CN215430481U - Silicon chip washs and sprays mechanism - Google Patents
Silicon chip washs and sprays mechanism Download PDFInfo
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- CN215430481U CN215430481U CN202120676539.4U CN202120676539U CN215430481U CN 215430481 U CN215430481 U CN 215430481U CN 202120676539 U CN202120676539 U CN 202120676539U CN 215430481 U CN215430481 U CN 215430481U
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Abstract
The utility model provides a silicon wafer cleaning and spraying mechanism which comprises a plurality of groups of silicon wafers arranged in a hanging manner and pipe fittings which are symmetrical to two sides of the silicon wafers and are arranged in a rotating manner, wherein at least two groups of pipe fittings are arranged on one side of each silicon wafer, the height parts of the spraying covers of the two adjacent groups of pipe fittings are overlapped, and the total height of the spraying covers of all the pipe fittings is not less than the sum of the heights of the silicon wafers and a material plate; and two adjacent groups of the pipe fittings are arranged along the width direction of the silicon wafer in a staggered manner. The spraying mechanism is particularly suitable for degumming and primary cleaning of large-size silicon wafers, the two groups of pipe fittings which are arranged at intervals and can be sprayed in a rotating mode are sprayed to completely cover the height range of the silicon wafers, silicon mud on the side faces of the silicon wafers can be completely cleaned, particularly, the silicon mud which is gathered on the lower end faces of the silicon wafers is cleaned, the cleaning efficiency is improved, and a foundation is laid for subsequent degumming and cleaning.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer degumming and cleaning, and particularly relates to a silicon wafer cleaning and spraying mechanism.
Background
The cleaning of the silicon wafer in the existing degumming machine adopts a fixed structure cleaning mode, but the cleaning effect is poor, the spraying coverage area is limited, and the cleaning of the silicon wafer with the size of 12 inches, 18 inches or more than 18 inches is more difficult.
The multi-wire silicon wafer degumming and cleaning device proposed in the Chinese patent publication CN207952094U provides a rotary type group of pipe fittings which are oppositely arranged. This structure is only suitable for small size wafers, and for wafers of 12 inches, 18 inches and more in diameter, it does not cover completely and has poor cleaning performance.
Meanwhile, in the cutting process of the large-size silicon wafer, as the processing area of the silicon wafer is increased, along with the increase of the cutting depth, the content of silicon powder generated in the cutting process is increased, the gap between the silicon wafers is smaller and smaller, and particularly, the adhesion area between the silicon wafers at the side far away from the glue layer is larger and the adsorption force is strong; and along with the deepening of cutting, the silicon mud flows downwards along the height of the silicon chip due to the flushing of the cooling liquid and the self gravity, and the silicon mud gathered on the lower end surface of the silicon chip is more due to the large adsorption and adhesion area of the lower end surface of the silicon chip. How to clean the silicon mud accumulated on the lower end face of the silicon wafer under the condition of ensuring complete coverage of the side face of the silicon wafer is the key point of the utility model.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon wafer cleaning and spraying mechanism, which is particularly suitable for primary cleaning of large-size silicon wafer degumming and solves the technical problem of poor cleaning effect caused by unreasonable structural design in the prior art.
In order to solve the technical problems, the utility model adopts the technical scheme that:
a silicon chip cleaning and spraying mechanism comprises a plurality of groups of silicon chips arranged in a hanging manner and pipe fittings which are symmetrical to two sides of the silicon chips and are arranged in a rotating manner, wherein at least two groups of pipe fittings are arranged on one side of each silicon chip, the height parts of the spraying covers of the two adjacent groups of pipe fittings are overlapped, and the total height of the spraying covers of all the pipe fittings is not less than the sum of the heights of the silicon chips and a material plate; and two adjacent groups of the pipe fittings are arranged along the width direction of the silicon wafer in a staggered manner.
Furthermore, a group of the pipe fittings are positioned at the upper section of the height of the silicon wafer, and the height of the spraying coverage of the pipe fittings is not less than 1/2 of the sum of the heights of the silicon wafer and the material plate.
Further, the spraying height of the pipe fitting positioned at the upper section of the height of the silicon wafer comprises 1/2 from the upper end surface of the height of the material plate to the sum of the heights of the silicon wafer and the material plate.
