CN111399563B

CN111399563B - User terminal equipment

Info

Publication number: CN111399563B
Application number: CN202010215477.7A
Authority: CN
Inventors: 丁名区
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-03-24
Filing date: 2020-03-24
Publication date: 2021-10-19
Anticipated expiration: 2040-03-24
Also published as: CN111399563A

Abstract

The application provides a user terminal device, including chip, temperature sensor, temperature control module, heat-radiating piece and heating member. The starting temperature of the chip is a preset temperature. The temperature sensor is arranged adjacent to the chip and used for detecting the ambient temperature around the chip so as to obtain a first ambient temperature signal. The temperature control module is electrically connected with the temperature sensor and used for receiving a first environment temperature signal, judging whether the environment temperature is lower than a preset temperature according to the first environment temperature signal and sending a heating control signal when the environment temperature is judged to be lower than the preset temperature. The heat dissipation member surrounds the periphery of the chip and is used for dissipating heat of the chip. The heating member bears in the radiating piece, and the heating member is connected with the temperature control module electricity, heats the chip when the heating member receives heating control signal. The user terminal equipment can still be started when the ambient temperature is lower, and is convenient to replace when the heating element is damaged.

Description

User terminal equipment

Technical Field

The present application relates to communications technologies, and in particular, to a user terminal device.

Background

A Customer Premises Equipment (CPE) is a kind of user terminal Equipment for wireless broadband access. The CPE typically converts the network signals transmitted by the base stations into Wireless Fidelity (WiFi) signals. Because the network signal that CPE can receive is the wireless network signal, can save the expense of laying the line network. Therefore, the CPE can be widely applied to occasions without a wired network, such as rural areas, towns, hospitals, factories, cells and the like. The fifth generation mobile communication technology (5G) is favored by users due to its higher communication speed. For example, the transmission rate when data is transmitted by 5G mobile communication is hundreds of times faster than the transmission rate when data is transmitted by 4G mobile communication. Millimeter wave signals are the main means for implementing 5G mobile communications. However, when the ambient temperature of the user terminal device is low, the chip in the user terminal device often cannot be normally started, so that the user terminal device cannot work.

Disclosure of Invention

The application provides a user terminal device. The user terminal device includes:

the starting temperature of the chip is a preset temperature;

the temperature sensor is arranged close to the chip and used for detecting the ambient temperature around the chip to obtain a first ambient temperature signal;

the temperature control module is electrically connected with the temperature sensor and is used for receiving the first environment temperature signal, judging whether the environment temperature is lower than a preset temperature according to the first environment temperature signal and sending a heating control signal when the environment temperature is judged to be lower than the preset temperature; and

the heat dissipation part is arranged around the periphery of the chip and used for dissipating heat of the chip; and

the heating member, the heating member bear in the radiating piece, just the heating member with the temperature control module electricity is connected, works as the heating member receives it is right when heating control signal the chip heats.

Compared with the prior art, the user terminal device provided by the embodiment detects the temperature of the environment where the chip is located through the temperature sensor, when the temperature control module judges that the environment temperature of the environment where the chip is located is lower than the preset temperature, the heating element is started to heat the chip, so that the environment temperature of the environment where the chip is located is increased, the starting temperature of the chip is met when the temperature of the environment where the chip is located is higher than or equal to the first preset temperature, so that preparation is made for starting the chip, and the user terminal device can still normally work when being located in a low-temperature environment. In addition, the heating member of this application bear in the radiating piece, when the heating member damages, directly change bear the heat-radiating piece of heating member can.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic application environment diagram of a user terminal device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a user terminal device according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a user terminal device provided in an embodiment of the present application, with a housing removed.

Fig. 4 is a circuit block diagram of a user terminal device according to another embodiment of the present application.

Fig. 5 is a circuit block diagram of a user terminal device according to another embodiment of the present application.

Fig. 6 is a schematic structural diagram of a user terminal device according to still another embodiment of the present application.

Fig. 7 is a circuit block diagram of a user terminal device according to another embodiment of the present application.

Fig. 8 is a schematic structural diagram of a part of devices in a user terminal device according to still another embodiment of the present application.

Fig. 9 is a circuit block diagram of a user terminal device according to an embodiment of the present application.

Fig. 10 is a schematic view of a heating element provided in accordance with an embodiment of the present application.

Fig. 11 is a circuit block diagram of a user terminal device according to another embodiment of the present application.

Fig. 12 is a schematic structural diagram of a part of devices in a user terminal device according to still another embodiment of the present application.

Fig. 13 is a schematic structural diagram of a part of a device in a user terminal device according to still another embodiment of the present application.

Fig. 14 is a schematic structural diagram of a part of devices in a user terminal device according to still another embodiment of the present application.

Fig. 15 is a schematic view of another perspective of the heat dissipation body in the user terminal device shown in fig. 14 according to an embodiment.

Fig. 16 is a schematic view of another perspective of the heat dissipation body and the carrier in the user terminal device shown in fig. 14 according to another embodiment.

Fig. 17 is a schematic view of another perspective of the heat dissipation body and the carrier in the user terminal device shown in fig. 14 according to another embodiment.

