CN215378970U

CN215378970U - Electronic device

Info

Publication number: CN215378970U
Application number: CN202121027314.2U
Authority: CN
Inventors: 邓振华; 高旭
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2021-12-31
Anticipated expiration: 2031-05-13

Abstract

The application discloses electronic equipment belongs to electronic equipment technical field. The electronic equipment comprises a first functional module, a second functional module and a supporting structural member, wherein the first functional module and the second functional module are respectively positioned on two sides of the supporting structural member; the support structure is provided with an integrated circuit structure, and the first functional module and the second functional module are electrically connected through the integrated circuit structure. The embodiment of the application has the advantages that the stacking space of the electronic equipment can be optimized, and the overall weight of the electronic equipment is reduced.

Description

Electronic device

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

At present, the electronic equipment industry is competitive and has rapid iteration. Taking a smart phone as an example, consumers are increasingly pursuing the requirements of mobile phones, realizing diversified and complex functions and having high requirements on the appearance of the mobile phones, and particularly paying attention to the light and thin handshake experience.

In the prior art, in order to realize diversified complex functions, such as wireless charging, pressure sensing and the like, electronic devices need to be correspondingly added, and the connection mode among the functional modules is realized by adopting independent flexible circuit boards.

However, the adoption of the flexible circuit board connection mode increases the thickness of the whole mobile phone, increases the whole weight of the mobile phone, and is not beneficial to realizing the extremely light and thin mobile phone design.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide electronic equipment, and the problem that the thickness of the whole electronic equipment is increased in a mode of connecting the electronic equipment by adopting a flexible circuit board in the prior art can be solved.

In order to solve the technical problem, the present application is implemented as follows:

the embodiment of the application provides electronic equipment, which comprises a first functional module, a second functional module and a supporting structural part;

the first functional module and the second functional module are respectively positioned on two sides of the supporting structural member;

the support structure is provided with an integrated circuit structure, and the first functional module and the second functional module are electrically connected through the integrated circuit structure.

In this application embodiment, the setting of integrated circuit structure can link together first functional module and second functional module, has set up the conducting wire at bearing structure spare through integrated mode, can reduce electronic equipment's thickness effectively, and then can optimize electronic equipment's the space that piles up, has reduced electronic equipment's complete machine weight, has promoted bearing structure spare's structural strength. The embodiment of the application has the advantages that the stacking space of the electronic equipment can be optimized, and the overall weight of the electronic equipment is reduced.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device before an integrated circuit structure is arranged in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of an electronic device with an integrated circuit structure according to an embodiment of the present application;

FIG. 3 is a partial cross-sectional view of a support structure according to one embodiment of the present application;

FIG. 4 is a schematic view of another embodiment of the present disclosure after forming a through-hole slot in the support body;

FIG. 5 is a schematic diagram of the structure of an integrated circuit board and a through hole slot after being matched in another embodiment of the present application;

FIG. 6 is a schematic diagram of an integrated circuit board according to another embodiment of the present application;

FIG. 7 is an enlarged view of a portion of an integrated circuit board according to another embodiment of the present application;

fig. 8 is a partial cross-sectional view of an integrated circuit board in another embodiment of the present application.

Description of reference numerals:

10. a first functional module; 20. a second functional module; 30. a support structure; 31. a support body; 311. a through hole slot; 32. an integrated circuit board; 321. an insulating plate; 322. an assembly hole; 33. an integrated circuit structure; 331. a first connector; 332. a second connector; 40. and (4) covering the main board.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 8, an embodiment of the present application provides an electronic device including a first functional module 10, a second functional module 20, and a support structure 30;

the first functional module 10 and the second functional module 20 are respectively positioned at both sides of the support structure 30;

wherein, the supporting structure 30 is provided with an integrated circuit structure 33, and the first functional module 10 and the second functional module 20 are electrically connected through the integrated circuit structure 33.

In the embodiment of the present application, the first functional module 10 and the second functional module 20 can be connected together by the integrated circuit structure 33, and the conductive circuit is disposed on the supporting structure 30 in an integrated manner, so that the thickness of the electronic device can be effectively reduced, the stacking space of the electronic device can be optimized, the overall weight of the electronic device is reduced, and the structural strength of the supporting structure 30 is improved. The embodiment of the application has the advantages that the stacking space of the electronic equipment can be optimized, and the overall weight of the electronic equipment is reduced.

