CN113423253A

CN113423253A - Heat dissipation assembly and electronic equipment

Info

Publication number: CN113423253A
Application number: CN202110843763.2A
Authority: CN
Inventors: 梁建煊
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-07-26
Filing date: 2021-07-26
Publication date: 2021-09-21

Abstract

The application provides a heat dissipation assembly and an electronic device, wherein the heat dissipation assembly comprises a radiator and a liquid bag; the heat radiator is arranged close to the heat source or in contact with the heat source; the liquid bag is enclosed into an accommodating space, and the radiator and the heat source are accommodated in the accommodating space; wherein the liquid bag is filled with liquid configured to be capable of circulating in the liquid bag and the radiator to dissipate heat by the circulating flow of the liquid. The radiating assembly and the electronic equipment provided by the embodiment of the application contain the radiator and the heat source in the containing space of the liquid bag, and the liquid bag is filled with liquid to enable the liquid to flow in the liquid bag and the radiator in a circulating mode, so that the heat radiation is carried out through the circulating flow of the liquid, and the radiating efficiency is improved.

Description

Heat dissipation assembly and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment structures, in particular to a heat dissipation assembly and electronic equipment.

Background

The electronic equipment can generate heat in the electronic equipment in a working state, and if the generated heat cannot be timely dissipated from the inside of the electronic equipment, the working efficiency of the electronic equipment is greatly influenced.

The related art basically utilizes natural convection and radiation heat dissipation to dissipate heat from the inside to the outside of the electronic device. However, in an outdoor use scene, electronic equipment generally has a waterproof requirement, and at the moment, the electronic equipment basically adopts a non-opening form, so that the inside of the electronic equipment cannot radiate heat to the outside of the electronic equipment in a natural convection mode.

Disclosure of Invention

In one aspect, the present embodiments provide a heat dissipation assembly, including a heat sink and a fluid bag; the heat radiator is arranged close to the heat source or in contact with the heat source; the liquid bag is enclosed into an accommodating space, and the radiator and the heat source are accommodated in the accommodating space; wherein the liquid bag is filled with liquid configured to be capable of circulating in the liquid bag and the radiator to dissipate heat by the circulating flow of the liquid.

Another aspect of the embodiments of the present application further provides a heat dissipation assembly, where the heat dissipation assembly includes a heat sink, a bracket, and a liquid bag; the heat radiator is arranged close to the heat source or in contact with the heat source; the bracket encloses an accommodating space, and the radiator and the heat source are accommodated in the accommodating space; the liquid bag is enclosed into an accommodating space, and the bracket is accommodated in the accommodating space; wherein the liquid bag is filled with liquid configured to be capable of circulating in the liquid bag and the radiator to dissipate heat by the circulating flow of the liquid.

Yet another aspect of the embodiments of the present application further provides a heat dissipation assembly, including a heat sink and a fluid bag, the heat sink being disposed adjacent to or in contact with a heat source; the liquid bag is enclosed into an accommodating space, and the radiator and the heat source are accommodated in the accommodating space; wherein the liquid bag is filled with liquid configured to be capable of circulating in the liquid bag and the radiator to dissipate heat by the circulation flow of the liquid; the surface of the radiator, which faces away from the heat source, is at least partially in contact with the liquid bag.

In another aspect, an embodiment of the present application further provides an electronic device, where the electronic device includes a housing assembly, a heat source, and a heat dissipation assembly; the shell assembly is provided with an accommodating cavity; the heat source is accommodated in the accommodating cavity; the heat dissipation assembly is accommodated in the accommodating cavity; the heat dissipation assembly comprises a liquid bag and a radiator, and the liquid bag encloses an accommodating space; the heat sink is arranged adjacent to the heat source or in contact with the heat source; the heat radiator and the heat source are contained in the containing space, liquid is filled in the liquid bag, and the liquid can circularly flow in the liquid bag and the heat radiator so as to dissipate heat through the circular flow of the liquid.

In another aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes a housing assembly, a power supply, and a heat dissipation assembly, the housing assembly is provided with an accommodating cavity, the heat source is accommodated in the accommodating cavity, and the heat dissipation assembly is accommodated in the accommodating cavity; the heat dissipation assembly comprises a liquid bag, a bracket and a heat radiator; the liquid bag is enclosed into an accommodating space; the bracket is accommodated in the accommodating space, and the bracket encloses an accommodating space; the heat sink is arranged adjacent to the heat source or in contact with the heat source; the heat radiator and the heat source are accommodated in the accommodating space, liquid is filled in the liquid bag, and the liquid can circularly flow in the liquid bag and the heat radiator so as to dissipate heat through the circular flow of the liquid; the surface of the radiator, which faces away from the heat source, is at least partially in contact with the liquid bag.

The radiating assembly and the electronic equipment provided by the embodiment of the application contain the radiator and the heat source in the containing space of the liquid bag, and the liquid bag is filled with liquid to enable the liquid to flow in the liquid bag and the radiator in a circulating mode, so that the heat radiation is carried out through the circulating flow of the liquid, and the radiating efficiency is improved. Further locate the radiator unit in the casing subassembly, can be furthest with heat conduction to the casing subassembly through the liquid circulation flow on, the rethread casing subassembly takes away the heat with external environment's radiation and convection current, can avoid the lower defect of no trompil electronic equipment radiating efficiency betterly.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 discloses a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 discloses a structure-splitting schematic diagram of the electronic device in the embodiment of FIG. 1;

FIG. 3 discloses a schematic structural diagram of a heat dissipation assembly according to some embodiments of the present application;

FIG. 4 is a schematic diagram illustrating a disassembled structure of the heat dissipation assembly of FIG. 3;

FIG. 5 is a cross-sectional view of the heat sink of the embodiment of FIG. 4 along the direction A-A;

FIG. 6 discloses a schematic structural diagram of the fluid bag in the embodiment of FIG. 4;

FIG. 7 is a schematic view of the fluid bag of the embodiment of FIG. 6 from another perspective;

FIG. 8 is a schematic cross-sectional view taken along the direction B-B of the fluid bag in the embodiment of FIG. 6;

FIG. 9 is a schematic view of a heat sink assembly according to another embodiment of the present application;

FIG. 10 is a schematic view of the heat sink assembly of the embodiment of FIG. 9 with a disassembled structure;

FIG. 11 is a schematic view of a heat sink assembly according to another embodiment of the present application;

FIG. 12 is a schematic view of the heat sink assembly of the embodiment of FIG. 11 with a disassembled structure;

FIG. 13 is a schematic cross-sectional view of the heat sink assembly of the embodiment of FIG. 11 taken along the direction C-C;

FIG. 14 is a schematic cross-sectional view of a heat sink assembly according to still another embodiment of the present application;

FIG. 15 is a cross-sectional view of an electronic device according to still other embodiments of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal).

A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver.

The "signal conversion device" used herein may include, but is not limited to, a wireless broadband access device, that is, a device for converting a Long Term Evolution (LTE) signal into a WiFi signal that is common to electronic devices such as a tablet computer, a smart phone, and a notebook, and can simultaneously support multiple electronic devices to access the internet; the signal conversion device may further include, but is not limited to, a data backhaul device, that is, the user video and data are transmitted back to the public network or the private network through the wireless LTE signal and then transmitted to the client data processing center. For example, the signal conversion device may be a Customer Premises Equipment (CPE).