Fig. 18 is a schematic structural diagram of a part of devices in a user terminal device according to still another embodiment of the present application.

Fig. 19 is a schematic diagram illustrating a control method of a user terminal device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments, in case at least two embodiments are combined together without contradiction.

Referring to fig. 1, fig. 1 is a schematic view of an application environment of a user terminal device according to an embodiment of the present application. The user terminal 1 is a user terminal (CPE). The user terminal device 1 communicates with the base station 3, receives a first network signal sent by the base station 3, and converts the first network signal into a second network signal. The second network signal can be used by terminal equipment 5 such as a tablet computer, a smart phone, a notebook computer and the like. The first network signal may be, but is not limited to, a fifth generation mobile communication technology (5G) signal, and the second network signal may be, but is not limited to, a Wireless Fidelity (WiFi) signal. The CPE can be widely applied to rural areas, towns, hospitals, factories, cells and the like, and the first network signals which can be accessed by the CPE can be wireless network signals, so that the cost of laying a line network can be saved.

Referring to fig. 2, fig. 3 and fig. 4 together, fig. 2 is a schematic structural diagram of a user terminal device according to an embodiment of the present application; fig. 3 is a schematic structural diagram of a user terminal device provided in an embodiment of the present application, with a housing removed; fig. 4 is a circuit block diagram of a user terminal device according to another embodiment of the present application. The user terminal device 1 comprises a housing 220. The housing 220 may be in the shape of a multi-sided cylindrical barrel, or a cylindrical barrel. The material of the housing 220 may be, but is not limited to, a non-electromagnetic wave shielding material such as plastic. It is to be understood that in other embodiments, the user terminal device 1 may not include the housing 220.

The user terminal apparatus 1 further comprises a first signal receiving antenna 110 and a signal conversion device 120. The first signal receiving antenna 110 is rotatable to receive the first network signals from different directions, and the signal conversion device 120 converts the first network signal with the strongest signal from the first network signals received by the first signal receiving antenna 110 from different directions into the second network signal.

When the user terminal apparatus 1 includes the housing 220, the first signal receiving antenna 110 and the signal conversion device 120 may be disposed in the housing 110.

The first signal receiving antenna 110 may be, but is not limited to, a millimeter wave signal receiving antenna or a terahertz signal receiving antenna. Accordingly, the first network signal may be, but is not limited to, a millimeter wave signal or a terahertz signal. Currently, in the fifth generation mobile communication technology (5th generation wireless systems, 5G), according to the specification of the 3GPP TS 38.101 protocol, a New Radio (NR) of 5G mainly uses two sections of frequencies: FR1 frequency band and FR2 frequency band. Wherein, the frequency range of the FR1 frequency band is 450 MHz-6 GHz, also called sub-6GHz frequency band; the frequency range of the FR2 frequency band is 24.25 GHz-52.6 GHz, and belongs to the millimeter Wave (mm Wave) frequency band. The 3GPP Release 15 specification specifies that the current 5G millimeter wave frequency band includes: n257(26.5 to 29.5GHz), n258(24.25 to 27.5GHz), n261(27.5 to 28.35GHz) and n260(37 to 40 GHz). Millimeter wave or terahertz signal have transmission speed advantage such as fast, however, millimeter wave or terahertz signal are sheltered from by external object easily. When there is an object block between the first signal receiving antenna 110 and the base station 3, the signal strength of the first network signal received by the first signal receiving antenna 110 is weak, and at this time, if the first network signal with weak signal strength is converted into the second network signal, the signal strength of the obtained second network signal may also be weak.

For the user terminal equipment 1 placed at a certain position, the signal strength of the first network signal in each direction of the first signal receiving antenna 110 is different. In the present embodiment, the first signal receiving antenna 110 in the user terminal device 1 is rotatable, and when the first signal receiving antenna 110 is located in the direction in which the signal strength of the first network signal is strongest, the first signal receiving antenna 110 stays in the direction in which the signal strength of the first network signal is strongest. The signal conversion device 120 converts the first network signal with the strongest signal received by the first signal receiving antenna 110 into the second network signal. The signal conversion device 120 in the user terminal device 1 in this embodiment converts the first network signal with the strongest signal into the second network signal, so as to ensure the signal strength of the second network signal, and further ensure the communication quality when communicating by using the second network signal.

In one embodiment, the first signal receiving antenna 110 can be rotated manually or automatically, as long as the first signal receiving antenna 110 can be rotated.

Optionally, in an embodiment, the user terminal device 1 further includes a controller 130. The controller 130 is configured to determine a direction of the strongest signal strength according to the signal strength of the first network signal, and control the first signal receiving antenna 110 to rotate to the direction of the strongest first network signal.

Specifically, the controller 130 is electrically connected to the first signal receiving antenna 110, when the first signal receiving antenna 110 rotates, the first signal receiving antenna 110 can receive the first network signals in each direction, and the controller 130 compares the strength of the first network signals in each direction and determines the direction with the strongest signal strength. In this embodiment, the controller 130 controls the first signal receiving antenna 110 to rotate to the direction in which the first network signal is the strongest, so as to realize the automatic control of the rotation of the first signal receiving antenna 110.