Furthermore, a group of the pipe fittings are positioned at the lower section of the height of the silicon wafer, and the height of the spraying coverage of the pipe fittings is not less than 2/3 of the sum of the heights of the silicon wafer and the material plate.
Further, the spraying height of the pipe fitting positioned at the lower section of the height of the silicon wafer comprises 2/3 from the lower end surface of the height of the silicon wafer to the sum of the heights of the silicon wafer and the material plate.
Furthermore, on the same side face of the silicon wafer, the horizontal distance from the pipe fitting positioned at the upper section of the height of the silicon wafer to the side face of the silicon wafer is greater than the horizontal distance from the pipe fitting positioned at the lower section of the height of the silicon wafer to the side face of the silicon wafer.
Further, the horizontal distance from the pipe fitting positioned at the lower section of the height of the silicon wafer to the side surface of the silicon wafer is 12-15 mm.
Further, the horizontal distance difference between the pipe fitting positioned at the upper section of the height of the silicon wafer and the pipe fitting positioned at the lower section of the height of the silicon wafer is 4-8 mm.
Further, the number of the pipe fittings positioned at the upper section of the silicon wafer height and the number of the pipe fittings positioned at the lower section of the silicon wafer height can be the same or different; the structures of the pipe fittings which are symmetrically arranged are the same.
Furthermore, each pipe fitting is provided with a plurality of nozzles arranged at intervals, and the width between two nozzles at the outermost side is not less than the total length of the silicon wafer on the material plate;
the spray heads in the pipe fittings positioned at the upper section part of the height of the silicon wafer and the spray heads in the pipe fittings positioned at the lower section part of the height of the silicon wafer are arranged side by side or in a staggered manner along the height direction of the silicon wafer.
The spraying mechanism is particularly suitable for the primary cleaning of large-size silicon wafer degumming, at least comprises two groups of symmetrically arranged pipe fittings, and two groups of pipe fittings which are arranged at intervals and can be sprayed in a rotating manner, wherein the spraying completely covers the height range of the silicon wafer, so that the silicon mud on the side surface of the silicon wafer can be completely cleaned, particularly, the silicon mud which is more accumulated on the lower end surface of the silicon wafer can be cleaned, the cleaning efficiency is improved, and a foundation is laid for the subsequent degumming cleaning.
Drawings
Fig. 1 is a schematic structural view of a spraying mechanism according to a first embodiment of the present invention;
FIG. 2 is a top view of a spray mechanism according to a first embodiment of the present invention;
FIG. 3 is a top view of another spray mechanism according to a first embodiment of the present invention;
fig. 4 is a schematic structural view of a spraying mechanism according to a second embodiment of the present invention;
fig. 5 is a schematic structural view of a spray mechanism according to a third embodiment of the present invention.
In the figure:
10. silicon chip 20, pipe fitting I30 and pipe fitting II
40. Three 50 pipe fittings, four 60 pipe fittings and six pipe fittings
Detailed Description
The utility model is described in detail below with reference to the figures and specific embodiments.
The embodiment provides a silicon wafer cleaning and spraying mechanism, as shown in fig. 1 and 2, the mechanism comprises a plurality of groups of suspended silicon wafers 10 and pipe fittings which are symmetrical to two sides of the silicon wafers 10 and are rotatably arranged, wherein the silicon wafers 10 are formed by cutting silicon rods bonded on a material plate, the upper end faces of all the silicon wafers 10 are bonded on the material plate, a lot of silicon powder is generated during line cutting, the silicon powder and cooling liquid are mixed to form silicon mud, a lot of silicon mud exists between the side of each silicon wafer 10 and the adjacent silicon wafers 10, and especially, the silicon mud at the lower section part of each silicon wafer 10 is more. At least two groups of pipe fittings are arranged on the single side surface of the silicon wafer 10, the height covered by the spraying of the two adjacent groups of pipe fittings is partially overlapped, and the total height covered by the spraying of all the pipe fittings is not less than the sum L of the heights of the silicon wafer 10 and the material plate; and two adjacent groups of pipe fittings are arranged along the width direction of the silicon chip 10 in a staggered way. The cross spraying structure controls the spray heads on the pipe fittings by rotating the rotating shafts of the adjacent pipe fittings, so that the spraying coverage heights of the pipe fittings are overlapped and crossed, the range of the height of a large-size silicon wafer 10 with any diameter can be completely covered, and the silicon mud covered on the silicon wafer 10 is cleaned by measuring the bottom. And the pipe fitting that the dislocation set up can be on the basis of guaranteeing that the height of silicon chip 10 is covered completely, and the distance that makes a set of pipe fitting that is close to silicon chip 10 lower terminal surface adhesion silicon mud is more apart from silicon chip 10 side is nearer to increase the speed that sprays rivers, with the impact of improving it to silicon chip 10 bonding resistance, with higher speed silicon mud washes, with improvement cleaning performance.
