CN215412136U - Combined transmitter for heat supply unit - Google Patents

Combined transmitter for heat supply unit Download PDF

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Publication number
CN215412136U
CN215412136U CN202120618616.0U CN202120618616U CN215412136U CN 215412136 U CN215412136 U CN 215412136U CN 202120618616 U CN202120618616 U CN 202120618616U CN 215412136 U CN215412136 U CN 215412136U
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ports
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capacitor
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CN202120618616.0U
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杨润靖
王增业
张广志
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Shandong Yitni New Energy Technology Co ltd
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Shandong Yitni New Energy Technology Co ltd
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Abstract

The utility model relates to the field of industrial self-control environments, in particular to a combined transmitter for a heat supply unit. The pressure sensor part, the temperature sensor part, the address setting part and the 485 circuit part are respectively connected to the MCU part to form a combined transmitter. Including a power supply section. The utility model can measure the temperature and the pressure in the pipeline only by opening a mounting hole on the pipeline. Through 485 bus transmission data, can realize that a plurality of sensors cascade. The convenience of wiring is greatly improved in the use process, and the plurality of combined transmitters can be powered and data can be read only through 4 wires.

Description

Combined transmitter for heat supply unit
Technical Field
The utility model discloses the field of industrial self-control environments, and particularly relates to a combined transmitter for a heat supply unit.
Background
The pressure transmitter and the temperature transmitter on the market at present can provide various output signal selections, including 4-20 mA; DC is 0-5V; DC 1-5V, etc., and also can have 232 or 485 digital output. However, the temperature and pressure sensors are single bodies, when the temperature and pressure sensors are used on a heat supply unit, the temperature and pressure sensors are required to be measured at the same position of a pipeline, and in a traditional mode, two mounting holes are required to be formed in a measuring point position, and a temperature transmitter and a pressure transmitter are respectively mounted. For the heat exchange type unit, the temperature and the pressure of primary water supply, primary water return, secondary water supply and secondary water return need to be detected, and when the temperature and the pressure of a plurality of positions are measured, the number of required transmitters is large, and connecting wires are also large. Which is not conducive to detection and installation.
Disclosure of Invention
The utility model aims to solve the technical problems that the existing mode has more mounting holes, more transmitters and more connecting wires, and is not beneficial to detection and installation. The combined transmitter for the heat supply unit is provided, can realize cascade connection of a plurality of sensors, and greatly improves the convenience of wiring in the use process.
In order to realize the purpose, the following technical scheme is provided:
a combined transmitter for a heating unit comprises a pressure sensor part, a temperature sensor part, an MCU part, a 485 circuit part and an address setting part, wherein the pressure sensor part, the temperature sensor part, the address setting part and the 485 circuit part are respectively connected to the MCU part.
In operation, DC24V provides power to the circuit and sets the address of the pressure transmitter via a dial switch/jumper cap or the like. The single chip microcomputer collects pressure values and temperature values from the pressure sensor circuit and the temperature sensor circuit in real time. The host computer communicates with the combined transmitter through a 485 circuit, and pressure and temperature data are acquired through a Modbus protocol. 485 circuit principle: m1 is 485 module with signal and power isolation circuit, and the serial port pin of the single chip is directly connected with the serial port input pin of the module. The 485 output end is connected with a resistor, a TVS transient suppression diode, a common mode filter inductor and a ceramic anti-explosion tube. Wherein G1 is a ceramic detonator for lightning protection. The common mode inductor L5 filters out the electromagnetic interference signal of the signal line. The TVS diodes D1, D2, and D3 discharge static electricity. R12, R17 are pull-up resistance, improve the interference killing feature of signal, R16 is impedance matching resistance, realize the maximum power utilization of signal.