Referring to fig. 5, fig. 5 is a circuit block diagram of a user terminal device according to another embodiment of the present application. The user terminal device 1 further comprises a signal transmitting antenna 200. The signal transmitting antenna 200 is electrically connected to the signal conversion device 120 to radiate the second network signal. When the second network signal is a WiFi signal, the signal transmitting antenna 200 is a WiFi antenna.

Referring to fig. 2 and fig. 6 and fig. 7 together, fig. 6 is a schematic structural diagram of a user terminal device according to another embodiment of the present application; fig. 7 is a circuit block diagram of a user terminal device according to another embodiment of the present application. In the present embodiment, for convenience of illustration, the housing 220 in the user terminal device 1 is removed, and the user terminal device 1 further includes a plurality of second signal receiving antennas 210. The plurality of second signal receiving antennas 210 are configured to receive a third network signal, and the signal conversion apparatus 120 is further configured to convert the third network signal into a fourth network signal. The first signal receiving antenna 110 is disposed on the top of the user terminal apparatus 1 compared to the second signal receiving antenna 210, and the plurality of second signal receiving antennas 210 are distributed along the periphery of the user terminal apparatus 1. The user terminal device 1 may include, but is not limited to, 8 second signal receiving antennas 210. Alternatively, the two second signal receiving antennas 210 may constitute an antenna group 210a, and the two second signal receiving antennas 210 in the antenna group 210a are disposed on different substrates 230.

Due to the uncertainty of the position of the base station 3 transmitting the third network signal, there is also an uncertainty of the direction of transmission of the third network signal. The plurality of second signal receiving antennas 210 are fixed in position and are not rotatable. By distributing the second signal receiving antennas 210 along the circumference of the user terminal equipment 1, the third network signal in multiple directions can be detected. And further, the accuracy of judging the third network signal with the strongest signal according to the signal strength of each acquired third network signal can be improved.

The second signal receiving antenna 210 may be, but is not limited to, a sub-6G signal receiving antenna, and accordingly, the third network signal may be, but is not limited to, a sub-6G signal receiving antenna, and the fourth network signal may be, but is not limited to, a WiFi signal.

The plurality of second signal receiving antennas 210 are distributed along the periphery of the user terminal device 1, including but not limited to the plurality of second signal receiving antennas 210 being directly or indirectly attached to the housing 220; alternatively, the second signal receiving antenna 210 is disposed in the housing 220 of the user terminal device 1, and the second signal receiving antenna 210 is not in contact with the housing 220.

The housing 220 may be a multi-surface cylindrical tube or a cylindrical tube, which is not described in detail. The first signal receiving antenna 110, the signal conversion device 120, the controller 130, the plurality of second signal receiving antennas 210, and the like may be disposed in an accommodating space formed by the housing 220. The material of the housing 220 may be, but is not limited to, a non-electromagnetic wave shielding material such as plastic.

In one embodiment, the signal conversion device 120 converts the plurality of third network signals with the strongest signal strength in the plurality of second signal receiving antennas 210 into the fourth network signal.

For example, the number of the second signal receiving antennas 210 is M, and the signal conversion apparatus 120 is configured to select N second signal receiving antennas 210 from the M second signal receiving antennas 210 according to the strength of the third network signal received by the second signal receiving antennas 210. When the number of the selected second signal receiving antennas 210 is N, the sum of the signal strengths of the selected N second signal receiving antennas 210 is greater than the sum of the strengths of the third network signals received by any remaining N second signal receiving antennas 210 of the M second signal receiving antennas 210. Wherein M and N are both positive integers, for example, M is equal to but not limited to 8, and N is equal to but not limited to 4.

Referring to fig. 8 and 9 together, fig. 8 is a schematic structural diagram of a part of a device in a user terminal device according to another embodiment of the present application; fig. 9 is a circuit block diagram of a user terminal device according to an embodiment of the present application. The user terminal device 1 includes a chip 310, a temperature sensor 320, a temperature control module 330, a heat sink 280, and a heating member 340. The starting temperature of the chip 310 is a preset temperature. The temperature sensor 320 is disposed adjacent to the chip 310, and is configured to detect an ambient temperature around the chip 310 to obtain a first ambient temperature signal. The temperature control module 330 is electrically connected to the temperature sensor 320, and is configured to receive the first ambient temperature signal, determine whether the ambient temperature is lower than a preset temperature according to the first ambient temperature signal, and send a heating control signal when determining that the ambient temperature is lower than the preset temperature. The heat dissipation member 280 is disposed around the periphery of the chip 310 for dissipating heat from the chip 310. The heating element 340 is carried on the heat sink 280, and the heating element 340 is electrically connected to the temperature control module 330, so that the chip 310 is heated when the heating element 340 receives the heating control signal.

