CN215420911U

CN215420911U - Embedded PCB packaging structure for conducting different networks

Info

Publication number: CN215420911U
Application number: CN202121591794.5U
Authority: CN
Inventors: 黄万林; 王灿钟
Original assignee: Edadoc Co ltd
Current assignee: Edadoc Co ltd
Priority date: 2021-07-13
Filing date: 2021-07-13
Publication date: 2022-01-04
Anticipated expiration: 2031-07-13

Abstract

The utility model discloses an embedded PCB packaging structure for conducting different networks, which comprises two pins connected with different networks, wherein the bonding pads of the two pins are in short circuit, the shapes of the two bonding pads are consistent, the two bonding pads are respectively a first pin bonding pad and a second pin bonding pad, and the second pin bonding pad is arranged in the first pin bonding pad and is in short circuit with the first pin bonding pad; or the second pin bonding pad is arranged outside the first pin bonding pad, and the first pin bonding pad and the second pin bonding pad are in short circuit through copper sheets. According to the utility model, the conduction of two different networks is realized through the optimized packaging structure, the design risk caused by manual copper foil covering treatment is avoided, the fool-proof effect is realized from the principle design, compared with the mode of connecting zero-ohm resistors or magnetic beads in series, the material cost and the welding cost are reduced, and the packaging structure is embedded into the inner layer of the board, so that for a high-density board, the layout space of the device surface of the PCB board can be saved, the design is convenient, and the attractiveness of the PCB board can also be improved.

Description

Embedded PCB packaging structure for conducting different networks

Technical Field

The utility model relates to the field of circuit board design, in particular to an embedded PCB packaging structure for conducting different networks.

Background

In some power conversion circuits, it is necessary to isolate the ground network (e.g. analog ground network) to which a specific device pin is connected from the ground network (e.g. digital ground network) of the whole circuit, but it is finally necessary to short them together by means of single-point grounding or multi-point grounding, so as to achieve the purpose of common grounding and avoid mutual interference between them.

The traditional design methods include two methods, one is to connect zero-ohm resistors or magnetic beads in series between two different networks to realize the conduction connection of the two different networks, but the cost is increased, such as material cost and device welding cost; and the other is that when the PCB layout and wiring design, an engineer artificially covers the copper foil to connect two different networks together in a short time, but because of the artificial operation, the design risk is large, the later-stage upgrade design is not facilitated, and the fool-proofing in principle design cannot be realized.

The other is to add a standard package short device (such as 0201,0402,0603) on the schematic diagram, and although the fool-proof is solved in principle, the package short device is placed on the device surface of the PCB board, which affects the layout and wiring space of the PCB device surface and is not beautiful.

The above problems are worth solving.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides an embedded PCB packaging structure for conducting different networks.

The technical scheme of the utility model is as follows:

an embedded PCB packaging structure for conducting different networks comprises two pins connected with different networks, wherein the bonding pads of the two pins are in short circuit connection, the shapes of the two bonding pads are consistent, the embedded PCB packaging structure for conducting different networks is arranged on the inner layer of a PCB, the two bonding pads are respectively a first pin bonding pad and a second pin bonding pad,

the second pin bonding pad is arranged inside the first pin bonding pad; or the like, or, alternatively,

the second pin pad is arranged outside the first pin pad, and the first pin pad and the second pin pad are in short circuit through copper sheets.

The present invention according to the above aspect is characterized in that the center of the first pin pad and the center of the second pin pad are located on the same horizontal line.

The utility model according to the above aspect is characterized in that the pad is a circular pin pad.

Further, the diameter of the second pin pad is smaller than or equal to the diameter of the first pin pad.

Further, the diameter of the first pin pad is 100 micrometers or 450-600 micrometers.

Further, the diameter of the second pin pad is 100 microns.

The utility model according to the above aspect is characterized in that the pad is a square pin pad.

Further, the size of the first pin pad is the same as the size of the second pin pad.

Furthermore, the copper sheet is rectangular, the length of the copper sheet is greater than that of the bonding pad, and the width of the copper sheet is equal to that of the bonding pad.