In this embodiment, two sets of symmetrically disposed pipes, namely the first pipe 20 and the second pipe 30, are included, that is, the height H1 covered by the first pipe 20 and the height H2 covered by the second pipe 30 are overlapped, and the height H covered by the two sets of pipes completely includes the sum L of the heights of the silicon wafer 10 and the material plate.
Wherein, the first pipe 20 is located at the upper section of the height of the silicon wafer 10, and the height H1 of the spraying cover is not less than 1/2 of the sum L of the heights of the silicon wafer 10 and the material plate. And the height H1 of the spray of the first tube member 20 comprises 1/2 from the upper end face of the height of the material plate to the sum L of the height of the silicon wafer 10 and the height of the material plate.
Preferably, the first pipe 20 is located at 1/4 of the sum L of the heights of the silicon wafer 10 and the material plate and is arranged close to the upper end face of the height of the silicon wafer 10, the first pipe 20 is controlled by external force to rotate and sprays towards one side of the silicon wafer 10, and the spraying coverage height of the first pipe is not less than 1/2 of the sum L of the heights of the silicon wafer 10 and the material plate, so that the height area of the upper section of the silicon wafer 10 is within the spraying range of the first pipe 10, and silicon mud can be completely cleaned.
Further, the second pipe 30 is located at the lower section of the height of the silicon wafer 10, and the height of the spraying cover of the second pipe is not less than 2/3 of the sum L of the heights of the silicon wafer 10 and the material plate. And the spraying height H2 of the second pipe fitting 30 comprises 2/3 from the lower end face of the height of the silicon wafer 10 to the sum L of the heights of the silicon wafer 10 and the material plate.
Preferably, the second pipe 30 is located at 1/3 of the sum of the heights of the silicon wafer 10 and the material plate and is arranged close to the lower end face of the silicon wafer 10, the second pipe 30 is controlled to rotate and sprays towards one side of the silicon wafer 10, and the spraying covering height of the second pipe is not less than 2/3 of the sum L of the heights of the silicon wafer 10 and the material plate, so that the lower section and the middle part of the silicon wafer 10 can be covered, especially the spraying areas of the middle part of the silicon wafer 10 and the first pipe 20 of the upper section are overlapped and crossed, the convergence of the water liquid accelerates the spraying of the middle part of the silicon wafer 10, and the water liquid sprayed by the second pipe 30 of the lower section accelerates the cleaning of the silicon mud accumulated in the lower section together, further accelerates the cleaning of the silicon mud of the lower section, and improves the cleaning effect.
Further, in order to improve the cleaning effect of the silicon mud at the lower section of the silicon wafer 10, the horizontal distance W1 between the first pipe 20 and the side of the silicon wafer 10 at the upper section of the height of the silicon wafer 10 is required to be greater than the horizontal distance W2 between the second pipe 20 and the side of the silicon wafer 10 at the lower section of the height of the silicon wafer 10 on the same side of the silicon wafer 10; that is, the second pipe 30 is disposed close to the side of the silicon wafer 10, and the first pipe 20 is slightly farther than the second pipe 30 from the side of the silicon wafer 10. The closer the pipe fitting second 30 is to the side face of the silicon wafer 10, the larger the instantaneous impulsive force of the pipe fitting second 30 to the silicon mud on the side face of the silicon wafer 10 is, the larger the contact area of the cleaning water liquid and the silicon wafer 10 is, and the higher the utilization rate of the water liquid is, so that the cleaning of the silicon mud adhered to the lower section part of the silicon wafer 10 can be increased, the cleaning efficiency is improved, obstacles are swept for subsequent cleaning, and a foundation is laid for subsequent degumming cleaning.