Preferably: the pressure sensor part comprises a pressure sensor, an instrumentation amplifier U3, a resistor R13, a resistor R14 and a resistor R15, wherein the pressure sensor is respectively connected to + IN ports and-IN ports of the instrumentation amplifier U3, a resistor R13 is connected between + RG ports and-RG ports of the instrumentation amplifier U3 IN series, a + VS port is connected with a power supply at +3.3V and-VS ground, a 5 port of the instrumentation amplifier U3 is connected with GND and a 3.3V power supply through the resistor R15 and a resistor R14 respectively, and an OUTPUT port is connected with a 6 port of a singlechip U1.
Preferably: the temperature sensor part comprises a platinum thermal resistor P1, an ADC chip U2, an inductor L1, an inductor L2, an inductor L3, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5 and a resistor R1, wherein 5 ports and 6 ports of the ADC chip U2 are grounded through the capacitor C2 and are connected with 3 ports of the platinum thermal resistor P1 through the inductor L1, 1 port and 2 ports of the ADC chip U2 are connected and are connected with 3 ports in series through the resistor R1, and 3 ports and 4 ports of the ADC chip U2 are connected; the 7 ports of the ADC chip U2 are connected with the 2 ports of the platinum thermal resistor P1 through an inductor L2, and are grounded through a C3 and connected with the 8 ports and the 9 ports through a C4; the 9 port of the ADC chip U2 is connected with the 1 port of the platinum thermal resistor P1 through an inductor L3 and is grounded through a capacitor C5; the U11-14 port of the ADC chip is connected with the 13-10 port of the singlechip U1.
Preferably: the MCU part comprises a single chip microcomputer U1, a resistor R9, a resistor R11, an inductor L4, a capacitor C6 and a capacitor C7, 6 ports of the single chip microcomputer U1 are connected with the pressure sensor part, 10-13 ports are connected with the temperature sensor part, 19-20 ports are connected with the RS485 circuit, 4 ports are respectively grounded and +3.3V power supply through the capacitor C7 and the resistor R11, 14-30 ports are correspondingly connected with the address setting part, 31 ports are grounded through a resistor R9, 1 port is connected with 17 ports in series, 5 ports are connected with 1 port in series through the inductor L4, and are grounded through a capacitor C6 and 33 ports are grounded.
Preferably: the address setting part comprises dial switches K1-K8 and resistors R2-R10, wherein the dial switches K1-K8 are sequentially connected with the resistors R2-R10 in series, two ends of a formed series circuit are connected in parallel, one end of the series circuit is connected with a power supply +3.3V, and the other end of the series circuit is grounded.
Preferably: the 485 circuit part comprises a 485 module M1, a resistor R12, a resistor R16, a resistor R17, a resistor R18, a TVS diode D1, a TVS diode D2, a TVS diode D3, an inductor L5, a ceramic detonator G1, a capacitor C8 and a 485 output end P2; the 3-4 port of the 485 module M1 is connected with the 19-20 port of the single chip microcomputer, 8 port and 9 port are connected in series through a resistor R16, 9 port is connected in series with VO through R12, 8 port is grounded through a resistor R17, TVS diode D1, TVS diode D2 and TVS diode D3 are connected in series, TVS diode D2 is connected in parallel with resistor R16, TVS diode D1 and TVS diode D3 are grounded, inductor L5 is connected in parallel with ceramic detonator G1 and is connected in parallel with TVS diode D2 at the same time, ceramic detonator G1 is grounded through a parallel circuit of resistor R18 and capacitor C8, and two ends of ceramic detonator G1 are respectively connected with the 1 port and the 2 port of the 485 output end.
