized in that a first light source is further arranged below the detection gap, the first camera corresponds to the first light source, and the first light source is located in the detection cavity.

In the above technical solution, the first light source and the first camera are arranged correspondingly, so that the light source is provided for the work of the first camera.

The utility model is further provided with: the other side of the detection gap is also provided with a second light source, the second camera and the second light source are arranged correspondingly, and the second light source is positioned in the detection cavity.

In the above technical solution, the second light source is disposed corresponding to the second camera, so as to provide a light source for the work of the second camera.

The utility model is further provided with: the first camera is connected with the XZ double-shaft sliding table, and the XZ double-shaft sliding table is located in the detection cavity.

Among the above-mentioned technical scheme, XZ biax slip table is connected with first camera, and XZ biax slip table can drive first camera and carry out the removal about the horizontal direction and reciprocating of vertical direction.

The utility model is further provided with: the lower end of the second camera is connected with an XY double-shaft sliding table I, and the XY double-shaft sliding table I is located in the detection cavity.

Among the above-mentioned technical scheme, XY biax slip table one is connected with the second camera, and XY biax slip table one can drive the second camera and carry out the removal of horizontal left and right direction and the removal of horizontal fore-and-aft direction.

The utility model is further provided with: and one side of the second light source is connected with an XY double-shaft sliding table II, and the XY double-shaft sliding table II is positioned in the detection cavity.

Among the above-mentioned technical scheme, XY biax slip table two is connected with the second light source, and XY biax slip table two can drive the second light source and carry out the removal of horizontal left and right direction and the removal of horizontal fore-and-aft direction.

The utility model discloses a wafer profile measuring instrument, which has the following advantages compared with the prior art:

1. according to the technical scheme, the first camera and the second camera are adopted in the detection cavity to extract and collect images of the wafer, so that the detection efficiency is greatly improved, the influence of external illumination on detection can be reduced through the arrangement of the protection cover, and the detection accuracy is greatly improved;

2. the first camera, the second camera and the second light source are all adjustable, different angles of the wafer can be detected, and adaptability is greatly improved;

3. the automatic clamping device adopts the pressing wheel capable of automatically tensioning to automatically clamp the wafer, and realizes the positioning of the wafer through the matching of the pressing wheel and the guide pillar, so that the region to be detected of the wafer extends to the outer side of the notch, and the wafer is detected;

4. according to the utility model, the rubber sleeve is sleeved outside the pressing wheel, so that the friction force can be increased, when the pressing wheel rotates, the pressing wheel can drive the wafer to rotate, and meanwhile, the damage to the wafer is prevented to a great extent;

5. the limiting mechanisms are in multiple groups, and guide columns of the limiting mechanisms are detachable, so that the limiting mechanisms can be adjusted according to wafers of different specifications, and the detection range of the utility model is greatly improved.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the internal structure of the present invention.

Fig. 3 is a cross-sectional view of the present invention.

Fig. 4 is a schematic perspective view of the carrying device of the present invention.

Fig. 5 is a cross-sectional view of the carrier of the present invention.

Fig. 6 is a top view of a carrier plate according to the present invention.

FIG. 7 is a schematic diagram illustrating an effect of placing a wafer on a carrier according to the present invention.

Figure 8 is a cross-sectional view of the guide post of the present invention.

Fig. 9 is a schematic structural view of the sliding mechanism of the present invention.

The corresponding part names indicated by the numbers and letters in the drawings:

wherein: 10. a housing; 10a, a detection cavity; 20. a carrying device; 20a, a carrier plate; 20b, detecting gaps; 20c, a limiting component; 20c1, limiting hole; 20c2, guide posts; 20c21, fixed axis; 20c22, rotating rod; 20d, a sliding groove; 20e, a pinch roller; 20f, a rubber sleeve; 20g, connecting shafts; 30. a wafer; 40. a detection device; 40a, a first camera; 40b, a second camera; 40c, a first light source; 40d, a second light source; 40e, an XZ double-shaft sliding table; 40f, carrying out XY double-shaft sliding table I; 40g, an XY double-shaft sliding table II; 60. a sliding mechanism; 60a, a fixing frame; 60b, a slider; 60c, a sliding component; 60c1, connecting block; 60c2, a slide plate; 60d, a clockwork spring; 60e, mounting the shaft.