The signal conversion device may be understood as one of the electronic devices described above.

Referring to fig. 1 and fig. 2, fig. 1 discloses a schematic structural diagram of an electronic device 100 according to some embodiments of the present application, and fig. 2 discloses a schematic structural diagram of the electronic device 100 according to fig. 1, where the electronic device 100 may be a signal conversion device.

The electronic device 100 may include a housing assembly 10, a heat dissipation assembly 20 disposed within the housing assembly 10, and a heat source 30 disposed within the housing assembly 10. The heat source 30 may be a device capable of generating heat inside the electronic apparatus 100. For example, the heat source 30 may be a circuit board, a power device, or the like.

The heat sink assembly 20 is in contact with the inner surface of the housing assembly 10, and the heat sink assembly 20 is configured to uniformly conduct the heat generated by the heat source 30 to the housing assembly 10, so that the heat generated by the heat source 30 can be more rapidly radiated through the housing assembly 10. That is, the electronic device 100 provided in the embodiment can uniformly conduct the heat generated by the heat source 30 to the housing assembly 10 through the heat dissipation assembly 20 disposed in the housing assembly 10, so as to improve the temperature uniformity and the heat conduction efficiency of the housing assembly 10, and further utilize the radiation heat dissipation efficiency to the maximum extent.

The heat dissipation assembly 20 is wrapped around at least a portion of the heat source 30 and is in approximately full contact with the inner surface of the housing assembly 10, so as to uniformly transfer heat generated by the heat source 30 to the housing assembly 10, and perform radiation heat dissipation through the housing assembly 10, thereby improving the temperature uniformity and heat conduction efficiency of the housing assembly 10, and further utilizing the radiation heat dissipation efficiency to the maximum extent.

In one embodiment, the housing assembly 10 may include a bottom shell 11 and a cover 12, and the bottom shell 11 may include a bottom wall 111 and a side wall 112 extending from an edge of the bottom wall 111, and the bottom wall 111 and the side wall 112 cooperatively enclose the bottom shell 11 having the receiving cavity 101. The cover 12 covers the opening of the accommodating cavity 101, and the cover 12 can be fixed to the bottom case 11 by screwing, inserting, fastening, bonding, welding, and the like. The heat dissipation assembly 20 and the heat source 30 are accommodated in the accommodating cavity 101, and the heat dissipation assembly 20 is at least partially in contact with the inner surface of the accommodating cavity 101.

In one embodiment, the heat source 30 may be a circuit board, and a signaling chip and/or a signaling antenna may be disposed on the circuit board for receiving/transmitting communication signals such as 4G, 5G, and the like. The millimeter wave-based communication system has the advantage of high bandwidth and has a wide prospect in a 5G communication background. However, millimeter waves have the characteristics of large propagation attenuation and weak through-wall capability, and therefore, in order to avoid affecting signal propagation, the housing assembly 10 is preferably made of a plastic material, i.e., a non-metal material, so that the metal housing can be prevented from blocking and shielding the antenna signals inside the electronic device 100.

The housing assembly 10 is generally made of a plastic material to avoid interference with the antenna inside the electronic device 100 and affecting the stability of the antenna signal.

It should be understood that, in the present embodiment, the connection portion between the cover 12 and the bottom case 11 should be subjected to a waterproof treatment to improve the working stability of the whole device. For example, when the cover 12 and the bottom case 11 are connected by a snap fit, the waterproof effect can be achieved by an interference fit.

In an embodiment, the cover 12 has a positioning groove 121, and the opening direction of the positioning groove 121 is away from the bottom case 11. That is, the positioning groove 121 is formed by recessing the surface of the cover 12 away from the bottom case 11 toward the bottom case 11. A bottom wall of the positioning slot 121 is opened with a wire hole 122, and the wire hole 122 may be configured for a cable to pass through to connect the electronic device 100 and an external device/power source.

The electronic device 100 may further include a cable 40, and the cable 40 may be a signal line and/or a power line, which is not described in detail. In an embodiment, a connector 41 is disposed at one end of the cable 40, a connector seat 42 is disposed inside the electronic device 100, and the connector 41 is disposed through the wire hole 122 and electrically connected to the connector seat 42. In an embodiment, the connector 42 may be disposed on an internal circuit board of the electronic device 100 and electrically connected to the circuit board, so as to electrically connect the cable 40 to the circuit board, and further enable the electronic device 100 to transmit/receive signals through the cable 40, and further enable the electronic device 100 to obtain power from an external power source through the cable 40. It is understood that when the heat source 30 is a circuit board, the connector base 42 may be disposed at an end of the circuit board near the cover 12.

Further, a groove cover 123 is disposed on the cover 12, the groove cover 123 covers the opening of the positioning groove 121, and can be fixed to the cover 12 by means of screw connection, insertion connection, fastening, bonding, welding, and the like. A through hole 1230 corresponding to the wire hole 122 is formed on the slot cover 123, and the cable 40 can pass through the through hole 1230 to be connected to an external device. An elastic member 124 is disposed between the slot cover 123 and the bottom wall of the positioning slot 121, and the elastic member 124 is disposed around the outer circumference of the wire hole 122. When the slot cover 123 and the cover body 12 are fixedly connected, the slot cover 123 and the cover body 12 cooperate to press the elastic member 124 to form a waterproof sealing effect.

The elastic member 124 may be a silicone member or a rubber member.

Referring to fig. 3 and 4, fig. 3 discloses a schematic structural diagram of a heat dissipation assembly 20 in some embodiments of the present application, and fig. 4 discloses a schematic structural diagram of the heat dissipation assembly 20 in the embodiment of fig. 3, which is disassembled.

The heat dissipation assembly 20 may include a heat sink 21 and a liquid bag 22, the liquid bag 22 encloses a containing space 201, and the heat sink 21 and the heat source 30 are contained in the containing space 201. The heat source 30 may be a circuit board, i.e., the heat source 30 has a substantially plate shape. Of course, the heat source 30 may have other shapes, which will not be described in detail. The heat source 30 may include a first surface 31 and a second surface 32 disposed opposite. The heat sink 21 is disposed adjacent to the first surface 31 and/or the second surface 32 of the heat source 30, that is, the heat sink 21 may be disposed adjacent to the heat source 30 or may be disposed in contact with the heat source 30, wherein the heat sink 21 may be in direct or indirect contact with the heat source 30, which is not limited in this embodiment. For example, the heat sink 21 may be disposed on the first surface 31 and/or the second surface 32 of the heat source 30 and directly contact the first surface 31 and/or the second surface 32 of the heat source 30. For another example, the heat sink 21 may be spaced apart from the first surface 31 and/or the second surface 32 of the heat source 30, and may be thermally coupled to the first surface 31 and/or the second surface 32 via a thermally conductive structure.

