CN215379588U

CN215379588U - Open type water-cooling double-H bridge power unit

Info

Publication number: CN215379588U
Application number: CN202120963553.2U
Authority: CN
Inventors: 申宁; 董金龙; 范方起; 闫晓光
Original assignee: Shandong Taikai Power Electronic Co ltd
Current assignee: Shandong Taikai Power Electronic Co ltd
Priority date: 2021-05-08
Filing date: 2021-05-08
Publication date: 2021-12-31
Anticipated expiration: 2031-05-08

Abstract

The utility model discloses an open type water-cooling double H-bridge power unit which comprises a shell, wherein a heat dissipation mechanism for dissipating heat is arranged at the top of the shell, and an installation mechanism for installation is arranged in the shell; the utility model discloses a water pump, including shell lateral wall fixedly connected with a plurality of handles, shell lateral wall side from the top down fixedly connected with faucet and water inlet nozzle in proper order, shell lateral wall from the top down first journal stirrup and the second journal stirrup of fixedly connected with in proper order. According to the utility model, by arranging the heat dissipation mechanism and the installation mechanism, when the IGBT module on the composite mother board is connected with the pole connection copper bar in series, a double H-bridge design is formed, and then the installation effect is ensured.

Description

Open type water-cooling double-H bridge power unit

Technical Field

The utility model relates to the technical field of high-voltage chained water-cooling SVG devices, in particular to an open type water-cooling double H-bridge power unit.

Background

Among the prior art, high-pressure chain formula SVG device is formed by a plurality of SVG power unit concatenation, power unit quantity is numerous, power unit volume is too big simultaneously, lead to the power cabinet volume to be on a large side, area is big, and is with high costs, SVG power unit generally adopts the forced air cooling heat dissipation, except the radiator heat dissipation for IGBT module lower part, inside IGBT module drive plate, pick-up plate, power module, components and parts such as discharge resistance board also need the heat dissipation, consequently greatly reduced the reliability of equipment.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides an open type water-cooling double H-bridge power unit.

In order to achieve the purpose, the utility model adopts the following technical scheme: an open type water-cooling double H-bridge power unit comprises a shell, wherein a heat dissipation mechanism for dissipating heat is arranged at the top of the shell, and an installation mechanism for installation is arranged in the shell;

the utility model discloses a multi-functional water dispenser, including shell lateral wall fixedly connected with a plurality of handles, shell lateral wall side from the top down fixedly connected with faucet and water inlet tap in proper order, shell lateral wall from the top down first journal stirrup and the second journal stirrup of fixedly connected with in proper order, a plurality of compound motherboards of shell lateral wall fixedly connected with, shell lateral wall threaded connection has a plurality of first screws, shell lateral wall from the top down first installation piece of fixedly connected with and second installation piece in proper order, a plurality of first mounting holes have been seted up to the shell lateral wall.

As a further description of the above technical solution:

the heat dissipation mechanism comprises a plurality of capacitors, the bottoms of the capacitors are connected with the shell, and the side walls of the capacitors are fixedly connected with radiators.

As a further description of the above technical solution:

the installation mechanism comprises a driving installation plate, a driving plate is fixedly connected to the front surface of the driving installation plate, and the back of the driving installation plate is fixedly connected with the composite mother plate.

As a further description of the above technical solution:

the composite motherboard is characterized in that a plurality of IGBT modules are fixedly connected to the back of the composite motherboard, the front of each IGBT module is fixedly connected with a polar connection copper bar, and the front of each polar connection copper bar is fixedly connected with a supporting beam.

As a further description of the above technical solution:

the front face of the IGBT module is fixedly connected with an absorption capacitor, and the front face of the composite mother board is fixedly connected with a fixing plate.

As a further description of the above technical solution:

the front of the fixed plate is provided with a movable hole, the inner part of the movable hole is in threaded connection with a movable screw, and the front of the composite mother plate is fixedly connected with a connecting block.

As a further description of the above technical solution:

a plurality of movable mounting holes are formed in the front face of the composite mother board, and movable screws are connected in the movable mounting holes in a threaded mode.