Detailed Description

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.

Referring to fig. 1 to 9, a wafer profile measuring apparatus includes: the detection device comprises a shell 10, wherein a detection cavity 10a is arranged inside the shell 10; the carrying device 20, the carrying device 20 includes a carrier plate 20a, one side of the carrier plate 20a extends into the inspection chamber 10a, an inspection notch 20b is formed on one side of the carrier plate 20a close to the inspection chamber 10a, a wafer 30 is placed on the surface of the carrier plate 20a, and the wafer 30 extends to the outside of the inspection notch 20 b; the detection device 40 is disposed in the detection cavity 10a, and the detection device 40 includes a first camera 40a disposed above the detection notch 20b and a second camera 40b disposed on one side of the detection notch 20 b. The detection notch 20b on the carrier plate 20a is mainly used for detecting a portion of the wafer 30, which exceeds the detection notch 20b, when the wafer is detected, if the wafer is circular and has no notch, four equal sites are equally divided into four points for detection, if the wafer has a notch or a notch, four equal sites are equally divided into four points for detection and detection of a single notch or notch, namely five point locations are detected, and as a whole, the arrangement of the detection notch 20b is convenient for image acquisition and system analysis and judgment in the contour detection process, and meanwhile, the detection of the multiple point locations enables the detection result to be more accurate; the whole detection process is completed in the detection cavity 10a, and particularly for a notch-containing wafer, the first camera 40a is mainly used for collecting chamfer, appearance outline and angle information images of the notch, and the second camera 40b is mainly used for collecting information images of the thickness, depth and the like of the wafer; it should be noted that the present invention further includes a control system, the control system is electrically connected to the first camera 40a and the second camera 40b, the control system is also electrically connected to the display screen, the image information collected by the first camera 40a and the second camera 40b is transmitted to the control system, the control system transmits the image signal to the display screen and displays the analysis and comparison result through the display screen, if there is a defect, the defect position is displayed on the display screen, in addition, the control system and the display screen are both the prior art, and the technicians in the field can select the control system according to the actual requirements; according to the technical scheme, the wafer is arranged on the wafer platform, the edge part of the wafer is captured through the built-in first camera and the built-in second camera, an image closest to the actual contour of an object is obtained through adjusting the multiplying power and the light quantity of a lens and focused, the image is analyzed after being locked, data are subjected to binarization processing to form a black-white contour image, and then the black-white contour image is analyzed through an internal calculation program to obtain the specific numerical value of the measured object.

Referring to fig. 1, a protection cover 50 is further disposed outside the detection cavity 10a, and the protection cover 50 is detachably connected to the housing 10. Wherein, the protection cover 50 still is equipped with the breach in one side that is close to the load-bearing device 20, it is worth noting, the support plate 20a of load-bearing device 20 can carry out fore-and-aft direction's removal, the removal of fore-and-aft direction can be realized through the slip table to support plate 20a, and to technical staff in the field, the back-and-forth movement that realizes support plate 20a is prior art, and technical staff in the field can choose according to actual need, and protection cover 50 sets up firstly in order to block the influence of external light to wafer detection, and protection cover 50's breach can also supply support plate 20a to pass through, prevents that guide pillar 20c2 from appearing colliding with protection cover 50.

