CN215418140U

CN215418140U - Small semiconductor device with wireless communication function

Info

Publication number: CN215418140U
Application number: CN202121636538.3U
Authority: CN
Inventors: 陈锦汐; 梁家恩
Original assignee: Individual
Current assignee: Zhang Xiangdong; Zhang Zhiyuan
Priority date: 2021-07-19
Filing date: 2021-07-19
Publication date: 2022-01-04
Anticipated expiration: 2031-07-19

Abstract

The utility model provides a small semiconductor device with wireless communication function, comprising a device body; the device body bottom is provided with the lower seal shell of left and right directions, and lower seal shell top is provided with the rectangle and places the chamber, and the wall top terminal surface is all seted up around the lower seal shell and runs through about seven exhaust spacing grooves. The setting of lower seal shell conveniently bears the fixed plate and puts into and install and bear at the inside integrated circuit board that bears of top, and the heat that makes things convenient for integrated circuit board to produce is dispelled the heat for lower seal shell through bearing the fixed plate transmission, has solved and can not carry out radiating problem for the protecting crust through the base plate with heat transfer.

Description

Small semiconductor device with wireless communication function

Technical Field

The utility model belongs to the technical field of semiconductor devices, and particularly relates to a small semiconductor device with a wireless communication function.

Background

Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as a material for a rectifier, an oscillator, a light emitter, an amplifier, a photodetector, or the like.

Based on the above, the present inventors have found that a small semiconductor device currently used for wireless communication has the following disadvantages:

1. in the packaging process, the integrated circuit bare chip is required to be connected with the pin through the metal lead, the metal lead is inconvenient to weld, and the pin cannot be directly pressed and fixed at the contact point position of the integrated circuit bare chip;

2. the heat generated by the integrated circuit bare chip during use is not easy to dissipate, and the heat cannot be transferred to the protective shell through the substrate for heat dissipation.

In view of the above, it is an object of the present invention to provide a small semiconductor device having a wireless communication function, which is improved in view of the conventional structure and defects, and has a higher practical value.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems, the utility model provides a small semiconductor device with a wireless communication function, which aims to solve the problems that an integrated circuit bare chip is required to be connected with a pin through a metal lead in the existing packaging process, the metal lead is inconvenient to weld, and the pin cannot be directly pressed and fixed at the contact point position of the integrated circuit bare chip; the heat that produces when the integrated circuit bare chip uses is difficult to distribute, can not transmit the heat to the protective housing through the base plate and carry out the radiating problem.

The purpose and the effect of the small semiconductor device with the wireless communication function are achieved by the following specific technical means:

a small semiconductor device having a wireless communication function includes an apparatus body;

the device body bottom is provided with the lower seal shell of left and right directions, and lower seal shell top is provided with the rectangle and places the chamber, and the wall top terminal surface is all seted up around the lower seal shell and runs through about seven exhaust spacing grooves.

Furthermore, the top between the fixed pin piece is pressed in from top to bottom and is provided with a sealing rubber ring, the sealing rubber ring is integrally of a rectangular annular structure, and seven matching grooves which penetrate through the front and the back and are discharged from the left and the right are formed in the end faces of the bottom of the front wall and the back wall of the sealing rubber ring.

Further, all install seven fixed pin pieces of controlling the range around the integrated circuit board top, fixed pin piece is whole to be L shaped plate column structure, and fixed pin piece top medial extremity is provided with the semicircle head structure, and the semicircle head structure bottom terminal surface of fixed pin piece is provided with the contact post.

Furthermore, the integrated circuit board in the left-right direction is embedded and installed on the end face of the top of the bearing fixing plate, and seven contact circular grooves which are discharged left and right are formed in the front and the back of the end face of the top of the integrated circuit board.

Furthermore, a bearing fixing plate installed in the left direction and the right direction is placed inside the top of the lower closed shell, a rectangular embedded groove is formed in the end face of the top of the bearing fixing plate, and seven transmission heat dissipation plates arranged in the front-back direction and the left direction are arranged on the end face of the bottom of the bearing fixing plate.

Furthermore, an upper closed shell in the left-right direction is buckled and mounted at the top of the lower closed shell, a rectangular protective cavity is formed in the bottom of the upper closed shell, and seven heat dissipation plates in the left-right direction are arranged in the front-back direction on the end face of the bottom of the top plate of the upper closed shell.

Compared with the prior art, the utility model has the following beneficial effects:

the setting of lower seal shell conveniently bears the fixed plate and puts into and install and bear at the inside integrated circuit board that bears of top, and the heat that makes things convenient for integrated circuit board to produce is dispelled the heat for lower seal shell through bearing the fixed plate transmission, has solved and can not carry out radiating problem for the protecting crust through the base plate with heat transfer.

The setting of fixed pin piece conveniently inserts integrated circuit board and spacing under on the close shell, makes things convenient for the sealing rubber ring to place the top and compress tightly through last close shell between the fixed pin piece, realizes from this that fixed pin piece compresses tightly to be fixed on integrated circuit board, has solved and can not directly compress tightly the pin and fix the problem at integrated circuit bare chip contact point position.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic cross-sectional structure of the present invention.

Fig. 3 is a disassembled structure schematic diagram of the utility model.

