CN215418164U

CN215418164U - MOSFET packaging structure

Info

Publication number: CN215418164U
Application number: CN202120976008.7U
Authority: CN
Inventors: 郭力
Original assignee: Wuxi Lishen Microelectronics Co ltd
Current assignee: Wuxi Lishen Microelectronics Co ltd
Priority date: 2021-05-10
Filing date: 2021-05-10
Publication date: 2022-01-04
Anticipated expiration: 2031-05-10

Abstract

The utility model discloses a MOSFET packaging structure, which comprises a heat-conducting shell and a plurality of MOSFET chips, wherein a fixing device for fixing the MOSFET chips is detachably connected to the shell; fixing device includes the fixed plate, the fixed plate with can dismantle the connection through first connecting piece between the heat conduction casing top surface, a plurality of recesses have been seted up to fixed plate top surface one side, the recess in-connection has and is used for compressing tightly the springboard of MOSFET chip. Has the advantages that: through setting up fixed plate and connecting plate and elastic plate, can compress tightly the MOSFET chip simultaneously when the installation, can dismantle the connecting plate alone when the change when needs are dismantled, be convenient for change the maintenance to the MOSFET chip, it is more convenient to use.

Description

MOSFET packaging structure

Technical Field

The utility model belongs to the field of electrical elements, and particularly relates to a MOSFET packaging structure.

Background

The MOSFET chip is an important power element of the electric control system of the new energy automobile, along with the development of the new energy automobile industry, the MOSFET chip is more widely applied to the electric control system of the new energy automobile, the heating phenomenon inevitably occurs in the use process of the MOSFET chip, and how to solve the heat dissipation problem is an important factor influencing the performance and the service life of the MOSFET chip.

The existing MOSFET packaging structure adopts an integral type to compress the MOSFET chip, when the MOSFET chip needs to be replaced, the compressing device needs to be detached, all the MOSFET chips need to be detached at the moment, the operation is troublesome, confusion is easily caused when the MOSFET chip is detached and replaced, and the use is inconvenient.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems, and provides a MOSFET packaging structure, wherein a fixing plate, a connecting plate and an elastic plate are arranged, so that a MOSFET chip can be simultaneously compressed during installation, and the connecting plate can be independently disassembled when the MOSFET chip needs to be disassembled and replaced, so that the MOSFET chip is convenient to replace and maintain and is more convenient to use.

In order to achieve the technical purpose, the utility model provides the following technical scheme:

the utility model provides a MOSFET packaging structure, which comprises a heat-conducting shell and a plurality of MOSFET chips, wherein a fixing device for fixing the MOSFET chips is detachably connected to the shell;

fixing device includes the fixed plate, the fixed plate with can dismantle the connection through first connecting piece between the heat conduction casing top surface, a plurality of recesses have been seted up to fixed plate top surface one side, the recess in-connection has and is used for compressing tightly the springboard of MOSFET chip.

By adopting the MOSFET packaging structure, when the device is used, the fixing device is firstly installed, the connecting plates are sequentially fixed in the grooves through the second connecting pieces, then the MOSFET chips are installed on the heat conduction shell, then the fixing plates are fixed on the heat conduction shell through the first connecting pieces, then the elastic plates are right the MOSFET chips are compressed, when the MOSFET chips need to be replaced, the second connecting pieces can be correspondingly disassembled, then the elastic plates are enabled not to compress the MOSFET chips, and the MOSFET chips can be replaced.

Preferably, the plurality of grooves are uniformly formed along the length direction of the fixing plate, and gaps exist among the plurality of grooves.

Preferably, a plurality of grooves are matched with connecting plates in a rotating mode, the connecting plates are detachably fixed in the grooves through second connecting pieces, and one ends of the connecting plates are fixed with elastic plates used for pressing the MOSFET chips.

Preferably, the connecting plate is integrally formed with the elastic plate.

Preferably, a heat conducting gasket is arranged on the heat conducting shell.

Preferably, a plurality of the MOSFET chips are located between the elastic plate and the thermal pad, and the positions of the plurality of the MOSFET chips correspond to the positions of the plurality of the elastic plates.