Referring to fig. 4 to 9, a limiting mechanism is further disposed on a side of the surface of the carrier plate 20a close to the detection notch 20b, the limiting mechanism includes at least one set of limiting components 20c, the limiting components 20c include two limiting holes 20c1 symmetrically disposed on the surface of the carrier plate 20a, and guide pillars 20c2 are disposed in the limiting holes 20c 1; the surface of the carrier plate 20a is provided with a sliding groove 20d, a pressing wheel 20e is rotatably arranged in the sliding groove 20d, a rubber sleeve 20f is coated outside the pressing wheel 20e, and the pressing wheel 20e can approach or leave the detection gap 20 b. The guide post 20c2 includes: a stationary shaft 20c21, the stationary shaft 20c21 being placed within the stopper hole 20c 1; the rotating rod 20c22 is provided with a rotating rod 20c22 sleeved outside the fixed shaft 20c 21. The lower end of the carrier plate 20a is further provided with a sliding mechanism 60, and the sliding mechanism 60 includes: a fixing frame 60a disposed below the carrier plate 20 a; a sliding block 60b slidably disposed inside the fixing frame 60 a; a sliding assembly 60c, including a connecting block 60c1 and a sliding plate 60c2 fixed on the upper end of the connecting block 60c1, wherein the sliding plate 60c2 can slide on the surface of the fixed frame 60a, and the pressing wheel 20e is fixed above the sliding plate 60c2 through a connecting shaft 20 g; and a clockwork spring 60d, wherein one end of the clockwork spring 60d is connected with the sliding block 60b, the other end of the clockwork spring 60d is connected with a mounting shaft 60e, and the mounting shaft 60e is positioned on one side, close to the detection notch 20b, below the carrier plate 20 a. Referring to fig. 4, 6 and 7, it can be seen from fig. 4, 6 and 7 that the number of the limiting assemblies is at least one, and the preferred embodiment of the present technical solution is that the limiting assemblies are four groups, and the four groups of limiting assemblies can be adjusted according to actual requirements to realize the detection of wafers with different specifications; regarding the distribution of the limiting assemblies, the arrangement of the limiting assemblies in the technical scheme is that a longitudinal axis is drawn according to the central point of the carrier plate 20a, and each group of limiting assemblies are symmetrically arranged according to the axis; taking the outermost limiting component as an example, the two limiting holes 20c1 are symmetrically arranged according to the axis, and when a plurality of sets of limiting components need to be arranged, the limiting holes of the rest limiting components are sequentially close to the axis direction compared with the outermost limiting component; as shown in fig. 4, a knob is further fixed at the upper end of the pinch roller 20e, the side wall of the knob is in a stripe shape, meanwhile, a rotation scale is further arranged at the circumferential position of the knob, the stripe-shaped side wall facilitates the rotation of the pinch roller 20e, and in addition, the rotation scale is convenient for a person to observe the rotation angle of the wafer, so that the rotation scale is very intuitive; and the pressure wheel 20e can be close to or far away from the detection gap 20b, so that the wafer 30 can be pressed, and the detection accuracy is improved.

In addition, the fixed shaft 20c21 is inserted into the limiting hole 20c1, the rotating rod 20c22 is sleeved outside the fixed shaft 20c21, the rotating rod 20c22 rotates outside the fixed shaft 20c21, the rotating rod 20c22 rotates on the surface of the carrier plate 20a, the rotating rod 20c22 comprises a rotating body and a rotating block arranged at the upper end of the rotating body, the rotating body and the rotating block are both cylindrical, the diameter of the rotating block is smaller than that of the rotating body, the rotating body of the rotating rod 20c22 is in contact with the wafer 30, and a groove is concavely arranged at the position, corresponding to the fixed shaft 20c21, of the lower surface of the rotating body, and the fixed shaft 20c21 extends into the groove.

Then, the sliding groove 20d is located at the middle portion of the carrier plate 20a, and the sliding groove 20d provides a certain space for the movement of the pressing wheel 20 e.

