CN207318979U - A kind of semiconductor equipment data acquisition device and system - Google Patents
A kind of semiconductor equipment data acquisition device and system Download PDFInfo
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- CN207318979U CN207318979U CN201721003057.2U CN201721003057U CN207318979U CN 207318979 U CN207318979 U CN 207318979U CN 201721003057 U CN201721003057 U CN 201721003057U CN 207318979 U CN207318979 U CN 207318979U
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Abstract
The utility model provides a kind of semiconductor equipment data acquisition device and system, including：The sensor being arranged in the equipment of some no communication functions；Semiconductor equipment data acquisition device with voltage output type sensor interface, voltage analog-to-digital conversion module, electric current output type sensor interface, electric current analog-to-digital conversion module, numeral output type sensor interface, logical operation module and communication module, each sensor interface connect respective sensor；The serial ports for being connected to semiconductor equipment data acquisition device PORT COM turns ether net unit；Turn ether net unit with serial ports to be connected, carry out logical process, data storage, the Logical processing unit of instruction transmission；And client.The utility model is based on the serial port of " one-to-many ", by selecting different types of sensor such as temperature, pressure, humidity to access the diverse location on the semiconductor equipment without communication function, more multidata purposes of equipment multiposition can be collected by reaching, and have wide applicability.
Description
Technical field
Electronic circuit field is the utility model is related to, more particularly to a kind of semiconductor equipment data acquisition device and is
System.
Background technology
, it is necessary to which production environment and working condition to semiconductor carry out implementing monitoring in semiconductor production, to ensure half
The quality of conductor production.Semiconductor on-site supervises some specific regions for conditions such as temperature, humidity, pressure at present
The mode of control, mainly sensor addition product intelligent digital displaying.Following functions are mainly realized using this scheme：
1st, the instantaneous value (such as temperature, humidity, pressure) that sensor detecting arrives is shown on intelligent display instrument；
2nd, alarm threshold is set on intelligent display instrument, the display instrument that goes beyond the scope can send alarm.
But these data acquisitions are realized using man-to-man form by the intelligent display instrument of purchase in the prior art,
Since each sensor will correspond to an intelligent display instrument, when needing to carry out data acquisition to multiple sensors
With regard to needing multiple intelligent display instrument, there are the shortcomings of of high cost, function is single.
In addition, in semicon industry, there are many equipment not possess communication function, system cannot obtain in real time for these equipment
The parameter of body is derived from, management and control degree of the engineer to equipment can be influenced.
Therefore, how " one-to-many " data acquisition in real time is realized to the equipment of no communication function, it has also become this area skill
One of art personnel's urgent problem to be solved.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of semiconductor equipment data
Harvester and system, for solving, semiconductor equipment data acquisition is of high cost in the prior art, function is single and data are unreal
When the problem of.
In order to achieve the above objects and other related objects, the utility model provides a kind of semiconductor equipment data acquisition dress
Put, the semiconductor equipment data acquisition device includes at least：
Voltage output type sensor interface, voltage analog-to-digital conversion module, electric current output type sensor interface, current-mode
Number modular converter, numeral output type sensor interface, logical operation module and communication module；
The voltage output type sensor interface is connected with external voltage output type sensor, receives the voltage
The voltage signal of output type sensor output；
The voltage analog-to-digital conversion module is connected to the output terminal of the voltage output type sensor interface, to the electricity
The voltage signal of output type sensor output is pressed to carry out analog-to-digital conversion；
The electric current output type sensor interface is connected with external electric current output type sensor, receives the electric current
The current signal of output type sensor output；
The electric current analog-to-digital conversion module is connected to the output terminal of the electric current output type sensor interface, to the electricity
The current signal for flowing the output of output type sensor carries out analog-to-digital conversion；
The numeral output type sensor interface is connected with external numeral output type sensor, receives the numeral
The digital signal of output type sensor output；
The logical operation module is connected to the voltage analog-to-digital conversion module, the electric current analog-to-digital conversion module, described
The output terminal of numeral output type sensor interface, receives the detection signal of each sensor, and carries out logic to each detection signal
Computing；
The communication module is connected to the output terminal of the logical operation module, is used for transmission through the logical operation module
Detection signal after processing.