In an embodiment, the heat sink 21 is disposed above the first surface 31, i.e. the heat conducting connection with the first surface 31 is realized by a heat conducting structure. The heat sink 21 and the heat conducting structure are generally made of heat conducting materials, such as metal materials with high heat conducting efficiency, graphite, etc., so that the heat emitted from the heat source 30 can be quickly dissipated through the heat dissipating structure 21. The heat sink 21 is spaced apart from the first surface 31, and can provide a layout space for other components disposed on the heat source 30, thereby facilitating the overall structural layout of the heat dissipation assembly 20.

The liquid bag 22 is at least partially in contact with the surface of the heat sink 21 away from the heat source 30, that is, at least a portion of the surface of the heat sink 21 away from the first surface 31 is in contact with the inner surface of the accommodating space 201 of the liquid bag 22, so that heat conducted by the heat sink 21 can be directly conducted to the liquid bag 22 and then conducted to the housing assembly 10 through the liquid bag 22, and thus the heat dissipation efficiency is improved. It is understood that in the embodiment of the present application, the heat generated by the heat source 30 can be directly or indirectly conducted to the heat sink 21, and directly or indirectly conducted to the fluid bag 22 via the heat sink 21, and then dissipated through the fluid bag 22, that is, the heat is directly conducted to the housing assembly 10 through the fluid bag 22 for heat dissipation.

In the research of the applicant, in the actual product heat dissipation scene, heat is conducted only through the heat conduction material, so that the defect of low heat dissipation efficiency exists, local overhigh heat may occur, and the maximization of the radiation heat dissipation efficiency is not facilitated. Based on this, the applicant further found through research that if a cooling liquid circulation heat dissipation manner is added inside the electronic device, the heat dissipation efficiency can be greatly improved, and the local overheating phenomenon can be avoided.

In order to solve the above technical problem, the cooling module 20 of the present application skillfully incorporates the cooling liquid circulation heat dissipation structure on the premise of not increasing other components to avoid occupying the internal layout space of the electronic device, thereby greatly improving the heat dissipation efficiency of the electronic device and avoiding the occurrence of the local overheating phenomenon.

In one embodiment, the fluid bag 22 may be configured to contain a fluid having a heat dissipation effect, such as water (distilled water), oil, or the like. The liquid bag 22 may be provided with a first liquid inlet 221 and a first liquid outlet 222, and the first liquid inlet 221 and the first liquid outlet 222 are disposed at an end of the liquid bag 22 close to the opening of the receiving cavity 101, i.e. at an end of the liquid bag 22 away from the bottom wall 111. Of course, the first liquid inlet 221 and the first liquid outlet 222 may be disposed at other positions of the liquid bag 22, which is not described in detail.

The liquid in the liquid bag 22 can flow out of the liquid bag 22 through the first liquid outlet 222, and the liquid outside the liquid bag 22 can flow into the liquid bag 22 through the first liquid inlet 221.

The heat sink 21 may have a second liquid inlet 211, a second liquid outlet 212, and a liquid channel inside the heat sink 21. The liquid channel penetrates through the heat sink 21, and two ends of the liquid channel are respectively communicated with the second liquid inlet 211 and the second liquid outlet 212. The second liquid inlet 211 and the second liquid outlet 212 are disposed at an end of the heat sink 21 close to the opening of the receiving cavity 101, i.e. at an end of the heat sink 21 away from the bottom wall 111. Of course, the second liquid inlet 211 and the second liquid outlet 212 may also be disposed at other positions of the heat sink 21, which is not described in detail.

The liquid in the radiator 21 can flow out of the radiator 21 through the second liquid outlet 212, and the liquid outside the radiator 21 can flow into the radiator 21 through the second liquid inlet 211.

The second liquid inlet 211 can be communicated with the first liquid outlet 222 through a pipe (e.g., a hose, etc.), and the second liquid outlet 212 can be communicated with the first liquid inlet 221 through a pipe (e.g., a hose, etc.), so that the liquid in the liquid bag 22 can flow to the heat sink 21 through the first liquid outlet 222 and the second liquid inlet 211 in sequence, and then flow into the liquid bag 22 through the second liquid outlet 212 and the first liquid inlet 221, thereby realizing the circulation flow of the liquid, and further conducting the heat conducted from the heat source to the heat sink 21 to the liquid bag 22 through the liquid. Namely, the heat dissipation is realized through the circulation flow of the liquid, so that the heat dissipation efficiency is improved.

The heat sink assembly 20 may further include a driver 23, the driver 23 being configured to drive the flow of liquid within the liquid bag 22. The driving member 23 may be a pump or the like and is disposed on the heat sink 21. In an embodiment, the heat sink 21 is provided with a mounting groove for mounting the driving member 23, the mounting groove is provided on a surface of the heat sink 21 away from the first surface 31, and the shape of the mounting groove is adapted to the shape of the driving member 23. That is, the driving member 23 is embedded in the heat sink 21, so that the driving member 23 can be prevented from occupying other layout space. In some embodiments, the surface of the driver 23 facing away from the first surface 31 and the surface of the heat sink 21 facing away from the first surface 31 are disposed substantially coplanar. Of course, in other embodiments, the driving member 23 may be disposed on the heat sink 21, and may be fixed to the cover 12 by screwing, inserting, snapping, adhering, welding, or the like.

The driving member 23 may be provided with a third liquid inlet 231 and a third liquid outlet 232, and the third liquid inlet 231 and the third liquid outlet 232 are disposed at an end of the driving member 23 close to the opening of the receiving cavity 101, that is, at an end of the driving member 23 away from the bottom wall 111. Of course, the third liquid inlet 231 and the third liquid outlet 232 may also be disposed at other positions of the driving member 23, which is not described in detail.

The liquid in the driving member 23 can flow out of the driving member 23 through the third liquid outlet 232, and the liquid outside the driving member 23 can flow into the driving member 23 through the third liquid inlet 231.

The third liquid inlet 231 may be communicated with the first liquid outlet 222 through a pipe (e.g., a hose, etc.), and the third liquid outlet 232 may be communicated with the second liquid inlet 211 through a pipe (e.g., a hose, etc.), so as to form a liquid flow path inside the heat dissipation assembly 20. That is, the liquid in the liquid bag 22 can flow to the heat sink 21 through the first liquid outlet 222, the third liquid inlet 231, the third liquid outlet 232 and the second liquid inlet 211 in sequence, and then flow into the liquid bag 22 through the second liquid outlet 212 and the first liquid inlet 221, so as to realize the circulation flow of the liquid, and further the heat conducted from the heat source to the heat sink 21 is dissipated through the circulation flow of the liquid.

It will be appreciated that the drive member 23 is adapted to provide a driving force for the flow of the liquid, i.e. the drive member 23 may be adapted to control the flow rate of the liquid. The heat dissipation efficiency can be controlled by controlling the flow rate of the liquid according to actual needs, so that the use experience of a user is improved. The driving member 23 is electrically connected to the circuit board inside the electronic device 100, so as to control the flow rate of the liquid through the circuit board.

Referring to fig. 5, fig. 5 shows a schematic cross-sectional structure of the heat sink 21 along the direction a-a in the embodiment of fig. 4, a liquid channel 213 communicating the second liquid inlet 211 and the second liquid outlet 212 is disposed inside the heat sink 21, and the liquid outside the heat sink 21 flows into the liquid channel 213 from the second liquid inlet 211 and then flows out through the second liquid outlet 212.