As shown in fig. 5 to 9, the fixing frame 60a is a hollow rectangular frame, two opposite long sides of the fixing frame 60a are both provided with a moving groove, the sliding block 60b is a round rod, and two ends of the sliding block 60b penetrate through the moving grooves and extend to the outer side of the fixing frame 60 a; the connecting blocks 60c1 are circular ring-shaped structures, the number of the connecting blocks 60c1 is two, the connecting blocks 60c1 are sleeved outside the sliding block 60b, the two connecting blocks 4c1 are both located inside the fixed frame 60a, the upper end of the connecting block 60c1 is connected with the sliding plate 60c2 through connecting ribs, the sliding block 60c2 can slide on the surface of the fixed frame 60a, and the sliding plate 60c2, the connecting blocks 60c1 and the sliding block 60b are connected, so that the sliding plate 60c2 can move more stably, and meanwhile, the pressing wheel 20e can move according to a predetermined route in the moving process; in addition, one end of the clockwork spring 60d is wound to the outside of the sliding block 60b and the clockwork spring 60d is located between the two connecting blocks 60c1, and the other end of the clockwork spring 60d is connected with the mounting shaft 60e, and due to the intrinsic characteristics of the clockwork spring 60d, it has elastic potential energy, and it is possible to achieve automatic tension of the sliding plate 60c 2; it is known to those skilled in the art that the self-tightening of the sliding plate 60c2 by the spring 60d is achieved, and other structures that can achieve the self-tightening of the sliding block 60b are also possible.

It should be noted that, referring to fig. 2, a support plate is further annularly disposed on the outer side of the lower portion of the connecting shaft 20g, and the pressing wheel 20e is sleeved outside the connecting shaft 20g and is limited by the support plate.

Referring to fig. 2, a first light source 40c is further disposed below the detection notch 20b, the first camera 40a corresponds to the first light source 40c, and the first light source 40c is located in the detection cavity 10 a; the other side of the detection notch 20b is further provided with a second light source 40d, the second camera 40b is arranged corresponding to the second light source 40d, and the second light source 40d is located in the detection cavity 10 a. As can be seen from fig. 2, the first light source 40c is located below the first camera 40a and below the detection notch 20b, and the first camera 40a and the first light source 40c are used in cooperation; the second camera 40b is positioned at the left side of the detection notch 20b, the second light source 40d is positioned at the right side of the detection notch 20b, and the second camera 40b and the second light source 40d are matched for use; it should be noted that the first light source 40c and the second light source 40d are both electrically connected to a control system, and the control system can control the on/off operation of the first light source 40c and the second light source 40 d.

Referring to fig. 2, the first camera 40a is connected to an XZ dual-axis sliding table 40e, and the XZ dual-axis sliding table 40e is located in the detection cavity 10 a; the lower end of the second camera 40b is connected with an XY double-axis sliding table I40 f, and the XY double-axis sliding table I40 f is positioned in the detection cavity 10 a; one side of the second light source 40d is connected with a second XY double-shaft sliding table 40g, and the second XY double-shaft sliding table 40g is located in the detection cavity 10 a. The XZ double-shaft sliding table 40e, the XY double-shaft sliding table I40 f and the XY double-shaft sliding table II 40g are arranged to facilitate stroke adjustment in the detection process so as to adapt to different detection conditions, and adaptability is greatly enhanced; in addition, the XZ double-shaft sliding table 40e, the XY double-shaft sliding table I40 f and the XY double-shaft sliding table II 40g are electrically connected with a control system, and the control system can control the XZ double-shaft sliding table 40e, the XY double-shaft sliding table I40 f and the XY double-shaft sliding table II 40g to work; it should be noted that the XZ dual-axis slide table 40e, the XY dual-axis slide table one 40f, and the XY dual-axis slide table two 40g are all the prior art, and those skilled in the art can select them according to actual requirements.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Claims (10)