Preferably: the power supply further comprises a power supply part, wherein the power supply part comprises a power supply input P3, a rectifier bridge M2, a diode Z1, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12 and a voltage stabilizer U4, a port 1 and a port 2 of the rectifier bridge M2 are correspondingly connected with a port 1 and a port 2 of a power supply input P3, the port 3 and the port 4 are connected through the diode Z1, the port 3 is simultaneously connected with a +24V power supply, the capacitor C10 is connected with the capacitor C11 in parallel and grounded, the capacitor C9 is connected with the capacitor C12 in parallel and grounded, the whole parallel circuit of the capacitor C9 and the capacitor C12 is connected with the voltage stabilizer U4 in series, and the voltage stabilizer U4 is grounded.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model can measure the temperature and the pressure in the pipeline only by opening a mounting hole on the pipeline. Through 485 bus transmission data, can realize that a plurality of sensors cascade. The convenience of wiring is greatly improved in the use process, and the plurality of combined transmitters can be powered and data can be read only through 4 wires.
Drawings
FIG. 1 is a schematic view of the connection of the apparatus of the present invention;
FIG. 2 is a circuit connection diagram of the pressure sensor portion;
fig. 3 is a circuit connection diagram of a temperature sensor portion;
FIG. 4 is a circuit connection diagram of the MCU section;
fig. 5 is a circuit connection diagram of an address setting portion;
FIG. 6 is a circuit connection diagram of the 485 circuit portion;
fig. 7 is a circuit connection diagram of the power supply portion.
Detailed Description
Example (b):
a combined transmitter for a heat supply unit comprises a pressure sensor part, a temperature sensor part, an MCU part, a 485 circuit part and an address setting part, wherein the pressure sensor part, the temperature sensor part, the address setting part and the 485 circuit part are respectively connected to the MCU part to form the combined transmitter.
The pressure sensor part comprises a pressure sensor, an instrumentation amplifier U3, a resistor R13, a resistor R14 and a resistor R15, wherein two opposite ends of the pressure sensor are respectively connected to + IN and-IN ports of the instrumentation amplifier U3, one end of the other two ends of the pressure sensor is connected with a power supply +3.3V, the other end of the pressure sensor is grounded, a resistor R13 is connected between + RG and-RG ports of the instrumentation amplifier U3 IN series, + VS is connected with the power supply +3.3V and-VS is grounded, 5 ports of an AD623 are respectively connected with GND and a 3.3V power supply through the resistor R15 and the resistor R14, and an OUTPUT port is connected with 6 ports of a singlechip U1.
The temperature sensor part comprises a platinum thermal resistor P1, an RTD-to-digital output converter U2, an inductor L1, an inductor L2, an inductor L3, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5 and a resistor R1, wherein 5 ports and 6 ports of the RTD-to-digital output converter U2 are connected in series, meanwhile, the 5 port is grounded through a capacitor C2, the 3 port of the platinum thermal resistor P1 is connected through an inductor L1, the 1 port and the 2 port of the RTD-to-digital output converter U2 are connected in series, the 3 port and the 4 port are connected in series, the 1 port is connected in series with the 3 port through a resistor R1, the 7 port of the RTD-to-digital output converter U2 is connected with the 2 port of the platinum thermal resistor P2 through an inductor L2, the ground is connected with the 8 port and the 9 port through a C2, the 9 port of the RTD-to digital output converter U2 is connected with the 1 port of the platinum thermal resistor P2 through the inductor L2, the RTD-to-digital output converter U3620, the +3.3V power supply is connected in parallel, and is grounded through a capacitor C1, the ports 15 and 6 are grounded in series, and the ports 11-14 are connected with the ports 13-10 of the single chip microcomputer U1.