Meanwhile, considering that the liquid spraying amount of each pipe fitting controlled by the same power is equal, the silicon wafer 10 close to one side of the material plate is bonded by the adhesive layer, if the impact force of the liquid spraying amount is too large, the suspension stability of the silicon wafer 10 can be affected, the silicon wafer 10 is dropped, the silicon wafer 10 is damaged, and the cleaning of the silicon wafer 10 is not facilitated, so that the pipe fitting I20 is arranged far away from one side of the silicon wafer 10 as far as possible under the condition that the complete cleaning of silicon mud at the upper section of the silicon wafer 10 is ensured, namely, the side face of the pipe fitting I20 far away from the silicon wafer 10 is reasonable and feasible relative to the position of the pipe fitting II 30.
Preferably, the horizontal distance W2 from the second pipe member 30 to the side of the silicon wafer 10 is 12-15 mm. And the horizontal distance difference DeltaW between the first pipe fitting 20 and the second pipe fitting 30 is 4-8mm, i.e. the difference between W1 and W2 is 4-8 mm.
Further, the number of the pipe members located at the upper section of the height of the silicon wafer 10 may be the same as the number of the pipe members located at the lower section of the height of the silicon wafer 10, as shown in fig. 1, i.e., only two pipe members one 20 and two pipe members two 30 are included.
Of course, the number of tubes at the upper section of the height of the wafer 10 may be different from the number of tubes at the lower section of the height of the wafer 10. As shown in fig. 4, two pipe fittings, namely a pipe fitting one 20 and a pipe fitting three 40, are arranged at the upper section of the silicon wafer 10; the number of the pipe fittings at the lower section of the silicon wafer 10 is two, namely a pipe fitting two 30 and a pipe fitting four 50. Alternatively, the first and second electrodes may be,
as shown in fig. 5, two pipe fittings, namely a pipe fitting one 20 and a pipe fitting three 40, are arranged at the upper section of the silicon wafer 10; the number of the pipe fittings at the lower section of the silicon wafer 10 is three, namely a pipe fitting two 30, a pipe fitting four 50 and a pipe fitting five 60.
No matter the upper section part and the lower section part of the silicon wafer 10 are respectively provided with a plurality of pipe fittings, the structures of the pipe fittings which are symmetrically arranged in each group are the same, and the structures of the pipe fittings and the pipe fittings of the lower section part can be the same or different, but the device for controlling the rotation of all the pipe fittings of the upper section part or the lower section part is the same structure, namely all the pipe fittings of the upper section part synchronously rotate and spray; all the pipe fittings of the lower section part rotate synchronously to spray, the structure is easy to control and simple in structure, the overall production cost is low, the control requirement can be met without excessive input of auxiliary materials, all control parts are omitted, and the pipe fittings are common structures in the field.
Furthermore, a plurality of nozzles are arranged on each pipe fitting in a clearance mode, the width between two nozzles on the outermost side of each pipe fitting is not smaller than the total length of the silicon wafers 10 on the material plate, namely the length of spraying of each pipe fitting is not smaller than the length of the cut silicon rod, namely all the silicon wafers 10 are contained in the silicon wafers to be sprayed, and all the silicon wafers 10 are guaranteed to be sprayed and covered. The structure of the nozzle is a structure commonly used in the field, preferably a flat nozzle structure, which is simple and easy to purchase and is not specifically required here.
Furthermore, the nozzle in the first pipe 20 and the nozzle in the second pipe 30 may be arranged side by side up and down along the height direction of the silicon wafer 10, as shown in fig. 2; or offset up and down as shown in fig. 3.
Preferably, in the single-sided structure of the silicon wafer 10, the positions of the nozzles in all the tubes of the upper stage or the lower stage combined in a plurality of sets are uniformly set and uniformly arranged up and down. However, the nozzles in all the pipe fittings of the upper section and the nozzles in all the pipe fittings of the lower section can be arranged up and down correspondingly or in a staggered manner, and the structure is the same as that of fig. 2 and 3 respectively.