Preferably, the voltage analog-to-digital conversion module is ADC0832 chips.
Preferably, the electric current analog-to-digital conversion module is MCP3421 chips.
Preferably, the numeral output type sensor interface includes temperature sensor interface, the number of numeral output type
The humidity sensor interface of word output type or the pressure sensor interface of numeral output type.
It is highly preferred that the numeral output type sensor interface includes DS18B20 temperature sensor interfaces or DHT11 types
Humidity sensor interface.
Preferably, the semiconductor equipment data acquisition device further includes constant-current source, for powering for sensor.
Preferably, the logical operation module is microcontroller.
Preferably, the communication module uses RS232 communications protocol.
It is highly preferred that the communication module is MAX232 chips.
Preferably, each sensor interface includes some groups, is acquired with the same information to multiple equipment.
Preferably, the semiconductor equipment data acquisition device further includes power module, there is provided 5V and 24V supply voltages.
In order to achieve the above objects and other related objects, the utility model provides a kind of semiconductor equipment data acquisition system
System, the semiconductor equipment data collecting system include at least：
Sensor, is arranged in the equipment of some no communication functions；
Above-mentioned semiconductor equipment data acquisition device, each sensor interface connect corresponding in the equipment of the no communication function
Sensor；
Serial ports turns ether net unit, is connected to the PORT COM of the semiconductor equipment data acquisition device；
Logical processing unit, turns ether net unit with the serial ports and is connected, to the semiconductor equipment data acquisition device
The detection signal collected carries out logical process or data storage, while refers to semiconductor equipment data acquisition device transmission
Order；
Client, is connected with the Logical processing unit, receives the testing result of the Logical processing unit output, at the same time
Instruction is sent to the Logical processing unit and the semiconductor equipment data acquisition device.
Preferably, the Logical processing unit includes server and database.
Preferably, the sensor includes temperature sensor, humidity sensor in the equipment of each no communication function
Or pressure sensor.
As described above, the semiconductor equipment data acquisition device and system of the utility model, have the advantages that：
The semiconductor equipment data acquisition device and system of the utility model are based on the serial port of " one-to-many ", lead to
The diverse location selected on the different types of semiconductor equipment of the sensor access without communication function such as temperature, pressure, humidity is crossed,
More multidata purposes of equipment multiposition can be collected by reaching, and have wide applicability.
Brief description of the drawings
Fig. 1 is shown as the structure diagram of the semiconductor equipment data acquisition device of the utility model.
Fig. 2 is shown as the structure diagram of the semiconductor equipment data collecting system of the utility model.
Component label instructions
1 semiconductor equipment data acquisition device
11 voltage output type sensor interfaces
12 voltage analog-to-digital conversion modules
13 electric current output type sensor interfaces
14 electric current analog-to-digital conversion modules
15 constant-current sources
16 numeral output type sensor interfaces
161 DS18B20 temperature sensor interfaces
162 DHT11 type humidity sensor interfaces
17 logical operation modules
18 communication modules
19 power modules
2 equipment without communication function
3 serial ports turn ether net unit
4 servers
5 databases
6 clients
Embodiment
Illustrate the embodiment of the utility model below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Please refer to Fig.1~Fig. 2.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, the then only display component related with the utility model rather than during according to actual implementation in schema
Component count, shape and size are drawn, and kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation
Become, and its assembly layout kenel may also be increasingly complex.
Embodiment one
As shown in Figure 1, the utility model provides a kind of semiconductor equipment data acquisition device 1, the semiconductor equipment number
Included at least according to harvester 1：
Voltage output type sensor interface 11, voltage analog-to-digital conversion module 12, electric current output type sensor interface 13,
Electric current analog-to-digital conversion module 14, numeral output type sensor interface 16, logical operation module 17, communication module 18 and power supply mould
Block 19.
As shown in Figure 1, the voltage output type sensor interface 11 is connected with external voltage output type sensor,
Receive the voltage signal of the voltage output type sensor output.