It should be noted that the supporting structure 30 may be a unitary insert, or may be an assembly of multiple parts, wherein the integrated circuit structure 33 may be integrated at different positions of the supporting structure 30 according to the requirement.

It should be noted that the first functional module 10 and the second functional module 20 of the present application are exemplary descriptions, the same or different numbers of functional modules may be respectively disposed on both sides of the supporting structural member 30, and the integrated circuit structure 33 is adapted according to the requirement.

Referring to fig. 2 and 3, optionally, in an embodiment of the present application, the integrated circuit structure 33 includes an insulating layer and a conductive circuit layer, the insulating layer is disposed on the supporting structure 30, the conductive circuit layer is disposed on a side of the insulating layer facing away from the supporting structure 30, and the insulating layer is used for isolating the conductive circuit layer from the supporting structure 30.

In the embodiment of the present application, the insulating layer is disposed to prevent the interference between the supporting structure 30 and the conductive circuit layer, prevent the contact between the conductive connecting layer and the supporting structure 30, and ensure the conductive effect of the conductive circuit layer. The conductive line layer may be provided to communicate the first functional module 10 and the second functional module 20.

It should be noted that the conductive circuit layer may include at least one conductive line, and the at least one conductive line electrically connects the first functional module 10 and the second functional module 20.

It should be noted that the supporting structural member 30 may be made of a metal material, such as an aluminum alloy or a magnesium alloy, or may be made of a non-metal material, such as an insulating material like rubber, or may be a composite of multiple materials. When the supporting structure 30 is made of an insulating material, the insulating layer may not be provided, so as to further reduce the thickness of the whole machine.

Optionally, in an embodiment of the present application, the integrated circuit structure 33 further includes a protective layer, the protective layer is located on a side of the guiding circuit layer facing away from the insulating layer, and the protective layer covers the conductive circuit layer.

In this application embodiment, the setting of protective layer can protect the conducting wire layer, prevents that external conducting structure from producing the conducting wire layer and disturbing, guarantees the reliable and stable of conducting wire layer. The protective layer may be a coating layer having an insulating effect.

Referring to fig. 4 to 8, optionally, in the embodiment of the present application, the supporting structure 30 includes a supporting main body 31 and an integrated circuit board 32, a through hole slot 311 is formed on the supporting main body 31, and the integrated circuit board 32 is installed in the through hole slot 311;

the integrated circuit structure 33 is disposed on the integrated circuit board 32.

In the embodiment of the present application, the integrated circuit board 32 and the through hole slot 311 are cooperatively disposed, so that the thickness of the supporting structure 30 is not increased after the integrated circuit structure 33 is disposed on the supporting structure 30, the thickness of the electronic device can be further reduced, the stacking space of the electronic device can be further optimized, and the overall weight of the electronic device is reduced.

Alternatively, in the embodiment of the present application, the integrated circuit board 32 includes the insulating plate 321, and the integrated circuit structure 33 is disposed on the insulating plate 321.

In the embodiment of the present application, the insulating plate 321 may have a certain insulating effect, and the conductive circuit layer in the integrated circuit structure 33 may be directly integrated on the insulating plate 321, so as to reduce the setting of the insulating layer, and further reduce the thickness of the integrated circuit board 32.

The insulating plate 321 may be made of any material as needed, for example, an insulating glass fiber plate.

Optionally, in an embodiment of the present application, the integrated circuit structure 33 includes a conductive circuit layer disposed on the insulating plate 321 and a protective layer disposed on a side of the guiding circuit layer facing away from the insulating plate 321.

In the embodiment of the present application, the conductive circuit layer may be disposed to communicate the first functional module 10 and the second functional module 20. The setting of protective layer can protect the conducting wire layer, prevents that external conductive structure from producing the interference to the conducting wire layer, guarantees the reliable and stable of conducting wire layer. The protective layer may be a coating layer having an insulating effect.

Optionally, in an embodiment of the present application, at least one assembly hole 322 is provided on the integrated circuit board 32, the assembly hole 322 is adapted to a fixing member, and the integrated circuit board 32 is fixedly connected to the device main body of the electronic device through the fixing member.