The spraying mechanism is particularly suitable for the primary cleaning of large-size silicon wafer degumming, at least comprises two groups of symmetrically arranged pipe fittings, and two groups of pipe fittings which are arranged at intervals and can be sprayed in a rotating manner, wherein the spraying completely covers the height range of the silicon wafer, so that the silicon mud on the side surface of the silicon wafer can be completely cleaned, particularly, the silicon mud which is more accumulated on the lower end surface of the silicon wafer can be cleaned, the cleaning efficiency is improved, and a foundation is laid for the subsequent degumming cleaning.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. A silicon chip cleaning and spraying mechanism comprises a plurality of groups of silicon chips arranged in a hanging manner and pipe fittings which are symmetrical to two sides of the silicon chips and are arranged in a rotating manner, and is characterized in that at least two groups of pipe fittings are arranged on one side of each silicon chip, the height parts of the spraying covers of the two adjacent groups of pipe fittings are overlapped, and the total height of the spraying covers of all the pipe fittings is not less than the sum of the heights of the silicon chips and a material plate; and two adjacent groups of the pipe fittings are arranged along the width direction of the silicon wafer in a staggered manner.
2. The silicon wafer cleaning and spraying mechanism of claim 1, wherein a group of said pipes are located at the upper section of the height of said silicon wafer, and the height of the spraying cover of said pipes is not less than 1/2 of the sum of the heights of said silicon wafer and said material plate.
3. The silicon wafer cleaning and spraying mechanism as claimed in claim 2, wherein the spraying height of the pipe member located at the upper section of the silicon wafer height comprises 1/2 from the upper end face of the material plate height to the sum of the silicon wafer height and the material plate height.
4. The silicon wafer cleaning and spraying mechanism as claimed in any one of claims 1 to 3, wherein a group of said pipes is located at a lower section of the height of said silicon wafer, and the height of the spraying cover is not less than 2/3 of the sum of the heights of said silicon wafer and said material plate.
5. The silicon wafer cleaning and spraying mechanism as claimed in claim 4, wherein the spraying height of the pipe member located at the lower section of the silicon wafer height comprises 2/3 from the lower end face of the silicon wafer height to the sum of the silicon wafer height and the material plate height.
6. The silicon wafer cleaning and spraying mechanism according to any one of claims 1 to 3 and 5, wherein the horizontal distance from the pipe at the upper section of the silicon wafer height to the side surface of the silicon wafer is greater than the horizontal distance from the pipe at the lower section of the silicon wafer height to the side surface of the silicon wafer on the same side surface of the silicon wafer.
7. The silicon wafer cleaning and spraying mechanism of claim 6, wherein the horizontal distance from the pipe at the lower section of the silicon wafer height to the side surface of the silicon wafer is 12-15 mm.
8. The silicon wafer cleaning and spraying mechanism of claim 7, wherein the difference between the horizontal distances of the pipe at the upper section of the silicon wafer height and the pipe at the lower section of the silicon wafer height is 4-8 mm.
9. The silicon wafer cleaning and spraying mechanism according to any one of claims 1 to 3, 5 and 7 to 8, wherein the number of the pipe members positioned at the upper section of the height of the silicon wafer and the number of the pipe members positioned at the lower section of the height of the silicon wafer can be the same or different; the structures of the pipe fittings which are symmetrically arranged are the same.
10. The silicon wafer cleaning and spraying mechanism of claim 9, wherein each pipe is provided with a plurality of nozzles arranged at intervals, and the width between the two outermost nozzles is not less than the total length of the silicon wafers on the material plate;
the spray heads in the pipe fittings positioned at the upper section part of the height of the silicon wafer and the spray heads in the pipe fittings positioned at the lower section part of the height of the silicon wafer are arranged side by side or in a staggered manner along the height direction of the silicon wafer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120676539.4U CN215430481U (en) | 2021-04-02 | 2021-04-02 | Silicon chip washs and sprays mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120676539.4U CN215430481U (en) | 2021-04-02 | 2021-04-02 | Silicon chip washs and sprays mechanism |
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| CN215430481U true CN215430481U (en) | 2022-01-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114504257A (en) * | 2022-02-21 | 2022-05-17 | 国家康复辅具研究中心 | Multi-shower-arm intelligent bathing robot |
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2021
- 2021-04-02 CN CN202120676539.4U patent/CN215430481U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114504257A (en) * | 2022-02-21 | 2022-05-17 | 国家康复辅具研究中心 | Multi-shower-arm intelligent bathing robot |
| CN114504257B (en) * | 2022-02-21 | 2023-08-08 | 国家康复辅具研究中心 | Multi-shower-arm intelligent bathing robot |
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