Specifically, in the present embodiment, the voltage output type sensor interface 11 includes some groups, can be right at the same time
The information of multiple voltage output type sensors is acquired.The output signal of the voltage output type sensor is voltage-mode
Intend signal, the object of detection is included but not limited to temperature, humidity and pressure, is not limited with the present embodiment.In the present embodiment, institute
Voltage output type sensor interface 11 is stated to be used to connect the sensor that output voltage is 0V~5V.
As shown in Figure 1, the voltage analog-to-digital conversion module 12 is connected to the voltage output type sensor interface 11
Output terminal, analog-to-digital conversion is carried out to the voltage signal of voltage output type sensor output.
Specifically, in the present embodiment, the voltage analog-to-digital conversion module 12 uses ADC0832 chips, by 0V~5V's
Voltage signal (analog signal) is converted to digital signal.The circuit of any other achievable voltage analog-to-digital conversion is suitable for this reality
With new, do not repeat one by one herein.
As shown in Figure 1, the electric current output type sensor interface 13 is connected with external electric current output type sensor,
Receive the current signal of the electric current output type sensor output.
Specifically, in the present embodiment, the electric current output type sensor interface 13 includes some groups, can be right at the same time
The information of multiple electric current output type sensors is acquired.The output signal of the voltage output type sensor is voltage-mode
Intend signal, the object of detection is included but not limited to temperature, humidity and pressure, is not limited with the present embodiment.In the present embodiment, institute
State electric current output type sensor interface 13 and connect PT100 temperature sensors.In the present embodiment, in order to improve the PT100
The accuracy of temperature sensor detection, the PT100 temperature sensors are connected by the electric current output type sensor interface 13
A constant-current source 15 is connect, the constant-current source 15 is powered for the PT100 temperature sensors, in the present embodiment, the constant-current source 15
For the constant-current source of 1mA.The constant-current source 15 can connect other sensors interface and power for other sensors, to improve sensor
The accuracy of detection, does not repeat one by one herein.
As shown in Figure 1, the electric current analog-to-digital conversion module 14 is connected to the electric current output type sensor interface 13
Output terminal, analog-to-digital conversion is carried out to the current signal of electric current output type sensor output.
Specifically, in the present embodiment, the electric current analog-to-digital conversion module 14 uses MCP3421 chips, the MCP3421
Chip is 16 high precision analogue conversion chips, and current signal (analog signal) is converted to digital signal.It is any other can be real
The circuit of existing electric current analog-to-digital conversion is suitable for the utility model, does not repeat one by one herein.
As shown in Figure 1, the numeral output type sensor interface 16 is connected with external numeral output type sensor,
Receive the digital signal of the numeral output type sensor output.
Specifically, the numeral output type sensor interface 16 includes but not limited to the temperature sensing of numeral output type
The pressure sensor interface of device interface, the humidity sensor interface of numeral output type and numeral output type.As shown in Figure 1,
In the present embodiment, the numeral output type sensor interface 16 includes DS18B20 temperature sensor interfaces 161 and DHT11
Type humidity sensor interface 162.The DS18B20 temperature sensor interfaces 161 connect DS18B20 temperature sensors, described
DS18B20 temperature sensors are used to gather 0 DEG C~125 DEG C of temperature value, and precision is 0.5 degree Celsius.The DHT11 types humidity passes
Sensor interface 162 connects DHT11 type humidity sensors, and the DHT11 types humidity sensor is detected the humidity in environment.
The type and detection object of the numeral output type sensor interface 16 are unlimited, are not limited with the present embodiment.Each numeral output
Type sensor interface 16 includes some groups, and the information of multiple numeral output type sensors can be acquired at the same time.
As shown in Figure 1, each sensor interface includes some groups, it is acquired with the same information to multiple equipment.
As shown in Figure 1, the logical operation module 17 is connected to the voltage analog-to-digital conversion module 12, the electric current modulus
The output terminal of modular converter 14, the numeral output type sensor interface 16, receives the detection signal of each sensor, and to each
Detect signal and carry out logical operation.