The utility model has the following beneficial effects:

1. the driving device is formed by matching the driving mounting plate and the driving plate by arranging the heat dissipation mechanism and the mounting mechanism and mounting the driving mounting plate in the shell, so that the driving device is ensured to run, then a water inlet nozzle and a water outlet nozzle are mounted on the shell, and the heat radiator performs water cooling, when the water cooling is required, water flows in from the water inlet nozzle to dissipate heat of the equipment in the shell, and simultaneously the water is discharged through the water outlet nozzle after heat dissipation, so that the accelerated cooling of the equipment is ensured, then the IGBT module on the composite mother board is connected with the pole copper bar in series, so that a double H-bridge design is formed, the mounting effect is ensured, meanwhile, the composite mother board is in a stacked structure, the stray inductance is small, the IGBT module and the heat radiator are matched, the heat transfer effect is better, so that the air cooling heat dissipation is not required during heat dissipation, the accelerated cooling of the internal equipment can be ensured by the water cooling, and the reliability of the equipment is enhanced, the heat dissipation effect is improved.

2. Through installing the joist on the copper bar is allied oneself with to the utmost point, then install the connecting block on compound mother board, then consolidate compound mother board through the connecting block, install the handle simultaneously on the shell to conveniently transport or install, guarantee then to remove the transportation effect, thereby conveniently to carrying out fixed mounting, when just so making to be convenient for remove the transportation, improve the fixed mounting effect.

Drawings

Fig. 1 is a schematic view of an overall structure of an open type water-cooling double H-bridge power unit according to the present invention;

fig. 2 is a schematic top view of an open type water-cooling double H-bridge power unit according to the present invention;

fig. 3 is a schematic cross-sectional structural diagram of an open water-cooled double H-bridge power unit according to the present invention.

Illustration of the drawings:

1. a housing; 2. a handle; 3. a water inlet nozzle; 4. a water outlet nozzle; 5. a first lug; 6. a second lug; 7. a composite mother board; 8. a first screw; 9. a first mounting block; 10. a first mounting hole; 11. a capacitor; 12. a heat sink; 13. driving the mounting plate; 14. a drive plate; 15. an IGBT module; 16. a polar copper bar; 17. a joist; 18. an absorption capacitance; 19. a fixing plate; 20. moving the hole; 21. moving the screw; 22. connecting blocks; 23. a movable mounting hole; 24. a movable screw.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the open type water-cooling double-H bridge power unit provided by the utility model comprises a housing 1, wherein a heat dissipation mechanism for dissipating heat is arranged at the top of the housing 1, and an installation mechanism for installation is arranged in the housing 1;

a plurality of handles 2 of 1 lateral wall fixedly connected with of shell, 1 lateral wall side from the top down of shell fixedly connected with faucet 4 and water inlet tap 3 in proper order, 1 lateral wall from the top down of shell fixedly connected with first journal stirrup 5 and second journal stirrup 6 in proper order, 1 inside wall fixedly connected with of shell a plurality of

compound motherboards

7, 1 lateral wall threaded connection of shell has a plurality of

first screws

8, 1 lateral wall from the top down of shell fixedly connected with first installation piece 9 and second installation piece in proper order, a plurality of first mounting holes 10 have been seted up to 1 lateral wall of shell.

Referring to fig. 2, the heat dissipation mechanism includes a plurality of capacitors 11, the bottom of each capacitor 11 is connected to the housing 1, and a heat sink 12 is fixedly connected to a sidewall of each capacitor 11, so that the capacitors 11 and the heat sink 12 can be conveniently mounted.

Referring to fig. 1, the mounting mechanism comprises a driving mounting plate 13, a driving plate 14 is fixedly connected to the front surface of the driving mounting plate 13, and the back of the driving mounting plate 13 is fixedly connected with the composite mother plate 7, so that the driving mounting plate 13 can be mounted through the composite mother plate 7.

Referring to fig. 3, a plurality of IGBT modules 15 are fixedly connected to the back of the composite mother board 7, a polar connection copper bar 16 is fixedly connected to the front of each IGBT module 15, and a joist 17 is fixedly connected to the front of each polar connection copper bar 16, so that the joist 17 is fixedly mounted on the polar connection copper bars 16.

Referring to fig. 3, the absorption capacitor 18 is fixedly connected to the front surface of the IGBT module 15, and the fixing plate 19 is fixedly connected to the front surface of the composite mother board 7, so that the fixing plate 19 is mounted on the composite mother board 7.