In the embodiment of the present application, the mounting holes 322 are provided to mount the integrated circuit board 32 at corresponding positions, for example, the integrated circuit board 32 may be mounted on the motherboard upper cover 40 by a fixing member. The fixing member may be provided as a screw or a rivet, and the fitting hole 322 may be provided at both sides of the connector as needed to improve the connection stability of the connector.

Optionally, in the embodiment of the present application, a first end of the integrated circuit structure 33 is provided with a first connector 331, the first connector 331 is connected with the first functional module 10, a second end of the integrated circuit structure 33 is provided with a second connector 332, and the second connector 332 is connected with the second functional module 20.

In the embodiment of the present application, the connectors (including the first connector 331 and the second connector 332) may be provided as board-to-board connectors, or may be provided as other connectors as long as the electrical connection between the first functional module 10 and the second functional module 20 can be achieved.

It should be noted that the connector may include a male connector and a female connector, and only one of the male connector and the female connector may be disposed at both ends of the integrated circuit structure 33.

Optionally, in the embodiment of the present application, the thickness of the supporting structural member 30 is h, and h is greater than or equal to 0.3mm and less than or equal to 0.5 mm.

In the embodiment of the present application, the thickness of the supporting structure 30 can be made thinner by the above structure, so that the thickness of the electronic device can be effectively reduced, the stacking space of the electronic device can be further optimized, and the overall weight of the electronic device is reduced.

Optionally, in an embodiment of the present application, the electronic device further includes a middle frame and a main board structure, the middle frame is provided with a main board support, the main board structure is fixedly connected to the main board support, the main board structure is provided with a main board upper cover 40, and the supporting structural member 30 is embedded in the main board upper cover 40.

In the embodiment of the present application, the supporting structural member 30 may be an aluminum alloy or magnesium alloy insert embedded in the motherboard upper cover 40. The supporting structure member 30 can be arranged on the supporting structure member 30 in an integrated manner, so that the thickness of the electronic equipment can be effectively reduced, the stacking space of the electronic equipment can be further optimized, the overall weight of the electronic equipment is reduced, and the structural strength of the supporting structure member 30 is improved.

It should be noted that, the electronic device of the present application may be configured as one of a mobile phone, a tablet, a notebook phone, and an intelligent wearable device. Other electronic devices may be provided as needed.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device comprising a first functional module, a second functional module and a support structure;

2. The electronic device of claim 1, wherein the integrated circuit structure comprises an insulating layer and a conductive circuit layer, the insulating layer is disposed on the supporting structure, the conductive circuit layer is disposed on a side of the insulating layer facing away from the supporting structure, and the insulating layer is configured to isolate the conductive circuit layer from the supporting structure.

3. The electronic device of claim 2, wherein the integrated circuit structure further comprises a protective layer on a side of the conductive line layer facing away from the insulating layer, the protective layer covering the conductive line layer.

4. The electronic device of claim 1, wherein the supporting structure comprises a supporting body and an integrated circuit board, the supporting body is provided with a through hole slot, and the integrated circuit board is mounted in the through hole slot;

the integrated circuit structure is arranged on the integrated circuit board.

5. The electronic device of claim 4, wherein the integrated circuit board comprises an insulating board, the integrated circuit structure being disposed on the insulating board.

6. The electronic device according to claim 5, wherein the integrated circuit structure comprises an electrically conductive circuit layer and a protective layer, the electrically conductive circuit layer being disposed on the insulating plate, the protective layer being disposed on a side of the electrically conductive circuit layer facing away from the insulating plate.

7. The electronic device according to claim 4, wherein the integrated circuit board is provided with at least one mounting hole, the mounting hole is adapted to a fixing member, and the integrated circuit board is fixedly connected to the device body of the electronic device through the fixing member.

8. The electronic device of any of claims 1-7, wherein a first end of the integrated circuit structure is provided with a first connector that is connected to the first functional module, and a second end of the integrated circuit structure is provided with a second connector that is connected to the second functional module.

9. The electronic device of claim 8, wherein the support structure has a thickness h, wherein h is 0.3mm ≦ h ≦ 0.5 mm.

10. The electronic device according to claim 1, further comprising a middle frame and a main board structure, wherein the middle frame is provided with a main board support, the main board structure is fixedly connected to the main board support, the main board structure is provided with a main board upper cover, and the supporting structure is embedded in the main board upper cover.