Specifically, in the present embodiment, the logical operation module 17 uses chip microcontroller, and the microcontroller is
AT89C52 microcontrollers, as the kernel control module of the semiconductor equipment data acquisition device 1, for logical operation.
As shown in Figure 1, the communication module 18 is connected to the output terminal of the logical operation module 17, it is used for transmission through institute
State the detection signal after logical operation module 17 is handled.
Specifically, the communication module 18 uses RS232 communications protocol, and in the present embodiment, the communication module 18 is adopted
Communication conversion is carried out with MAX232 chips, the communication interface of the MAX232 chips uses 9 adapters.
As shown in Figure 1, the power module 19 connects each module (Fig. 1 is for sake of simplicity, connection not shown relation), there is provided electricity
Source voltage.
Specifically, in the present embodiment, the power module 19 provides the supply voltage of 5V and 24V, and 5V supply voltages supply
To each module in the semiconductor equipment data acquisition device 1, each sensor of 24V power supply voltage supplyings.The power module
19 further include a switch, and the switch is bilateral switching, while controls the supply voltage of 5V and 24V.The power module 19 is also
Including a power supply indicator, for indicating 5V supply voltages.
Embodiment two
The present embodiment provides a kind of semiconductor equipment data collecting system, the semiconductor equipment data collecting system is at least
Including：
Sensor, the semiconductor equipment data acquisition device 1, serial ports turn ether net unit 3, Logical processing unit and visitor
Family end 6.
As shown in Fig. 2, the sensor is arranged in the equipment 2 of some no communication functions.
Specifically, in the present embodiment, the equipment 2 of the no communication function includes three, and the no communication function is set
Standby 2 quantity is not limited according to setting is actually needed with the present embodiment.Each sensor (not shown) is arranged to be measured
In equipment 2 without communication function, respectively the quantity of sensor described in the equipment 2 without communication function is set according to actual needs.Respectively
Sensor includes but not limited to temperature sensor, humidity sensor and the pressure sensing in the equipment 2 of each no communication function
Device, does not repeat one by one herein.
As shown in Fig. 2, each sensor interface connects the no communication function in the semiconductor equipment data acquisition device 1
Equipment 2 in corresponding sensor.
Specifically, the structure of the semiconductor equipment data acquisition device 1 describes in detail in embodiment one, differs herein
One repeats.
As shown in Fig. 2, the serial ports, which turns ether net unit 3, is connected to the logical of the semiconductor equipment data acquisition device 1
Interrogate port connection.
Specifically, the serial ports turns the communication module that ether net unit 3 connects the semiconductor equipment data acquisition device 1
18, realize the transmitted in both directions of data.
Equipment 2, sensor, the semiconductor equipment data acquisition device 1 and the serial ports of the no communication function turn
Ether net unit 3 is located at device context.
It is connected as shown in Fig. 2, the Logical processing unit turns ether net unit 3 with the serial ports, the semiconductor is set
The detection signal that standby data acquisition device 1 collects carries out logical process or data storage, while to the semiconductor equipment number
Transmit and instruct according to harvester 1.
Specifically, in the present embodiment, the Logical processing unit includes server 4 and database 5.
As shown in Fig. 2, the client 6 is connected with the Logical processing unit, the Logical processing unit output is received
Testing result, while send instruction to the Logical processing unit and the semiconductor equipment data acquisition device 1.
Specifically, the client 6 is used as user interface, for changing matching somebody with somebody for data acquisition program in the server 4
File is put, includes but not limited to device name, IP address, parameter type and parameter name；Concurrently set the alarm of device parameter
Boundary and warning message receive telephone number, mailbox number.
Embodiment three
The present embodiment provides the installation collocation method of semiconductor equipment data collecting system in embodiment two, specific steps are such as
Under：
The definite parameter for needing to pay close attention to, includes but not limited to temperature, pressure, humidity.
Prepare the sensor of corresponding parameter, select the sensor of different output types as needed.