In one embodiment, the chip 310 includes a chip body 311 and a package 312. The chip body 311 refers to a component for performing the main function of the chip 310, and the chip body 311 is usually made of a silicon substrate. The package 312 is usually made of plastic, and the package 312 is usually disposed around the chip body 311 for packaging and protecting the chip body 311. In the schematic diagram of the embodiment, one surface of the chip body 311 is disposed on the surface of the circuit board 260, and the package casing 312 surrounds the rest of the side surfaces of the chip body 311. The heating element 340 may be, but is not limited to, a resistance wire, a resistance sheet, etc.

In one embodiment, the temperature sensor 320 is packaged together with the chip body 311 in the package 312 to improve the accuracy of the temperature sensor 320 detecting the ambient temperature around the chip body 311. The temperature sensor 320 and the chip body 311 may be integrated into one module, or may be two independent modules.

For convenience of description, the starting temperature of the chip 310 is named as a first preset temperature, in other words, the starting temperature of the chip 310 is the first preset temperature. The starting temperature of the chip 310 is the first preset temperature, which means that the chip 310 can only be started when the ambient temperature of the chip 310 is greater than or equal to the first preset temperature, and the chip 310 cannot be started when the ambient temperature of the chip 310 is less than the first preset temperature. For example, when the chip 310 is a baseband chip, the starting temperature of the baseband chip is 0 ° for the baseband chip, in other words, the baseband chip can be started only when the ambient temperature of the baseband chip is greater than or equal to 0 °, and the baseband chip cannot be started when the ambient temperature of the baseband chip is less than 0 °. In a part of the global area, the outdoor temperature may be lower than 0 ° in part of the seasons in some places, and if the baseband chip cannot be started when the ambient temperature is lower than the start temperature of the baseband chip, the user terminal device 1 cannot operate normally.

Compared with the prior art, the user terminal device 1 provided in this embodiment detects the temperature of the environment where the chip 310 is located through the temperature sensor 320, and when the temperature control module 330 determines that the environment temperature of the environment where the chip 310 is located is less than the first preset temperature, the heating element 340 is activated to heat the chip 310, so that the environment temperature of the environment where the chip 310 is located is increased, and for the temperature of the environment where the chip 310 is located is greater than or equal to the first preset temperature, the activation temperature of the chip 310 is satisfied, so as to prepare for activating the chip 310, and further, the user terminal device 1 can still normally operate in a low-temperature environment. In addition, the heating element 340 of the present application is carried in the heat sink 280, and when the heating element 340 is damaged, the heat sink 280 carrying the heating element 340 is directly replaced.

In one embodiment, the package 312 includes: a first sealing portion 3121 and a second sealing portion 3122. The first encapsulating portion 3121 is disposed at one side of the chip body 311. The second sealing portion 3122 surrounds the periphery of the first sealing portion 3121 and is connected to the first sealing portion 3121 in a bending manner, and the second sealing portion 3122 is disposed corresponding to the thickness of the chip body 311. The heating member 340 is disposed outside the first packing portion 3121. In the schematic view of the present embodiment, the heating element 340 is disposed inside the heat sink 280 and outside the first package portion 3121.

The chip body 311 is a rectangular parallelepiped, and the size of the chip body 311 is typically 10 × 1mm, that is, the length of the chip body 311 is typically 10mm, the width is typically 10mm, and the thickness (also referred to as height) is typically 1 mm. The chip body 311 may also have a size of 20 × 1mm, that is, the chip body 311 has a length of 20mm, a width of 20mm, and a thickness (also referred to as a height) of 1 mm. Generally, the chip body 311 has poor heat conductivity in the longitudinal direction and the width direction and good heat conductivity in the thickness direction due to the limitation of the material (usually, a silicon wafer) of the chip body 311. In the user terminal device 1 of the present embodiment, the heating element 340 is carried on the heat sink 280 and disposed outside the first encapsulating portion 3121, so that heat generated by the heating element 340 is conducted in the thickness direction of the chip body 311, which is beneficial to improving the heating effect on the chip body 311.

In one embodiment, the temperature sensor 320 is further configured to detect an ambient temperature around the chip 310 after the heating element 340 is activated for a predetermined time to obtain a second ambient temperature signal. Correspondingly, the temperature control module 330 is further configured to determine whether the ambient temperature is greater than or equal to a second preset temperature according to the second ambient temperature, and turn off the heating element 340 when the ambient temperature is greater than or equal to the second preset temperature and after the chip 310 is started, where the ambient temperature corresponding to the second ambient temperature signal is greater than the ambient temperature corresponding to the first ambient temperature signal.

In this embodiment, when the ambient temperature corresponding to the second ambient temperature signal is greater than the ambient temperature corresponding to the first ambient temperature signal, it indicates that the ambient temperature of the environment where the chip 310 is located due to the action of the heating element 340 is greater than or equal to the starting temperature of the chip 310, and the chip 310 can be started. After the chip 310 is started, the chip 310 may emit a large amount of heat energy when operating, so even if the heating element 340 is turned off, the temperature of the environment where the chip 310 is located is usually higher than the first preset temperature due to the heat energy emitted by the chip 310 when operating, and at this time, the operation of the chip 310 is not affected by turning off the heating element 340.