The fluid channel 213 is substantially U-shaped and may include first and

second channels

2131, 2132 spaced apart from one another and a third channel 2133 connecting the first and

second channels

2131, 2132. The first channel 2131 and the second channel 2132 are respectively arranged in the radiator 21 in a penetrating manner, two ends of the first channel 2131 are respectively communicated with the second liquid inlet 211 and the third channel 2133, and two ends of the second channel 2132 are respectively communicated with the second liquid outlet 212 and the third channel 2133.

In one embodiment, the first and

second passages

2131, 2132 may be formed directly in the radiator 21 by an integral molding process, and then the first and

second passages

2131, 2132 are connected by an external piping member (e.g., a hose) to form the complete liquid passage 213, i.e., the third passage 2133 formed by the piping member is located outside the radiator 21. For example, the heat sink 21 may directly form the built-in first and

second passages

2131 and 2132 using an aluminum extrusion process.

Of course, in another embodiment, the first passages 2131, the second passages 2132 and the third passages 2133 (i.e., the entire liquid passages 213) may be directly formed in the heat sink 21 by an integral molding process. For example, the heat sink 21 may directly form the built-in first passages 2131, second passages 2132, and third passages 2133 using an aluminum extrusion process.

In still other embodiments, the liquid channel 213 may include a first channel 2131 and a second channel 2132 that are connected in a bending manner, and the first channel 2131 and the second channel 2132 may be directly formed in the heat sink 21 by an integral molding process. For example, the heat sink 21 may directly form the built-in first and

second passages

2131 and 2132 using an aluminum extrusion process. One end of the first passage 2131 is communicated with the second liquid inlet 211, and one end of the second passage 2132 is communicated with the second liquid outlet 212.

The first channel 2131 may be in a shape of a straight line, an arc, a spiral, etc., the second channel 2132 may be in a shape of a straight line, an arc, a spiral, etc., and the third channel 2133 may be in a shape of a straight line, an arc, a spiral, etc., which will not be described herein. It is understood that the liquid channel 213 may have different structures and shapes based on different heat dissipation requirements, and will not be described in detail.

Referring to fig. 6 to 8, fig. 6 discloses a schematic structural diagram of the fluid bag 22 in the embodiment of fig. 4, fig. 7 discloses a schematic structural diagram of the fluid bag 22 in the embodiment of fig. 6 from another view angle, and fig. 8 discloses a schematic structural diagram of a cross section of the fluid bag 22 in the embodiment of fig. 6 along the direction B-B. The first liquid inlet 221 and the first liquid outlet 222 are disposed at an end of the liquid bag 22 close to the opening of the receiving cavity 101, that is, at an end of the liquid bag 22 away from the bottom wall 111. Of course, the first liquid inlet 221 and the first liquid outlet 222 may be disposed at other positions of the liquid bag 22, which is not described in detail.

In an embodiment, the fluid bag 22 is configured to contain a fluid, and the fluid is configured to circulate in the fluid bag 22 and the heat sink 21 to conduct the heat generated by the heat source 30 to the fluid bag 22 via the heat sink 21 and then to be dissipated through the fluid bag 22. That is, a liquid chamber 220 for filling liquid is disposed in the liquid bag 22, and the liquid chamber 220 is respectively communicated with the first liquid inlet 221 and the first liquid outlet 222, so that the liquid in the liquid chamber 220 can flow out of the liquid bag 22 through the first liquid outlet 222, and the liquid outside the liquid bag 22 can flow into the liquid chamber 220 through the first liquid inlet 221.

The liquid bag 22 may have a liquid outlet pipe 223 communicating the first liquid outlet 222 with the liquid chamber 220, and the liquid bag 22 may also have a liquid inlet pipe 224 communicating the first liquid inlet 221 with the liquid chamber 220. Of course, in other embodiments, the first liquid inlet 221 may be directly connected to the liquid cavity 220, and the first liquid outlet 222 may be directly connected to the liquid cavity 220, which will not be described in detail.

The liquid bag 22 can be wrapped around the heat sink 21 and the heat source 30, and the outer surface of the liquid bag 22 is adapted to the inner surface of the housing assembly 10, so as to increase the contact area between the liquid bag 22 and the housing assembly 10, and further, the heat dissipated from the liquid bag 22 can be uniformly conducted to the housing assembly 10, thereby improving the temperature uniformity and the heat conduction efficiency of the housing assembly 10. For example, the outer surface of the liquid bag 22 and the inner surface of the bottom case 11 may be contoured, so that the outer surface of the liquid bag 22 can be in sufficient contact with the outer surface of the bottom case 11, so as to improve the heat dissipation efficiency of the electronic device 100, thereby avoiding the defect that the electronic device 100 has poor waterproof effect due to the heat dissipation of the opening on the electronic device 100.

The liquid cavity 220 is substantially bent into a U shape and can be distributed on two opposite sides of the heat sink 21 and the heat source 30, and the first liquid inlet 221 and the first liquid outlet 222 can be distributed on two opposite sides of the heat sink 21 and the heat source 30, that is, the first liquid inlet 221 and the first liquid outlet 222 are distributed on two opposite ends of the liquid cavity 220. Liquid flows into the liquid cavity 220 from one side of the heat radiator 21 and the heat source 30 and flows out of the liquid cavity 220 from the other side of the heat radiator 21 and the heat source 30, so that the flowing distance and the coverage area of the liquid in the liquid cavity 220 can be increased, and the heat dissipation effect of the liquid bag 22 is improved.

Of course, in other embodiments, the liquid cavity 220 may also be distributed on a side of the heat sink 21 away from the heat source 30, and correspondingly, the first liquid inlet 221 and the first liquid outlet 222 may be correspondingly distributed on a side of the heat sink 21 away from the heat source 30, which will not be described in detail.

In an embodiment, the liquid chamber 220 in the liquid bag 22 may be divided into a plurality of sub-chambers, and each sub-chamber is respectively communicated with the first liquid inlet 221 and the first liquid outlet 222, so that the coverage area of the liquid in the liquid chamber 220 can be flexibly set according to the specific shape and the heat dissipation requirement of the liquid bag 22 or the electronic device 100. Of course, in order to further increase the flexibility of the liquid coverage area in the liquid chamber 220, some sub-chambers of the plurality of sub-chambers may be respectively communicated with the first liquid inlet 221 and the first liquid outlet 222, and the other sub-chambers may be respectively connected in series with the above-mentioned sub-chambers. It is understood that the meaning of "a plurality" is at least two, e.g., two, three, etc., unless specifically limited otherwise.

For example, the liquid chamber 220 may be divided into a first sub-chamber 2201, a second sub-chamber 2202 and a third sub-chamber 2203 which are sequentially arranged at intervals, and the first sub-chamber 2201, the second sub-chamber 2202 and the third sub-chamber 2203 are substantially U-shaped and distributed on two opposite sides of the heat sink 21 and the heat source 30. The first liquid inlet 221 is distributed at one side of the heat sink 21 and the heat source 30, and the first liquid outlet 222 is distributed at the other side of the heat sink 21 and the heat source 30. The first sub-chamber 2201, the second sub-chamber 2202 and the third sub-chamber 2203 are respectively communicated with the first liquid inlet 221 and the first liquid outlet 222.