Referring to fig. 3, a moving hole 20 is formed in the front surface of the fixing plate 19, a moving screw 21 is connected to the inside of the moving hole 20 through a thread, and a connecting block 22 is fixedly connected to the front surface of the composite mother plate 7, so that the connecting block 22 is fixedly mounted on the composite mother plate 7.

Referring to fig. 3, a plurality of movable mounting holes 23 are formed in the front surface of the composite mother board 7, and movable screws 24 are screwed in the movable mounting holes 23 so as to fix the composite mother board 7 by movable bolts.

The working principle is as follows: firstly, when in use, a capacitor 11 and a radiator 12 are installed on a shell 1, then a driving installation plate 13 is installed inside the shell 1, the driving installation plate 13 is matched with a driving plate 14 to form driving equipment, so that the equipment is driven to operate, then a handle 2 is installed on the shell 1, so that the transportation or installation is convenient, meanwhile, a first support lug 5 and a second support lug 6 are installed on the shell 1, so that the fixation is convenient, then a water inlet nozzle 3 and a water outlet nozzle 4 are installed on the shell 1, the radiator 12 carries out water-cooling heat dissipation, when in need of the water-cooling heat dissipation, water flows in from the water inlet nozzle 3 to dissipate the heat of the equipment inside the shell 1, and simultaneously the water is discharged through the water outlet nozzle 4, then an IGBT module 15 on a composite mother board 7 is connected with a pole-connected copper bar 16 in series, so that a double H-bridge design is formed, and the composite mother board 7 is in a stacked structure, stray inductance is little, and the cooperation between IGBT module 15 and radiator 12, heat transfer effect is better, then installs joist 17 on the copper bar 16 is ally oneself with to the utmost point to fix, then install connecting block 22 on composite mother board 7, consolidate composite mother board 7 through connecting block 22 then, thereby conveniently install.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides an open water-cooling pair of H bridge power unit, includes shell (1), its characterized in that: the top of the shell (1) is provided with a heat dissipation mechanism for dissipating heat, and the inside of the shell (1) is provided with an installation mechanism for installation;

the utility model discloses a multi-functional water purifier, including shell (1), shell (1) lateral wall fixedly connected with a plurality of handles (2), shell (1) lateral wall side from the top down fixedly connected with faucet (4) and water inlet (3) in proper order, shell (1) lateral wall from the top down first journal stirrup (5) and second journal stirrup (6) of fixedly connected with in proper order, a plurality of compound mother board (7) of shell (1) inside wall fixedly connected with, shell (1) lateral wall threaded connection has a plurality of first screws (8), shell (1) lateral wall from the top down first installation piece (9) of fixedly connected with and second installation piece in proper order, a plurality of first mounting hole (10) have been seted up to shell (1) lateral wall.

2. The open water-cooled double H-bridge power unit of claim 1, wherein: the heat dissipation mechanism comprises a plurality of capacitors (11), the bottoms of the capacitors (11) are connected with the shell (1), and the side walls of the capacitors (11) are fixedly connected with a radiator (12).

3. The open water-cooled double H-bridge power unit of claim 1, wherein: the installation mechanism comprises a driving installation plate (13), a driving plate (14) is fixedly connected to the front surface of the driving installation plate (13), and the back of the driving installation plate (13) is fixedly connected with the composite mother board (7).

4. The open water-cooled double H-bridge power unit of claim 3, wherein: the composite motherboard (7) is fixedly connected with a plurality of IGBT modules (15) on the back, the IGBT modules (15) are fixedly connected with the pole connection copper bar (16) on the front side, and the pole connection copper bar (16) is fixedly connected with the joist (17) on the front side.

5. The open water-cooled double H-bridge power unit of claim 4, wherein: the front surface of the IGBT module (15) is fixedly connected with an absorption capacitor (18), and the front surface of the composite motherboard (7) is fixedly connected with a fixing plate (19).

6. The open water-cooled double H-bridge power unit of claim 5, wherein: the front surface of the fixing plate (19) is provided with a moving hole (20), the inner part of the moving hole (20) is in threaded connection with a moving screw (21), and the front surface of the composite mother plate (7) is fixedly connected with a connecting block (22).

7. The open water-cooled double H-bridge power unit of claim 6, wherein: the front surface of the composite mother board (7) is provided with a plurality of movable mounting holes (23), and movable screws (24) are connected with the inner threads of the movable mounting holes (23).