In the figure: 1. a device body; 2. a lower enclosure housing; 3. an upper enclosure housing; 4. a bearing fixing plate; 5. an integrated circuit board; 6. fixing the pin sheet; 7. and sealing the rubber ring.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in figures 1 to 3:

the utility model provides a small-sized semiconductor device with wireless communication function, comprising a device body 1;

device 1 bottom is provided with the lower seal shell 2 of left right direction, 2 tops of lower seal shell are provided with the rectangle and place the chamber, conveniently bear fixed plate 4 and put into installation transmission heat, wall top terminal surface runs through about seven departments all around the lower seal shell 2, it is spacing to make things convenient for fixed pin piece 6 to imbed, 2 top locks of lower seal shell are installed the last seal shell 3 of left right direction, the convenience seals the protection to the internals, the rectangle protection chamber has been seted up to 3 bottoms of last seal shell, 3 roof bottom terminal surfaces of last seal shell are provided with seven and arrange the heating panel of left right direction from beginning to end, the heat that conveniently produces integrated circuit board 5 dispels the heat.

Wherein, the inside bearing fixed plate 4 of installing left right direction of placing in 2 tops of lower seal casing, the rectangle embedded groove has been seted up to bearing fixed plate 4 top terminal surface, make things convenient for integrated circuit board 5 embedding installation, bearing fixed plate 4 bottom terminal surface is provided with the transmission heating panel of arranging left right direction around seven departments, the heat transfer that conveniently produces integrated circuit board 5 is for lower seal casing 2, bearing fixed plate 4 top terminal surface embedding installs integrated circuit board 5 of left right direction, integrated circuit board 5 top terminal surface all is provided with around seven departments discharge contact circular slot, the contact post of convenient fixed pin piece 6 inserts fixedly.

Wherein, all install seven fixed pin pieces 6 of controlling range around the 5 tops of integrated circuit board, fixed pin piece 6 is whole to be L shaped plate column structure, conveniently stretch out lower seal housing 2, fixed pin piece 6 top medial extremity is provided with the semicircle head structure, the semicircle head structure bottom terminal surface of fixed pin piece 6 is provided with the contact post, conveniently insert integrated circuit board 5's contact circular slot, top follow top is impressed and is installed sealing rubber ring 7 between the fixed pin piece 6, sealing rubber ring 7 is whole to be rectangle annular structure, sealing rubber ring 7 is around the wall bottom terminal surface all set up seven and is run through about the groove of agreeing with of discharging, it is fixed conveniently agreeing with and presses the fastening with fixed pin piece 6.

The specific use mode and function of the embodiment are as follows:

in the utility model, when the device body 1 shown in fig. 1 is used, heat generated at the bottom of the integrated circuit board 5 is transferred to the lower closed shell 2 through the bearing fixing plate 4 to realize heat dissipation, and simultaneously, heat generated at the top of the integrated circuit board 5 is transferred to the upper closed shell 3 through air to realize heat dissipation, the upper closed shell 3 is a main pressing piece for the fixed pin sheet 6, the sealing rubber ring 7 is an auxiliary pressing piece for the fixed pin sheet 6, and the fixed pin sheet 6 is insulated at intervals through the sealing rubber ring 7; the lower closed shell 2 is convenient for the bearing fixing plate 4 to be placed inside the top to bear the integrated circuit board 5, heat generated by the integrated circuit board 5 is convenient to be transferred to the lower closed shell 2 through the bearing fixing plate 4 to be radiated, and the problem that the heat cannot be transferred to the protective shell through the substrate to be radiated is solved; wherein fixed pin piece 6 conveniently inserts integrated circuit board 5 and spacing under on close casing 2, make things convenient for sealing rubber ring 7 to place the top between fixed pin piece 6 and compress tightly through last close casing 3, realize from this that fixed pin piece 6 compresses tightly and fixes on integrated circuit board 5, solved and can not directly compress tightly the pin and fix the problem at integrated circuit bare chip contact point position.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A small semiconductor device having a wireless communication function, characterized in that: comprises a device body;

2. A small semiconductor device having a wireless communication function according to claim 1, wherein: the top of the lower closed shell is buckled with an upper closed shell in the left-right direction, the bottom of the upper closed shell is provided with a rectangular protective cavity, and the end surface of the bottom of the top plate of the upper closed shell is provided with seven heat dissipation plates arranged in the front-back direction and in the left-right direction.

3. A small semiconductor device having a wireless communication function according to claim 2, wherein: the bearing fixing plate is arranged inside the top of the lower closed shell in the left-right direction, a rectangular embedded groove is formed in the end face of the top of the bearing fixing plate, and seven transmission heat dissipation plates which are arranged in the front-back direction and in the left-right direction are arranged on the end face of the bottom of the bearing fixing plate.

4. A small semiconductor device having a wireless communication function according to claim 3, wherein: the integrated circuit board of direction about bearing the fixed plate top terminal surface embedding installation, integrated circuit board top terminal surface all is provided with seven contact circular slots of controlling the discharge around the department.

5. A small semiconductor device having a wireless communication function according to claim 4, wherein: all install seven fixed pin pieces of controlling the range around the integrated circuit board top, fixed pin piece wholly is L shaped plate column structure, and fixed pin piece top medial extremity is provided with the semicircle head structure, and the semicircle head structure bottom terminal surface of fixed pin piece is provided with the contact post.

6. A small semiconductor device having a wireless communication function according to claim 5, wherein: the top is pressed in from the top down between the fixed pin piece and is installed the sealing rubber ring, and the sealing rubber ring is whole to be rectangle annular structure, and seven run through around all around the sealing rubber ring bottom terminal surfaces are seted up and are controlled the exhaust groove of agreeing with.