It should be noted that the terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.

First sub-chamber 2201, second sub-chamber 2202 and third sub-chamber 2203 may be in communication with first liquid outlet 222 via liquid outlet 223, and first sub-chamber 2201, second sub-chamber 2202 and third sub-chamber 2203 may be in communication with first liquid inlet 221 via liquid inlet 224.

The liquid outlet pipe 223 may include a main liquid outlet pipe 2231 communicated with the first liquid outlet 222, and a plurality of liquid outlet branch pipes 2232 respectively communicated with each sub-chamber, and each liquid outlet branch pipe 2232 is respectively communicated with the main liquid outlet pipe 2231. Specifically, the liquid outlet branch pipe 2232 may include a first liquid outlet branch pipe 2232a communicating with the first sub-chamber 2201, a second liquid outlet branch pipe 2232b communicating with the second sub-chamber 2202, and a third liquid outlet branch pipe 2232c communicating with the third sub-chamber 2203. The first liquid outlet branch pipe 2232a is respectively communicated with the first sub-cavity 2201 and the liquid outlet main pipe 2231, the second liquid outlet branch pipe 2232b is respectively communicated with the second sub-cavity 2202 and the liquid outlet main pipe 2231, and the third liquid outlet branch pipe 2232c is respectively communicated with the third sub-cavity 2203 and the liquid outlet main pipe 2231. In one embodiment, the first liquid outlet branch pipe 2232a, the second liquid outlet branch pipe 2232b and the third liquid outlet branch pipe 2232c may be directly communicated with the liquid outlet main pipe 2231. In one embodiment, the first liquid outlet branch pipe 2232a, the second liquid outlet branch pipe 2232b and the third liquid outlet branch pipe 2232c may be indirectly communicated with the liquid outlet main pipe 2231.

In an embodiment, the liquid outlet pipe 223 may further include a liquid outlet connecting pipe 2233, and the liquid outlet connecting pipe 2233 is respectively communicated with the plurality of liquid outlet branch pipes 2232 and the liquid outlet main pipe 2231, so that the liquid in the plurality of liquid outlet branch pipes 2232 can be converged to the liquid outlet main pipe 2231 through the liquid outlet connecting pipe 2233. The first liquid outlet branch pipe 2232a, the second liquid outlet branch pipe 2232b and the third liquid outlet branch pipe 2232c are respectively connected in parallel to the liquid outlet connecting pipe 2233.

The liquid inlet pipe 224 may include a main liquid inlet pipe 2241 communicated with the first liquid inlet 221, and a plurality of branch liquid inlet pipes 2242 communicated with each sub-chamber, where each branch liquid inlet pipe 2242 is communicated with the main liquid inlet pipe 2241. Specifically, liquid inlet branch pipe 2242 may include first liquid inlet branch pipe 2242a communicating with first sub-chamber 2201, second liquid inlet branch pipe 2242b communicating with second sub-chamber 2202, and third liquid inlet branch pipe 2242c communicating with third sub-chamber 2203. First liquid inlet branch pipe 2242a communicates first subchamber 2201 and liquid inlet main pipe 2241 respectively, and second liquid inlet branch pipe 2242b communicates second subchamber 2202 and liquid inlet main pipe 2241 respectively, and third liquid inlet branch pipe 2242c communicates third subchamber 2203 and liquid inlet main pipe 2241 respectively. In one embodiment, first inlet leg 2242a, second inlet leg 2242b and third inlet leg 2242c may be in direct communication with inlet main 2241. In one embodiment, first inlet leg 2242a, second inlet leg 2242b and third inlet leg 2242c may be in indirect communication with inlet main 2241.

In an embodiment, the liquid inlet pipe 224 may further include a liquid inlet connecting pipe 2243, and the liquid inlet connecting pipe 2243 is connected to the plurality of liquid inlet branch pipes 2242 and the liquid inlet main pipe 2241, respectively, so that the liquid in the liquid inlet main pipe 2241 may flow to the plurality of liquid inlet branch pipes 2242 through the liquid inlet connecting pipe 2243, respectively. Wherein, first liquid inlet branch pipe 2242a, second liquid inlet branch pipe 2242b and third liquid inlet branch pipe 2242c are connected in parallel to the liquid inlet connection pipe 2243, respectively. Through setting up above-mentioned cascaded feed liquor pipe 224, form the parallelly connected sub-chamber distribution network in at least part sub-chamber, and then can adjust the liquid flow of each sub-chamber through setting up the length and the pipe diameter of adjusting feed liquor main pipe 2241, feed liquor branch pipe 2242 and feed liquor connecting pipe 2243 to realize that the heat that heat source 30 produced evenly transmits to each region of liquid bag 22 as required, and then conduct to housing assembly 10 fast effectively and give off to the external world.

This application embodiment forms at least part of the parallelly connected son chamber distribution network of son chamber through setting up above-mentioned cascaded drain pipe 223 and feed liquor pipe 224, and then can adjust the liquid flow of each son chamber through the length and the pipe diameter that each part of drain pipe 223 and feed liquor pipe 224 were adjusted in the setting to the heat that realizes heat source 30 production transmits to each region of liquid bag 22 as required uniformly, and then conducts to housing assembly 10 and gives off to the external world fast effectively.

The liquid bag 22 may be formed directly on the liquid bag 22 by blow molding or the like to form the liquid inlet pipe 224 and the liquid outlet pipe 223. Of course, in some embodiments, the liquid inlet pipe 224 and the liquid outlet pipe 223 may be embedded in the liquid bag 22 by embedding pipes.

In an embodiment, the liquid bag 22 may be made of a flexible material such as TPU, PVC, etc., so as to utilize the characteristics of the flexible material such as changeability and high elasticity, that is, the flexible material can better adapt to the assembly of complex shapes, so that the inner and outer surfaces of the liquid bag 22 can be distributed in interference contact with the heat sink 21 and the housing assembly 10, the gap between the heat sink 21 and the housing assembly 10 can be better filled, the influence of air thermal resistance is reduced, a part of heat can be conducted to the housing assembly 10 without flowing through a liquid circulation, the conduction and heat dissipation efficiency is further improved, the heat dissipation requirement can be met without starting the driving member 23 in a scene with low power consumption or low temperature, the use frequency of the driving member 23 is reduced, and the service life is prolonged. In addition, bag 22, which is made of flexible material, can better accommodate complex structures of chamber 220, inlet tube 224 and outlet tube 223.

Referring to fig. 9 and 10, fig. 9 discloses a schematic structural diagram of a heat dissipation assembly 50 in other embodiments of the present application, and fig. 10 discloses a schematic structural diagram of the heat dissipation assembly 50 in the embodiment of fig. 9, which is disassembled. The heat dissipation assembly 50 in the present embodiment is different from the heat dissipation assembly 20 in the previous embodiment in that: heat sink assembly 50 may include a heat sink 51, a fluid bag 52, and a bracket 53. It should be understood that, as for the technical features of the heat spreader 51 and the liquid bag 52, reference may be made to the heat spreader and the liquid bag in the foregoing embodiments, and therefore, detailed description is not repeated in this embodiment.