The MCU part comprises a single chip microcomputer U1, a resistor R9, a resistor R11, an inductor L4, a capacitor C6 and a capacitor C7, 6 ports of the single chip microcomputer U1 are connected with the pressure sensor part, 10-13 ports are connected with the temperature sensor part, 19-20 ports are connected with the RS485 circuit, 4 ports are respectively grounded and +3.3V power supply through the capacitor C7 and the resistor R11, 14-30 ports are correspondingly connected with the address setting part, 31 ports are grounded through a resistor R9, 1 port is connected with 17 ports in series, 5 ports are connected with 1 port in series through the inductor L4, and are grounded through a capacitor C6 and 33 ports are grounded.
The address setting part comprises dial switches K1-K8 and resistors R2-R10, wherein the dial switches K1-K8 are sequentially connected with the resistors R2-R10 in series, two ends of a formed series circuit are connected in parallel, one end of the series circuit is connected with a power supply +3.3V, and the other end of the series circuit is grounded.
The 485 circuit part comprises a 485 module M1, a resistor R12, a resistor R16, a resistor R17, a resistor R18, a TVS diode D1, a TVS diode D2, a TVS diode D3, an inductor L5, a ceramic detonator G1, a capacitor C8 and a 485 output end P2, wherein a port 3-4 of the 485 module M1 is connected with a port 19-20 of a single chip microcomputer, a port 1 and a port 2 are respectively connected with +3.3V and ground, a port 8 and a port 9 are connected in series through the resistor R16, a port 9 is connected in series with VO through R12, a port 8 is connected to ground through the resistor R17, the TVS diode D1, the TVS diode D2 and the TVS diode D3 are connected in series, and the TVS diode D2 is in the middle, parallel to the resistor R16, the TVS diode D1 and TVS diode D3 are grounded at both ends, the inductor L5 is parallel to the ceramic detonator G1, and simultaneously connected with a TVS diode D2 in parallel, a parallel circuit of a ceramic workshop detonator G1 and a capacitor C8 is grounded through a resistor R18, and two ends of the ceramic workshop detonator G1 are respectively connected with a port 1 and a port 2 of a 485 output end.
The power supply part comprises a power supply input P3, a rectifier bridge M2, a diode Z1, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12 and a voltage stabilizer U4, wherein a port 1 and a port 2 of the rectifier bridge M2 are correspondingly connected with a port 1 and a port 2 of the power supply input P3, the port 3 and the port 4 are connected through the diode Z1, the port 3 is simultaneously connected with a +24V power supply, the capacitor C10 is connected with the capacitor C11 in parallel and is grounded, the capacitor C9 is connected with the capacitor C12 in parallel and is grounded, the whole parallel circuit of the capacitor C9 and the capacitor C12 is connected with the voltage stabilizer U4 in series, and the voltage stabilizer U4 is grounded.
In operation, DC24V provides power to the circuit and sets the address of the pressure transmitter via a dial switch/jumper cap or the like. The single chip microcomputer collects pressure values and temperature values from the pressure sensor circuit and the temperature sensor circuit in real time. The host computer communicates with the combined transmitter through a 485 circuit, and pressure and temperature data are acquired through a Modbus protocol. 485 circuit principle: m1 is 485 module with signal and power isolation circuit, and the serial port pin of the single chip is directly connected with the serial port input pin of the module. The 485 output end is connected with a resistor, a TVS transient suppression diode, a common mode filter inductor and a ceramic anti-explosion tube. Wherein G1 is a ceramic detonator for lightning protection. The common mode inductor L5 filters out the electromagnetic interference signal of the signal line. The TVS diodes D1, D2, and D3 discharge static electricity. R12, R17 are pull-up resistance, improve the interference killing feature of signal, R16 is impedance matching resistance, realize the maximum power utilization of signal.
The utility model can measure the temperature and the pressure in the pipeline only by opening a mounting hole on the pipeline. Through 485 bus transmission data, can realize that a plurality of sensors cascade. The convenience of wiring is greatly improved in the use process, and the plurality of combined transmitters can be powered and data can be read only through 4 wires.