1. A wafer profile measuring instrument, comprising:

the detection device comprises a shell (10), wherein a detection cavity (10a) is arranged inside the shell (10);

the carrying device (20) comprises a carrying plate (20a), one side of the carrying plate (20a) extends into the detection cavity (10a), a detection notch (20b) is formed in one side, close to the detection cavity (10a), of the carrying plate (20a), a wafer (30) is placed on the surface of the carrying plate (20a), and the wafer (30) extends to the outer side of the detection notch (20 b);

the detection device (40) is arranged in the detection cavity (10a), and the detection device (40) comprises a first camera (40a) arranged above the detection notch (20b) and a second camera (40b) arranged on one side of the detection notch (20 b).

2. The wafer profile measuring instrument according to claim 1, wherein: the detection cavity (10a) is also externally provided with a protective cover (50), and the protective cover (50) is detachably connected with the shell (10).

3. The wafer profile measuring instrument according to claim 1, wherein: a limiting mechanism is further arranged on one side, close to the detection notch (20b), of the surface of the carrier plate (20a), the limiting mechanism comprises at least one group of limiting components (20c), each limiting component (20c) comprises two limiting holes (20c1) symmetrically arranged on the surface of the carrier plate (20a), and guide pillars (20c2) are placed in the limiting holes (20c 1);

the surface of the carrier plate (20a) is provided with a sliding groove (20d), a pressing wheel (20e) is rotationally arranged in the sliding groove (20d), a rubber sleeve (20f) is coated outside the pressing wheel (20e), and the pressing wheel (20e) can be close to or far away from the detection gap (20 b).

4. A wafer profile measuring instrument according to claim 3, characterized in that the guide pillar (20c2) comprises:

a stationary shaft (20c21), the stationary shaft (20c21) being placed within the stopper hole (20c 1);

the rotating rod (20c22), the rotating rod (20c22) is sleeved outside the fixed shaft (20c 21).

5. The wafer profile measuring instrument according to claim 4, wherein the carrier plate (20a) is further provided with a sliding mechanism (60) at a lower end thereof, and the sliding mechanism (60) comprises:

a fixing frame (60a) arranged below the carrier plate (20 a);

a sliding block (60b) which is arranged in the fixed frame (60a) in a sliding manner;

the sliding assembly (60c) comprises a connecting block (60c1) and a sliding plate (60c2) fixed at the upper end of the connecting block (60c1), the sliding plate (60c2) can slide on the surface of the fixed frame (60a), and the pressing wheel (20e) is fixed above the sliding plate (60c2) through a connecting shaft (20 g);

spring (60d), the one end of spring (60d) with sliding block (60b) are connected, the other end of spring (60d) is connected with installation axle (60e), installation axle (60e) are located support plate (20a) below is close to the one side that detects breach (20 b).

6. The wafer profile measuring instrument according to claim 1, wherein: a first light source (40c) is further arranged below the detection notch (20b), the first camera (40a) corresponds to the first light source (40c), and the first light source (40c) is located in the detection cavity (10 a).

7. The wafer profile measuring instrument according to claim 1, wherein: the other side of the detection notch (20b) is also provided with a second light source (40d), the second camera (40b) and the second light source (40d) are arranged correspondingly, and the second light source (40d) is positioned in the detection cavity (10 a).

8. The wafer profile measuring instrument according to claim 6, wherein: the first camera (40a) is connected with an XZ double-shaft sliding table (40e), and the XZ double-shaft sliding table (40e) is located in the detection cavity (10 a).

9. The wafer profile measuring instrument according to claim 7, wherein: the lower end of the second camera (40b) is connected with an XY double-shaft sliding table I (40f), and the XY double-shaft sliding table I (40f) is located in the detection cavity (10 a).

10. The wafer profile measuring instrument according to claim 7, wherein: one side of the second light source (40d) is connected with a second XY double-shaft sliding table (40g), and the second XY double-shaft sliding table (40g) is located in the detection cavity (10 a).

Images