The utility model according to the scheme has the advantages that:

according to the utility model, the conduction of two different networks is realized through the embedded packaging structure, the design risk caused by artificial copper foil covering treatment in the design of the PCB is reduced, the foolproof effect is realized from the principle design, and the material cost and the welding cost are reduced compared with the mode of connecting zero-ohm resistors or magnetic beads in series; furthermore, the embedded type PCB packaging is adopted, the packaging is defined to the inner layer of the PCB according to requirements during PCB design, for the high-density PCB, the layout space of the device surface of the PCB can be saved, through holes do not need to be additionally added to realize conduction, the PCB packaging size can be reduced or enlarged according to requirements, the PCB design is convenient and simple, and the PCB is more attractive.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic diagram of a PCB package structure of a first embodiment;

FIG. 2 is a dimension labeled diagram of a PCB package of the first embodiment;

FIG. 3 is a diagram illustrating a PCB package structure of a second embodiment;

fig. 4 is a dimension label diagram of a PCB package of the second embodiment.

In the figures, the various reference numbers:

1. first pin pad, 2, second pin pad, 3, copper sheet.

Detailed Description

The utility model is further described with reference to the following figures and embodiments:

it should be noted that the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features.

As shown in fig. 1 to 4, an embedded PCB package structure for conducting different networks includes two pins connected to different networks, wherein the two pins have short-circuited pads, the two pads have the same shape, the two pads are respectively a first pin pad 1 and a second pin pad 2, the second pin pad 2 is disposed inside the first pin pad 1, and the PCB package is disposed on an inner layer of a PCB; or, the first pin pad 1 is arranged outside the second pin pad 2, the first pin pad 1 and the second pin pad 2 are in short circuit through the copper sheet 3, and the PCB is packaged in the inner layer of the PCB.

According to the utility model, the conduction of two different networks is realized through the embedded pad packaging structure, the design risk caused by artificial copper foil covering treatment in the design of the PCB is reduced, the foolproof effect is achieved from the principle design, and the material cost and the welding cost are reduced compared with the mode of connecting zero-ohm resistors or magnetic beads in series; furthermore, the embedded type PCB packaging is adopted, the packaging is defined to the inner layer of the PCB according to requirements during PCB design, for the high-density PCB, the layout space of the device surface of the PCB can be saved, through holes do not need to be additionally added to realize conduction, the packaging size of the PCB can be reduced or enlarged according to requirements, the PCB is convenient and simple to design, and the PCB is more attractive.

First embodiment

The utility model provides a switch on formula of buryying PCB packaging structure of different networks, includes two pins of connecting different networks, the pad short circuit of two pins, and the shape of two pads is unanimous, is circular pin pad, and two pin pads are first pin pad 1 and second pin pad 2 respectively, and second pin pad 2 is established in the inside of first pin pad 1 and is short circuit with first pin pad 1, and this PCB encapsulation is established in the inlayer of PCB board.

In order to more intuitively embody the overlapping relationship of two circular pin pads in the PCB design, in this embodiment, the size of the first pin pad 1 is larger than the size of the second pin pad 2. In order not to affect the routing space of the PCB, the size of the first pin pad 1 may be set between 450 micrometers and 600 micrometers, and the size of the second pin pad is preferably 100 micrometers. In actual design, the minimum size of the pin pad is only required to meet the production requirement of the plate making, and the size of the first pin pad 1 can be the same as that of the second pin pad 2 and is set to be 100 micrometers.

In one embodiment, the diameter D1 of the first pin pad 1 is 450 microns, the diameter D2 of the second pin pad 2 is 100 microns, and the distance a between the first pin pad 1 and the second pin pad 2 is 150 microns.

In another embodiment, the diameter D1 of the first pin pad 1 is 600 microns, the diameter D2 of the second pin pad 2 is 100 microns, and the spacing a between the first pin pad 1 and the second pin pad 2 is 100 microns.

The pitch between the two pin pads of the present invention is not particularly limited, and may be any value as long as the second pin pad 2 is disposed inside the first pin pad 1.

In the present embodiment, the different networks are an analog ground network and a digital ground network, the first pin pad 1 is connected to the digital Ground Network (GND), and the second pin pad 2 is connected to the Analog Ground Network (AGND). In other PCB designs, the first pin pad 1 is connected to an Analog Ground Network (AGND) and the second pin pad 2 is connected to a digital Ground Network (GND).

Two pin pads superpose and form a PCB encapsulation to reach the direct short circuit's of two networks purpose, during the PCB design, define the PCB encapsulation at multilayer PCB intralamellar wiring layer, can define arbitrary one PCB aspect as required, such as second floor, third layer, fourth layer etc. need not hinder designs such as windowing, steel mesh and silk screen printing to the PCB encapsulation.