Referring to fig. 10, fig. 10 is a schematic view of a heating element according to an embodiment of the present disclosure. The heating member 340 includes a plurality of heating branches 341 disposed at intervals, and a connecting portion 342 connecting two connected heating branches 341, and of the three connected heating branches 341, two opposite ends of the middle heating branch 341 are respectively connected to the connecting portion 342. In this embodiment, the heating member 340 is substantially "S" shaped. The structure of the heating member 340 has a good heating effect and is convenient to arrange. It is to be understood that the structure of the heating member 340 is not limited thereto in other ways.

In an embodiment, the distance between the heating branches 341 adjacent to the chip 310 is smaller than the distance between the heating branches 341 far from the chip 310, so that the heating element 340 can heat the chip 310 better.

Referring to fig. 11, fig. 11 is a circuit block diagram of a user terminal device according to another embodiment of the present application. In order to make the structure of the user terminal device 1 in this embodiment substantially the same as that of the user terminal device 1 in fig. 8 and 9 and their related descriptions, the difference is that in this embodiment, the user terminal device 1 further includes: a control module 360. The same modules in the user terminal device 1 related to fig. 9 and the related description thereof are not repeated, and refer to the foregoing description specifically. The control module 360 is configured to detect an ambient temperature around the chip 310 at a predetermined time after the heating element 340 is activated. When the ambient temperature corresponding to the first ambient temperature signal is less than the first preset temperature, and the difference between the ambient temperature corresponding to the first ambient temperature signal and the first preset temperature is larger, the preset time is longer.

Specifically, the control module 360 is electrically connected to the temperature sensor 320, and is configured to control the temperature sensor 320 to detect the ambient temperature around the chip 310 when the heating element 340 is activated for a preset time.

In one embodiment, the control module 360 and the temperature control module 330 may be integrated into a single module.

Generally speaking, when the ambient temperature of the environment where the chip 310 is located rises a limited amount of time after the heating element 340 is started, it is usually difficult to reach the starting temperature of the chip 310, and therefore, the user terminal device 1 in this embodiment detects the ambient temperature around the chip 310 at the preset time after the heating element 340 is started, which is beneficial to prolonging the service life of the temperature sensor 320 and saving electric energy. The preset time may be, but is not limited to, one minute or three minutes.

When the ambient temperature corresponding to the first ambient temperature signal is lower than the first preset temperature and the difference between the ambient temperature corresponding to the first ambient temperature signal and the first preset temperature is larger, it indicates that the temperature of the environment around the chip 310 is lower, and it takes a longer time for the heating element 340 to heat the ambient temperature around the chip 310 to the preset temperature after being started; accordingly, when the ambient temperature corresponding to the first ambient temperature signal is less than the first preset temperature and the difference between the ambient temperature corresponding to the first ambient temperature signal and the first preset temperature is smaller, it indicates that the ambient temperature around the chip 310 is lower than the starting temperature of the chip 310, but the ambient temperature around the chip 310 is not too low, and the heating element 340 can heat the ambient temperature around the chip 310 to the preset temperature in a shorter time after being started.

In an embodiment, the temperature control module 330 is further configured to adjust the magnitude of the current flowing through the heating element 340 according to a difference between the ambient temperature and the first preset temperature.

In an embodiment, when the ambient temperature is lower than the first predetermined temperature and the difference between the ambient temperature and the first predetermined temperature is larger, the temperature control module 330 controls the current flowing through the heating element 340 to be larger. For the same heating element 340, the heating element 340 emits more heat per unit time when the current flowing through the heating element 340 is larger; when the current flowing through the heating member 340 is smaller, the heating member 340 emits less heat per unit time. At this time, no matter the difference between the ambient temperature around the chip 310 and the first preset temperature is large or small, the technical effect that the time difference of the ambient temperature around the chip 310 rising to the first preset temperature is small or even equal can be achieved.

In one embodiment, when the ambient temperature is lower than the first predetermined temperature and the temperature difference between the ambient temperature and the first predetermined temperature is a first temperature difference range, the temperature control module 330 controls the current flowing through the heating element 340 to be a first current; work as ambient temperature is less than first preset temperature, just ambient temperature with when the difference in temperature of first preset temperature is the second difference in temperature scope, temperature control module 330 control flow through the electric current of heating element 340 is the second electric current, wherein, the second difference in temperature scope with first difference in temperature scope does not overlap, just the ambient temperature that the second difference in temperature scope corresponds is less than the ambient temperature that first difference in temperature scope corresponds, the second electric current is less than first electric current.

For example, the first preset temperature is 0 °, the first temperature difference range is (-12 ° -7 °), and the second temperature difference range is (-6 ° -1 °), so that the second current is smaller than the first current if the ambient temperature corresponding to the second temperature difference range is smaller than the ambient temperature corresponding to the first temperature difference range.

In addition, when the temperature difference between the ambient temperature and the first preset temperature is within the same temperature difference range, the temperature control module 330 controls the current flowing through the heating element 340 to be the same. In this embodiment, the control of the heating member 340 can be simplified.

For example, the first preset temperature is 0 °, and the temperature difference ranges of the ambient temperature and the first preset temperature are both in the same temperature difference range (-6 ° -1 °), and at this time, although the ambient temperatures are different, the temperature control module 330 controls the currents flowing through the heating element 340 to be equal.