The bracket 53 is accommodated in the accommodating space 201 of the liquid bag 52 and is arranged between the liquid bag 52 and the radiator 51, so that unnecessary damage caused by squeezing the liquid bag 52 in the process of assembling the heat dissipation assembly 50 is avoided, namely, the bracket 53 can play a role in protection in the assembling process. The bracket 53 can be wrapped around at least a portion of the heat sink 51 and the heat source 30, the heat source 30 can be fixedly connected to the bracket 53 through a connecting method such as screwing, inserting, buckling, bonding, and welding, and the heat sink 51 can be fixedly connected to the bracket 53 through a connecting method such as screwing, inserting, buckling, bonding, and welding. In an embodiment, the heat sink 51 is disposed between the heat source 30 and the support 53, and the support 53 is provided with a window 530, so that a surface of the heat sink 51 exposed to the window 530 can contact with the liquid bag 52, and an influence of air thermal resistance is reduced, so that a part of heat can be directly conducted to the liquid bag 52, and further, the heat conduction and dissipation efficiency is improved.

In one embodiment, the surface of the heat sink 51 exposed by the window 530 does not protrude from the surface of the support 53 in contact with the fluid bag 52. Preferably, the surface of the heat sink 51 exposed to the window 530 and the surface of the bracket 53 in contact with the fluid bag 52 are disposed coplanar.

In one embodiment, the surface of the support 53 facing away from the heat source 30 is matched with the surface of the liquid bag 22 close to the heat source 30, so as to increase the contact area between the liquid bag 22 and the support 53, thereby improving the stability of the overall structure of the heat dissipation assembly 50. For example, the surface of the frame 53 facing away from the heat source 30 and the surface of the fluid bag 22 adjacent to the heat source 30 can be contoured to allow the fluid bag 22 to contact the frame 53 sufficiently to avoid misalignment during assembly of the heat sink assembly 50.

In one embodiment, the bracket 53 may have a groove-shaped structure, the heat sink 51 and the heat source 30 are accommodated in the groove space of the bracket 50, and the liquid bag 52 is wrapped outside the groove of the bracket 53, so as to protect the heat sink 51 and the heat source 30 through the bracket 53.

Referring to fig. 11 to 13, fig. 11 discloses a schematic structural diagram of a heat dissipation assembly 60 in another embodiment of the present application, fig. 12 discloses a schematic structural diagram of the heat dissipation assembly 60 in the embodiment of fig. 11, and fig. 13 discloses a schematic structural diagram of a cross section of the heat dissipation assembly 60 in the embodiment of fig. 11 along the direction C-C. The heat dissipation assembly 60 may include a heat sink 61, a fluid bag 62, and a support 63, wherein the heat sink 61 may include a first heat sink 611 and a second heat sink 612, and the support 63 may include a first support 631 and a second support 632.

In the present embodiment, the heat source is exemplified by the circuit board 70, and the circuit board 70 can be fixedly connected to the bracket 63 by means of screwing, plugging, snapping, bonding, welding, and the like. The circuit board 70 may include a first surface 71 and a second surface 72 that are oppositely disposed. The circuit board 70 may be provided with a signal receiving and transmitting chip and/or a signal receiving and transmitting antenna. The circuit board 70 can be fixedly connected to the bracket 63 by means of screwing, inserting, snapping, bonding, welding, and the like.

The first heat sink 611 may be disposed in direct or indirect contact with the first surface 71, and the second heat sink 612 may be disposed in direct or indirect contact with the second surface 72. Namely, the first heat sink 611 is provided on the first surface 71, and the second heat sink 612 is provided on the second surface 72. The first heat sink 611 and the second heat sink 612 may have the same or different structures, and are not described in detail.

The first bracket 631 is disposed on a side of the first heat sink 611 facing away from the first surface 71, and the second bracket 632 is disposed on a side of the second heat sink 612 facing away from the second surface 72. The first bracket 631 and the second bracket 632 enclose a receiving space 630, and the first heat sink 611, the second heat sink 612 and the circuit board 70 are received in the receiving space 630.

The first bracket 631 and the second bracket 632 can be connected and fixed by connecting means such as screw joint, insertion, snap, adhesion, welding and the like after being separately molded. Of course, in other embodiments, the first bracket 631 and the second bracket 632 may be directly integrally formed.

The first bracket 631 may cover a side of the first heat sink 611 facing away from the first surface 71. The first heat sink 611 may be fixed to the first bracket 631 by screwing, inserting, fastening, bonding, welding, or the like. The second bracket 632 may cover a side of the second heat sink 612 away from the second surface 72, and the second heat sink 612 may be fixed to the second bracket 632 by means of screw connection, insertion connection, fastening, adhesion, welding, and the like.

The circuit board 70 may be disposed between the first heat sink 611 and the second heat sink 612, and may be fixed to the first bracket 631 and/or the second bracket 632 by screwing, plugging, snapping, adhering, welding, or the like.

The first support 631 is provided with a first window 6311, and at least a part of the surface of the first heat sink 611 facing away from the first surface 71 is exposed to the first window 6311, so that at least a part of the surface of the first heat sink 611 facing away from the first surface 71 can contact the liquid bag 62. The second bracket 632 defines a second window 6321, and at least a portion of a surface of the second heat sink 612 facing away from the second surface 72 is exposed to the second window 6321, so that at least a portion of a surface of the second heat sink 612 facing away from the second surface 72 can contact the liquid bag 62. In the embodiment, the first window 6311 is formed in the first support 631, and the second window 6321 is formed in the second support 632, so that the first heat sink 611 and the second heat sink 612 are exposed, the first heat sink 611 and the second heat sink 612 can contact the liquid bag 52, the influence of air thermal resistance is reduced, a part of heat can be directly conducted to the liquid bag 52, and the heat conduction and dissipation efficiency is further improved. It is understood that the structures of the first bracket 631 and the second bracket 632 may be the same or different, and are not described in detail.

In an embodiment, a surface of the first heat sink 611 exposed to the first window 6311 and an opening plane of the first window 6311 are disposed substantially coplanar. The surface of the second heat sink 612 exposed to the second window 6321 and the opening plane of the second window 6321 are disposed substantially coplanar.

In one embodiment, the liquid bag 62 encloses a receiving space 601, and the heat sink 61, the bracket 63 and the circuit board 70 are received in the receiving space 601. Wherein, the inner surface of the liquid bag 62 and the outer surface of the support 63 are matched, so that the liquid bag 62 and the support 63 can be in full contact, and further the overall structural stability and the heat dissipation efficiency of the heat dissipation assembly 60 are improved. Preferably, the fluid bag 62 and the bracket 63 may form a stable integral structure by means of interference fit, so as to facilitate assembling the heat sink assembly 60 with the housing assembly 10.