Module needed for the semiconductor equipment data acquisition device 1 is soldered to a circuit board, described is partly led with being formed
Body device data acquisition device 1.
Reach the standard grade installation, it is specific as follows：Sensor is installed to the designated position of semiconductor equipment, with to the position into line number
According to collection；Circuit board where the semiconductor equipment data acquisition device 1 is installed in protecting box；Each sensor is welded
The circuit board being connected on where the semiconductor equipment data acquisition device 1；By the logical of the semiconductor equipment data acquisition device 1
News module serial ports turns ether net unit 3 with the serial ports and is connected.
Data acquisition program configuration file is changed, includes but not limited to device name, IP address, parameter type, parameter name
Claim.
User sets the alarm threshold of semiconductor equipment parameter and warning message receives telephone number, mailbox number.
Data acquisition and alarm monitoring can be achieved in opening program.
The semiconductor equipment data acquisition device and system of the utility model can substantially reduce cost, buy man-to-man intelligence
Energy digital display instrument, price general charged is all members up to a hundred, and uses the semiconductor equipment data acquisition device of the utility model, and cost is only
20 yuan or so.
Intelligent digital displaying function of the prior art is single, and different parameters just need different types of digital display instrument, and this reality
The various parameters that can realize common environmental with new semiconductor equipment data acquisition device gather, and possess one-to-many
Function.
The semiconductor equipment data acquisition device of the utility model can be applied on various no communication apparatus, pass through network
Real-time collecting device data, greatly improves equipment stability.
In conclusion the utility model provides a kind of semiconductor equipment data acquisition device and system, including：If it is arranged at
Sensor in the dry equipment without communication function；With voltage output type sensor interface, voltage analog-to-digital conversion module, electric current
Output type sensor interface, electric current analog-to-digital conversion module, numeral output type sensor interface, logical operation module and communication
The semiconductor equipment data acquisition device of module, each sensor interface connects to be sensed accordingly in the equipment of the no communication function
Device；The serial ports for being connected to the PORT COM of the semiconductor equipment data acquisition device turns ether net unit；Turn with the serial ports
Ether net unit connects, and carries out logical process, data storage, the Logical processing unit of instruction transmission；And client.This practicality
New semiconductor equipment data acquisition device and system are based on the serial port of " one-to-many ", by selecting temperature, pressure
Diverse location on the different types of semiconductor equipment of the sensor access without communication function such as power, humidity, reaching can
More multidata purposes of equipment multiposition are collected, there is wide applicability.So the utility model effectively overcomes existing skill
Various shortcoming in art and have high industrial utilization.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
God and all equivalent modifications completed under technological thought or change, should be covered by the claim of the utility model.
Claims (14)
1. a kind of semiconductor equipment data acquisition device, it is characterised in that the semiconductor equipment data acquisition device at least wraps
Include：
Voltage output type sensor interface, voltage analog-to-digital conversion module, electric current output type sensor interface, electric current modulus turn
Change the mold block, numeral output type sensor interface, logical operation module and communication module；
The voltage output type sensor interface is connected with external voltage output type sensor, receives the voltage output
The voltage signal of type sensor output；
The voltage analog-to-digital conversion module is connected to the output terminal of the voltage output type sensor interface, defeated to the voltage
The voltage signal for going out type sensor output carries out analog-to-digital conversion；
The electric current output type sensor interface is connected with external electric current output type sensor, receives the electric current output
The current signal of type sensor output；
The electric current analog-to-digital conversion module is connected to the output terminal of the electric current output type sensor interface, defeated to the electric current
The current signal for going out type sensor output carries out analog-to-digital conversion；
The numeral output type sensor interface is connected with external numeral output type sensor, receives the numeral output
The digital signal of type sensor output；
The logical operation module is connected to the voltage analog-to-digital conversion module, the electric current analog-to-digital conversion module, the numeral
The output terminal of output type sensor interface, receives the detection signal of each sensor, and carries out logical operation to each detection signal；
The communication module is connected to the output terminal of the logical operation module, is used for transmission and is handled through the logical operation module
Detection signal afterwards.
2. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The voltage modulus modulus of conversion
Block is ADC0832 chips.
3. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The electric current modulus modulus of conversion
Block is MCP3421 chips.
4. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The numeral output type passes
It is defeated that sensor interface includes the temperature sensor interface of numeral output type, the humidity sensor interface of numeral output type or numeral
Go out the pressure sensor interface of type.
5. the semiconductor equipment data acquisition device according to claim 1 or 4, it is characterised in that：The numeral output class
Type sensor interface includes DS18B20 temperature sensor interfaces or DHT11 type humidity sensor interfaces.
6. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The semiconductor equipment data
Harvester further includes constant-current source, for powering for sensor.
7. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The logical operation module is
Microcontroller.
8. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The communication module uses
RS232 communications protocol.
9. the semiconductor equipment data acquisition device according to claim 1 or 8, it is characterised in that：The communication module is
MAX232 chips.
10. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：Each sensor interface wraps
Some groups are included, is acquired with the same information to multiple equipment.
11. semiconductor equipment data acquisition device according to claim 1, it is characterised in that：The semiconductor equipment number
Power module is further included according to harvester, there is provided 5V and 24V supply voltages.
12. a kind of semiconductor equipment data collecting system, it is characterised in that the semiconductor equipment data collecting system is at least wrapped
Include：
Sensor, is arranged in the equipment of some no communication functions；
Semiconductor equipment data acquisition device as described in claim 1~11 any one, described in the connection of each sensor interface
Corresponding sensor in equipment without communication function；
Serial ports turns ether net unit, is connected to the PORT COM of the semiconductor equipment data acquisition device；
Logical processing unit, turns ether net unit with the serial ports and is connected, and the semiconductor equipment data acquisition device is gathered
The detection signal arrived carries out logical process or data storage, while transmits and instruct to the semiconductor equipment data acquisition device；
Client, is connected with the Logical processing unit, receives the testing result of Logical processing unit output, while to institute
State Logical processing unit and the semiconductor equipment data acquisition device sends instruction.
13. semiconductor equipment data collecting system according to claim 12, it is characterised in that：The Logical processing unit
Including server and database.
14. semiconductor equipment data collecting system according to claim 12, it is characterised in that：The sensor includes position
Temperature sensor, humidity sensor or pressure sensor in the equipment of each no communication function.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201721003057.2U CN207318979U (en) | 2017-08-11 | 2017-08-11 | A kind of semiconductor equipment data acquisition device and system |
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|---|---|---|---|
| CN201721003057.2U CN207318979U (en) | 2017-08-11 | 2017-08-11 | A kind of semiconductor equipment data acquisition device and system |
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Family
ID=62434274
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324553A (en) * | 2018-10-18 | 2019-02-12 | 深圳市朗驰欣创科技股份有限公司 | A kind of standardization detection module interface |
| CN110849410A (en) * | 2018-08-20 | 2020-02-28 | 合肥暖流信息科技有限公司 | Sensor with multi-parameter acquisition input port structure and application thereof |
| WO2023030119A1 (en) * | 2021-08-30 | 2023-03-09 | 北京北方华创微电子装备有限公司 | Data acquisition method, device, and system for semiconductor process equipment |
-
2017
- 2017-08-11 CN CN201721003057.2U patent/CN207318979U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110849410A (en) * | 2018-08-20 | 2020-02-28 | 合肥暖流信息科技有限公司 | Sensor with multi-parameter acquisition input port structure and application thereof |
| CN109324553A (en) * | 2018-10-18 | 2019-02-12 | 深圳市朗驰欣创科技股份有限公司 | A kind of standardization detection module interface |
| WO2023030119A1 (en) * | 2021-08-30 | 2023-03-09 | 北京北方华创微电子装备有限公司 | Data acquisition method, device, and system for semiconductor process equipment |
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Address after: 401331 No. 25 Xiyong Avenue, Shapingba District, Chongqing Patentee after: Huarun Microelectronics (Chongqing) Co., Ltd. Address before: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Patentee before: China Aviation (Chongqing) Microelectronics Co., Ltd. |