Referring to fig. 8, the heat sink 280 includes a heat sink body 281 and a plurality of heat dissipation fins 282. The heat dissipation body 281 is disposed adjacent to the chip 310. The heat dissipation fins 282 are disposed at intervals on a surface of the heat dissipation body 281 facing away from the chip 310; wherein, the heating element 340 is embedded in the heat dissipation body 281.

The shape of the heat dissipating body 281 may be, but is not limited to, a rectangle or a square. The shape of the heat sink 282 may be, but is not limited to, a rectangle. The heat dissipation fins 282 are disposed at intervals on the surface of the heat dissipation body 281 facing away from the chip 310, which includes the following conditions: the distance between two adjacent heat dissipation fins 282 is the same, and the size of the heat dissipation fins 282 is the same; alternatively, the distance between two adjacent heat dissipation fins 282 gradually increases from the position near the center of the chip 310 to the two sides, and the sizes of the heat dissipation fins 282 are the same; alternatively, the distance between two adjacent heat dissipation fins 282 is uniform, and the size of the heat dissipation fins 282 gradually decreases from the position near the center of the chip 310 to the two sides. The heat sink 280 is easily manufactured when the distance between two adjacent heat dissipation fins 282 is uniform and the heat dissipation fins 282 are uniform. The heat dissipation fins 282 can enhance the heat dissipation effect of the heat dissipation member 280.

The heating element 340 may be embedded in the heat dissipating body 281 by, but not limited to, a die casting process. Specifically, the heating element 340 is placed in a mold, and molten metal (e.g., molten aluminum alloy) is injected into the mold to cool the molten metal, so that the heating element 340 is embedded in the heat dissipation body 281.

In an embodiment, the user terminal device 1 further comprises a thermal pad 350. The thermal pad 350 is disposed between the heat dissipation body 281 and the chip 310, and is respectively connected to the heat dissipation body 281 and the chip 310.

In one embodiment, the thermal pad 350 may be made of thermal conductive silicone. The silicone rubber has a thermal conductive function, has a certain compressible amount, and has a certain viscosity, and therefore, the thermal pad 350 not only realizes the connection between the heat sink 280 and the chip 310, but also realizes the heat transfer between the heat sink 280 and the chip 310. Specifically, when the chip 310 is not activated, the thermal pad 350 may transfer heat generated from the heating element 340 carried on the heat sink 280 to the chip 310 to heat the chip 310; when the chip 310 is activated, the thermal pad 350 may conduct heat of the chip 310 to the heat sink 280 to dissipate heat of the chip 310.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a part of a device in a user terminal device according to another embodiment of the present application. The heat sink 280 includes: a heat sink 281 and a plurality of heat sink fins 282. The user terminal 1 provided by this embodiment is substantially the same as the user terminal 1 described in the previous embodiment, except that in this embodiment, the heat dissipation body 281 is disposed adjacent to the chip 310, and the heat dissipation body 281 has an accommodating space that forms an opening on a surface of the heat dissipation body 281 adjacent to the chip 310. The heat dissipation fins 282 are disposed at intervals on a surface of the heat dissipation body 281 facing away from the chip 310; the heating element 340 is disposed in the receiving space and detachably connected to the heat dissipating body 281.

The heating member 340 is detachably connected to the heat dissipating body 281, so that the heating member 340 can be easily replaced when the heating member 340 is damaged. In this embodiment, the heating element 340 is disposed in the accommodating space through a heat conductive gel 370.

Referring to fig. 13, fig. 13 is a schematic structural diagram of a part of a device in a user terminal device according to another embodiment of the present application. In the present embodiment, the heat sink 280 includes: a heat sink 281 and a plurality of heat sink fins 282. The user terminal 1 provided by this embodiment is substantially the same as the user terminal 1 described in the previous embodiment, except that in this embodiment, the heat dissipation body 281 is disposed adjacent to the chip 310, and the heat dissipation body 281 has an accommodating space that forms an opening on a surface of the heat dissipation body 281 adjacent to the chip 310. The heat dissipation fins 282 are disposed at intervals on a surface of the heat dissipation body 281 facing away from the chip 310; the heating element 340 is disposed in the receiving space and detachably connected to the heat dissipating body 281.

In this embodiment, the user terminal device 1 further includes: a bearing member 380, the heating member 340 is embedded in the bearing member 380, and the bearing member 380 embedded with the heating member 340 is detachably connected to the heat dissipating body 281.

Referring to fig. 14 and fig. 15 together, fig. 14 is a schematic structural diagram of a part of a device in a user terminal device according to another embodiment of the present application; fig. 15 is a schematic view of another perspective of the heat dissipation body in the user terminal device shown in fig. 14 according to an embodiment. Fig. 14 is a schematic sectional view, and fig. 15 is a schematic side view. The heat dissipation body 281 includes a first surface 2811 and a second surface 2812. The first surface 2811 is a surface of the heat dissipation body 281 adjacent to the chip 310, and the first surface 2811 is provided with the opening. The second surface 2812 is connected to the first surface 2811, and the second surface 2812 is also opened with an opening communicating with the receiving space 2813. The carrier 380 can be loaded into the receiving space through the opening of the second surface 2812 and separated from the heat dissipating body 281 through the opening of the second surface 2812.