Second embodiment

The utility model provides a switch on formula PCB packaging structure of buryying of different networks, includes two pins of connecting different networks, the pad short circuit of two pins, and the shape of two pads is unanimous, is square pin pad, and two pin pads are first pin pad 1 and second pin pad 2 respectively, and first pin pad 1 is established in the outside of second pin pad 2, and first pin pad 1 and second pin pad 2 are through the short circuit of 3 coppers, and this PCB encapsulation is established in the inlayer of PCB board.

In order to embody the superposition relationship of two square pin bonding pads more intuitively during the design of the PCB, in the embodiment, the length of the copper sheet 3 is greater than that of the pin bonding pads, and the two pin bonding pads have the same size. In order not to affect the routing space of the PCB, the widths of the first pin pad 1 and the second pin pad 2 are preferably 50 micrometers, 100 micrometers, 150 micrometers, and 200 micrometers. In the actual PCB design, the minimum width of the pin pad is 50 microns, the design size is not too large, and the PCB wiring space is influenced by the too large size.

Preferably, the lengths L1 of the first pin pad 1 and the second pin pad 2 are both 40 micrometers, the widths W are both 50 micrometers, and the edge distance B between the first pin pad 1 and the second pin pad 2 is 60 micrometers.

In this embodiment, the copper sheet 3 is rectangular, one end of the copper sheet 3 is connected to the first pin pad 1, and the other end is connected to the second pin pad 2.

Preferably, the length L2 of the copper sheet 3 is 100 micrometers, so that the connection areas of the two pin pads are uniformly distributed, and the pin signal connection is more stable.

To achieve the shorting effect, the width of the copper sheet 3 is equal to the width W of the pin pad is equal to 50 microns.

Two pin pads superpose and form a PCB encapsulation, and the size of this PCB encapsulation is 140 x 50 microns to reach the direct short circuit's of two networks purpose, during the PCB design, define the PCB encapsulation at multilayer PCB inner layer wiring layer, can define arbitrary one PCB aspect as required, for example second floor, third layer, fourth layer etc. need not hinder to the PCB encapsulation and weld designs such as windowing, steel mesh and silk screen printing.

It should be noted that the two different networks of the present invention may also be a power ground network and a working ground network, and a radio frequency ground network and a working ground network, which may be defined as any two networks according to the requirement, and are not specifically limited herein.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the utility model as defined in the appended claims.

The utility model is described above with reference to the accompanying drawings, which are illustrative, and it is obvious that the implementation of the utility model is not limited in the above manner, and it is within the scope of the utility model to adopt various modifications of the inventive method concept and technical solution, or to apply the inventive concept and technical solution to other fields without modification.

Claims

1. An embedded PCB packaging structure for conducting different networks comprises two pins connected with different networks, wherein the bonding pads of the two pins are in short circuit connection, and the shapes of the two bonding pads are consistent, and the embedded PCB packaging structure for conducting different networks is arranged on the inner layer of a PCB and is characterized in that the two bonding pads are respectively a first pin bonding pad and a second pin bonding pad,

the second pin bonding pad is arranged inside the first pin bonding pad; or the second pin pad is arranged outside the first pin pad, and the first pin pad and the second pin pad are in short circuit through copper sheets.

2. The embedded PCB package structure for conducting different networks of claim 1, wherein the center of the first pin pad and the center of the second pin pad are located on a same horizontal line.

3. The embedded PCB package structure with different networks connected thereto according to claim 1, wherein the pads are circular pin pads.

4. The embedded PCB package structure with different networks connected thereto according to claim 3, wherein the diameter of the second pin pad is smaller than or equal to the diameter of the first pin pad.

5. The embedded PCB package structure for conducting different networks as recited in claim 3, wherein the diameter of the first pin pad is 100 microns or 450-600 microns.

6. The embedded PCB package structure with different networks as recited in claim 3, wherein the diameter of the second pin pad is 100 μm.

7. The embedded PCB package structure with different networks connected thereto according to claim 1, wherein the pads are square pin pads.

8. The embedded PCB package structure with different networks connected thereto according to claim 7, wherein the first pin pad and the second pin pad have the same size.

9. The embedded PCB package structure with different networks as claimed in claim 7, wherein the copper sheet is rectangular, and has a length greater than the length of the bonding pad and a width equal to the width of the bonding pad.