Claims (7)

1. The utility model provides a heat supply unit is with combination changer which characterized in that: the temperature control device comprises a pressure sensor part, a temperature sensor part, an MCU part, a 485 circuit part and an address setting part, wherein the pressure sensor part, the temperature sensor part, the address setting part and the 485 circuit part are respectively connected to the MCU part.
2. The combined transmitter for a heating unit according to claim 1, wherein: the pressure sensor part comprises a pressure sensor, an instrumentation amplifier U3, a resistor R13, a resistor R14 and a resistor R15, wherein the pressure sensor is respectively connected to + IN ports and-IN ports of the instrumentation amplifier U3, a resistor R13 is connected between + RG ports and-RG ports of the instrumentation amplifier U3 IN series, a + VS port is connected with a power supply at +3.3V and-VS ground, a 5 port of the instrumentation amplifier U3 is connected with GND and a 3.3V power supply through the resistor R15 and a resistor R14 respectively, and an OUTPUT port is connected with a 6 port of a singlechip U1.
3. The combined transmitter for a heating unit according to claim 1, wherein: the temperature sensor part comprises a platinum thermal resistor P1, an ADC chip U2, an inductor L1, an inductor L2, an inductor L3, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5 and a resistor R1, wherein 5 ports and 6 ports of the ADC chip U2 are grounded through the capacitor C2 and are connected with 3 ports of the platinum thermal resistor P1 through the inductor L1, 1 port and 2 ports of the ADC chip U2 are connected and are connected with 3 ports in series through the resistor R1, and 3 ports and 4 ports of the ADC chip U2 are connected; the 7 ports of the ADC chip U2 are connected with the 2 ports of the platinum thermal resistor P1 through an inductor L2, and are grounded through a C3 and connected with the 8 ports and the 9 ports through a C4; the 9 port of the ADC chip U2 is connected with the 1 port of the platinum thermal resistor P1 through an inductor L3 and is grounded through a capacitor C5; the U11-14 port of the ADC chip is connected with the 13-10 port of the singlechip U1.
4. The combined transmitter for a heating unit according to claim 1, wherein: the MCU part comprises a single chip microcomputer U1, a resistor R9, a resistor R11, an inductor L4, a capacitor C6 and a capacitor C7, 6 ports of the single chip microcomputer U1 are connected with the pressure sensor part, 10-13 ports are connected with the temperature sensor part, 19-20 ports are connected with the RS485 circuit, 4 ports are respectively grounded and +3.3V power supply through the capacitor C7 and the resistor R11, 14-30 ports are correspondingly connected with the address setting part, 31 ports are grounded through a resistor R9, 1 port is connected with 17 ports in series, 5 ports are connected with 1 port in series through the inductor L4, and are grounded through a capacitor C6 and 33 ports are grounded.
5. The combined transmitter for a heating unit according to claim 1, wherein: the address setting part comprises dial switches K1-K8 and resistors R2-R10, wherein the dial switches K1-K8 are sequentially connected with the resistors R2-R10 in series, two ends of a formed series circuit are connected in parallel, one end of the series circuit is connected with a power supply +3.3V, and the other end of the series circuit is grounded.
6. The combined transmitter for a heating unit according to claim 1, wherein: the 485 circuit part comprises a 485 module M1, a resistor R12, a resistor R16, a resistor R17, a resistor R18, a TVS diode D1, a TVS diode D2, a TVS diode D3, an inductor L5, a ceramic detonator G1, a capacitor C8 and a 485 output end P2; the 3-4 port of the 485 module M1 is connected with the 19-20 port of the single chip microcomputer, 8 port and 9 port are connected in series through a resistor R16, 9 port is connected in series with VO through R12, 8 port is grounded through a resistor R17, TVS diode D1, TVS diode D2 and TVS diode D3 are connected in series, TVS diode D2 is connected in parallel with resistor R16, TVS diode D1 and TVS diode D3 are grounded, inductor L5 is connected in parallel with ceramic detonator G1 and is connected in parallel with TVS diode D2 at the same time, ceramic detonator G1 is grounded through a parallel circuit of resistor R18 and capacitor C8, and two ends of ceramic detonator G1 are respectively connected with the 1 port and the 2 port of the 485 output end.
7. The combined transmitter for a heating unit according to claim 1, wherein: the power supply further comprises a power supply part, wherein the power supply part comprises a power supply input P3, a rectifier bridge M2, a diode Z1, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12 and a voltage stabilizer U4, a port 1 and a port 2 of the rectifier bridge M2 are correspondingly connected with a port 1 and a port 2 of a power supply input P3, the port 3 and the port 4 are connected through the diode Z1, the port 3 is simultaneously connected with a +24V power supply, the capacitor C10 is connected with the capacitor C11 in parallel and grounded, the capacitor C9 is connected with the capacitor C12 in parallel and grounded, the whole parallel circuit of the capacitor C9 and the capacitor C12 is connected with the voltage stabilizer U4 in series, and the voltage stabilizer U4 is grounded.
CN202120618616.0U 2021-03-26 2021-03-26 Combined transmitter for heat supply unit Active CN215412136U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120618616.0U CN215412136U (en) 2021-03-26 2021-03-26 Combined transmitter for heat supply unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120618616.0U CN215412136U (en) 2021-03-26 2021-03-26 Combined transmitter for heat supply unit

Publications (1)

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CN215412136U true CN215412136U (en) 2022-01-04

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CN202120618616.0U Active CN215412136U (en) 2021-03-26 2021-03-26 Combined transmitter for heat supply unit

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CN (1) CN215412136U (en)

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