CN215418096U

CN215418096U - Target disc of sealing ion implanter

Info

Publication number: CN215418096U
Application number: CN202121465473.0U
Authority: CN
Inventors: 宋戈
Original assignee: Shanghai Yuchen Electronic Technology Co ltd
Current assignee: Shanghai Yuchen Electronic Technology Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-01-04
Anticipated expiration: 2031-06-29

Abstract

The utility model relates to the technical field of target discs of ion implanters and discloses a sealing target disc of an ion implanter, which comprises a target disc rotating mechanism and a wafer claw, wherein the wafer claw comprises a support, a wafer clamping piece, a vertical sliding mechanism and a first power device. Set up like this, can move perpendicular slide mechanism and drive the wafer holder and reciprocate, after reaching certain height, drive the rotatory reverse side of wafer holder through first power device, process the another side, overall structure is simple, and the upset is convenient, has the practicality.

Description

Target disc of sealing ion implanter

Technical Field

The utility model relates to the technical field of target discs of ion implanters, in particular to a target disc of a sealing ion implanter.

Background

Ion implantation is a common process in semiconductor manufacturing, and is one of the main means for preparing the active layer of a device, the final aim of the research of a target chamber of a high-temperature ion implanter is to realize the uniform implantation of a single wafer, each batch of wafers and batch-to-batch wafers, and the main technical difficulty lies in the realization of the high-temperature target chamber at 500-600 ℃ under vacuum and the uniformity control of the surface temperature of a lens. Therefore, a special sealed high-temperature target disk is adopted, and the target disk comprises a wafer claw, a supporting rod, a target disk rotating motor, a wafer claw driving motor, a water cooling structure and the like. However, this target disk cannot turn the clamped wafer over when in use, and cannot process the other surface of the wafer satisfactorily.

SUMMERY OF THE UTILITY MODEL

The utility model mainly provides a target disc of a sealing ion implanter, which solves the problems that a clamped wafer cannot be overturned when the target disc is used and the other surface of the wafer cannot be processed well in the prior art.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a leakproofness ion implantation machine target disc, includes target disc rotary mechanism and wafer claw, the wafer claw includes support and wafer holder, still including set up in perpendicular slide mechanism on the support, the wafer holder rotate connect in on the perpendicular slide mechanism, and pass through perpendicular slide mechanism's drive and reciprocate, still including being used for driving wafer holder pivoted first power device. Set up like this, can move perpendicular slide mechanism and drive the wafer holder and reciprocate, after reaching certain height, drive the rotatory reverse side of wafer holder through first power device, process the another side, overall structure is simple, and the upset is convenient, has the practicality.

Furthermore, the vertical sliding mechanism comprises a vertical sliding rail arranged on the support, a sliding block arranged on the vertical sliding rail and a second power device used for driving the sliding block to move. The vertical sliding mechanism is simple in structure and low in cost.

Further, the second power device adopts an air cylinder and is arranged above the sliding block, and the output end of the second power device is provided with a vacuum suction nozzle and sucks the sliding block through the vacuum suction nozzle. According to the arrangement, when the sliding block reaches the lower position of the second power device after being rotated by the target disc rotating mechanism, the second power device moves downwards and drives the sliding block to move upwards by being sucked by the vacuum suction nozzle or the vacuum suction nozzle, the whole structure is simple, and the operation is stable; and a second power device can move a plurality of annular arrays of sliders on the target disk rotating mechanism.

Further, the vertical slide rail is arranged at the outer end of the support, and the first power device is arranged at the outer side of the sliding block. By the arrangement, damage to corresponding parts caused by direct bombardment of ion implantation arranged in the middle can be avoided.

Further, still including set up in the blotter of perpendicular slide rail bottom. The arrangement is that when the slide block is driven by the first power device to move downwards, the end point shock absorption effect is achieved, and meanwhile, the wafer is prevented from falling off.

Has the advantages that: set up like this, can move perpendicular slide mechanism and drive the wafer holder and reciprocate, after reaching certain height, drive the rotatory reverse side of wafer holder through first power device, process the another side, overall structure is simple, and the upset is convenient, has the practicality.

Drawings

FIG. 1 is a schematic view of a target disk structure according to the present embodiment;

reference numerals: the wafer clamping device comprises a support 1, a wafer clamping piece 2, a first power device 3, a vertical sliding rail 4, a sliding block 5, a second power device 6, a vacuum suction nozzle 7 and a cushion pad 8.

Detailed Description

The technical solution of the present invention for a sealed ion implanter target disk will be further described in detail with reference to the following embodiments.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, the target disk of the hermetic ion implanter of the embodiment includes a target disk rotating mechanism and a wafer claw, wherein the wafer claw includes a support 1 and a wafer holder 2, and further includes a vertical sliding mechanism disposed on the support 1, the wafer holder 2 is rotatably connected to the vertical sliding mechanism and is driven by the vertical sliding mechanism to move up and down, and further includes a first power device 3 for driving the wafer holder 2 to rotate. The vertical sliding mechanism comprises a vertical sliding rail 4 arranged on the support 1, a sliding block 5 arranged on the vertical sliding rail 4 and a second power device 6 used for driving the sliding block 5 to move. The second power device 6 adopts an air cylinder and is arranged above the sliding block 5, and the output end of the second power device 6 is provided with a vacuum suction nozzle 7 and sucks the sliding block 5 through the vacuum suction nozzle 7. The vertical sliding rail 4 is arranged at the outer end of the bracket 1, and the first power device 3 is arranged at the outer side of the sliding block 5. And the device also comprises a buffer pad 8 arranged at the bottom of the vertical slide rail 4. Set up like this, can move perpendicular slide mechanism and drive wafer holder 2 and reciprocate, after reaching certain height, drive the rotatory reverse side of wafer holder 2 through first power device 3, process the another side, overall structure is simple, and the upset is convenient, has the practicality.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a leakproofness ion implantation machine target disc, includes target disc rotary mechanism and wafer claw, its characterized in that: the wafer claw comprises a support, a wafer clamping piece and a vertical sliding mechanism arranged on the support, wherein the wafer clamping piece is rotatably connected to the vertical sliding mechanism and moves up and down under the driving of the vertical sliding mechanism, and the wafer claw further comprises a first power device for driving the wafer clamping piece to rotate.

2. The hermetically sealed target disk of claim 1, wherein: the vertical sliding mechanism comprises a vertical sliding rail arranged on the support, a sliding block arranged on the vertical sliding rail and a second power device used for driving the sliding block to move.

3. A hermetic ion implanter target disk as defined in claim 2, wherein: the second power device adopts an air cylinder and is arranged above the sliding block, and the output end of the second power device is provided with a vacuum suction nozzle and sucks the sliding block through the vacuum suction nozzle.

4. A hermetic ion implanter target disk as defined in claim 2, wherein: the vertical sliding rail is arranged at the outer end of the support, and the first power device is arranged at the outer side of the sliding block.

5. A hermetic ion implanter target disk as defined in claim 2, wherein: the device also comprises a cushion pad arranged at the bottom of the vertical slide rail.