The liquid bag 62 may have a first liquid inlet 621 and a first liquid outlet 622, and the heat sink 61 may have a second liquid inlet 6111 and a second liquid outlet 6121. Preferably, the first heat sink 611 may be provided with a second liquid inlet 6111, and the second heat sink 612 may be provided with a second liquid outlet 6121.

Further, the first heat sink 611 may further include a first liquid passage 6112 communicating with the second liquid inlet 6111, and the second heat sink 612 may further include a second liquid passage 6122 communicating with the second liquid outlet 6121. Wherein, one end of the first liquid passage 6112 is communicated with the second liquid inlet 6111, and the other end can be communicated with the second liquid passage 6122 through a pipeline (such as a rubber pipe). One end of the second liquid passage 6122 is communicated with the second liquid outlet 6121, and the other end can be communicated with the first liquid passage 6112 through a pipeline (such as a rubber tube). I.e. through the first liquid passage 6112 and the second liquid passage 6122 connected in series, so that the liquid can flow into the first heat sink 611 via the second liquid inlet 6111, then flow into the second heat sink 612 via the first liquid passage 6112 and the second liquid passage 6122, and finally flow out of the second heat sink 612 from the second liquid outlet 6121. It is understood that other technical features of the first fluid passage 6112 and the second fluid passage 6122 can refer to the fluid passage 213 in the foregoing embodiments, and thus, the detailed description is omitted.

It should be understood that, reference may be made to the liquid bag in the foregoing embodiment for technical features not described in detail about the liquid bag 62, reference may be made to the heat sink in the foregoing embodiment for technical features not described in detail about the first heat sink 611 and the second heat sink 612, reference may be made to the support in the foregoing embodiment for technical features not described in detail about the first support 631 and the second support 632, and reference may be made to the heat dissipation assembly in the foregoing embodiment for technical features not described in detail about the heat dissipation assembly 60, so that no further description is provided in this embodiment.

Referring to fig. 14, fig. 14 is a schematic cross-sectional view of a heat dissipation assembly 80 according to another embodiment of the present disclosure, in which the heat dissipation assembly 80 may include a heat sink 81, a fluid bag 82, and a bracket 83, the heat sink 81 may include a first heat sink 811 and a second heat sink 812, and the bracket 83 may include a first bracket 831 and a second bracket 832.

In the present embodiment, the heat source is illustrated by taking the circuit board 70 as an example, and the circuit board 70 may include a first surface 71 and a second surface 72 that are disposed opposite to each other. The circuit board 70 may be provided with a signal receiving and transmitting chip and/or a signal receiving and transmitting antenna. In one embodiment, the second surface 72 of the circuit board 70 is exemplified by a chip 73, and the chip 73 can be used for signal connection.

The second heat sink 812 has a first escape port 8121 corresponding to the chip 73, and the liquid bag 82 has a second escape port 8201 corresponding to the chip 73. The first avoidance port 8121 and the second avoidance port 8201 are both arranged on the same side of the chip 73, namely, on the side of the chip 73 away from the second surface 72. The orthographic projection of the first avoidance port 8121 on the circuit board 70 covers the orthographic projection of at least part of the chip 73 on the circuit board 70, and the orthographic projection of the second avoidance port 8201 on the circuit board 70 covers the orthographic projection of at least part of the chip 73 on the circuit board 70. Preferably, the first avoidance port 8121, the second avoidance port 8201 and the chip 73 are arranged oppositely, and the first avoidance port 8121 and the second avoidance port 8201 are matched to form a channel for receiving and sending signals by the chip 73.

Of course, in other embodiments, the signal transceiver chip may be disposed on the first surface 71 and/or the second surface 72 of the circuit board 70, and the first avoidance port 8121 and the second avoidance port 8201 are correspondingly adjusted adaptively, which is not described in this embodiment.

In one embodiment, the first surface 71 and/or the second surface 72 of the circuit board 70 are provided with a signaling antenna, an orthogonal projection of the first heat sink 811 projected on the first surface 71 is spaced from the signaling antenna provided on the first surface 71, and an orthogonal projection of the second heat sink 812 projected on the second surface 72 is spaced from the signaling antenna provided on the second surface 72.

In one embodiment, the first heat sink 811 is spaced apart from the first surface 71 to provide a space for components disposed on the first surface 71, and the second heat sink 812 is spaced apart from the second surface 72 to provide a space for components disposed on the second surface 72.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present embodiment, reference may be made to the heat dissipation assembly in the foregoing embodiments for technical features of the heat dissipation assembly 80 that are not described in detail, so that no further description is provided in this embodiment. This embodiment is through setting up first dodge mouthful 8121 and second dodge mouthful 8201 in order to form the chip 73 and receive the passageway of sending out the signal, and then can avoid producing the interference to chip 73 received signal, promotes received signal's stability.

Referring to fig. 15, fig. 15 is a schematic cross-sectional view of an electronic device 200 according to another embodiment of the present application, where the electronic device 200 includes the housing assembly 10, the heat dissipation assembly 90, and a heat source in the foregoing embodiments, and the heat source is taken as the circuit board 70 for illustration.

The housing assembly 10 may have a receiving cavity 101, and the heat sink assembly 90 and the circuit board 70 are received in the receiving cavity 101. The heat dissipation assembly 90 may include a heat sink 91, a fluid bag 92, and a bracket 93, the heat sink 91 may include a first heat sink 911 and a second heat sink 912, and the bracket 93 may include a first bracket 931 and a second bracket 932. The liquid bag 92 is surrounded to form an accommodating space 920, and the heat sink 91, the bracket 93 and the circuit board 70 are accommodated in the accommodating space 920. The first and

second brackets

931 and 932 enclose a receiving space 930, and the heat sink 91 and the circuit board 70 are received in the receiving space 930. It is to be understood that, in the present embodiment, reference may be made to the electronic device 100 in the foregoing embodiment for technical features that are not described in detail with respect to the electronic device 200, and thus, detailed description is not repeated.

A gap a is formed between the bracket 93 and the inner side wall of the housing assembly 10, and the liquid bag 92 is filled in the gap a, so that the liquid bag 92 can contact the inner side wall of the housing assembly 10. Preferably, the liquid bag 92 is disposed in an interference fit with the housing assembly 10 to increase a contact area between the liquid bag 92 and the housing assembly 10 as much as possible, so as to improve the temperature uniformity of the housing assembly 10.

In the electronic device provided by this embodiment, the heat sink, the bracket, and the circuit board (heat source) are accommodated in the accommodating space of the liquid bag to form the heat dissipation assembly having a stable structure, and the heat dissipation assembly is assembled to the housing assembly. This embodiment is through utilizing the outer surface shape of liquid bag and the internal surface looks adaptation of casing subassembly and the outer surface looks adaptation of liquid bag internal surface and support for the heat that circuit board (heat source) sent is through liquid circulation flow back, and furthest conducts to the casing subassembly on, and the rethread casing subassembly takes away the heat with external environment's radiation and convection current, can avoid the lower defect of no trompil electronic equipment radiating efficiency betterly.