The heat dissipating body 281 has a side wall forming the receiving space, an orthographic projection range of the side wall on the first surface 2811 covers the opening formed on the first surface 2811, and the orthographic projection range of the side wall on the first surface 2811 is located outside the range of the opening formed on the first surface 2811. In other words, the sidewall is shaped such that the carrier 380 cannot fall out of the opening in the first surface 2811; and the carrier 380 provided with the heating element 340 can be replaced at the opening on the second surface 2812. The specific form of the heat dissipating body 281 will be described in detail in several embodiments.

In the illustration of the present embodiment, the side wall of the heat dissipation body 281 forming the receiving space deviates from the opening by the largest dimension, and the side wall corresponding to the opening is the smallest dimension, and the side wall is inclined. In other words, the heat dissipating body 281 has a trapezoidal shape in a cross-sectional view perpendicular to a plane where the opening is located.

Referring to fig. 16, fig. 16 is a schematic view of another perspective of the heat dissipation body and the carrier in the user terminal device shown in fig. 14 according to another embodiment. In this embodiment, the side wall is a convex arc surface.

Referring to fig. 17, fig. 17 is a schematic view of another perspective of the heat dissipation body and the carrier in the user terminal device shown in fig. 14 according to another embodiment. In the present embodiment, the carrier 380 has a T-shape, and accordingly, the shape of the receiving space is adapted to the shape of the carrier 380. In other words, the bearing member 380 has a bearing body 381 and two protruding portions 382 connected to two opposite sides of the bearing body 381. Correspondingly, the side wall of the heat dissipating body 281 has a groove, when assembled, the bearing member 380 bearing the heating element 340 can be installed into the heat dissipating body 281 from the opening of the second surface 2812, and the protrusion 382 is accommodated in the groove, so as to fix the bearing member 380 bearing the heating element 340 to the heat dissipating body 281, and further, the heat dissipating body 281 cannot be taken out through the opening of the first surface 2811 of the heat dissipating body 281.

It is understood that, in the above embodiments, the chip 310 includes a chip body 311 and a package 312 as an example, when the user terminal device 1 further includes a thermal pad 350, the thermal pad 350 is disposed between the heat dissipation body 281 and the package 312, and is respectively connected to the heat dissipation body 281 and the package 312. In another embodiment, please refer to fig. 18, where fig. 18 is a schematic structural diagram of a part of devices in a user terminal device according to yet another embodiment of the present application. In this embodiment, the chip 310 may not include the package 312, and only includes the chip body 311. When the user terminal device 1 further includes a thermal pad 350, the thermal pad 350 is disposed between the heat dissipation body 281 and the chip body 311, and is respectively connected to the heat dissipation body 281 and the chip body 311.

When the chip 310 does not include the package 312, the thermal pad 350 is directly connected to the heat dissipation body 281 and the chip body 311. The thermal pad 350 directly connecting the chip body 311 and the heat dissipation body 281 is named a first thermal pad, and the thermal pad 350 connecting the heat dissipation body 281 and the package casing 312 is named a second thermal pad, wherein the hardness of the first thermal pad is less than that of the second thermal pad. Generally speaking, the hardness of the chip body 311 is less than that of the package 312, and when the chip body 311 is directly connected to the chip 310 and the heat dissipation body 281, the hardness of the first thermal pad is less, so that the chip body 311 can be protected from being damaged by the heat dissipation body 281.

When the chip 310 does not include the package 312, the example that the heating element 340 is embedded in the heat dissipation body 281 is taken as an example for illustration, it can be understood that, in other embodiments, the chip body 310 does not include the package 312 and only includes the chip body 311, and can be further incorporated into the user terminal device 1 provided in any of the foregoing embodiments, for example, the relationship between the heating element 340 and the heat dissipation body 281 can also be as described in any of the foregoing embodiments, and the heat dissipation member 280 can also refer to one of the embodiments described in any of the foregoing embodiments.

In combination with the above embodiments, the heat sink 280 further includes a supporter 283. The heat sink 280 including the supporter 283 may be incorporated into the heat sink 280 described in any of the previous embodiments. One end of the support 283 is connected to the surface of the heat dissipation body 281 deviating from the plurality of heat dissipation fins 282, the other end of the support 283 is disposed on the circuit board 260 and detachably connected to the circuit board 260, the support 283, the heat dissipation body 281 and the circuit board 260 are enclosed to form an accommodation space for accommodating the chip 310, and the support 283 is made of an electromagnetic shielding material.

In this embodiment, the heat dissipating member 280 includes a support 283, the support 283 can support the heat dissipating body 281 to enhance the structural strength of the heat dissipating member 280 when connected to the chip 310, and the support 283 is made of an electromagnetic shielding material to prevent the interference of external electromagnetic wave signals to the chip 310.

Further, a gap exists between the support 283 and the package casing 312 to enhance the firmness and stability of the heat sink 280 when connected with the chip 310.