Has the advantages that: the device can compress tightly the MOSFET chip simultaneously when the installation through setting up fixed plate and connecting plate and elastic plate, can dismantle the connecting plate alone when changing when needs are dismantled, is convenient for change the maintenance to the MOSFET chip, and it is more convenient to use.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of the present invention;

FIG. 2 is a diagram of the present invention;

FIG. 3 is a top view of the present invention;

the reference numerals are explained below:

1. a thermally conductive housing; 2. a fixing device; 201. a fixing plate; 202. a first connecting member; 203. a groove; 204. an elastic plate; 205. a second connecting member; 206. a connecting plate; 3. a MOSFET chip; 4. a thermally conductive pad.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.

Referring to fig. 1-3, the present invention provides a MOSFET package structure, which includes a heat conductive casing 1 and a plurality of MOSFET chips 3, wherein the casing is detachably connected with a fixing device 2 for fixing the MOSFET chips 3; the fixing device 2 comprises a fixing plate 201, the fixing plate 201 is detachably connected with the top surface of the heat conducting shell 1 through a first connecting piece 202, a plurality of grooves 203 are formed in one side of the top surface of the fixing plate 201, and elastic plates 204 used for compressing the MOSFET chip 3 are connected in the grooves 203.

As an alternative embodiment, the plurality of grooves 203 are uniformly formed along the length direction of the fixing plate 201, and gaps exist among the plurality of grooves 203.

All normal running fit has connecting plate 206 in a plurality of recesses 203, and connecting plate 206 can be dismantled through second connecting piece 205 and fix in recess 203, and the one end of a plurality of connecting plates 206 all is fixed with the elastic plate 204 that is used for compressing tightly MOSFET chip 3, and connecting plate 206 and elastic plate 204 integrated into one piece set up like this for the convenience of maintaining the change to MOSFET chip 3, is the stability in order to improve elastic plate 204 and connecting plate 206 through connecting plate 206 and elastic plate 204 integrated into one piece.

The heat conducting shell 1 is provided with a heat conducting gasket 4, the MOSFET chips 3 are located between the elastic plates 204 and the heat conducting gasket 4, and the positions of the MOSFET chips 3 correspond to the positions of the elastic plates 207.

Adopt above-mentioned structure, the device is when using, install fixing device 2 earlier, fix a plurality of connecting plates 206 in recess 203 through second connecting piece 205 in proper order, then install MOSFET chip 3 on heat conduction shell 1, then fix fixed plate 201 on heat conduction shell 1 through first connecting piece 202, then compress tightly MOSFET chip 3 through elastic plate 207, when MOSFET chip 3 is changed to needs, can correspond and dismantle second connecting piece 205, then make elastic plate 207 no longer compress tightly MOSFET chip 3, can change MOSFET chip 3.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A MOSFET package, comprising: the LED lamp comprises a heat-conducting shell (1) and a plurality of MOSFET chips (3), wherein a fixing device (2) for fixing the MOSFET chips (3) is detachably connected to the shell;

the fixing device (2) comprises a fixing plate (201), the fixing plate (201) is detachably connected with the top surface of the heat conducting shell (1) through a first connecting piece (202), a plurality of grooves (203) are formed in one side of the top surface of the fixing plate (201), and elastic plates (204) used for compressing the MOSFET chips (3) are connected in the grooves (203);

all running fit has connecting plate (206) in a plurality of recess (203), connecting plate (206) can be dismantled through second connecting piece (205) and fix in recess (203), a plurality of the one end of connecting plate (206) all is fixed with and is used for compressing tightly springboard (204) of MOSFET chip (3).

2. The MOSFET package of claim 1, wherein: the grooves (203) are uniformly formed along the length direction of the fixing plate (201), and gaps exist among the grooves (203).

3. The MOSFET package of claim 1, wherein: the connecting plate (206) and the elastic plate (204) are integrally formed.

4. The MOSFET package of claim 1, wherein: and a heat conducting gasket (4) is arranged on the heat conducting shell (1).

5. The MOSFET package structure of claim 4, wherein: the MOSFET chips (3) are located between the elastic plate (204) and the heat conducting gasket (4), and the positions of the MOSFET chips (3) correspond to the positions of the elastic plates (204).