In addition, the radiator can flexibly set the number and the positions of the liquid channels according to the positions of heat sources and heat dissipation requirements. The liquid cavity, the liquid inlet pipe and the liquid outlet pipe of the liquid bag can be flexibly arranged according to the product form and the heat dissipation requirement of the electronic equipment. Wherein, through dividing into a plurality of subchambers with the sap cavity in order to form a plurality of water route coverage areas, can avoid furthest to improve liquid coverage area, promote the radiating effect. Through setting feed liquor pipe and drain pipe to cascaded shunt tubes, make a plurality of son connect in parallel/establish ties and get up, and then can be through the length and the pipe diameter that set up each feed liquor pipe and each drain pipe, can control the liquid flow in each son to realize that the heat that the inside heat source of electronic equipment produced can transmit each position of casing subassembly as required uniformly.

In addition, through adopting the liquid bag that flexible material made, can make the interior external surface of liquid bag respectively with casing subassembly, radiator/support interference contact, can better fill the clearance between radiator/support and the casing subassembly internal surface, reduce the influence of air thermal resistance for some heat need not to be passed through liquid circulation and just can be conducted on the casing subassembly perpendicularly, further promote the conduction radiating efficiency. The heat dissipation requirement can be met without starting the driving part under the scene of low power consumption or low temperature, the use frequency of the driving part is reduced, and the service life is prolonged.

It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A heat dissipation assembly, comprising:

a heat sink disposed adjacent to or in contact with a heat source;

the liquid bag encloses an accommodating space, and the radiator and the heat source are accommodated in the accommodating space;

wherein the liquid bag is filled with liquid configured to be capable of circulating in the liquid bag and the radiator to dissipate heat by the circulating flow of the liquid.

2. The heat dissipation assembly of claim 1, wherein the fluid bag is provided with a first fluid inlet and a first fluid outlet, and the heat sink is provided with a second fluid inlet, a second fluid outlet, and a fluid channel; the first liquid outlet is communicated with the second liquid inlet, and the first liquid inlet is communicated with the second liquid outlet; wherein the liquid channel is communicated with the second liquid inlet and the second liquid outlet.

3. The heat dissipation assembly of claim 2, wherein the heat sink comprises a first heat sink and a second heat sink in communication, the first heat sink and the second heat sink being disposed on opposite sides of the heat source; the first radiator is provided with the second liquid inlet, and the second radiator is provided with the second liquid outlet.

4. The heat dissipating assembly of claim 3, wherein the first heat sink is provided with a first liquid passage communicating with the second liquid inlet, and the second heat sink is provided with a second liquid passage communicating with the second liquid outlet; wherein the first liquid passage and the second liquid passage are communicated.

5. The heat dissipation assembly of claim 2, wherein the liquid bag is provided with a liquid inlet pipe, a liquid outlet pipe and a liquid cavity for containing the liquid, the liquid inlet pipe is communicated with the first liquid inlet and the liquid cavity, and the liquid outlet pipe is communicated with the first liquid outlet and the liquid cavity; wherein the liquid cavity is wrapped on the periphery of the radiator and the heat source.

6. The heat removal assembly of claim 5, wherein the liquid chamber is divided into a plurality of sub-chambers, the liquid outlet pipe comprises a plurality of liquid outlet branch pipes, and the liquid inlet pipe comprises a plurality of liquid inlet branch pipes; each sub-cavity is through corresponding go out liquid branch pipe with first liquid outlet intercommunication, each sub-cavity is through corresponding feed liquor branch pipe with first inlet intercommunication.

7. The heat dissipating assembly of claim 6, wherein the outlet pipe further comprises a main outlet pipe in communication with the first outlet, each of the branch outlet pipes being in communication with the main outlet pipe; the liquid inlet pipe further comprises a liquid inlet main pipe communicated with the first liquid inlet, and each liquid inlet branch pipe is communicated with the liquid inlet main pipe respectively.

8. The heat dissipating assembly of any of claims 2-7, further comprising an actuator disposed on the heat sink; the driving piece is provided with a third liquid inlet and a third liquid outlet, the third liquid inlet is communicated with the first liquid outlet, and the third liquid outlet is communicated with the second liquid inlet.

9. The heat dissipating assembly of any of claims 2-7, further comprising a bracket, wherein the bracket is received in the receiving space and disposed between the fluid bag and the heat sink; wherein, the support is provided with a window, and at least part of the surface of the radiator, which is far away from the heat source, is exposed to the window.

10. The heat sink assembly of claim 9, wherein a surface of the heat sink exposed by the window is at least partially in contact with the fluid pocket.

11. The heat dissipation assembly of claim 9, wherein the bracket comprises a first bracket and a second bracket, the first bracket and the second bracket enclose a receiving space, the heat sink and the heat source are received in the receiving space, and at least a portion of a surface of the bracket facing away from the receiving space is in contact with the liquid bag.

12. A heat dissipation assembly, comprising:

a heat sink disposed adjacent to or in contact with a heat source;

the bracket encloses an accommodating space, and the radiator and the heat source are accommodated in the accommodating space;

the liquid bag encloses an accommodating space, and the bracket is accommodated in the accommodating space;

13. A heat dissipation assembly, comprising:

a heat sink disposed adjacent to or in contact with a heat source;

wherein the liquid bag is filled with liquid configured to be capable of circulating in the liquid bag and the radiator to dissipate heat by the circulation flow of the liquid; the surface of the radiator, which faces away from the heat source, is at least partially in contact with the liquid bag.

14. An electronic device, characterized in that the electronic device comprises:

the shell assembly is provided with an accommodating cavity;

the heat source is accommodated in the accommodating cavity; and

the heat dissipation assembly is accommodated in the accommodating cavity; the heat dissipation assembly includes:

the liquid bag is enclosed into an accommodating space; and

a heat sink disposed adjacent to or in contact with the heat source;

the heat radiator and the heat source are contained in the containing space, liquid is filled in the liquid bag, and the liquid can circularly flow in the liquid bag and the heat radiator so as to dissipate heat through the circular flow of the liquid.

15. The electronic device of claim 14, wherein a surface of the heat sink facing away from the heat source is at least partially in contact with the fluid bag, and an outer surface of the fluid bag is at least partially in contact with the housing assembly.

16. The electronic device of claim 14, wherein the heat source is a circuit board on which a chip is disposed; the radiator is provided with a first avoidance port corresponding to the chip, the liquid bag is provided with a second avoidance port corresponding to the chip, and the first avoidance port and the second avoidance port are matched to form a channel for receiving and sending signals by the chip.

17. An electronic device, characterized in that the electronic device comprises:

the shell assembly is provided with an accommodating cavity;

the heat source is accommodated in the accommodating cavity; and

the liquid bag is enclosed into an accommodating space;

the bracket is accommodated in the accommodating space, and the bracket encloses an accommodating space; and

a heat sink disposed adjacent to or in contact with the heat source;

the heat radiator and the heat source are accommodated in the accommodating space, liquid is filled in the liquid bag, and the liquid can circularly flow in the liquid bag and the heat radiator so as to dissipate heat through the circular flow of the liquid; the surface of the radiator, which faces away from the heat source, is at least partially in contact with the liquid bag.

18. The electronic device of claim 17, wherein a gap is formed between the bracket and the housing assembly, and the fluid bag fills the gap.