It is to be understood that the heat sink 280 including the supporter 283 may be joined to the heat sink 280 as described in any of the above embodiments.

In conjunction with the user terminal device 1 provided in each of the above embodiments, the user terminal device 1 further includes a circuit board 260, where the circuit board 260 is configured to carry the chip 310. Specifically, when the chip 310 includes a chip body 311 and a package 312, the chip body 311 is disposed on the surface of the circuit board 260, the package 312 surrounds the chip body 311, and the package 312 is carried on the circuit board 260. When the chip 310 includes the chip body 311 and does not include the package 312, the chip body 311 is disposed on the surface of the circuit board 260.

In one embodiment, the chip body 311 is stacked on the circuit board 260 from a thickness direction of the chip body 311. The circuit board 260 is also referred to as a large board. In the user terminal device 1 described in conjunction with the foregoing embodiment, the chip 310 may be a chip 310 that controls corresponding operations of the first signal receiving antenna 210 and the signal transmitting antenna 200. The chip 310 generally includes a receiving module and a transmitting module. The receiving module is electrically connected to the second signal receiving antenna 210. The third network signal received by the second signal receiving antenna 210 is transmitted to the signal conversion apparatus 120 via the receiving module. The transmitting module is electrically connected to the signal transmitting antenna 200, and the signal conversion device 120 converts the third network signal into a fourth network signal and transmits the fourth network signal to the signal transmitting antenna 200 through the transmitting module.

The following describes a control method for a user terminal device provided in the present application with reference to the user terminal device described in the foregoing embodiments. Referring to fig. 19, fig. 19 is a schematic diagram illustrating a control method of a ue according to an embodiment of the present application. The control method of the user terminal device 1 includes, but is not limited to, S100 to S700, and S100 to S700 are described in detail as follows.

S100, detecting the ambient temperature around the chip 310 to obtain a first ambient temperature signal;

s200, judging whether the ambient temperature is lower than a preset temperature or not according to the first ambient temperature signal;

s300, when the environment temperature is judged to be lower than the preset temperature, a heating control signal is sent out;

s400, starting a heating element 340 to heat for a preset time;

s500, measuring the ambient temperature around the chip 310 to obtain a second ambient temperature signal;

s600, judging whether the environment temperature is greater than or equal to the preset temperature or not according to the second environment temperature;

s700, the chip 310 is activated and the heating element 340 is turned off.

It should be understood that, although the present application is described by taking the chip 310 in the ue 1 as a chip for controlling the operation of the millimeter wave antenna as an example, the chip 310 is not limited to be a chip for controlling the operation of the millimeter wave antenna, and in other embodiments, the chip 310 may also be a chip for controlling the operation of other components, as long as the chip 310 is not normally started when the ambient temperature of the ue 1 is low. The heating member 340 has been increased in the user terminal equipment 1 in this application to guaranteed that user terminal equipment 1 also can normally work under the lower environment of temperature, just the heating member 340 set up in the connection can be dismantled to the radiating part the heating member 340 of convenient renewal when heating member 340 damages.

Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims

1. A user terminal device, characterized in that the user terminal device comprises:

the starting temperature of the chip is a preset temperature, and the chip comprises a chip body;

the heat dissipation device comprises a heat dissipation part, a first heat dissipation part and a second heat dissipation part, wherein the heat dissipation part is arranged around the periphery of a chip and used for dissipating heat of the chip, the heat dissipation part comprises a heat dissipation body, the heat dissipation body is provided with an accommodating space, the heat dissipation body comprises a first surface and a second surface, the first surface is the surface of the heat dissipation body adjacent to the chip, the first surface is provided with an opening communicated with the accommodating space, the second surface is connected with the first surface, and the second surface is also provided with an opening communicated with the accommodating space;

the bearing piece is embedded with a heating element, can be loaded into the accommodating space through the opening of the second surface, is separated from the heat dissipation body through the opening of the second surface, and cannot fall off from the opening on the first surface;

the heat conducting pad is arranged between the heat dissipation body and the chip and is respectively connected with the heat dissipation body and the chip; and

heating member, heating member bear in the heat-dissipating piece, embedded have heating member hold carrier set up in accommodating space, and with the connection can be dismantled to the heat dissipation body, just heating member with the control by temperature change module electricity is connected, works as heating member receives during the heating control signal right the chip heats.

2. The user terminal device of claim 1, wherein the heat sink further comprises:

the plurality of radiating fins are arranged on the surface of the radiating body deviating from the chip at intervals; wherein, the heating member is embedded in the heat dissipation body.

3. The user terminal device of claim 1, wherein the heat sink further comprises:

the heat dissipation body is provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the surface of the heat dissipation body deviating from the chip at intervals.

4. The user terminal device of claim 3, wherein the heating element is disposed in the receiving space through a thermally conductive gel.

5. The user terminal device according to claim 1, wherein the heat dissipation body has a side wall forming the receiving space, an orthographic projection range of the side wall on the first surface covers the opening formed on the first surface, and the orthographic projection range of the side wall on the first surface is located outside the opening formed on the first surface.